Sintering bearing plate for sintering ceramic electronic component

Abstract

The utility model discloses a setter plate for sintering ceramic electronic components, which comprises a plate body which is of a three-layer composite structure and comprises a zirconium oxide layer, a silicon carbide layer and an aluminum oxide layer from top to bottom. The zirconium oxide layer is a burning bearing layer, a plurality of ribs are uniformly arranged on the surface of the zirconium oxide layer at intervals, the tops of the ribs are arc-shaped, and the two side edges of the ribs are sunken inwards to form a shape with wide upper and lower parts and narrow middle parts; notches are evenly formed in each rib in the length direction of the rib at intervals, and each notch is in a big-end-up wedge shape. A protective baffle perpendicular to the burning bearing layer is arranged on the periphery of the edge of the burning bearing layer; the silicon carbide layer is a supporting layer, the bearing capacity is high, the corrosion resistance is good, the hardness is high, the service life is long, the contact area with ceramic electronic components is small, the air permeability is good, and the ceramic electronic components of different shapes can be borne.

Description

Technical Field

[0001] The utility model relates to the technical field of auxiliary tools for sintering ceramic electronic components, in particular to a sintering plate for sintering ceramic electronic components. Background Art

[0002] Generally, ceramic electronic components are manufactured by adding a sintering agent and a forming agent to ceramic powder to form an unfired component, which is then placed on a support plate and loaded into a sintering furnace to be sintered while controlling the furnace environment under specified temperature and atmosphere conditions.

[0003] Chinese patent CN216205336U discloses a ceramic support plate, which is provided with a plurality of grooves and is only suitable for sintering ceramic tubes, ceramic rods, ceramic columns and the like, but not suitable for sintering ceramic electronic components of other shapes.

[0004] Chinese patent CN204555699U discloses a ceramic firing plate. The bottom plate in this patent has a simple structure. After carrying heavy objects for a long time, the middle part of the bottom plate is prone to collapse downward. In addition, the bottom plate structure of this patent has a large contact area with the ceramic electronic components, which will cause uneven atmosphere during the firing of the electronic components and fail to meet the air permeability requirements for the firing of the electronic components. Utility Model Content

[0005] The utility model aims to provide a sintering plate for sintering ceramic electronic components.

[0006] The innovation of the utility model lies in that the utility model has strong carrying capacity, good corrosion resistance, high hardness, long service life, small contact area with ceramic electronic components, good air permeability, and can carry ceramic electronic components of different shapes.

[0007] In order to achieve the above utility model purpose, the technical solution of the utility model is:

[0008] A sintering plate for ceramic electronic components, comprising a plate body, which is a three-layer composite structure, including a zirconium oxide layer, a silicon carbide layer and an aluminum oxide layer from top to bottom; the zirconium oxide layer is a sintering layer, and a plurality of ribs are evenly arranged on the surface, the top of the rib is arc-shaped, and the two sides of the rib are concave inward, forming a shape that is wide at the top and bottom and narrow in the middle; notches are evenly arranged on each rib along its length, and the notches are wedge-shaped with larger top and smaller bottom; a protective baffle is arranged perpendicular to the edge of the sintering layer; the silicon carbide layer is a supporting layer with a thickness of 1-2 cm; the aluminum oxide layer is a non-sintering layer, and a cross-shaped reinforcing rib is arranged on the bottom; the ends of the reinforcing rib extend downward to form a supporting leg perpendicular to the non-sintering layer.

[0009] Furthermore, the height of the protective baffle is 1-2 cm higher than the top of the rib.

[0010] Furthermore, the notches on adjacent ribs are arranged in a staggered manner; and the sum of the top lengths of all the notches on the same rib is not less than 1 / 2 of the rib length.

[0011] Furthermore, the positions of the notches on adjacent ribs are arranged correspondingly; and the sum of the top lengths of all the notches on the same rib is not less than 1 / 2 of the length of the rib.

[0012] The beneficial effects of the utility model are:

[0013] First: The plate body of the present application is a three-layer composite structure. The silicon carbide layer is the supporting layer, which has strong load-bearing capacity and good thermal conductivity. Cross-shaped reinforcement ribs are arranged on the bottom surface of the non-fired layer, which can further enhance the load-bearing capacity of the plate body, prevent the plate body from collapsing downward, and extend the service life of the plate body; the zirconium oxide layer is the fired layer, which has good corrosion resistance, high hardness and wear resistance.

[0014] Second: ribs are arranged on the firing layer. The ribs are wide at the top and bottom, narrow in the middle, and the top of the ribs is arc-shaped, which can reduce the contact area with ceramic electronic components. The lower part has a large contact area with the bearing surface, has good connection stability, is concave inward in the middle, and has good air permeability.

