Plasma surface treatment testing machine

By designing an automated plasma surface treatment tester, the problems of high manual operation cost and low efficiency in the prior art are solved, and automated cleaning, line processing and testing are realized, improving production efficiency and cleaning effect.

CN222786130UActive Publication Date: 2025-04-22BIZLINK ELECTRONIC (XIAMEN) CO LTD
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Patent Information

Application Number
CN202421255542.9
Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
Filing Date
2024-06-04
Publication Date
2025-04-22
Estimated Expiration
2034-06-04

AI Technical Summary

Technical Problem

The existing plasma surface treatment technology relies on manual operation, resulting in high labor costs, low efficiency and easy fatigue, and cannot guarantee continuous and efficient treatment.

Method used

A plasma surface treatment testing machine is designed, including an operating table, a slide mechanism, a cleaning mechanism, a line management mechanism, a testing mechanism, a chute flip mechanism, a fork mechanism and a vehicle tool to realize automated dirty cleaning, wire management, testing and removal of defective products.

Benefits of technology

Through automated processes, cleaning effect and production efficiency are improved, manual operation is reduced, product performance is ensured to meet preset standards, and continuous and stable operation is achieved.

✦ Generated by Eureka AI based on patent content.

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Abstract

The utility model discloses a plasma surface treatment testing machine, and relates to the technical field of plasma equipment. The device comprises an operation table, a slide way mechanism is arranged on the upper side of the operation table, and a cleaning mechanism, a wire arranging mechanism, a testing mechanism, a slide groove overturning mechanism, a shifting fork mechanism and a carrier tool are arranged on the slide way mechanism. The cleaning mechanism is used for cleaning welding spots of the PCB; the wire arranging mechanism is used for straightening the core wires; the testing mechanism is used for testing product performance; the sliding groove turnover mechanism is used for tool positioning, repeated movement and turnover. The slideway mechanism is used for transferring and positioning the carrier tool; the shifting fork mechanism is used for moving the slideway tool; the carrier tool is used for transferring and positioning products. According to the utility model, special product plasma surface treatment test wire arrangement and the like are facilitated, the old process is integrated to realize automation, and the cleaning effect and the production efficiency are improved.
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Description

Technical Field

[0001] The utility model belongs to the field of plasma equipment, and in particular relates to a plasma surface treatment testing machine. Background Art

[0002] Plasma, also known as plasma state, is a substance in the plasma state that has properties similar to those of gaseous substances, such as good fluidity and diffusivity.

[0003] Currently, plasma surface treatment is done manually by using a brush dipped in board cleaning water to repeatedly clean the dirty parts of the PCB. The test fixture is manually placed into the fixture, and the tester is used to test wrong lines, open circuits, and short circuits. The positioning fixture needs to be manually placed and the plasma needs to be blown repeatedly, and then the other side needs to be manually turned over and the process is repeated. The labor cost is high, and manual operation cannot guarantee continuous high efficiency and is prone to fatigue.

[0004] In view of this, the present utility model is proposed. Utility Model Content

[0005] The technical problem to be solved by the utility model is to overcome the deficiencies of the prior art and provide a plasma surface treatment testing machine to solve the problems raised in the above-mentioned background technology.

[0006] In order to solve the above technical problems, the basic concept of the technical solution adopted by the utility model is:

[0007] A plasma surface treatment test machine comprises: an operating table, a slide mechanism is installed on the upper side of the operating table, a cleaning mechanism, a wire management mechanism, a testing mechanism, a slideway turning mechanism, a fork mechanism and a carrier tooling are installed on the slide mechanism;

[0008] The cleaning mechanism is used for cleaning solder joints on PCB boards;

[0009] The wire management mechanism is used to straighten the core wires;

[0010] Testing agencies are used to test product performance;

[0011] The slide turning mechanism is used for tooling positioning, repeated movement, and 180° turning;

[0012] The slide mechanism is used for transfer and positioning of carrier tooling;

[0013] The fork mechanism is used for the slide tooling movement function;

[0014] The carrier tooling is used for product transfer and positioning.

[0015] Optionally, the cleaning mechanism includes a rear movable slide cylinder and a front movable slide cylinder, a rear left and right movable slide cylinder mounted on the rear movable slide cylinder, a rear brush assembly mounted on the rear left and right movable slide cylinder, a front left and right movable slide cylinder mounted on the front movable slide cylinder, and a front brush assembly mounted on the front left and right movable slide cylinder.

[0016] Optionally, the cable management mechanism includes cable management left and right slide cylinders, a cable management upper slide cylinder installed on the cable management left and right slide cylinders, a cable management front and rear slide cylinders installed on the cable management lower slide cylinder, and a cable management assembly installed on the cable management front and rear slide cylinders.

[0017] Optionally, the testing mechanism includes a testing upper and lower slide cylinder and a testing mechanism installed on the testing upper and lower slide cylinder.

[0018] Optionally, the slide flipping mechanism includes a forward and backward moving component, an up and down moving component installed on the forward and backward moving component, a flipping slide component installed on the up and down moving component, a tooling positioning component installed on the flipping slide component, a tooling repetitive motion cylinder and a flipping power component.

[0019] Optionally, the slide mechanism includes a tooling circulation slide assembly, a tooling precision positioning assembly installed on the tooling circulation slide assembly, a defective product rejection assembly, a tooling pushing assembly, a conveyor belt assembly and a buckle opening assembly.

[0020] Optionally, the shift fork mechanism includes a shift fork forward and backward moving component, a left and right moving component mounted on the shift fork forward and backward moving component, and a shift fork component mounted on the left and right moving component.

