Fixing device for thermal resistance measurement

Abstract

The utility model relates to a fixing device for thermal resistance measurement. The fixing device comprises a base provided with a heat dissipation structure and a fixing assembly installed on the base. The fixing assembly comprises a fixing base installed on the base, a cover plate installed on the fixing base and a pressing mechanism installed on the cover plate. A cavity used for containing a semiconductor device is defined by the fixing base and the base, and the cover plate covers the cavity. The pressing mechanism comprises a plurality of pressing pieces evenly distributed on the cover plate and pressure sensors installed at the ends, close to the base, of the pressing pieces. The pressing piece is movably connected with the cover plate, and the distance between the pressing piece and the base can be adjusted. The pressing pieces are uniformly distributed on the cover plate, pressure is applied to a plurality of different positions of the semiconductor device, the pressure is uniformly distributed on the surface of the semiconductor device, the pressure on the surface of the semiconductor device is uniform in the testing process, and the accuracy and repeatability of a testing result are improved.

Description

Technical Field

[0001] The utility model relates to the field of testing tools, and more specifically to a fixing device for measuring thermal resistance. Background Art

[0002] The heat generated by semiconductor devices during operation will continue to increase, causing their junction temperature to rise, which in turn leads to reduced reliability and shortened life. In order to accurately evaluate its reliability, it is particularly important to test the thermal resistance of power devices.

[0003] When measuring the thermal resistance of semiconductor devices, a fixture is required to press the semiconductor devices onto a heat dissipation platform. After the semiconductor device is pressed, the force on its surface will have a significant impact on the measurement results. Although the existing fixture will perform pressure detection through a pressure sensor when pressing the semiconductor device, it is difficult to ensure the consistency of the position and size of the pressure on the device because there is only one force point or the force is unevenly distributed. In addition to the low repeatability of the test results, it is also easy to damage the device. Utility Model Content

[0004] In order to overcome the problem of uneven force when a semiconductor device is fixed in the prior art, the utility model provides a fixing device for thermal resistance measurement, which can fix the semiconductor device and make its surface subject to uniform pressure.

[0005] In order to solve the above technical problems, the technical solution adopted by the utility model is: a fixing device for thermal resistance measurement, comprising a base provided with a heat dissipation structure and a fixing assembly installed on the base; the fixing assembly comprises a fixing seat installed on the base, a cover plate installed on the fixing seat and a clamping mechanism installed on the cover plate; the fixing seat and the base form a cavity for accommodating semiconductor devices, and the cover plate covers the cavity; the clamping mechanism comprises a plurality of clamping members evenly distributed on the cover plate and a pressure sensor installed on the clamping member near one end of the base; the clamping member is movably connected to the cover plate and the distance between the clamping member and the base can be adjusted.

[0006] In the above technical solution, the semiconductor device is placed in the cavity, and silicone grease for heat conduction is applied between the bottom surface of the semiconductor device and the top surface of the base. After the semiconductor device is placed, the cavity is covered by a cover plate, and the cover plate does not press the semiconductor device. At this time, the distance from the base is adjusted by adjusting the clamping member to move relative to the cover plate so that the clamping member can press the semiconductor device. Each clamping member is individually adjusted and the pressure can be confirmed by a pressure sensor individually, so that each clamping member gives the same pressure to the semiconductor device, and the clamping members are evenly distributed on the cover plate, giving pressure to the semiconductor device at multiple different positions and these pressures are evenly distributed on the surface of the semiconductor device.

[0007] Preferably, the fixing assembly further comprises a first connecting frame and a second connecting frame, wherein the first connecting frame is located on the top surface of the cover plate, and the pressing members are all movably connected to the first connecting frame; the second connecting frame is located on the bottom surface of the cover plate and is connected to the pressure sensor. Adding the connecting frame helps to disperse the force when applying the force, and the force is changed from a point to a surface, which helps to achieve uniform force on the surface of the semiconductor device.

[0008] Preferably, the first connecting frame and the second connecting frame are both X-shaped, which can ensure that the pressure is applied in sequence along the diagonal direction of the surface of the semiconductor device, thereby helping to achieve uniform force on the device surface while avoiding unnecessary damage to the surface of the semiconductor device.

[0009] Preferably, one side of the cover is rotatably connected to the fixing seat, and the other side is buckled connected to the fixing seat. When the cover is opened to expose the cavity, the cover and the fixing seat are still in a connected state. When the cover needs to be closed, the cover is rotated and the cover is engaged with the fixing seat. When the cover needs to be opened, the buckle is released and the cover is rotated to reset the cover. Regardless of the state, the cover and the fixing seat are in a connected state, which is convenient for operation and reduces scattered components.

