Silicon wafer inserting mechanism and solar cell production equipment

Abstract

The utility model relates to the technical field of solar cell production equipment, in particular to a silicon wafer inserting mechanism and solar cell production equipment. The silicon wafer inserting mechanism comprises an installation base body and a plurality of clamping pieces. The clamping pieces are arranged on the mounting base body at intervals in the vertical direction, a gap is formed between every two adjacent clamping pieces, and the gaps are configured to allow silicon wafers to be inserted in, so that the two sides, in the thickness direction, of the silicon wafers are limited to the two clamping pieces respectively. And each clamping piece is movably connected with the mounting base body and is configured to be movably adjusted on the mounting base body in the vertical direction so as to adjust the width of the gap. According to the silicon wafer inserting mechanism, the width of the gap can be adjusted according to the thickness of the silicon wafer, so that the silicon wafers with various thickness values can be collected.

Description

Technical Field

[0001] The present application relates to the technical field of solar cell production equipment, and in particular to a silicon wafer inserting mechanism and solar cell production equipment. Background Art

[0002] The silicon wafer inserting mechanism is an important component of solar cell production equipment. Taking the silicon wafer production line as an example, the silicon wafer inserting mechanism is used to organize the silicon wafers on the silicon wafer production line to facilitate subsequent cleaning, collection, placement and other processes.

[0003] The silicon wafer inserting mechanism in the related art is customized according to the thickness of the silicon wafer. Specifically, the thickness of the gap for inserting the silicon wafer in the inserting mechanism is a fixed value, and only silicon wafers of one thickness value can be collected, so the versatility is poor. Utility Model Content

[0004] The embodiments of the present application disclose a silicon wafer inserting mechanism and a solar cell production device, which can collect silicon wafers of various thickness values.

[0005] In order to achieve the above objectives, in a first aspect, an embodiment of the present application discloses a silicon wafer inserting mechanism, comprising:

[0006] mounting substrate; and

[0007] A plurality of clamping members, wherein the plurality of clamping members are arranged on the mounting base at intervals in the vertical direction, and a gap is formed between two adjacent clamping members, wherein the gap is configured for inserting a silicon wafer, so that two sides of the silicon wafer in the thickness direction are respectively limited to the two clamping members;

[0008] Wherein, each of the clamping members is movably connected to the mounting base and is configured to be movably adjusted along the vertical direction on the mounting base to adjust the width of the gap.

[0009] In a possible implementation of the first aspect, the silicon wafer insertion mechanism also includes a movable structure, which is arranged on the mounting base, and each of the clamping members is connected to the movable structure, and the movable structure is configured to drive each of the clamping members to be movable and adjusted along the vertical direction respectively.

[0010] In a possible implementation of the first aspect, the movable structure includes a screw and a plurality of screw sleeves, the screw being vertically arranged on the mounting base; each of the screw sleeves is threadedly connected to the screw, and the plurality of screw sleeves are spaced apart in the vertical direction; each of the screw sleeves is configured to be movable and adjusted on the screw along the vertical direction, and each of the clamping members is respectively connected to each of the screw sleeves.

[0011] In a possible implementation of the first aspect, a circumferential groove is provided on the side of each of the threaded sleeves, and parts of each of the clamping members are respectively inserted into each of the circumferential grooves, so that each of the clamping members is respectively connected to each of the threaded sleeves.

[0012] In a possible implementation of the first aspect, the silicon wafer inserting mechanism further includes a pressing plate and a rotating handle;

[0013] The clamping plate is screwed to one end of the screw rod; in the vertical direction, the clamping plate is arranged opposite to the mounting base, and the clamping plate displaced along the vertical direction has a stop position abutting against the mounting base;

[0014] The rotating handle is detachably mounted on the screw rod, and the rotating handle and the pressing plate are both located at the same end of the screw rod, and the rotating handle is located at a side of the pressing plate away from the mounting base.

