Semiconductor temperature test board

Abstract

The utility model relates to the technical field of semiconductor testing, in particular to a semiconductor temperature testboard which comprises a fixing frame, a heat dissipation mechanism fixedly arranged at the upper end of the fixing frame, a guide sliding plate fixedly arranged at the front end of a supporting frame, a connecting frame arranged on the guide sliding plate and capable of sliding up and down, and a heater and a cooler fixedly arranged at the left end and the right end of the connecting frame respectively. A fixing plate is fixedly arranged at the lower end of the fixing frame and fixedly connected with a guide sliding rod through the fixing frame, the guide sliding rod is sleeved with a spline rod, a push spring is arranged between the spline rod and the guide sliding rod, the periphery of the spline rod is in spline fit with a spline sleeve, and a driven wheel is fixedly arranged on the periphery of the spline sleeve. The front end of the fixing frame can be fixedly connected with the guide sliding rod through the fixing rod, the detection table capable of sliding up and down and rotating in the circumferential direction is arranged in the guide sliding rod, and the semiconductor device rotates to different positions to perform corresponding work through rotation of the detection table, so that real-time testing is performed through the detection table and an external detection mechanism, and convenience and rapidness are achieved.

Description

Technical Field

[0001] The utility model relates to the technical field of semiconductor testing, in particular to a semiconductor temperature testing platform. Background Art

[0002] Semiconductors refer to materials whose electrical conductivity at room temperature is between that of conductors and insulators. Semiconductors are used in integrated circuits, consumer electronics, communication systems, photovoltaic power generation, lighting, high-power power conversion and other fields.

[0003] During the production and processing of semiconductor devices, hot and cold tests are often required to judge the semiconductor's tolerance to hot and cold shocks by its aging degree. Existing semiconductor testing equipment can usually only inspect and process a single semiconductor. In actual operation, in order to ensure detection efficiency, it is necessary to take out the semiconductor before it returns to normal temperature and then conduct the next set of tests. Therefore, there are certain limitations. Utility Model Content

[0004] The purpose of the utility model is to provide a semiconductor temperature test bench to overcome the above-mentioned defects in the prior art.

[0005] According to the utility model, a semiconductor temperature test bench comprises a fixed frame, the upper end of the fixed frame is fixedly provided with a support frame, the support frame is fixedly provided with a heat dissipation mechanism, the front end of the support frame is fixedly provided with a guide slide, the guide slide is provided with a connecting frame which can slide up and down, the left and right ends of the connecting frame are respectively fixedly provided with a heater and a cooler, a cylinder is fixedly provided on the upper end surface of the front end part of the support frame, the upper end of the cylinder is connected with a telescopic gas rod, the upper end of the telescopic gas rod is connected with a connecting frame, the lower end of the connecting frame is fixedly connected to the connecting frame, a T-shaped slide groove is fixedly provided on the front end surface of the guide slide, the connecting frame and the guide slide slide are slidably matched through the T-shaped slide groove, the lower end of the fixed frame is fixedly provided with a fixing plate, the fixing plate is connected with an electric mechanism, the electric mechanism comprises a fixing plate fixed on the fixed plate The top end of the driving wheel is engaged with the driving wheel and the transmission gear is engaged with the driving wheel in the driving wheel gear. The driving wheel gear is engaged with the driving wheel in the driving wheel gear. The transmission gear is engaged with the driving wheel and the transmission gear is engaged with the driving wheel in the driving wheel gear.

[0006] The beneficial effects of the utility model are:

[0007] By rotating the test table, the semiconductor device is rotated to different positions to perform corresponding work. For example, the test table is moved to the lower end of the heater for heating, moved to the lower end of the cooler for cooling, and moved to the lower end of the heat dissipation mechanism for returning to normal temperature. In this way, real-time testing can be carried out through the test table and the external test mechanism, which is convenient and quick.

[0008] The operation is convenient, and by setting a normal temperature fan, the semiconductor device after cooling or heating can be quickly restored to normal temperature, thereby improving the efficiency of hot and cold aging tests on semiconductor devices.

