LED module with inverted injection molding waterproof structure

Through the design of the flip-filled injection molding structure and fixed bracket, the problems of poor holes and sealing during the injection molding of existing LED lamps are solved, and high waterproof performance and longer service life are achieved.

CN222783498UActive Publication Date: 2025-04-22SHENZHEN LINGBENYANG TECHNICAL CO LTD
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Patent Information

Application Number
CN202421735629.6
Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
Filing Date
2024-07-22
Publication Date
2025-04-22
Estimated Expiration
2034-07-22

AI Technical Summary

Technical Problem

Existing LED lamps are prone to holes during injection molding, which affects waterproof performance, and no glue is injected into the contact point between the wire and the lens, resulting in poor sealing.

Method used

Design a flip-flop injection molding structure, and set up injection molding sealing grooves at both ends of the LED lampshade. During injection molding, an injection molding sealing ring is formed to tightly adhere to the wires. A fixed bracket is set behind the PCB control board instead of the traditional mold thimble to ensure that the shell is completely sealed.

Benefits of technology

It realizes the high waterproof performance of the LED module, avoids the problem of water seepage, extends the product service life, and reduces the frequency and cost of replacement of bad lights.

✦ Generated by Eureka AI based on patent content.

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    Figure CN222783498U_ABST
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Abstract

The utility model discloses a light-emitting diode (LED) module with an inverted injection molding waterproof structure, which comprises an LED lampshade, a printed circuit board (PCB) control board, a lead, a fixed support and an injection molding piece, a cavity is arranged in the LED lampshade, and injection molding sealing grooves are respectively arranged at two ends of the cavity. The PCB control board is installed in the cavity, and the wire is welded to the PCB control board and extends out of the two sides of the injection molding sealing groove. The fixing support is installed on the PCB control board, a wire fixing groove is formed in the fixing support, and the wire is embedded in the wire fixing groove; and the injection molding part is filled in the cavity and the injection molding sealing groove to connect the LED lampshade, the PCB control board, the lead and the fixed bracket into a whole. The injection molding sealing rubber rings are formed at the two ends of the LED lampshade in an injection molding mode to adhere the wires, the PCB control board is fully sealed and separated from the outside, and the waterproof effect is achieved. In addition, the fixed support is adopted to replace an ejector pin in a traditional mold, the shell is completely sealed after injection molding and rubber coating of the product, no hole exists, and the waterproof grade of the product is enhanced.
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Description

Technical Field

[0001] The utility model relates to the technology of LED lamp field, in particular to an LED module with a flip-chip injection-molded waterproof structure. Background Art

[0002] At present, there are two types of products on the market: one is a forward full-package injection molding process, which is to put the PCB and lens in the mold first, and then lift the PCB control board through the ejector pin under the mold, and then perform injection molding and overmolding. The finished product will form a hole at the ejector pin of the mold, affecting the waterproof performance of the product; the other is a flip-chip injection molding process, which is to put the lens upside down in the mold first, and then put the PCB in. During injection molding, the ejector pin on the mold presses the PCB control board to prevent it from lifting, and then perform injection molding and overmolding. The finished product will also form a hole at the ejector pin of the mold, affecting the waterproof performance of the product. In addition, during injection molding, the wire is in direct contact with the lens. During injection molding, the glue cannot be injected into the place where the wire contacts the lens, and the sealing is poor, causing water to seep in from here during use, affecting the waterproof performance. Utility Model Content

[0003] In view of this, the utility model aims to solve the deficiencies in the prior art, and its main purpose is to provide an LED module with a flip-chip injection molding waterproof structure. The utility model forms an injection molding sealing rubber ring at both ends of the LED lampshade to bond the wires, thereby fully sealing and separating the PCB control board from the outside world to achieve a waterproof effect. In addition, a fixed bracket is used to replace the ejector pin in the traditional mold, so that the product shell is completely sealed after injection molding without any holes, thereby enhancing the waterproof level of the product.