[0015] In a possible implementation of the first aspect, a slide groove is provided on the mounting base, and the slide groove extends in a vertical direction;

[0016] Each of the clamping members is provided with a slider, and the slider is slidably connected to the slide groove, so that each of the clamping members is slidably connected to the mounting base in the vertical direction;

[0017] The slider protrudes from the clamping member along the first horizontal direction and extends into the slide groove, and both side ends of the slider in the second horizontal direction are provided with limiting protrusions, the second horizontal direction intersects with the first horizontal direction, and both side walls of the slide groove in the second horizontal direction are provided with limiting recesses, and the two limiting protrusions are respectively slidably connected to the two limiting recesses;

[0018] The slide groove has a port at one end in the vertical direction, the port is located on the surface of the mounting base, and the port is configured to allow the slider to slide into or out of the slide groove;

[0019] The number of the slide grooves is two; the number of the sliders on each of the clamping members is two, and the two sliders are respectively slidably connected to the two slide grooves.

[0020] In a possible implementation of the first aspect, the clamping member includes a connecting portion, a first extending portion, and a second extending portion;

[0021] The connecting portion is movably connected to the mounting base and extends along a third horizontal direction;

[0022] The first extension portion and the second extension portion are respectively connected to two ends of the connecting portion, and both the first extension portion and the second extension portion extend along a fourth horizontal direction away from the mounting base, the third horizontal direction and the fourth horizontal direction intersect, and the fourth horizontal direction is the direction of inserting the silicon wafer into the gap.

[0023] In a possible implementation of the first aspect, a first linear groove is provided on the first extension portion, the first linear groove extends along the fourth horizontal direction, a first limiting wheel is provided in the first linear groove, and an axial direction of the first limiting wheel is parallel to the third horizontal direction; in the vertical direction, both side ends of the first limiting wheel protrude from the first linear groove;

[0024] And / or, a second linear groove is provided on the second extension portion, the second linear groove extends along the fourth horizontal direction, a second limiting wheel is provided in the second linear groove, and the axial direction of the second limiting wheel is parallel to the third horizontal direction; in the vertical direction, both side ends of the second limiting wheel protrude from the second linear groove.

[0025] In a possible implementation of the first aspect, the silicon wafer inserting mechanism further includes a cylinder, a guide column, a guide sleeve, and a base, the cylinder and the guide column are arranged on the base, the piston rod of the cylinder is connected to the mounting base, the guide column is vertically arranged, the guide sleeve is fixedly connected to the mounting base and slidably connected to the guide column; the number of the guide columns and the number of the guide sleeves are both two, the two guide columns are arranged opposite to each other, and the two guide sleeves are slidably connected to the two guide columns respectively;

[0026] And / or, the mounting base is a mounting plate, and the mounting plate is vertically arranged.

[0027] In a second aspect, the present application discloses a solar cell production device, including:

[0028] The silicon wafer inserting mechanism as described in the first aspect; and

[0029] A conveyor belt is configured to convey the silicon wafer along a conveying direction, the conveyor belt has an output end in the conveying direction, and the silicon wafer inserting mechanism is arranged opposite to the output end.

[0030] Compared with the prior art, the beneficial effects of the present application are as follows: the silicon wafer inserting mechanism forms a gap between two adjacent clamping members, and the gap is configured for inserting the silicon wafer, so that the two sides of the silicon wafer in the thickness direction are respectively limited to the two clamping members, that is, the width of the gap matches the thickness of the silicon wafer. And each clamping member is movable and adjusted in the vertical direction on the mounting base to adjust the width of the gap, and then the width of the gap can be adjusted according to the thickness of the silicon wafer, so that the silicon wafer inserting mechanism can be applicable to silicon wafers of various thicknesses, and has high versatility. BRIEF DESCRIPTION OF THE DRAWINGS

[0031] In order to more clearly illustrate the technical solutions in the embodiments of the present application, the drawings required for use in the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative work.

