MEMS packaging structure

Abstract

The utility model provides an MEMS packaging structure, which relates to the technical field of packaging of semiconductor devices, and comprises a packaging carrier, the packaging carrier is provided with a first cavity and a second cavity, a support table is formed between the first cavity and the second cavity, an adapter plate is placed on the table top of the support table, an MEMS chip is arranged on the bottom wall of the second cavity, and the MEMS chip is arranged on the bottom wall of the second cavity. The bottom wall of the second cavity below the MEMS chip is provided with a through hole, the through hole is matched with the MEMS chip, the MEMS chip is electrically connected with the adapter plate, the adapter plate is electrically connected with a lead wire, the lead wire extends freely after upwards penetrating out of the first cavity, the packaging carrier is made of a metal material, the packaging carrier made of the metal material is precise in machining and small in packaging size, and the packaging structure is simple in structure and convenient to operate. Therefore, the problem that the packaging size is large during plastic packaging is effectively solved, in addition, the processing temperature of the packaging carrier made of the metal material is low during injection molding packaging, the packaging carrier is not prone to deformation and warping, and the finished product yield of packaged products is effectively guaranteed.

Description

Technical Field

[0001] The utility model relates to the technical field of semiconductor device packaging, in particular to a MEMS packaging structure. Background Art

[0002] Existing MEMS chips are generally packaged in the form of plastic packaging. The plastic packaging shell protects the MEMS chip. The plastic packaging method can effectively eliminate interface stress and prevent the chip from cracking or delamination.

[0003] However, the molding cavity of the traditional plastic encapsulation mold is relatively large, and during the chip encapsulation process, there are defects such as large packaging size, difficulty in controlling the thermal shrinkage of the colloid after molding, punching and pressing, and low packaging efficiency. In addition, due to the high temperature of the plastic encapsulation material during the plastic encapsulation process, it is difficult to control the flatness and warping of the carrier during heating and cooling. After the injection molding is completed, the resin substrate is cut to form a single packaged product, and the device warps easily, thereby affecting the finished product yield of the packaged product. Utility Model Content

[0004] In order to meet the process requirements and structural requirements of MEMS chips during packaging and solve the problems existing in the above-mentioned prior art, a MEMS packaging structure is provided. The technical solution adopted by the utility model to solve the technical problems is:

[0005] A MEMS packaging structure comprises: a packaging carrier, wherein the packaging carrier is provided with a first chamber and a second chamber in sequence from top to bottom, the first chamber and the second chamber are connected, a through hole is provided on the bottom wall of the second chamber, a support platform is formed between the first chamber and the second chamber, an adapter plate is placed on the surface of the support platform, leads are electrically connected to the adapter plate, and the leads extend freely after passing through the first chamber upward.

[0006] Preferably, the material of the packaging carrier includes metal material.

[0007] Preferably, the first chamber is provided with a matching cover plate, and the outer edge of the cover plate is fixedly connected to the side wall of the first chamber.

[0008] Preferably, a sealing groove is formed on the outer wall of the packaging carrier, a sealing ring is passed through the sealing groove, and the sealing ring is in close contact with the inner wall of the sealing groove.

[0009] Preferably, a second chip is disposed on the bottom wall of the second chamber, the through hole cooperates with the second chip, and the second chip is electrically connected to the adapter board.

[0010] Preferably, the cover plate comprises a glass cover plate.

[0011] Preferably, the adapter board is electrically connected to a first chip.

[0012] Preferably, the size of the first chamber is larger than the size of the second chamber.

[0013] Preferably, the cross-section of the first chamber and the second chamber comprises a square.

[0014] Preferably, a fixing groove is provided on the surface of the support platform, and a plurality of exhaust holes are provided at intervals in the side wall of the first chamber, the upper ends of the exhaust holes pass upward through the upper surface of the side wall of the first chamber, and the lower ends of the exhaust holes are connected to the fixing groove.

[0015] Preferably, the cross-section of the fixing groove includes a trapezoid and a T-shape.

[0016] Preferably, the adapter plate is provided with a plurality of fixing holes penetrating the adapter plate at intervals, the fixing holes are communicated with the fixing grooves, and the fixing holes and the fixing grooves are jointly filled with adhesive for bonding the adapter plate.

[0017] Preferably, a clamping groove is formed on the inner wall of the first chamber, and the outer edge of the cover plate is inserted into the clamping groove, and the outer edge of the cover plate is in close contact with the inner wall of the clamping groove.