[0009] By controlling the downward pressure of the connecting frame, the spline rod is synchronously controlled to slide up and down, so that the operation of the electric mechanism and the driven wheel is maintained without the need to control the electric mechanism to start and stop repeatedly, thereby improving the service life of the electric mechanism. BRIEF DESCRIPTION OF THE DRAWINGS

[0010] Figure 1 It is a schematic diagram of the appearance of the utility model;

[0011] Figure 2 This utility model Figure 1 A schematic diagram of a top view structure;

[0012] Figure 3 This utility model Figure 1 A schematic diagram of the front view structure of

[0013] Figure 4 This utility model Figure 1 A side view structural schematic diagram of;

[0014] Figure 5 It is a schematic diagram of the appearance of the fixing frame part of the utility model;

[0015] Figure 6 It is a schematic diagram of the appearance of the testing platform of the utility model;

[0016] Figure 7 This utility model Figure 2 A partial cross-sectional schematic diagram of AA in the middle;

[0017] In the figure:

[0018] 10. Fixed frame; 11. Heat dissipation mechanism; 12. Connecting frame; 13. Guide slide plate; 14. Support frame; 15. Cylinder; 16. Telescopic gas rod; 17. Connecting frame; 18. Heater; 19. Cooler; 20. Fixed plate; 21. Electric mechanism; 22. Driven wheel; 23. Spline sleeve; 24. Spline rod; 25. Inspection table; 26. Push spring; 27. Guide slide rod. DETAILED DESCRIPTION

[0019] In order to make the purpose, technical solution and advantages of the embodiment of the utility model clearer, the technical solution in the embodiment of the utility model will be clearly and completely described below in conjunction with the drawings in the embodiment of the utility model. Obviously, the described embodiment is a part of the embodiment of the utility model, not all of the embodiments. Based on the embodiment of the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.

[0020] It should be noted that when an element is said to be "fixed to" another element, it can be directly on the other element or there can be an intermediate element. When an element is said to be "connected to" another element, it can be directly connected to the other element or there can be an intermediate element at the same time:

[0021] Embodiment 1:

[0022] Reference Figure 1-Figure 7 According to an embodiment of the utility model, a semiconductor temperature test bench includes a fixed frame 10, a support frame 14 is fixedly provided at the upper end of the fixed frame 10, a heat dissipation mechanism 11 is fixedly provided on the support frame 14, a guide slide 13 is fixedly provided at the front end of the support frame 14, a connecting frame 12 that can slide up and down is provided on the guide slide 13, a heater 18 and a cooler 19 are fixedly provided at the left and right ends of the connecting frame 12, a cylinder 15 is fixedly provided on the upper end surface of the front end portion of the support frame 14, a telescopic gas rod 16 is connected to the upper end of the cylinder 15, a connecting frame 17 is connected to the upper end of the telescopic gas rod 16, the lower end of the connecting frame 17 is fixedly connected to the connecting frame 12, a T-shaped slide groove is fixedly provided on the front end surface of the guide slide 13, the connecting frame 12 and the guide slide 13 slide together through the T-shaped slide groove, a fixed plate 20 is fixedly provided at the lower end of the fixed frame 10, an electric mechanism 21 is connected to the fixed plate 20, and the electric mechanism 21 includes A power source is fixedly provided on the lower end surface of the fixed plate 20, and a power output end is provided at the upper end of the power source. The power output end extends upward and penetrates the fixed plate 20, and a driving wheel is fixedly provided at the upper end of the power output end. The fixed plate 20 is fixedly connected with a guide slide rod 27 through a fixed frame, and a spline rod 24 is sleeved on the guide slide rod 27. A push spring 26 is provided between the spline rod 24 and the guide slide rod 27, and the lower end of the push spring 26 is connected to the guide slide rod 27, and the upper end of the push spring 26 abuts against the spline rod 24. A spline sleeve 23 is splined on the outer periphery of the spline rod 24, and a driven wheel 22 is fixedly provided on the outer periphery of the spline sleeve 23. The electric mechanism 21 is connected and matched with the driven wheel 22, and the outer periphery of the driven wheel 22 is meshed with the outer peripheral surface of the driving wheel on the electric mechanism 21. The front end of the fixed frame 10 can be fixedly connected to the guide slide rod 27 through a fixed rod, and a detection table 25 that can slide up and down and rotate circumferentially is provided in the guide slide rod 27.

[0023] The user places the semiconductor device in one of the four grooves on the test platform 25, for example, the semiconductor device is placed in the groove on the test platform 25 at the lower end of the heater 18 (left end part), and the pins of the semiconductor device are set downward and inserted into the test platform 25, and the test platform 25 is electrically connected with the detection mechanism at the outer end to perform the detection work;