[0032] Figure 1 It is a left view of a silicon wafer inserting mechanism disclosed in an embodiment of the present application;

[0033] Figure 2 for Figure 1 Front view of

[0034] Figure 3 yes Figure 2 A cross-sectional view of section AA shown in FIG.

[0035] Figure 4 This is a schematic diagram of the structure of a solar cell production device disclosed in an embodiment of the present application.

[0036] Description of reference numerals:

[0037] 100, silicon wafer inserting mechanism; 110, mounting base; 111, slide groove; 112, port; 113, limiting recess; 120, clamping member; 121, slider; 122, limiting protrusion; 123, connecting portion; 124, first extension portion; 125, second extension portion; 126, first linear groove; 127, first limiting wheel; 128, second linear groove; 129, second limiting wheel; 130, gap; W, width of gap; 140, screw sleeve; 141, circumferential groove; 150, screw rod; 151, clamping plate; 152, rotating handle; 160, cylinder; 170, guide column; 180, guide sleeve; 190, base; 200, conveyor belt; 210, output end; 300, silicon wafer. DETAILED DESCRIPTION

[0038] The following will be combined with the drawings in the embodiments of the present application to clearly and completely describe the technical solutions in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, not all of the embodiments. Based on the embodiments in the present application, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of this application.

[0039] In this application, the terms "upper", "top", "bottom", "inner", "vertical", "horizontal" and the like indicate positions or positional relationships based on the positions or positional relationships shown in the drawings. These terms are mainly used to better describe the present application and its embodiments, and are not used to limit the indicated devices, elements or components to have a specific orientation, or to be constructed and operated in a specific orientation.

[0040] In addition, some of the above terms may be used to express other meanings in addition to indicating orientation or positional relationship. For example, the term "on" may also be used to express a certain dependency or connection relationship in some cases. For those of ordinary skill in the art, the specific meanings of these terms in this application can be understood according to specific circumstances.

[0041] In addition, the terms "disposed", "provided with", and "connected" should be understood in a broad sense. For example, it can be a fixed connection, a detachable connection, or an integral structure; it can be a mechanical connection, or an electrical connection; it can be a direct connection, or an indirect connection through an intermediate medium, or it can be an internal connection between two devices, elements, or components. For those of ordinary skill in the art, the specific meanings of the above terms in this application can be understood according to specific circumstances.

[0042] In addition, the terms "first", "second", etc. are mainly used to distinguish different devices, elements or components (the specific types and structures may be the same or different), and are not used to indicate or imply the relative importance and quantity of the indicated devices, elements or components. Unless otherwise specified, "plurality" means two or more.

[0043] The technical solution of the utility model will be described below in conjunction with embodiments and drawings.

[0044] First, as Figure 1 As shown, the embodiment of the present application discloses a silicon wafer inserting mechanism 100, including a mounting base 110 and a plurality of clamping members 120. For example, the mounting base 110 may be a mounting plate, a mounting seat, a mounting box, a mounting base or a mounting bracket, but the present application is not limited thereto. The silicon wafer used in the silicon wafer inserting mechanism 100 may be an unprocessed silicon wafer raw material or a processed silicon wafer, for example, a silicon wafer with a functional film made on its surface, and the functional film may be a polysilicon layer, a passivation film or an anti-reflection film.

[0045] A plurality of clamping members 120 are arranged on the mounting base 110 at intervals along the vertical direction, and a gap 130 is formed between two adjacent clamping members 120. The gap 130 is configured to allow the silicon wafer 300 to be inserted, so that the two sides of the silicon wafer 300 along the thickness direction are respectively limited to the two clamping members 120. Figure 1 The X0 - X1 direction shown in FIG. 1 is inserted into the gap 130 .

[0046] Each clamping member 120 is movably connected to the mounting base 110 and is configured to be movably adjusted along the vertical direction on the mounting base 110 to adjust the width W of the gap 130. Figure 1 The Z0-Z1 direction shown in .