[0010] Preferably, a through portion is provided on one side of the fixing seat close to the base, and the through portion is used for silicone grease to overflow. When the semiconductor device is pressed, the silicone grease can overflow through the through portion to avoid the accumulation of silicone grease, which causes the bottom surface of the semiconductor device to be uneven and causes uneven pressure.

[0011] Preferably, the heat dissipation structure includes a cooling pipe disposed in the base, and the water inlet and outlet of the cooling pipe extend outside the base. By injecting coolant into the water inlet of the cooling pipe, the base can take away the heat generated by the semiconductor device, simulating the use of the semiconductor device.

[0012] Preferably, it also includes a pin connection seat connected to one side of the base, wherein the pin connection seat is provided with a connection port and a socket for connecting with the pin of the semiconductor device. The semiconductor device pin is connected through the socket of the pin connection seat, and then the external connection is completed through the connection port, so that the connection of the semiconductor device can be completed quickly, thereby improving the test efficiency.

[0013] Preferably, the wiring ports include a gate test wiring port, a drain test wiring port, a source power wiring port and a drain power wiring port, all of which are located on the top surface of the pin wiring seat, the gate test wiring port, the drain test wiring port and the source power wiring port are located on one side of the top surface of the pin wiring seat, and the drain power wiring port is located on the other side of the top surface of the pin wiring seat. The wiring ports are all arranged on the top surface to facilitate wiring operations.

[0014] Preferably, a docking portion is provided on one side of the base, and the pin terminal block is provided with a docking groove matching the docking portion. The pin terminal block can be installed on the base through the cooperation of the docking groove and the docking portion, so that the pin terminal block can maintain a stable state during use, ensuring that the wiring of the semiconductor device will not be disconnected. At the same time, the docking portion and the docking groove are not completely fixed, which can facilitate the replacement of the pin terminal block. When testing semiconductor devices of different models, the matching pin terminal block can be easily replaced.

[0015] Preferably, a ceramic sheet is also included for placement in the cavity. Compared with the prior art, the utility model has the following beneficial effects: the pressing members are evenly distributed on the cover plate, applying pressures at multiple different positions of the semiconductor device and the pressures are evenly distributed on the surface of the semiconductor device, and the surface pressure of the semiconductor device is even during the test, thereby improving the accuracy and repeatability of the test results. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] Figure 1 This is a structural schematic diagram of Embodiment 1 of a fixing device for thermal resistance measurement of the utility model;

[0017] Figure 2 This is a schematic diagram of the structure of a clamping mechanism of a fixing device for thermal resistance measurement of the utility model;

[0018] Figure 3 A schematic diagram of the working condition of a fixing device for thermal resistance measurement of the utility model;

[0019] Figure 4 It is a structural schematic diagram of another embodiment of a fixing device for thermal resistance measurement of the utility model;

[0020] Figure 5 This is a schematic diagram of the structure of a base of a fixing device for thermal resistance measurement according to the utility model;

[0021] Figure 6 The utility model is a schematic diagram of the structure of a pin connection socket of a fixing device for thermal resistance measurement. DETAILED DESCRIPTION

[0022] The drawings are only for illustrative purposes and cannot be construed as limiting the present invention. To better illustrate the present embodiment, some parts of the drawings may be omitted, enlarged, or reduced, and do not represent the size of the actual product. For those skilled in the art, it is understandable that some well-known structures and their descriptions may be omitted in the drawings. The positional relationships described in the drawings are only for illustrative purposes and cannot be construed as limiting the present invention.

[0023] The same or similar numbers in the drawings of the embodiments of the present invention correspond to the same or similar parts; in the description of the present invention, it should be understood that if the terms "upper", "lower", "left", "right", "long", "short" and the like indicate directions or positional relationships based on the directions or positional relationships shown in the drawings, they are only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific direction, be constructed and operated in a specific direction. Therefore, the terms describing the positional relationship in the drawings are only used for illustrative purposes and cannot be understood as limitations on this patent. For ordinary technicians in this field, the specific meanings of the above terms can be understood according to specific circumstances.