[0004] In order to achieve the above purpose, the utility model adopts the following technical solutions:

[0005] An LED module with a flip-chip injection-molded waterproof structure comprises an LED lampshade, a PCB control board, a wire, a fixing bracket and an injection-molded part. The LED lampshade has a cavity for accommodating the PCB control board, and injection-molded sealing grooves are respectively arranged at both ends of the cavity; the PCB control board is installed in the cavity, and the wire is welded on the PCB control board and extends out from both sides of the injection-molded sealing groove; the fixing bracket is installed on the PCB control board, and a wire fixing groove for pressing and fixing the wire on the PCB control board is arranged on the fixing bracket, and the wire is embedded in the wire fixing groove; the injection-molded part is filled in the cavity and the injection-molded sealing groove to connect the LED lampshade, the PCB control board, the wire and the fixing bracket into one.

[0006] As a preferred solution: the injection molded part forms an injection molded sealing rubber ring in the injection molded sealing grooves on both sides of the LED lamp cover to isolate the wires from the outside.

[0007] As a preferred solution: both sides of the injection molding sealing groove are provided with wire outlets communicating with the cavity and the outside, and the wires extend from the wire outlets to the outside of the LED lampshade.

[0008] As a preferred solution: the inner side of the cavity is provided with a first positioning column and a second positioning column for cooperating with the PCB control board, and the diameter of the first positioning column is larger than that of the second positioning column; the PCB control board is provided with a first positioning hole and a second positioning hole corresponding to the first positioning column and the second positioning column; the first positioning column is inserted into the first positioning hole, and the second positioning column is inserted into the second positioning hole.

[0009] As a preferred solution: multiple groups of plug-in columns are arranged on the fixed bracket along the diagonal direction, and multiple groups of plug-in holes are arranged on the PCB control board corresponding to the multiple groups of plug-in columns, and the multiple groups of plug-in columns are correspondingly inserted into the multiple groups of plug-in holes.

[0010] As a preferred solution: a fool-proof socket is provided on one side of the LED lampshade.

[0011] As a preferred solution: the LED lamp cover includes a base and a plurality of lenses or PC covers arranged on the base, and the plurality of lenses or PC covers are formed correspondingly on the top of the cavity.

[0012] As a preferred solution: the fixing bracket includes a main body and a plurality of arc-shaped wire-fixing blocks integrally arranged on both sides of the main body, the plurality of arc-shaped wire-fixing blocks are arranged at intervals on the edges of both sides of the main body, and the wire-fixing groove is formed between the arc-shaped wire-fixing blocks and the main body.

[0013] As a preferred solution: the bottom of the fixing bracket extends out from the injection molded part, and the bottom of the fixing bracket is flush with the bottom of the LED lamp cover.

[0014] As a preferred solution: the injection molding sealing groove is a U-shaped groove.

[0015] Compared with the prior art, the utility model has obvious advantages and beneficial effects. Specifically, it can be seen from the above technical scheme that by designing injection sealing grooves at both ends of the LED lampshade, the injection sealing grooves can be filled with glue to form injection sealing rubber rings during injection molding. The injection sealing rubber rings tightly adhere to the wires, fully sealing and separating the PCB control board from the outside world, and playing a waterproof role; in addition, a fixed bracket is set behind the PCB control board to replace the ejector pin in the traditional mold, so that the product shell is completely sealed after injection molding and has no holes, so that the inside of the LED module is completely isolated from the outside world, achieving a high waterproof effect and enhancing the waterproof level of the product. Thereby, the service life of the product is extended, the replacement frequency of broken lamps is reduced, and the use cost is reduced.

[0016] In order to more clearly illustrate the structural features and effects of the present invention, it is described in detail below in conjunction with the accompanying drawings and specific embodiments. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] Figure 1 This is a three-dimensional schematic diagram of the LED module of the present utility model;

[0018] Figure 2 This is a three-dimensional schematic diagram of the LED module of the present invention from another perspective;

[0019] Figure 3 This is a top view schematic diagram of the LED module of the present utility model;

[0020] Figure 4 for Figure 3 AA section diagram;

[0021] Figure 5 for Figure 3 BB section diagram;

[0022] Figure 6 for Figure 3 A cross-sectional view at CC;

[0023] Figure 7 This is an exploded three-dimensional schematic diagram of the LED module of the present invention;

[0024] Figure 8 This is a schematic exploded perspective view of the LED module of the present invention from another perspective.