[0047] The silicon wafer inserting mechanism 100 forms a gap 130 between two adjacent clamping members 120, and the gap 130 is configured for inserting a silicon wafer, so that the two sides of the silicon wafer in the thickness direction are respectively limited on the two clamping members 120, that is, the width W of the gap 130 matches the thickness of the silicon wafer. Each clamping member 120 is movable and adjusted along the vertical direction on the mounting base 110 to adjust the width W of the gap 130, and then the width W of the gap 130 can be adjusted according to the thickness of the silicon wafer, so that the silicon wafer inserting mechanism 100 can be applied to silicon wafers of various thicknesses, and has high versatility.

[0048] In a possible implementation of the first aspect, Figure 1 As shown, the silicon wafer inserting mechanism 100 also includes a movable structure, which is arranged on the mounting base 110, and each clamping member 120 is connected to the movable structure. The movable structure is configured to drive each clamping member 120 to be movable and adjusted in the vertical direction. Optionally, the movable structure can be a slider rail assembly, a guide post guide sleeve assembly, or a screw nut assembly. Taking the guide post guide sleeve assembly as an example, for example, a plurality of guide sleeves are sleeved on a vertically arranged guide post, and each clamping member is connected to each guide sleeve.

[0049] Preferably, if Figure 1As shown, the movable structure includes a screw rod 150 and a plurality of screw sleeves 140, and the screw rod 150 is vertically arranged on the mounting base 110. Each screw sleeve 140 is screwed to the screw rod 150, and the plurality of screw sleeves 140 are arranged at intervals in the vertical direction. Each screw sleeve 140 is configured to be movable and adjusted in the vertical direction on the screw rod 150, and each clamping member 120 is connected to each screw sleeve 140 respectively. When it is necessary to adjust the width W of the gap 130, the screw rod 150 is switched to a fixed state, and each screw sleeve 140 is rotated in sequence in the vertical direction. The screw rod 150 converts the rotational activity of the screw sleeve 140 into a linear motion in the vertical direction, and then the clamping member 120 is movable and adjusted in the vertical direction along the conveying direction to adjust the width W of the gap 130. When the screw sleeve 140 stops rotating, the screw sleeve 140 is locked on the screw rod 150 and the position of the clamping member 120 is fixed, so that the width W of the gap 130 is fixed, which is conducive to the work of the insert.

[0050] Furthermore, if Figure 1 and Figure 3 As shown, a circumferential groove 141 is provided on the side of each screw sleeve 140, and the term "circumferential groove 141" refers to a circle of grooves provided along the circumference of the screw sleeve 140. Parts of each clamping member 120 are respectively inserted into each circumferential groove 141, so that each clamping member 120 is respectively connected to each screw sleeve 140, so that the clamping member 120 and the screw sleeve 140 can be displaced together in the vertical direction, and the clamping member 120 and the screw sleeve 140 will not rotate together, that is, the clamping member 120 will not rotate around the axial direction of the screw 150.

[0051] In a possible implementation of the first aspect, Figure 1 As shown, the silicon wafer inserting mechanism 100 also includes a clamping plate 151. The clamping plate 151 is screwed to one end of the screw rod 150. Figure 1 In the Z0-Z1 direction shown in FIG, in the vertical direction, the pressing plate 151 is arranged opposite to the mounting base 110, and the pressing plate 151 displaced in the vertical direction has a stop position abutting against the mounting base 110. In one embodiment, the pressing plate 151 is arranged above the mounting base 110, and the pressing plate 151 at the stop position abuts against the top surface of the mounting base 110.