[0018] Preferably, a glass ring is further provided between the second chip and the through hole, the lower surface of the glass ring is fixedly connected to the bottom wall of the second chamber, and the upper surface of the glass ring is fixedly connected to the second chip.

[0019] Preferably, the sealing ring is made of elastic rubber.

[0020] Compared with the prior art, the beneficial effects of the utility model are:

[0021] 1. In the utility model, the packaging carrier is provided with a first chamber and a second chamber from top to bottom. The MEMS chip can be arranged in the first chamber or the second chamber according to the design requirements. The first chamber or the second chamber protects the MEMS chip. The packaging carrier is made of metal material. The metal packaging carrier is precisely machined and has a small packaging size, which effectively solves the problem of large packaging size during plastic packaging. In addition, the metal packaging carrier has a low processing temperature during injection molding, and the packaging carrier is not easy to deform, which effectively ensures the finished product yield of the packaged product.

[0022] 2. The utility model provides a support platform for placing an adapter plate, a fixing groove is provided on the surface of the support platform, and the cross-sectional shapes of the fixing groove include trapezoidal and T-shaped. A plurality of exhaust holes are provided at intervals in the side wall of the first chamber, and the upper ends of the exhaust holes pass upward through the upper surface of the side wall of the first chamber, and the lower ends of the exhaust holes are connected with the fixing groove. A plurality of fixing holes penetrating the adapter plate are provided at intervals on the adapter plate, and the fixing holes are connected with the fixing groove. When in use, adhesive is injected into the fixing holes, and the adhesive flows downward into the fixing groove, and the air in the fixing groove is discharged through the exhaust holes, thereby facilitating the inflow of adhesive. When the adhesive solidifies, the adhesive in the fixing hole and the fixing groove forms a whole, which is more conducive to improving the firmness between the adapter plate and the support platform.

[0023] 3. In the utility model, the first chamber is provided with a cover plate, which seals the first chamber into an enclosed space, thereby providing better protection for the internal components. The cover plate can be made of a variety of materials such as metal, ceramic and glass. When a transparent material such as glass is used, photosensitive components can be placed on the adapter plate of the first chamber, so that the packaged product has optical functions and the adaptability of the packaging structure is improved.

[0024] 4. In the utility model, a sealing groove is opened on the outer wall of the packaging carrier, and a sealing ring is passed through the sealing groove. The sealing ring is in close contact with the inner wall of the sealing groove. When the packaged product is installed, the sealing ring can improve the sealing degree at the installation position of the packaged product, thereby improving the safety and stability of the use of the packaged product. BRIEF DESCRIPTION OF THE DRAWINGS

[0025] The above and / or additional aspects and advantages of the present invention will become apparent and easily understood from the description of the embodiments in conjunction with the following drawings, in which:

[0026] Figure 1 It is a sectional view of the overall structure of the utility model (T-shaped cross section);

[0027] Figure 2 It is a cross-sectional view of the overall structure of the utility model (trapezoidal interface);

[0028] Figure 3 yes Figure 1 A magnified view of the structure of part A;

[0029] Figure 4 yes Figure 1 A magnified view of the structure of part B in the middle (without glue injection);

[0030] Figure 5 yes Figure 1 A magnified view of the structure of part B (glue injection);

[0031] Figure 6 yes Figure 2 A magnified view of the structure of part C in the middle;

[0032] Figure 7 It is a schematic diagram of the utility model and pipeline installation.

[0033] Description of reference numerals:

[0034] 100 packaging carrier; 101 sealing groove; 102 sealing ring; 110 first chamber; 111 exhaust hole; 112 cover plate; 113 snap-in groove; 120 second chamber; 121 second chip; 122 through hole; 123 glass ring; 130 support platform; 131 adapter plate; 132 lead wire; 133 fixing groove; 134 fixing hole; 135 first chip; 200 tube wall. DETAILED DESCRIPTION

[0035] The embodiments of the present invention are described in detail below, and examples of the embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals throughout represent the same or similar elements or elements having the same or similar functions. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain the present invention, and cannot be understood as limiting the present invention.

[0036] like Figure 1 , Figure 2 and Figure 7 As shown, the utility model proposes a MEMS packaging structure, which includes:

[0037] A MEMS packaging structure includes: a packaging carrier 100, wherein the packaging carrier 100 is provided with a first chamber 110 and a second chamber 120 in sequence from top to bottom, the first chamber 110 and the second chamber 120 are connected, a through hole 122 is provided on the bottom wall of the second chamber 120, a support platform 130 is formed between the first chamber 110 and the second chamber 120, an adapter plate 131 is placed on the surface of the support platform 130, a lead 132 is electrically connected to the adapter plate 131, and the lead 132 extends freely after passing through the first chamber 110 upward.