[0024] The technical solution of the present invention is further described in detail below through specific embodiments and in conjunction with the accompanying drawings:

[0025] Example 1

[0026] like Figure 1-4 The embodiment 1 of a fixing device for measuring thermal resistance is shown, comprising a base 1 provided with a heat dissipation structure and a fixing assembly mounted on the base 1; the fixing assembly comprises a fixing seat 2 mounted on the base 1, a cover plate 3 mounted on the fixing seat 2 and a clamping mechanism 4 mounted on the cover plate 3; the fixing seat 2 and the base 1 enclose a cavity for accommodating semiconductor devices, and the cover plate 3 covers the cavity; the clamping mechanism 4 comprises a plurality of clamping members 401 evenly distributed on the cover plate 3 and a pressure sensor 402 mounted on the clamping member 401 near one end of the base 1; the clamping member 401 is movably connected to the cover plate 3 and the distance between the clamping member 401 and the base 1 can be adjusted. The clamping member 401 can be a bolt, which is connected to the cover plate 3 by a threaded connection. The base 1 is fixed on a desktop or other supporting object by a fastener 103.

[0027] Specifically, the fixing assembly also includes a first connecting frame 403 and a second connecting frame 404. The first connecting frame 403 is located on the top surface of the cover plate 3, and the pressing member 401 is movably connected to the first connecting frame 403; the second connecting frame 404 is located on the bottom surface of the cover plate 3 and is connected to the pressure sensor 402. The first connecting frame 403 and the second connecting frame 404 are both X-shaped. By adding a connecting frame, it is helpful to disperse the force when applying the force, and the force is changed from a point to a surface, which helps to achieve uniform force on the surface of the semiconductor device. The X-shaped connecting frame can ensure that the pressure is applied in sequence along the diagonal direction of the surface of the semiconductor device, which helps to achieve uniform force on the surface of the device while avoiding unnecessary damage to the surface of the semiconductor device. In this embodiment, the second connecting frame 404 can be rotatably connected to the pressure sensor 402, or the pressure sensor 402 can be rotatably connected to the pressing member 401. When the pressing member 401 is tightened, the pressure sensor 402 rotates relative to the pressing member 401.

[0028] One side of the cover plate 3 is rotatably connected to the fixing seat 2, and the other side is snap-connected to the fixing seat 2. When the cover plate 3 is opened to expose the cavity, the cover plate 3 and the fixing seat 2 are still in a connected state. When the cover plate 3 needs to be closed, the cover plate 3 is rotated and snap-connected with the fixing seat 2. When the cover plate 3 needs to be opened, the snap is released and the cover plate 3 is rotated to reset the cover plate 3. Regardless of the state, the cover plate 3 and the fixing seat 2 are in a connected state, which is convenient for operation and reduces scattered parts. In this embodiment, a torsion spring is provided at the rotation connection between the cover plate 3 and the fixing seat 2, and the elastic force of the torsion spring can automatically reset the cover plate 3 to the open state. A rotating snap 202 is provided on the fixing seat 2 to snap-connect with the cover plate 3, and the rotating snap can be replaced with other snap connection forms.

[0029] Furthermore, a through portion 201 is provided on one side of the fixing seat 2 close to the base 1, and the through portion 201 is used for the silicone grease to overflow. When the semiconductor device is pressed, the silicone grease can overflow through the through portion 201, thereby preventing the accumulation of silicone grease from causing the bottom surface of the semiconductor device to be uneven and causing uneven pressure. In this embodiment, the through portions 201 are distributed on each side of the fixing seat 2. Since the fixing seat 2 needs to avoid the pins of the semiconductor device, the fixing seat 2 has only three sides.

[0030] The working principle or workflow of this embodiment is as follows: the semiconductor device 8 is placed in the cavity, and silicone grease for heat conduction is applied between the bottom surface of the semiconductor device 8 and the top surface of the base 1. After the semiconductor device 8 is placed, the cavity is covered by the cover plate 3, and the cover plate 3 does not press the semiconductor device. At this time, the distance from the base 1 is adjusted by adjusting the clamping member 401 to move it relative to the cover plate 3 so that the clamping member 401 can press the semiconductor device. Among them, each clamping member 401 is adjusted individually and the pressure can be confirmed individually by the pressure sensor 402, so that each clamping member 401 gives the same pressure to the semiconductor device 8, and the clamping members 401 are evenly distributed on the cover plate 3, giving pressure to the semiconductor device 8 at multiple different positions, and these pressures are evenly distributed on the surface of the semiconductor device 8.

[0031] Beneficial effects of this embodiment: the clamping members 401 are evenly distributed on the cover plate 3, applying pressure to the semiconductor device at multiple different positions and at the same time these pressures are evenly distributed on the surface of the semiconductor device. During the test, the surface pressure of the semiconductor device is uniform, which improves the accuracy and repeatability of the test results.