[0025] Description of the accompanying drawings:

[0026] 10. LED lampshade; 11. Cavity; 12. Injection molding sealing groove; 13. Wire outlet; 14. First positioning column; 15. Second positioning column; 16. Foolproofing jack; 17. Base; 18. Lens or PC cover; 20. PCB control board; 21. First positioning hole; 22. Second positioning hole; 23. Plug-in hole; 24. LED lamp bead; 30. Wire; 40. Fixed bracket; 41. Wire fixing groove; 42. Plug-in column; 43. Main body; 44. Arc-shaped wire fixing block; 50. Injection molding part; 51. Injection molding sealing rubber ring. DETAILED DESCRIPTION

[0027] The utility model Figures 1 to 8 As shown, an LED module with a flip-chip injection-molded waterproof structure includes an LED lampshade 10, a PCB control board 20, a wire 30, a fixing bracket 40 and an injection molded part 50, wherein:

[0028] This product is an LED light module string, which is used in the field of LED luminous characters or advertising light box lighting.

[0029] The LED lampshade 10 has an elliptical cavity 11 for accommodating the PCB control board 20. At both ends of the cavity 11, there are respectively provided injection sealing grooves 12 for injecting glue (injection molded part 50) during the overmolding of the injection mold. The injection sealing grooves 12 are used to fill the injection molding material to isolate the wire 30 from the outside and improve the waterproof performance of the LED module. The injection sealing grooves 12 are U-shaped grooves or grooves of other shapes, which are specifically designed according to actual conditions. The LED lampshade 10 includes a base 17 and a plurality of lenses or PC covers 18 arranged on the base 17. The plurality of lenses or PC covers 18 are formed correspondingly at the top of the cavity 11. A plurality of LED lamp beads 24 are arranged on the PCB control board 20 corresponding to the plurality of lenses or PC covers 18. A fool-proofing socket 16 is provided on one side of the LED lampshade 10, so that when the LED lampshade 10, the PCB control board 20 and the fixing bracket 40 are subsequently installed and placed in the injection mold, the fool-proofing socket 16 can be used to determine whether the left and right order when placed in the mold cavity is reversed, thereby achieving a fool-proofing effect.

[0030] The PCB control board 20 is embedded and installed in the cavity 11 of the LED lampshade 10. After the subsequent glue injection operation, the PCB control board 20 will be completely sealed in the cavity 11. The wire 30 is welded on the PCB control board 20 and extends from both sides of the injection molding sealing groove 12. A first positioning column 14 and a second positioning column 15 for matching with the PCB control board 20 are provided on the inner side of the cavity 11. The diameter of the first positioning column 14 is larger than that of the second positioning column 15. A first positioning hole 21 and a second positioning hole 22 are provided on the PCB control board 20 corresponding to the first positioning column 14 and the second positioning column 15. The first positioning column 14 is inserted into the first positioning hole 21, and the second positioning column 15 is inserted into the second positioning hole 22. The first positioning column 14 and the second positioning column 15 are designed to have different diameters, mainly to prevent the PCB control board 20 and the cavity 11 from being placed upside down during assembly, so as to achieve a foolproof effect. At the same time, the lens of the LED lamp cover 10 or the PC cover 18 and the LED lamp beads 24 on the PCB control board 20 can be more accurately aligned.