[0038] Furthermore, the material of the package carrier 100 includes metal material.

[0039] Furthermore, the first chamber 110 is provided with a matching cover plate 112 , and the outer edge of the cover plate 112 is fixedly connected to the side wall of the first chamber 110 .

[0040] Furthermore, a sealing groove 101 is formed on the outer wall of the packaging carrier 100 , and a sealing ring 102 is passed through the sealing groove 101 . The sealing ring 102 is in close contact with the inner wall of the sealing groove 101 .

[0041] Furthermore, a second chip 121 is disposed on the bottom wall of the second chamber 120 , the through hole 122 cooperates with the second chip 121 , and the second chip 121 is electrically connected to the adapter board 131 .

[0042] Furthermore, the cover plate 112 includes a glass cover plate.

[0043] Furthermore, the adapter board 131 is electrically connected to a first chip 135 .

[0044] The packaging carrier 100 is made of metal. The metal packaging carrier is precisely machined and has a small packaging size, which effectively solves the problem of large packaging size during plastic packaging. In addition, the metal packaging carrier has a low processing temperature during injection molding, and the packaging carrier is not easy to deform, which effectively ensures the finished product yield of the packaged product.

[0045] The support platform 130 is arranged between the first chamber 110 and the second chamber 120. An adapter plate 131 is arranged on the support platform 130. The support platform 130 supports the adapter plate 131. The adapter plate 131 separates the first chamber 110 and the second chamber 120 into two independent areas without interfering with each other, so that different functional chips can be placed in the first chamber 110 and the second chamber 120 to achieve the versatility of the packaged product. Of course, the functional chip can also be placed only in the first chamber 110 or the second chamber 120. The design of the packaged product is flexibly applied according to actual needs, and this embodiment will not be elaborated in detail.

[0046] The first chamber 110 is provided with a matching cover plate 112. The cover plate 112 can be made of a variety of materials, including metal, ceramic and glass. The outer edge of the cover plate 112 is fixedly connected to the side wall of the first chamber 110. The cover plate 112 seals the first chamber 110 to form an enclosed space, thereby protecting the first chip 135.

[0047] In this embodiment, the lead 132 extends freely after passing through the cover plate 112. According to design requirements, the lead 132 may include multiple wires, including both communication lines and transmission lines. The lead 132 is used to export the electrical signals of the second chip 121 and the first chip 135 and to provide power for the second chip 121 and the first chip 135.

[0048] A through hole 122 is provided on the bottom wall of the second chamber 120, and the through hole 122 is used to connect the second chamber 120 with the outside world. In addition, a sealing groove 101 is provided on the outer wall of the packaging carrier 100, and a sealing ring 102 is passed through the sealing groove 101. The sealing ring 102 is in close contact with the inner wall of the sealing groove 101. When the second chip 121 adopts a pressure sensor chip, the packaging product can have a pressure detection function, and is particularly suitable for performing pressure detection on a hole in a pipe wall or a container wall.

[0049] Specifically, Figure 7As shown, taking the air pressure detection in the pipeline for conveying gas as an example, after a hole is opened in the pipe wall 200 of the pipe, the packaging carrier 100 of the packaged product is inserted into the hole, the through hole 122 is connected to the medium in the pipe or container, and the second chip 121 senses the external pressure change through the through hole 122. At this time, the sealing ring 102 is in close contact with the inner wall of the hole, which not only plays a role in fixing the packaged product, but also ensures a good sealing effect on the other hand to avoid gas leakage in the pipeline.

[0050] Of course, when the pressure in the pipeline or container is relatively high and the packaged product cannot be fixed by the friction between the sealing ring 102 and the inner wall of the hole, other reinforcement and sealing structures can be added, such as pipe clamps, etc. These methods are conventional existing technologies and will not be elaborated in this solution.

[0051] Taking the first chip 135 as an optical sensor chip and the second chip 121 as a pressure sensor chip as an example, the method of using the utility model is explained. When in use, the second chip 121 is fixedly installed on the bottom wall of the second chamber 120, and the second chip 121 is located above the through hole 122. The first chip 135 is fixedly installed on the adapter plate 131, and the adapter plate 131 is fixed on the support platform 130. The first chip 135 and the second chip 121 are connected to the pads on the adapter plate 131 by wire bonding. The adapter plate 131 then exports the signal through the lead 132. After the upper cover plate 112 is buckled, a single packaged product is formed.