[0052] In other words, when the pressing plate 151 rotates, it moves on the screw rod 150 in the vertical direction and approaches or moves away from the mounting base 110. When the screw rod 150 needs to be fixed, the pressing plate 151 is rotated to displace the pressing plate 151 in the vertical direction and approaches the mounting base 110 until the pressing plate 151 abuts against the mounting base 110. At this time, the pressing plate 151 is locked to the mounting base 110, so that the screw rod 150 remains fixed, so that the screw sleeve 140 can be rotated alone to adjust the width W of the gap 130. When the screw rod 150 needs to be movable, the pressing plate 151 is rotated to move the pressing plate 151 away from the mounting base 110. When the pressing plate 151 and the mounting base 110 are separated, the screw rod 150 can be rotated.

[0053] Furthermore, in order to facilitate the rotation operation of the screw 150, as Figure 1 As shown, the silicon wafer inserting mechanism 100 further includes a rotating handle 152, which is detachably mounted on the screw rod 150. Optionally, the rotating handle 152 and the screw rod 150 can be detachably mounted on the screw rod 150 by means of threading, clamping, tight fitting, etc.

[0054] By operating the rotating handle 152 to rotate the screw rod 150, each screw sleeve 140 on the screw rod 150 moves synchronously in the vertical direction, thereby moving the plurality of clamps 120 as a whole. Exemplarily, in one of the operation modes of the silicon wafer inserting mechanism 100, the operator rotates each screw sleeve 140 in sequence to reduce the width W of each gap 130. When the adjustment operation is completed, the width W of each gap 130 is reduced. In other words, the space occupied by the plurality of clamps 120 in the vertical direction is reduced. At this time, in the vertical direction, a vacant position is formed on the mounting base 110. In order to better utilize the vacant position, more clamps 120 can be installed at the vacant position to collect more silicon wafers. One step in the process of installing the clamps 120 is to operate the rotating handle 152 to move the plurality of clamps 120 as a whole to one end of the mounting base 110 in the vertical direction so as to install more clamps 120 at the other end of the mounting base 110.

[0055] Furthermore, if Figure 1As shown, the rotating handle 152 and the pressing plate 151 are both located at the same end of the screw rod 150, for example, the rotating handle 152 and the pressing plate 151 are both located at the top of the screw rod 150. The rotating handle 152 is located at the side of the pressing plate 151 away from the mounting base 110. After the rotating handle 152 is removed, the pressing plate 151 can also be screwed out from the screw rod 150, and then more screw sleeves 140 can be inserted into the screw rod 150, or redundant screw sleeves 140 can be removed. When more clamping members 120 are installed on the mounting base 110, more screw sleeves 140 can be installed accordingly. On the contrary, when the number of clamping members 120 of the mounting base 110 is reduced, redundant screw sleeves 140 can be removed.

[0056] In a possible implementation of the first aspect, Figure 1 As shown, the silicon wafer insertion mechanism 100 also includes a cylinder 160, a guide column 170, a guide sleeve 180 and a base 190. The cylinder 160 and the guide column 170 are arranged on the base 190. The base 190 is used to support the mounting base 110 and the clamping member 120 and other components on the mounting base 110. The mounting base 110 can be displaced in the vertical direction through the setting of the base 190.

[0057] The piston rod of the cylinder 160 is connected to the mounting base 110, the guide post 170 is vertically arranged, and the guide sleeve 180 is fixedly connected to the mounting base 110 and slidably connected to the guide post 170. It can be understood that the plurality of clamps 120 are distributed in the vertical direction, in other words, the plurality of gaps 130 are also distributed in the vertical direction on the mounting base 110, and when one of the gaps 130 is completed with a sheet inserted, the cylinder 160 drives the mounting base 110 to move in the vertical direction so that the next gap 130 is switched to the position for sheet insertion.

[0058] The number of the guide posts 170 and the number of the guide sleeves 180 are both two, the two guide posts 170 are arranged opposite to each other, and the two guide sleeves 180 are slidably connected to the two guide posts 170 respectively, so that the installation base 110 can be lifted and lowered smoothly.

[0059] The mounting base 110 is a mounting plate, which is vertically arranged. The mounting plate has a simple structure, and structures such as the slide groove 111 can be easily processed on the mounting plate.