[0032] Example 2

[0033] Embodiment 2 of a fixture for thermal resistance measurement, such as Figure 2-6 As shown, it includes a base 1 provided with a heat dissipation structure, a fixing component mounted on the base 1 and a pin terminal block 5 connected to one side of the base 1; the fixing component includes a fixing base 2 mounted on the base 1, a cover plate 3 mounted on the fixing base 2 and a clamping mechanism 4 mounted on the cover plate 3; the fixing base 2 and the base 1 enclose a cavity for accommodating semiconductor devices, and the cover plate 3 covers the cavity; the clamping mechanism 4 includes a plurality of clamping members 401 evenly distributed on the cover plate 3 and a pressure sensor 402 mounted on the clamping member 401 near one end of the base 1; the clamping member 401 is movably connected to the cover plate 3 and the distance between the clamping member 401 and the base 1 can be adjusted. The clamping member 401 can be a bolt connected to the cover plate 3 by a threaded connection. The pin terminal block 5 is provided with a wiring port 6 and a socket 501 for connecting with the pins of the semiconductor device.

[0034] Specifically, the fixing assembly further includes a first connecting frame 403 and a second connecting frame 404. The first connecting frame 403 is located on the top surface of the cover plate 3, and the pressing members 401 are movably connected to the first connecting frame 403. The second connecting frame 404 is located on the bottom surface of the cover plate 3 and is connected to the pressure sensor 402. Preferably, the first connecting frame 403 and the second connecting frame 404 are both X-shaped.

[0035] The heat dissipation structure includes a cooling pipe 101 disposed in the base 1, and the water inlet and outlet of the cooling pipe 101 extend outside the base 1. By injecting coolant into the water inlet of the cooling pipe 101, the base 1 can take away the heat generated by the semiconductor device, simulating the use of the semiconductor device.

[0036] In this embodiment, the connection port 6 includes a gate test connection port 601, a drain test connection port 602, a source power connection port 603 and a drain power connection port 604, all of which are located on the top surface of the pin connection holder 5. The gate test connection port 601, the drain test connection port 602 and the source power connection port 603 are located on one side of the top surface of the pin connection holder 5, and the drain power connection port 604 is located on the other side of the top surface of the pin connection holder 5. The connection ports 6 are all arranged on the top surface for easy connection operation.

[0037] Furthermore, a docking portion 102 is provided on one side of the base 1, and a docking groove 502 matching the docking portion 102 is provided on the pin terminal holder 5. The pin terminal holder 5 can be installed on the base 1 through the cooperation of the docking groove 502 and the docking portion 102, so that the pin terminal holder 5 can maintain a stable state when in use, ensuring that the wiring of the semiconductor device will not be disconnected. At the same time, the docking portion 102 and the docking groove 502 are not completely fixed, which can facilitate the replacement of the pin terminal holder 5. When testing semiconductor devices of different models, the matching pin terminal holder 5 can be easily replaced.

[0038] The working principle or workflow of this embodiment is as follows: the semiconductor device 8 is placed in the cavity, and silicone grease for heat conduction is applied between the bottom surface of the semiconductor device 8 and the top surface of the base 1. After the semiconductor device 8 is placed, the cavity is covered by the cover plate 3, and the cover plate 3 does not press the semiconductor device 8. At this time, the distance from the base 1 is adjusted by adjusting the pressing member 401 to move relative to the cover plate 3, so that the pressing member 401 can press the semiconductor device. Among them, each pressing member 401 is adjusted separately and the pressure can be confirmed separately by the pressure sensor 402, so that each pressing member 401 gives the same pressure to the semiconductor device 8, and the pressing members 401 are evenly distributed on the cover plate 3, giving pressure to multiple different positions of the semiconductor device 8, and these pressures are evenly distributed on the surface of the semiconductor device. After the semiconductor device 8 is pressed, the socket 501 of the pin terminal block 5 is connected to the pin of the semiconductor device 8, and then the pin terminal block 5 is connected and fixed to the base 1 through the cooperation between the docking groove 502 and the docking part 102, and finally the wiring is completed through the wiring port 6 to start testing the semiconductor device 8.

[0039] Beneficial effects of this embodiment: the pressing members 401 are evenly distributed on the cover plate 3, giving pressure to the semiconductor device at multiple different positions and the pressure is evenly distributed on the surface of the semiconductor device. During the test, the surface pressure of the semiconductor device is even, which improves the accuracy and repeatability of the test results. By designing a pin terminal block 5 that is easy to disassemble and replace, the unused pin terminal block 5 can be replaced according to the different models of the semiconductor device, which makes it easier to connect the semiconductor device and improves the adaptability of the fixing device.