[0052] like Figure 1-Figure 7 As shown, in one embodiment of the MEMS packaging structure of the utility model,

[0053] Furthermore, the size of the first chamber 110 is greater than the size of the second chamber 120 .

[0054] Further, the cross-section of the first chamber 110 and the second chamber 120 includes a square.

[0055] Furthermore, the cross-section of the fixing groove 133 includes a trapezoidal shape and a T-shape.

[0056] Furthermore, a fixing groove 133 is provided on the surface of the support platform 130 , and a plurality of exhaust holes 111 are provided at intervals in the side wall of the first chamber 110 . The upper ends of the exhaust holes 111 pass upward through the upper surface of the side wall of the first chamber 110 , and the lower ends of the exhaust holes 111 are connected to the fixing groove 133 .

[0057] Furthermore, the adapter plate 131 is provided with a plurality of fixing holes 134 penetrating the adapter plate 131 at intervals, the fixing holes 134 are connected to the fixing grooves 133 , and the fixing holes 134 and the fixing grooves 133 are both filled with adhesive for bonding the adapter plate 131 .

[0058] Furthermore, a snap-fit ​​groove 113 is formed on the inner wall of the first chamber 110 , and the outer edge of the cover plate 112 is inserted into the snap-fit ​​groove 113 . The outer edge of the cover plate 112 is in close contact with the inner wall of the snap-fit ​​groove 113 .

[0059] Furthermore, a glass ring 123 is provided between the second chip 121 and the through hole 122 , the lower surface of the glass ring 123 is fixedly connected to the bottom wall of the second chamber 120 , and the upper surface of the glass ring 123 is fixedly connected to the second chip 121 .

[0060] Furthermore, the sealing ring 102 is made of elastic rubber.

[0061] In this embodiment, the size of the first chamber 110 is larger than that of the second chamber 120 , and the portion where the first chamber 110 and the second chamber 120 are connected forms a support platform 130 , and the surface of the support platform 130 is smooth, so as to better support the adapter plate 131 .

[0062] like Figure 4 As shown, the fixing groove 133 and the fixing hole 134 cooperate to bond and fix the adapter plate 131. The fixing groove 133 is connected to the fixing hole 134, and the fixing groove 133 is connected to the exhaust hole 111. When in use, after the adapter plate 131 is placed on the surface of the support table 130, the lower surface of the adapter plate 131 contacts the surface of the support table 130, as shown in FIG. Figure 5 As shown, adhesive is injected into the fixing hole 134, and the adhesive flows downward into the fixing groove 133. The air in the fixing groove 133 is smoothly discharged through the exhaust hole 111. The air pressure in the fixing groove 133 is always consistent with the outside, so that the adhesive can flow in smoothly.

[0063] It should be specially noted that the fixing groove 133 is arranged along the circumference of the support platform 130, that is, it is a closed ring. When the fixing groove 133 is fully injected with adhesive, the adhesive contacts the lower surface of the adapter plate 131 to form an annular bonding area, which on the one hand makes the adapter plate 131 more firmly bonded, and on the other hand is also conducive to the sealing between the adapter plate 131 and the support platform 130.

[0064] like Figure 2 and Figure 1 As shown, the cross-section of the fixing groove 133 includes a trapezoid and a T-shape. By adopting the trapezoidal and T-shaped cross-section design, when the adhesive is solidified, the fixing groove 133 and the adhesive can produce a better clamping and fixing effect, preventing the adhesive in the fixing groove 133 from escaping from the fixing groove 133, thereby improving the firmness of the fixing of the adapter plate 131.

[0065] In this embodiment, the snap-in groove 113 is arranged in a ring shape along the circumference direction of the first chamber 110. The snap-in groove 113 plays a good supporting and fixing role for the cover plate 112, so that the connection between the cover plate 112 and the first chamber 110 is more secure, and the cover plate 112 is prevented from shifting or falling off on the packaging carrier 100. Of course, adhesive can also be applied in the snap-in groove 113 to fix the cover plate 112 in the snap-in groove 113 by bonding.

[0066] In this embodiment, a glass ring 123 is further provided between the second chip 121 and the through hole 122 . The glass ring 123 has a good insulation effect, which prevents the second chip 121 from short circuiting, and helps to ensure the safety of the second chip 121 during operation.