[0015] Third: the gaps are evenly spaced along the length direction of the ribs, which can further reduce the contact area with the ceramic electronic components on the one hand, and can carry ceramic electronic components of different shapes on the other hand. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] Figure 1 It is a schematic diagram of the structure of the utility model.

[0017] Figure 2 It is a side view of the utility model.

[0018] Figure 3 It is a bottom view of the utility model.

[0019] In the figure: 10 is a plate body, 11 is a burning layer, 12 is a supporting layer, 13 is a non-burning layer, 20 is a rib, 21 is a notch, 30 is a protective baffle, 40 is a reinforcing rib, and 41 is a leg. DETAILED DESCRIPTION

[0020] The technical solutions in the embodiments of the present utility model will be described clearly and completely below in conjunction with the accompanying drawings.

[0021] A sintering plate for ceramic electronic components, comprising a plate body 10, wherein the plate body 10 is a three-layer composite structure, comprising a zirconium oxide layer, a silicon carbide layer and an aluminum oxide layer from top to bottom; the zirconium oxide layer is a sintering layer 11, and a plurality of ribs 20 are evenly arranged on the surface, the top of the rib 20 is arc-shaped, and the two sides of the rib 20 are concave inward, forming a shape that is wide at the top and bottom and narrow in the middle; notches 21 are evenly arranged on each rib 20 along its length, and the notches 21 are wedge-shaped with a larger top and a smaller bottom; a protective baffle 30 perpendicular to the sintering layer 11 is arranged around the edge of the sintering layer 11; the silicon carbide layer is a supporting layer 12 with a thickness of 1-2 cm; the aluminum oxide layer is a non-sintering layer 13, and a cross-shaped reinforcing rib 40 is arranged on the bottom; the ends of the reinforcing rib 40 extend downward to form a supporting leg 41 perpendicular to the non-sintering layer 13.

[0022] Furthermore, electronic components such as ceramic tubes, ceramic rods or ceramic columns can be carried between adjacent ribs 20; and because the notches 21 are provided on the ribs 20, the contact surface with the ceramic tubes, ceramic rods or ceramic columns can be further reduced, and the air permeability is good.

[0023] Furthermore, the plate body 10 can also carry electronic components of various shapes such as ceramic rings and ceramic sheets, with a small contact surface and good air permeability.

[0024] Furthermore, the height of the protective baffle 30 is 1-2 cm higher than the top of the rib 20 .

[0025] Furthermore, the notches 21 on adjacent ribs 20 are arranged in a staggered manner; the sum of the top lengths of all the notches 21 on the same rib 20 is not less than 1 / 2 of the length of the rib 20 .

[0026] Furthermore, the positions of the notches 21 on the adjacent ribs 20 are arranged correspondingly; the sum of the top lengths of all the notches 21 on the same rib 20 is not less than 1 / 2 of the rib length.

[0027] The described embodiments are only some embodiments of the utility model, not all embodiments. Based on the embodiments of the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.

Claims

1. A sintering plate for ceramic electronic components, comprising a plate body (10), characterized in that: The plate body (10) is a three-layer composite structure, comprising a zirconium oxide layer, a silicon carbide layer and an aluminum oxide layer from top to bottom; the zirconium oxide layer is a firing layer (11), and a plurality of ribs (20) are evenly spaced on the surface, the top of the rib (20) is arc-shaped, and the two sides of the rib (20) are concave inward, forming a shape that is wide at the top and narrow in the middle; each rib (20) is evenly spaced along its length, and the notches (21) are wedge-shaped, larger at the top and smaller at the bottom; a protective baffle (30) is arranged perpendicular to the firing layer (11) around the edge; the silicon carbide layer is a supporting layer (12) with a thickness of 1-2 cm; the aluminum oxide layer is a non-fired layer (13), and a cross-shaped reinforcing rib (40) is arranged on the bottom; the ends of the reinforcing ribs (40) extend downward to form supporting legs (41) perpendicular to the non-fired layer (13).

2. A setter plate for sintering ceramic electronic components according to claim 1, characterized in that: The height of the protective baffle (30) is 1-2 cm higher than the top of the rib (20).

3. A setter plate for sintering ceramic electronic components according to claim 1, characterized in that: The notches (21) on adjacent ribs (20) are arranged in a staggered manner; the sum of the top lengths of all the notches (21) on the same rib (20) is not less than 1 / 2 of the length of the rib (20).

4. A setter plate for sintering ceramic electronic components according to claim 1, characterized in that: The positions of the notches (21) on the adjacent ribs (20) are arranged correspondingly; the sum of the top lengths of all the notches (21) on the same rib (20) is not less than 1 / 2 of the rib length.

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