[0060] In a possible implementation of the first aspect, Figure 2 and Figure 3As shown, the mounting base 110 is provided with a slide groove 111, which extends in the vertical direction. Each clamping member 120 is provided with a slider 121, which is slidably connected to the slide groove 111, so that each clamping member 120 is slidably connected to the mounting base 110 in the vertical direction. One of the functions of the slider 121 and the slide groove 111 is to make the clamping member 120 move more smoothly, and the other function is to restrict the movement of the clamping member 120. When the screw sleeve 140 is rotated, the clamping member 120 will not rotate accordingly, so that two adjacent clamping members 120 remain corresponding in the vertical direction.

[0061] Furthermore, the slider 121 protrudes from the clamping member 120 along the first horizontal direction and extends into the slide groove 111. The slider 121 is provided with a limiting protrusion 122 at both ends in the second horizontal direction. The second horizontal direction intersects with the first horizontal direction. Figure 3 The X0-X1 direction shown in the second horizontal direction is as Figure 3 The two side walls of the slide groove 111 in the second horizontal direction are provided with limiting recesses 113, and two limiting protrusions 122 are respectively slidably connected to the two limiting recesses 113, so that the displacement of the slider 121 in the first horizontal direction is limited, and thus the slider 121 will not be displaced along the first horizontal direction and leave the slide groove 111.

[0062] like Figure 2 As shown, the slide groove 111 has a port 112 at one end in the vertical direction, the port 112 is located on the surface of the mounting base 110, and the port 112 is configured to allow a slider 121 to slide into or out of the slide groove 111. When more clamping members 120 need to be installed on the mounting base 110, the slider 121 on the newly added clamping member 120 can slide into the slide groove 111 through the port 112, so that the clamping member 120 is installed on the mounting base 110. Conversely, when the clamping member 120 needs to be removed from the mounting base 110, the slider 121 of the clamping member 120 to be removed slides out of the slide groove 111 from the port 112.

[0063] Furthermore, if Figure 2 and Figure 3 As shown, in order to ensure the balance of the clamping member 120, there are two slide grooves 111. There are two sliders 121 on each clamping member 120, and the two sliders 121 are slidably connected to the two slide grooves 111 respectively. The clamping member 120 is kept horizontal, which is conducive to the collection of silicon wafers.

[0064] The clamping member 120 of the present application is a member used to clamp and fix the silicon wafer. Exemplarily, the clamping member 120 can be a frame structure, a flat plate structure or a disc structure, but the present application is not limited thereto.

[0065] Preferably, if Figure 3As shown, the clamping member 120 includes a connecting portion 123, a first extending portion 124 and a second extending portion 125. Optionally, the connecting portion 123, the first extending portion 124 and the second extending portion 125 are all straight rod-shaped structures or long strip-shaped structures.

[0066] The connecting portion 123 is movably connected to the mounting base 110 and extends along the third horizontal direction. Specifically, part of the connecting portion 123 is inserted into the circumferential groove 141 and connected to the screw sleeve 140, and then movably connected to the mounting base 110. The first extension portion 124 and the second extension portion 125 are respectively connected to the two ends of the connecting portion 123, and the first extension portion 124 and the second extension portion 125 are both extended along the fourth horizontal direction away from the mounting base 110. The third horizontal direction intersects with the fourth horizontal direction. The fourth horizontal direction is the direction of inserting the silicon wafer into the gap. The third horizontal direction is as shown in FIG. Figure 3 The Y0-Y1 direction shown in FIG. 1 and the fourth horizontal direction are as follows: Figure 3 The first extension portion 124 and the second extension portion 125 gradually contact the silicon wafer during the insertion process of the silicon wafer. When the silicon wafer is inserted, the first extension portion 124 and the second extension portion 125 correspond to the two sides of the silicon wafer respectively, forming a better clamping effect on the silicon wafer.