[0067] like Figure 7 As shown, in this embodiment, the sealing ring 102 is made of elastic rubber. After the tube wall 200 is opened, the packaging carrier 100 is inserted into the hole, and the sealing ring 102 can contact the inner wall of the hole more tightly, thereby facilitating a better sealing effect between the sealing ring 102 and the inner wall of the hole.

[0068] Taking the first chip 135 as an optical sensor chip and the second chip 121 as a pressure sensor chip as an example, when in use, the glass ring 123 is fixed on the bottom wall of the second chamber 120, and the lower surface of the glass ring 123 is in close contact with the bottom wall of the second chamber 120 outside the through hole 122, and then the second chip 121 is fixed on the upper surface of the glass ring 123.

[0069] The first chip 135 is fixedly mounted on the adapter plate 131, and the adapter plate 131 is placed on the support platform 130, and adhesive is injected into the fixing hole 134, and the adhesive flows downward into the fixing groove 133, and the air in the fixing groove 133 is smoothly discharged through the exhaust hole 111. After the adhesive solidifies, the adhesive fixes the adapter plate 131 on the support platform 130.

[0070] The first chip 135 and the second chip 121 are connected to the pads on the adapter board 131 by wire bonding, and the adapter board 131 then outputs the signal through the wires 132. The cover plate 112 is buckled on the snap-fit ​​groove 113 so that the outer edge of the cover plate 112 is in close contact with the inner wall of the snap-fit ​​groove 113 to form a single packaged product.

[0071] Although the embodiments of the present invention have been shown and described, those skilled in the art will appreciate that various changes, modifications, substitutions and variations may be made to the embodiments without departing from the principles and spirit of the present invention, and that the scope of the present invention is defined by the claims and their equivalents.

Claims

1. A MEMS packaging structure, characterized in that: It includes: A packaging carrier (100), wherein the packaging carrier (100) is provided with a first chamber (110) and a second chamber (120) in sequence from top to bottom, the first chamber (110) and the second chamber (120) are connected, a through hole (122) is provided on the bottom wall of the second chamber (120), a support platform (130) is formed between the first chamber (110) and the second chamber (120), an adapter plate (131) is placed on the surface of the support platform (130), a lead (132) is electrically connected to the adapter plate (131), and the lead (132) extends freely after passing through the first chamber (110) upwards.

2. The MEMS packaging structure according to claim 1, characterized in that: The material of the packaging carrier (100) includes metal material.

3. The MEMS packaging structure according to claim 2, characterized in that: The first chamber (110) is provided with a matching cover plate (112), and the outer edge of the cover plate (112) is fixedly connected to the side wall of the first chamber (110).

4. The MEMS packaging structure according to claim 3, characterized in that: The cover plate (112) comprises a glass cover plate.

5. The MEMS packaging structure according to claim 4, characterized in that: The adapter board (131) is electrically connected to a first chip (135).

6. The MEMS packaging structure according to claim 1, characterized in that: A sealing groove (101) is provided on the outer wall of the packaging carrier (100), a sealing ring (102) is passed through the sealing groove (101), and the sealing ring (102) is in close contact with the inner wall of the sealing groove (101).

7. The MEMS packaging structure according to claim 6, characterized in that: A second chip (121) is disposed on the bottom wall of the second chamber (120), the through hole (122) cooperates with the second chip (121), and the second chip (121) is electrically connected to the adapter board (131).

8. The MEMS packaging structure according to claim 1, characterized in that: A fixing groove (133) is provided on the surface of the support platform (130), and a plurality of exhaust holes (111) are provided at intervals in the side wall of the first chamber (110). The upper ends of the exhaust holes (111) pass upward through the upper surface of the side wall of the first chamber (110), and the lower ends of the exhaust holes (111) are connected to the fixing groove (133).

9. The MEMS packaging structure according to claim 8, characterized in that: The adapter plate (131) is provided with a plurality of fixing holes (134) which penetrate the adapter plate (131) at intervals, the fixing holes (134) are communicated with the fixing grooves (133), and the fixing holes (134) and the fixing grooves (133) are both filled with adhesive for bonding the adapter plate (131).

10. The MEMS packaging structure according to claim 5, characterized in that: The inner wall of the first chamber (110) is provided with a clamping groove (113), the outer edge of the cover plate (112) is inserted into the clamping groove (113), and the outer edge of the cover plate (112) is in close contact with the inner wall of the clamping groove (113).

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