[0040] Example 3

[0041] Embodiment 3 of a fixing device for measuring thermal resistance, based on Embodiment 1 and Embodiment 2, the fixing device of this embodiment further includes a ceramic sheet 7 for being placed in the cavity.

[0042] In this embodiment, after a small amount of thermally conductive silicone grease is evenly applied to the top surface of the base 1, the ceramic sheet 75 is placed on the top surface of the base 1 and on the silicone grease, and then a layer of thermally conductive silicone grease is evenly applied to the surface of the ceramic sheet 7, and finally the semiconductor device is placed on the surface of the ceramic sheet 7 and on the silicone grease. If the metal back plate of the semiconductor device is connected to the pins, it is necessary to place a ceramic sheet to achieve electrical insulation between the semiconductor device and the base. The thermally conductive silicone grease covered on both sides of the ceramic sheet helps to conduct the heat generated by the semiconductor device to the base by improving the contact method.

[0043] Obviously, the above embodiments of the utility model are only examples for clearly explaining the utility model, and are not intended to limit the implementation methods of the utility model. For ordinary technicians in the relevant field, other different forms of changes or modifications can be made on the basis of the above description. It is not necessary and impossible to list all the implementation methods here. Any modifications, equivalent substitutions and improvements made within the spirit and principles of the utility model should be included in the protection scope of the claims of the utility model.

Claims

1. A fixture for thermal resistance measurement, characterized in that: The invention comprises a base (1) provided with a heat dissipation structure and a fixing assembly mounted on the base (1); the fixing assembly comprises a fixing seat (2) mounted on the base (1), a cover plate (3) mounted on the fixing seat (2) and a clamping mechanism (4) mounted on the cover plate (3); the fixing seat (2) and the base (1) enclose a cavity for accommodating a semiconductor device, and the cover plate (3) covers the cavity; the clamping mechanism (4) comprises a plurality of clamping members (401) evenly distributed on the cover plate (3) and a pressure sensor (402) mounted on the clamping member (401) near one end of the base (1); the clamping member (401) is movably connected to the cover plate (3) and the distance between the clamping member (401) and the base (1) can be adjusted.

2. A fixing device for thermal resistance measurement according to claim 1, characterized in that: The fixing assembly further comprises a first connecting frame (403) and a second connecting frame (404); the first connecting frame (403) is located on the top surface of the cover plate (3), and the pressing members (401) are movably connected to the first connecting frame (403); the second connecting frame (404) is located on the bottom surface of the cover plate (3) and is connected to the pressure sensor (402).

3. A fixing device for thermal resistance measurement according to claim 2, characterized in that: The first connecting frame (403) and the second connecting frame (404) are both X-shaped.

4. A fixture for thermal resistance measurement according to claim 2, characterized in that: One side of the cover plate (3) is rotatably connected to the fixing seat (2), and the other side is snap-connected to the fixing seat (2).

5. A fixture for thermal resistance measurement according to claim 1, characterized in that: A through portion (201) is provided on one side of the fixing seat (2) close to the base (1), and the through portion (201) is used for silicone grease to overflow.

6. A fixture for thermal resistance measurement according to claim 1, characterized in that: The heat dissipation structure comprises a cooling pipe (101) arranged inside the base (1), and a water inlet and a water outlet of the cooling pipe (101) extend outside the base (1).

7. A fixture for thermal resistance measurement according to any one of claims 1 to 6, characterized in that: It also comprises a pin connection seat (5) connected to one side of the base (1), wherein the pin connection seat (5) is provided with a connection port (6) and a socket (501) for connecting to the pins of a semiconductor device.

8. A fixture for thermal resistance measurement according to claim 7, characterized in that: The wiring port (6) comprises a gate test wiring port (601), a drain test wiring port (602), a source power wiring port (603) and a drain power wiring port (604), all of which are located on the top surface of the pin wiring seat (5); the gate test wiring port (601), the drain test wiring port (602) and the source power wiring port (603) are located on one side of the top surface of the pin wiring seat (5), and the drain power wiring port (604) is located on the other side of the top surface of the pin wiring seat (5).

9. A fixture for thermal resistance measurement according to claim 7, characterized in that: A docking portion (102) is provided on one side of the base (1), and the pin connection seat (5) is provided with a docking groove (502) matching the docking portion (102).

10. A fixing device for thermal resistance measurement according to any one of claims 1 to 6, characterized in that: It also includes a ceramic sheet (7) for being placed in the cavity.

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