[0067] Furthermore, if Figure 2 and Figure 3 As shown, the first extension portion 124 is provided with a first linear groove 126, the first linear groove 126 extends along the fourth horizontal direction, the first linear groove 126 is provided with a first limiting wheel 127, and the axial direction of the first limiting wheel 127 is parallel to the third horizontal direction. Figure 2 In the Z0 - Z1 direction shown in FIG, both side ends of the first limiting wheel 127 protrude from the first linear groove 126 .

[0068] And / or, a second linear groove 128 is provided on the second extension portion 125, the second linear groove 128 extends along the fourth horizontal direction, a second limiting wheel 129 is provided in the second linear groove 128, and the axial direction of the second limiting wheel 129 is parallel to the third horizontal direction. In the vertical direction, both side ends of the second limiting wheel 129 protrude from the second linear groove 128.

[0069] When the silicon wafer is inserted into the gap 130 along the fourth horizontal direction, the circumferential surface of the first limiting wheel 127 and / or the second limiting wheel 129 contacts the surface of the silicon wafer, thereby reducing the friction on the silicon wafer and the insertion resistance of the silicon wafer, so that the silicon wafer can be smoothly inserted into the gap 130 with a lower possibility of scratches.

[0070] Second, as Figure 4As shown, an embodiment of the present application discloses a solar cell production device, including a silicon wafer insertion mechanism 100 and a conveyor belt 200 as in the first aspect, the conveyor belt 200 is configured to convey silicon wafers along a conveying direction, the conveyor belt 200 has an output end 210 in the conveying direction, and the silicon wafer insertion mechanism 100 is arranged opposite to the output end 210.

[0071] For example, the silicon wafer is transported on the top surface of the conveyor belt 200. When the silicon wafer 300 is transported to the output end 210, one of the gaps 130 on the silicon wafer inserting mechanism 100 is flush with the top surface of the conveyor belt 200, and the silicon wafer 300 is gradually inserted into the gap 130 along the conveying direction to complete the insertion. Then the mounting plate moves in the vertical direction to switch the next gap 130 to a position flush with the top surface of the conveyor belt 200, and the next silicon wafer 300 is inserted.

[0072] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present application, rather than to limit it. Although the present application has been described in detail with reference to the aforementioned embodiments, those skilled in the art should understand that they can still modify the technical solutions described in the aforementioned embodiments, or replace some or all of the technical features therein with equivalents. However, these modifications or replacements do not cause the essence of the corresponding technical solutions to deviate from the scope of the technical solutions of the embodiments of the present application.

Claims

1. A silicon wafer inserting mechanism, characterized in that: include: Install the substrate; as well as A plurality of clamping members, wherein the plurality of clamping members are arranged on the mounting base at intervals in the vertical direction, and a gap is formed between two adjacent clamping members, wherein the gap is configured for inserting a silicon wafer, so that two sides of the silicon wafer in the thickness direction are respectively limited to the two clamping members; Wherein, each of the clamping members is movably connected to the mounting base and is configured to be movably adjusted along the vertical direction on the mounting base to adjust the width of the gap.

2. The silicon wafer inserting mechanism according to claim 1, characterized in that: The silicon wafer inserting mechanism further comprises a movable structure, wherein the movable structure is arranged on the mounting base, each of the clamping members is connected to the movable structure, and the movable structure is configured to drive each of the clamping members to be movable and adjusted along the vertical direction respectively.

3. The silicon wafer inserting mechanism according to claim 2, characterized in that: The movable structure includes a screw rod and a plurality of screw sleeves, wherein the screw rod is vertically arranged on the mounting base; each screw sleeve is threadedly connected to the screw rod, and the plurality of screw sleeves are arranged at intervals along the vertical direction; each screw sleeve is configured to be movable and adjusted on the screw rod along the vertical direction, and each clamping member is respectively connected to each screw sleeve.

