Packaging equipment for semiconductor chip

Abstract

The utility model discloses packaging equipment for a semiconductor chip, which comprises a packaging main body, a conveying belt is arranged in the packaging main body, a dispensing frame is arranged at the upper end of the conveying belt, a hydraulic lifter is arranged at the upper end of the dispensing frame, an assembling frame is movably mounted in the dispensing frame, and the assembling frame is connected with the conveying belt. A semiconductor chip is placed on a conveying belt, when the semiconductor chip moves to the position below a dispensing frame, a hydraulic lifter drives an assembling frame to move downwards, when the assembling frame moves downwards, a movable plate and a pressing plate move downwards under the action of a baffle and a pull rod, the semiconductor chip is sleeved with the pressing plate, and the semiconductor chip is inserted into a limiting groove; the semiconductor chip can be limited, the hydraulic lifter drives the assembly frame to continue to move downwards, and the assembly frame moves downwards along the pull rod, so that the dispensing head is inserted into the dispensing hole seat, the semiconductor chip can be conveniently dispensed, the semiconductor chip can be prevented from moving during dispensing, and glue can be prevented from being dispensed on a circuit.

Description

Technical Field

[0001] The utility model relates to the technical field of semiconductor chip packaging, in particular to packaging equipment for semiconductor chips. Background Art

[0002] Semiconductor chip: A semiconductor device that can achieve a certain function by etching and wiring on a semiconductor sheet. Not only silicon chips, but also common semiconductor materials such as gallium arsenide (gallium arsenide is toxic, so don't be curious to disassemble some inferior circuit boards), germanium, etc.

[0003] After searching, a semiconductor packaging device with a publication number of CN216818282U was disclosed. Although the utility model meets the user's needs to a certain extent, there are still certain defects in the use process. For example, when the existing semiconductor packaging equipment is packaging the semiconductor chip, it is necessary to dispense glue on the semiconductor chip. When the semiconductor chip is dispensed with glue through the glue dispensing head, the dust adhered to the surface of the semiconductor chip will affect the retention of the semiconductor chip. Moreover, the semiconductor chip is placed on a conveyor belt. When dispensing glue on it, the movement of the semiconductor chip will affect the dispensing effect. Utility Model Content

[0004] The purpose of the utility model is to provide a packaging device for semiconductor chips to solve the problems raised in the background technology.

[0005] To achieve the above-mentioned purpose, the utility model provides the following technical solutions: a packaging device for semiconductor chips, comprising a packaging body, a conveyor belt is arranged inside the packaging body, a dispensing rack is arranged at the upper end of the conveyor belt, a hydraulic lifter is arranged at the upper end of the dispensing rack, an assembly rack is movably installed inside the dispensing rack, the assembly rack is fixedly connected to the lower end of the hydraulic lifter, dispensing heads are arranged on both sides of the lower end of the assembly rack, and movable plates are movably installed on both sides of the dispensing rack, a pull rod is fixedly installed on the upper end of the movable plate, the upper end of the pull rod passes through the assembly rack and a baffle is installed, a pressure plate is installed between the two movable plates, and a dispensing hole seat is arranged on the surface of the pressure plate.

[0006] Preferably, the upper end of the dispensing hole seat is detachably mounted with a mounting ring sleeve through a thread.

[0007] A sponge sleeve is arranged inside the ring sleeve.

[0008] Preferably, a limiting groove is provided at the lower end of the pressing plate, and the limiting groove is connected to the lower end of the dispensing hole seat.

[0009] Preferably, a ventilation slot is provided inside the pressing plate, and a blowing hole is provided at the lower end of the ventilation slot, and the blowing hole is located inside the limiting slot.

[0010] Preferably, a blow pipe is detachably mounted on one side of the pressing plate, an air pump is mounted on the upper end of the packaging body, and one end of the blow pipe is connected to an output end of the air pump.

[0011] Preferably, a mounting groove is provided at one end of the movable plate, the length of the mounting groove is smaller than the width of the movable plate, and mounting bars are provided at both ends of the pressing plate, and the mounting bars are movably inserted into the interior of the mounting groove.

[0012] Preferably, a card slot is provided on one side of the mounting strip, a mounting block is fixedly mounted on the upper end of the movable plate, a card block is movably mounted inside the mounting block, one side of the lower end of the card block is inclined, the lower end of the card block is movably inserted into the inside of the card slot, and a retaining spring is fixedly mounted on the upper end of the card block.

[0013] Preferably, a pull block is movably inserted inside the installation block, the lower end of the pull block is fixedly connected to the clamping block, and the upper end of the pull block is movably inserted outside the installation block.