[0031] In addition, in order to prevent the PCB control board 20 from tilting during injection molding, a fixing bracket 40 is provided below the PCB control board 20. The fixing bracket 40 replaces the traditional fixing ejector pin during mold closing and injection molding, and can tightly fix the PCB control board 20 and the LED lamp cover 10 in the mold, so that no holes are generated at the bottom of the module after injection molding, which increases the waterproof performance of the product, achieves a sealing and waterproof effect, and increases the aesthetics of the product. The fixing bracket 40 can improve the protection level of the product, such as waterproof, dustproof, and anti-tilting of the wire 30.

[0032] The fixing bracket 40 is mounted on the PCB control board 20, and a fixing groove 41 for pressing and fixing the wire 30 on the PCB control board 20 is provided on the fixing bracket 40, and the wire 30 is embedded in the fixing groove 41. The fixing bracket 40 includes a body 43 and a plurality of arc-shaped fixing blocks 44 integrally arranged on both sides of the body 43, and the plurality of arc-shaped fixing blocks 44 are arranged at intervals on the edges of both sides of the body 43, and the fixing groove 41 is formed between the arc-shaped fixing blocks 44 and the body 43; when the fixing bracket 40 is assembled, the wire 30 is tightly pressed on the PCB control board 20 by the fixing groove 41, which can prevent the wire 30 from warping and leaking out of the wire skin during injection molding. A plurality of groups of plug-in posts 42 are arranged diagonally on the fixing bracket 40, and a plurality of groups of plug-in holes 23 are arranged corresponding to the plurality of groups of plug-in posts 42 on the PCB control board 20, and the plurality of groups of plug-in posts 42 are correspondingly inserted into the plurality of groups of plug-in holes 23; the diagonal distribution of the plurality of groups of plug-in posts 42 helps to combine the fixing bracket 40 with the PCB control board 20 more accurately and stably.

[0033] The injection molded part 50 is filled in the cavity 11 and the injection molding sealing groove 12 to connect the LED lampshade 10, the PCB control board 20, the wire 30 and the fixing bracket 40 into one. The injection molded part 50 forms an injection molding sealing rubber ring 51 in the injection molding sealing groove 12 on both sides of the LED lampshade 10 to isolate the wire 30 from the outside, tightly wrap the wire 30 to completely isolate it from the outside, and increase the waterproof effect here. Specifically, when the product is overmolded, the glue is injected into the injection molding sealing groove 12 to form an injection molding sealing rubber ring 51 to completely seal the wire 30 to isolate it from the outside. And on both sides of the injection molding sealing groove 12, there are outlets 13 connecting the cavity 11 and the outside, and the wire 30 extends from the outlet 13 to the outside of the LED lampshade 10. In addition, the bottom of the fixing bracket 40 extends out from the injection molded part 50, which is equivalent to embedding the bottom of the fixing bracket 40 into the injection molded part 50, which can improve the tightness of the combination of the two, thereby improving the overall structural stability of the product; and the bottom of the fixing bracket 40 is flush with the bottom of the LED lamp cover 10, making the product installation more convenient.

[0034] The production process of the LED module is as follows: first, the LED lamp beads 24 and other components are soldered on the PCB control board 20 through solder paste, and then the wires 30 are soldered on both ends of the PCB control board 20 through solder wire to form a semi-finished PCBA; then the LED lampshade 10 is placed in the mold, and the PCBA is placed in the cavity 11 of the LED lampshade 10, and the first and second positioning holes 22 of the PCB control board 20 and the first and second positioning columns 15 of the lens need to be matched one by one during the placement; then the fixing bracket 40 is directly placed on the PCBA, and the plug-in columns 42 of the fixing bracket 40 and the plug-in holes 23 of the PCB control board 20 need to be matched one by one during the placement; finally, the semi-finished product with the LED lampshade 10, PCBA and fixing bracket 40 installed is encapsulated and injection molded through the injection molding part 50 (glue) to form an LED module product.