4. The silicon wafer inserting mechanism according to claim 3, characterized in that: A circumferential groove is provided on the side surface of each screw sleeve, and parts of each clamping member are respectively inserted into each circumferential groove, so that each clamping member is respectively connected to each screw sleeve.

5. The silicon wafer inserting mechanism according to claim 3, characterized in that: The silicon wafer inserting mechanism also includes a pressing plate and a rotating handle. The clamping plate is screwed to one end of the screw rod; in the vertical direction, the clamping plate is arranged opposite to the mounting base, and the clamping plate displaced along the vertical direction has a stop position abutting against the mounting base; The rotating handle is detachably mounted on the screw rod, and the rotating handle and the pressing plate are both located at the same end of the screw rod, and the rotating handle is located at a side of the pressing plate away from the mounting base.

6. The silicon wafer inserting mechanism according to any one of claims 1 to 5, characterized in that: The mounting base is provided with a slide groove, and the slide groove extends in a vertical direction; Each of the clamping members is provided with a slider, and the slider is slidably connected to the slide groove, so that each of the clamping members is slidably connected to the mounting base in the vertical direction; The slider protrudes from the clamping member along the first horizontal direction and extends into the slide groove, and both side ends of the slider in the second horizontal direction are provided with limiting protrusions, the second horizontal direction intersects with the first horizontal direction, and both side walls of the slide groove in the second horizontal direction are provided with limiting recesses, and the two limiting protrusions are respectively slidably connected to the two limiting recesses; The slide groove has a port at one end in the vertical direction, the port is located on the surface of the mounting base, and the port is configured to allow the slider to slide into or out of the slide groove; The number of the slide grooves is two; the number of the sliders on each of the clamping members is two, and the two sliders are respectively slidably connected to the two slide grooves.

7. The silicon wafer inserting mechanism according to any one of claims 1 to 5, characterized in that: The clamping member includes a connecting portion, a first extending portion, and a second extending portion; The connecting portion is movably connected to the mounting base and extends along a third horizontal direction; The first extension portion and the second extension portion are respectively connected to two ends of the connecting portion, and both the first extension portion and the second extension portion extend along a fourth horizontal direction away from the mounting base, the third horizontal direction and the fourth horizontal direction intersect, and the fourth horizontal direction is the direction of inserting the silicon wafer into the gap.

8. The silicon wafer inserting mechanism according to claim 7, characterized in that: A first linear groove is provided on the first extension portion, the first linear groove extends along the fourth horizontal direction, a first limiting wheel is provided in the first linear groove, and the axial direction of the first limiting wheel is parallel to the third horizontal direction; in the vertical direction, both side ends of the first limiting wheel protrude from the first linear groove; And / or, a second linear groove is provided on the second extension portion, the second linear groove extends along the fourth horizontal direction, a second limiting wheel is provided in the second linear groove, and the axial direction of the second limiting wheel is parallel to the third horizontal direction; in the vertical direction, both side ends of the second limiting wheel protrude from the second linear groove.

9. The silicon wafer inserting mechanism according to any one of claims 1 to 5, characterized in that: The silicon wafer inserting mechanism further comprises a cylinder, a guide column, a guide sleeve and a base, wherein the cylinder and the guide column are arranged on the base, the piston rod of the cylinder is connected to the mounting base, the guide column is arranged vertically, the guide sleeve is fixedly connected to the mounting base and slidably connected to the guide column; the number of the guide columns and the number of the guide sleeves are both two, the two guide columns are arranged opposite to each other, and the two guide sleeves are slidably connected to the two guide columns respectively; And / or, the mounting base is a mounting plate, and the mounting plate is vertically arranged.

10. A solar cell production equipment, characterized in that: include: The silicon wafer inserting mechanism according to any one of claims 1 to 9; as well as A conveyor belt is configured to convey the silicon wafer along a conveying direction, the conveyor belt has an output end in the conveying direction, and the silicon wafer inserting mechanism is arranged opposite to the output end.

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