[0014] Compared with the prior art, the beneficial effects of the utility model are:

[0015] 1. In the utility model, the semiconductor chip is placed on the conveyor belt, and when it moves to the bottom of the dispensing rack, the hydraulic lifter drives the assembly rack to move downward. When the assembly rack moves downward, the moving plate and the pressure plate move downward under the action of the baffle plate and the pull rod, and the pressure plate is sleeved on the semiconductor chip. The semiconductor chip is inserted into the inside of the limiting groove, and the semiconductor chip can be limited. The hydraulic lifter drives the assembly rack to continue to move downward, and the assembly rack moves downward along the pull rod, so that the dispensing head is inserted into the inside of the dispensing hole seat, which is convenient for dispensing the semiconductor chip, and can prevent the semiconductor chip from moving during dispensing, and can prevent the glue from being applied to the circuit;

[0016] 2. In the present invention, when the pressure plate moves downward, the air pump operates, and the gas generated by the air pump passes through

[0017] The air is blown into the interior of the ventilation slot and discharged through the air hole, so that the dust adhering to the surface of the semiconductor chip can be blown off to avoid affecting the packaging of the semiconductor chip. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] Figure 1 is a schematic diagram of the main structure of the utility model;

[0019] FIG2 is a schematic diagram of the structure of the dispensing frame of the utility model device;

[0020] FIG3 is a bottom view of the structure of the dispensing frame of the utility model;

[0021] FIG4 is a schematic diagram of a half-section structure of the installation location of the pressure plate in the device of the utility model;

[0022] Figure 5 is a schematic diagram of the utility model Figure 4 Enlarged structural diagram at A in the middle.

[0023] In the figure: 1. Package body; 2. Conveyor belt; 3. Glue dispensing rack; 4. Air pump; 5. Hydraulic lifter;

[0024] 6. Moving plate; 7. Pressing plate; 8. Pull rod; 9. Baffle; 10. Assembly frame; 11. Glue dispensing head; 12. Glue dispensing hole seat; 13. Mounting ring sleeve; 14. Sponge sleeve; 15. Air blowing pipe; 16. Limiting groove; 17. Air blowing hole; 18. Mounting strip; 19. Mounting groove; 20. Clamping groove; 21. Mounting block; 22. Clamping block; 23. Pulling block; 24. Retaining spring. DETAILED DESCRIPTION

[0025] The following will be combined with the drawings in the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.

[0026] Example 1, please refer to Figures 1 to Figure 3 The utility model provides an embodiment: a packaging device for semiconductor chips, including a packaging body 1, a conveyor belt 2 is arranged inside the packaging body 1, a dispensing frame 3 is arranged at the upper end of the conveyor belt 2, a hydraulic lifter 5 is arranged at the upper end of the dispensing frame 3, an assembly frame 10 is movably installed inside the dispensing frame 3, the assembly frame 10 is fixedly connected to the lower end of the hydraulic lifter 5, and dispensing heads 11 are arranged on both sides of the lower end of the assembly frame 10, and a movable plate 6 is movably installed on both sides of the dispensing frame 3, and a pull rod 8 is fixedly installed on the upper end of the movable plate 6, and the upper end of the pull rod 8 penetrates the assembly frame 10 for installation.

[0027] There is a baffle 9, a pressing plate 7 is installed between the two movable plates 6, a dispensing hole seat 12 is arranged on the surface of the pressing plate 7, a mounting ring sleeve 13 is detachably installed on the upper end of the dispensing hole seat 12 through a thread, a sponge sleeve 14 is arranged inside the mounting ring sleeve 13, and a limiting groove 16 is arranged at the lower end of the pressing plate 7, and the limiting groove 16 is connected to the lower end of the dispensing hole seat 12;

[0028] Among them, the semiconductor chip is placed on the conveyor belt 2, and when it moves to the bottom of the dispensing rack 3, the hydraulic lifter 5 drives the assembly rack 10 to move downward. When the assembly rack 10 moves downward, the movable plate 6 and the pressure plate 7 move downward under the action of the baffle 9 and the pull rod 8. The pressure plate 7 is sleeved on the semiconductor chip, and the semiconductor chip is inserted into the inside of the limiting groove 16, which can limit the semiconductor chip. The hydraulic lifter 5 drives the assembly rack 10 to continue to move downward, and the assembly rack 10 moves downward along the pull rod 8, so that the dispensing head 11 is inserted into the inside of the dispensing hole seat 12, which is convenient for dispensing the semiconductor chip, can prevent the semiconductor chip from moving during dispensing, and can prevent the glue from being applied to the circuit.

[0029] Example 2, please refer to Figures 1 to Figure 3 The utility model provides an embodiment: a packaging device for semiconductor chips, a ventilation slot is provided inside the pressing plate 7, a blowing hole 17 is provided at the lower end of the ventilation slot, the blowing hole 17 is located inside the limiting slot 16, a blowing pipe 15 is detachably installed on one side of the pressing plate 7, an air pump 4 is installed at the upper end of the packaging body 1, and one end of the blowing pipe 15 is connected to the output end of the air pump 4;

[0030] When the pressing plate 7 moves downward, the air pump 4 operates, and the gas generated by the air pump 4 is blown into the interior of the ventilation slot through the blowing holes 17 and discharged from the blowing holes 17, so as to blow off the dust adhering to the surface of the semiconductor chip and avoid affecting the packaging of the semiconductor chip.