[0024] The connecting frame 12 moves up and down through the operation of the cylinder 15. The cylinder 15 controls the telescopic gas rod 16 to extend and retract downward, so that the telescopic gas rod 16 pulls the connecting frame 17 connected to the upper end to move downward, so that the connecting frame 12 fixedly connected to the connecting frame 17 moves downward, and the connecting frame 12 drives the heaters 18 and the coolers 19 at the left and right ends to work downward. The heater 18 abuts against the upper end surface of the detection table 25 downward and pushes the detection table 25 to slide downward. The detection table 25 slides downward along the direction of the guide slide rod 27 through the spline rod 24 fixedly connected, and the push spring 26 is compressed and contracted, and the spline rod 24 and the spline sleeve 23 disengages from the spline fit, and the heater 18 works to heat the semiconductor device at the test table 25. After the test is completed, the cylinder 15 controls the connecting frame 12 to move upward and reset, and the electric mechanism 21 is powered on to work. Through the meshing between the driving wheel and the driven wheel 22, the driven wheel 22 is driven to rotate, so that the spline sleeve 23 fixedly connected to the driven wheel 22 and the spline rod 24 of the spline fit of the spline sleeve 23 rotate, and the spline rod 24 drives the test table 25 fixedly connected at the upper end to rotate, so that the test table 25 drives the chip to rotate circumferentially, so as to put the semiconductor device into the four grooves of the test table 25;

[0025] When the semiconductor device at the left end rotates circumferentially through the detection table 25 and moves to the rear end, the cylinder 15 works to control the connection frame 12 to move downward, and the heater 18 heats the semiconductor device subsequently placed in the detection table 25, and the working state of the semiconductor device is detected by the detection table 25. During this period, the heat dissipation mechanism 11 works to blow the surrounding air downward to the semiconductor device located at the lower end of the heat dissipation mechanism 11, and cools the semiconductor device to a normal temperature state.

[0026] As the detection table 25 rotates, the semiconductor device originally set at the left end first rotates to the rear end position and then rotates to the right end position again, and is located at the lower end of the cooler 19. The cooler 19 works during the downward movement to cool the semiconductor device, and the working state of the semiconductor device during the cooling is detected by the detection table 25.

[0027] The inspection table 25 rotates to the front end position again, and a sorting mechanism is arranged at the front end position to sort and collect qualified and unqualified semiconductor devices.

[0028] It is clear to those skilled in the art that various modifications to the above embodiments can be made without departing from the overall spirit and concept of the present invention. All of them fall within the protection scope of the present invention. The protection scheme of the present invention shall be subject to the claims attached to the present invention.

Claims

1. A semiconductor temperature test bench, comprising a fixing frame (10), wherein a support frame (14) is fixedly arranged at the upper end of the fixing frame (10), characterized in that: The support frame (14) is fixedly provided with a heat dissipation mechanism (11), the front end of the support frame (14) is fixedly provided with a guide slide plate (13), the guide slide plate (13) is provided with a connecting frame (12) capable of sliding up and down, the left and right ends of the connecting frame (12) are respectively fixedly provided with a heater (18) and a cooler (19), the lower end of the fixed frame (10) is fixedly provided with a fixing plate (20), the fixing plate (20) is connected with an electric mechanism (21), the fixing plate (20) is fixedly connected with a guide slide rod (27) through the fixing frame, and the guide slide rod ( A spline rod (24) is sleeved on the guide slide rod (27), a push spring (26) is provided between the spline rod (24) and the guide slide rod (27), a spline sleeve (23) is splined on the outer periphery of the spline rod (24), a driven wheel (22) is fixedly provided on the outer periphery of the spline sleeve (23), the electric mechanism (21) is connected and cooperated with the driven wheel (22), the front end of the fixed frame (10) can be fixedly connected to the guide slide rod (27) through a fixing rod, and a detection table (25) that can slide up and down and rotate in the circumferential direction is provided in the guide slide rod (27).

2. A semiconductor temperature test bench according to claim 1, characterized in that: A cylinder (15) is fixedly provided on the upper end surface of the front end portion of the support frame (14); a telescopic gas rod (16) is connected to the upper end of the cylinder (15); a connecting frame (17) is connected to the upper end of the telescopic gas rod (16); and the lower end of the connecting frame (17) is fixedly connected to the connecting frame (12).

3. A semiconductor temperature test bench according to claim 2, characterized in that: The electric mechanism (21) comprises a power source fixedly mounted on the lower end surface of the fixed plate (20), a power output end being provided at the upper end of the power source, the power output end extending upwardly and penetrating the fixed plate (20), and a driving wheel being fixedly mounted at the upper end of the power output end.

4. A semiconductor temperature test bench according to claim 3, characterized in that: A T-shaped sliding groove is fixedly provided on the front end surface of the guide slide plate (13), and the connecting frame (12) and the guide slide plate (13) are slidably matched through the T-shaped sliding groove.

5. A semiconductor temperature test bench according to claim 4, characterized in that: The lower end of the push spring (26) is connected to the guide slide rod (27), and the upper end of the push spring (26) is in contact with the spline rod (24).

6. A semiconductor temperature test bench according to claim 5, characterized in that: The outer periphery of the driven wheel (22) meshes with the outer peripheral surface of the driving wheel on the electric mechanism (21).

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