[0035] The design focus of the utility model is that by designing injection sealing grooves at both ends of the LED lampshade, the injection sealing grooves can be filled with glue to form injection sealing rubber rings during injection molding. The injection sealing rubber rings tightly adhere to the wires, fully sealing and separating the PCB control board from the outside world, and playing a waterproof role; in addition, a fixed bracket is set behind the PCB control board to replace the ejector pin in the traditional mold, so that the product shell is completely sealed after injection molding without any holes, so that the inside of the LED module is completely isolated from the outside world, achieving a high waterproof effect and enhancing the waterproof level of the product. Thereby, the service life of the product is extended, the replacement frequency of broken lamps is reduced, and the use cost is reduced.

[0036] The above description is only a preferred embodiment of the present invention and does not limit the technical scope of the present invention. Therefore, any slight modifications, equivalent changes and modifications made to the above embodiments based on the technical essence of the present invention are still within the scope of the technical solution of the present invention.

Claims

1. An LED module with a flip-chip injection-molded waterproof structure, characterized in that: The invention comprises an LED lampshade, a PCB control board, a wire, a fixing bracket and an injection molded part. The LED lampshade has a cavity for accommodating the PCB control board, and injection molding sealing grooves are respectively arranged at both ends of the cavity; the PCB control board is installed in the cavity, and the wire is welded on the PCB control board and extends out from both sides of the injection molding sealing groove; the fixing bracket is installed on the PCB control board, and a wire fixing groove for pressing and fixing the wire on the PCB control board is arranged on the fixing bracket, and the wire is embedded in the wire fixing groove; the injection molded part is filled in the cavity and the injection molding sealing groove to connect the LED lampshade, the PCB control board, the wire and the fixing bracket into one.

2. The LED module with a flip-chip injection-molded waterproof structure according to claim 1, characterized in that: The injection molded part forms an injection molded sealing rubber ring in the injection molded sealing grooves on both sides of the LED lamp cover to isolate the wires from the outside.

3. The LED module with a flip-chip injection-molded waterproof structure according to claim 1, characterized in that: Wire outlets communicating with the cavity and the outside are arranged on both sides of the injection molding sealing groove, and the wires extend out of the LED lampshade from the wire outlets.

4. The LED module with a flip-chip injection-molded waterproof structure according to claim 1, characterized in that: The inner side of the cavity is provided with a first positioning column and a second positioning column for cooperating with the PCB control board, and the diameter of the first positioning column is larger than that of the second positioning column; the PCB control board is provided with a first positioning hole and a second positioning hole corresponding to the first positioning column and the second positioning column; the first positioning column is inserted into the first positioning hole, and the second positioning column is inserted into the second positioning hole.

5. The LED module with a flip-chip injection-molded waterproof structure according to claim 1, characterized in that: A plurality of groups of plug-in posts are arranged on the fixed bracket along the diagonal direction, and a plurality of groups of plug-in holes are arranged on the PCB control board corresponding to the plurality of groups of plug-in posts, and the plurality of groups of plug-in posts are correspondingly inserted into the plurality of groups of plug-in holes.

6. The LED module with a flip-chip injection-molded waterproof structure according to claim 1, characterized in that: A fool-proof socket is arranged on one side of the LED lamp cover.

7. The LED module with a flip-chip injection-molded waterproof structure according to claim 1, characterized in that: The LED lamp cover comprises a base and a plurality of lenses or PC covers arranged on the base, and the plurality of lenses or PC covers are formed correspondingly on the top of the cavity.

8. The LED module with a flip-chip injection-molded waterproof structure according to claim 1, characterized in that: The fixing bracket includes a body and a plurality of arc-shaped wire-fixing blocks integrally arranged on both sides of the body. The plurality of arc-shaped wire-fixing blocks are arranged at intervals on the edges of both sides of the body, and the wire-fixing grooves are formed between the arc-shaped wire-fixing blocks and the body.

9. The LED module with a flip-chip injection-molded waterproof structure according to claim 1, characterized in that: The bottom of the fixing bracket extends out from the injection molded part, and the bottom of the fixing bracket is flush with the bottom of the LED lamp cover.

10. The LED module with a flip-chip injection-molded waterproof structure according to claim 1, characterized in that: The injection molding sealing groove is a U-shaped groove.