[0031] Example 3, please refer to Figure 4 and Figure 5 The utility model provides an embodiment: a packaging device for semiconductor chips, a mounting groove 19 is provided at one end of a movable plate 6, the length of the mounting groove 19 is less than the width of the movable plate 6, mounting bars 18 are provided at both ends of a pressing plate 7, the mounting bars 18 are movably inserted in the interior of the mounting groove 19, a card slot 20 is provided on one side of the mounting bar 18, a mounting block 21 is fixedly installed at the upper end of the movable plate 6, a card block 22 is movably installed inside the mounting block 21, one side of the lower end of the card block 22 is inclined, the lower end of the card block 22 is movably inserted in the interior of the card slot 20, and the upper end of the card block 22 is fixedly installed

[0032] There is a clamping spring 24, a pull block 23 is movably inserted inside the mounting block 21, the lower end of the pull block 23 is fixedly connected to the clamping block 22, and the upper end of the pull block 23 is movably inserted outside the mounting block 21;

[0033] The user pulls the pull block 23 upward, and the pull block 23 drives the clamping block 22 to move upward, and the clamping block 22 moves toward the inside of the mounting block 21, compressing the clamping spring 24, so that the clamping block 22 is pulled out from the inside of the clamping slot 20, and the mounting bar 18 can be pulled out from the inside of the mounting slot 19, so that the pressing plate 7 can be pulled out from between the two movable plates 6, so that the pressing plate 7 can be replaced easily, and the pressing plates 7 with different sizes of limiting slots 16 can be replaced according to the size of the semiconductor chip.

[0034] It is obvious to those skilled in the art that the present invention is not limited to the details of the exemplary embodiments described above, and that the present invention can be implemented in other specific forms without departing from the spirit or essential features of the present invention. Therefore, the embodiments should be regarded as exemplary and non-restrictive from any point of view, and the scope of the present invention is defined by the appended claims rather than the above description, and it is intended that all changes falling within the meaning and scope of the equivalent elements of the claims be included in the present invention. Any reference numeral in a claim should not be regarded as limiting the claim to which it relates.

Claims

1. A packaging device for semiconductor chips, comprising a packaging body (1), a conveyor belt (2) being arranged inside the packaging body (1), and a dispensing frame (3) being arranged at the upper end of the conveyor belt (2), characterized in that: The upper end of the dispensing frame (3) is provided with a hydraulic lifter (5), an assembly frame (10) is movably installed inside the dispensing frame (3), the assembly frame (10) is fixedly connected to the lower end of the hydraulic lifter (5), both sides of the lower end of the assembly frame (10) are provided with dispensing heads (11), both sides of the dispensing frame (3) are movably installed with moving plates (6), the upper end of the moving plate (6) is fixedly provided with a pull rod (8), the upper end of the pull rod (8) passes through the assembly frame (10) and is provided with a baffle (9), a pressure plate (7) is installed between the two moving plates (6), and a dispensing hole seat (12) is provided on the surface of the pressure plate (7).

2. A semiconductor chip packaging device according to claim 1, characterized in that: The upper end of the dispensing hole seat (12) is detachably mounted with a mounting ring sleeve (13) via a thread, and a sponge sleeve (14) is arranged inside the mounting ring sleeve (13).

3. A semiconductor chip packaging device according to claim 2, characterized in that: A limiting groove (16) is provided at the lower end of the pressing plate (7), and the limiting groove (16) is connected to the lower end of the glue dispensing hole seat (12).

4. A semiconductor chip packaging device according to claim 3, characterized in that: A ventilation slot is provided inside the pressing plate (7), a blowing hole (17) is provided at the lower end of the ventilation slot, and the blowing hole (17) is located inside the limiting slot (16).

5. A semiconductor chip packaging device according to claim 4, characterized in that: An air blowing pipe (15) is detachably mounted on one side of the pressing plate (7), an air pump (4) is mounted on the upper end of the packaging body (1), and one end of the air blowing pipe (15) is connected to the output end of the air pump (4).

6. A semiconductor chip packaging device according to claim 5, characterized in that: A mounting groove (19) is provided at one end of the movable plate (6), the length of the mounting groove (19) being smaller than the width of the movable plate (6), and mounting strips (18) are provided at both ends of the pressing plate (7), the mounting strips (18) being movably inserted into the interior of the mounting groove (19).

7. A semiconductor chip packaging device according to claim 6, characterized in that: A clamping groove (20) is provided on one side of the mounting strip (18); a mounting block (21) is fixedly mounted on the upper end of the movable plate (6); a clamping block (22) is movably mounted inside the mounting block (21); one side of the lower end of the clamping block (22) is inclined; the lower end of the clamping block (22) is movably inserted into the inside of the clamping groove (20); and a clamping spring (24) is fixedly mounted on the upper end of the clamping block (22).

8. The semiconductor chip packaging device according to claim 7, characterized in that: A pull block (23) is movably inserted into the interior of the installation block (21); the lower end of the pull block (23) is fixedly connected to the clamping block (22); and the upper end of the pull block (23) is movably inserted into the outer side of the installation block (21).

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