[0021] Optionally, the carrier tooling includes a carrier tooling body and a buckle clamping assembly mounted on the carrier tooling body.

[0022] After adopting the above technical solution, the utility model has the following beneficial effects compared with the prior art. Of course, any product implementing the utility model does not necessarily need to achieve all the advantages described below at the same time:

[0023] Through the slide mechanism, cleaning mechanism, wire management mechanism, testing mechanism, slide chute flipping mechanism, fork mechanism and carrier tooling arranged on the operating table, the PCB board can be cleaned of dirt, and automatic board washing water can be sprayed and residual sewage can be automatically removed. The use of automated board washing stations can operate continuously and stably, and automatic wire management processes and defective product rejection processes have been added. Performance testing of the processed boards can be carried out to ensure that the products meet the preset standards. The automatic testing mechanism can quickly and accurately detect various performance indicators, which is convenient for special product plasma surface treatment testing and wire management, etc. The old process is integrated to achieve automation, which improves the cleaning effect and production efficiency.

[0024] The specific implementation of the utility model is further described in detail below with reference to the accompanying drawings. BRIEF DESCRIPTION OF THE DRAWINGS

[0025] The drawings described below are only some embodiments. For those skilled in the art, other drawings can be obtained based on these drawings without creative work.

[0026] In the figure:

[0027] Figure 1 It is a schematic diagram of the three-dimensional structure of the test machine;

[0028] Figure 2 It is a schematic diagram of the cleaning mechanism structure;

[0029] Figure 3 It is a schematic diagram of the structure of the wire management mechanism;

[0030] Figure 4 It is a schematic diagram of the test organization structure;

[0031] Figure 5 It is a schematic diagram of the structure of the slideway flipping mechanism;

[0032] Figure 6 Schematic diagram of the slide mechanism structure;

[0033] Figure 7 It is a schematic diagram of the structure of the shift fork mechanism;

[0034] Figure 8 This is a schematic diagram of the vehicle tooling structure.

[0035] In the accompanying drawings, the components represented by the reference numerals are listed as follows:

[0036] Cleaning mechanism 1, front brush assembly 101, front left and right moving slide cylinder 102, front moving slide cylinder 103, rear brush assembly 104, rear left and right moving slide cylinder 105, rear moving slide cylinder 106, wire management mechanism 2, wire management assembly 201, wire management front and rear slide cylinder 202, wire management slide cylinder 203, wire management left and right slide cylinder 204, testing mechanism 3, testing assembly 301, testing upper and lower slide cylinder 302, slideway flipping mechanism 4, tooling repeated motion cylinder 401, tooling positioning assembly 402, flipping Slide assembly 403, up and down moving assembly 404, flipping power assembly 405, front and back moving assembly 406, slide mechanism 5, tooling circulation slide assembly 501, tooling precision positioning assembly 502, defective product rejection assembly 503, tooling pushing assembly 504, conveyor belt assembly 505, buckle opening assembly 506, fork mechanism 6, fork assembly 601, fork front and back moving assembly 602, left and right moving assembly 603, carrier tooling 7, carrier tooling main body 701, buckle clamping assembly 702, operating table 8.

[0037] It should be noted that these drawings and textual descriptions are not intended to limit the conceptual scope of the present invention in any way, but rather to illustrate the concept of the present invention for those skilled in the art by referring to specific embodiments. DETAILED DESCRIPTION

[0038] The utility model will now be further described in detail with reference to the accompanying drawings.

[0039] See also Figure 1-8 As shown, in this embodiment, a plasma surface treatment test machine is provided, including: an operating table 8, a slide mechanism 5 is installed on the upper side of the operating table 8, and a cleaning mechanism 1, a wire management mechanism 2, a testing mechanism 3, a slide trough flipping mechanism 4, a fork mechanism 6 and a carrier tool 7 are installed on the slide mechanism 5;

[0040] The cleaning mechanism 1 is used for cleaning solder joints of PCB boards;

[0041] The wire management mechanism 2 is used for straightening the core wires;

[0042] Testing agency 3 is used to test product performance;

[0043] The chute flipping mechanism 4 is used for positioning, repeated movement, and flipping 180° of the tooling;

[0044] The slideway mechanism 5 is used for the transfer and positioning of the carrier tooling;

[0045] The fork mechanism 6 is used for the slide tooling movement function;

[0046] The carrier tooling 7 is used for product transfer and positioning.

[0047] like Figure 2 As shown, the cleaning mechanism 1 of this embodiment includes a rear movable slide cylinder 106 and a front movable slide cylinder 103, a rear left and right movable slide cylinder 105 installed on the rear movable slide cylinder 106, a rear brush assembly 104 installed on the rear left and right movable slide cylinder 105, a front left and right movable slide cylinder 102 installed on the front movable slide cylinder 103, and a front brush assembly 101 installed on the front left and right movable slide cylinder 102.

[0048] like Figure 3 As shown, the cable management mechanism 2 of this embodiment includes a cable management left and right slide cylinders 204, a cable management upper slide cylinder 203 installed on the cable management left and right slide cylinders 204, a cable management front and rear slide cylinders 202 installed on the cable management upper slide cylinder 203, and a cable management assembly 201 installed on the cable management front and rear slide cylinders 202.

[0049] like Figure 4 As shown, the testing mechanism 3 of the present embodiment includes a testing upper and lower slide cylinder 302 and a testing mechanism 3 installed on the testing upper and lower slide cylinder 302 .

[0050] like Figure 5 As shown, the slide flipping mechanism 4 of this embodiment includes a front-and-rear moving component 406, an up-and-down moving component 404 installed on the front-and-back moving component 406, a flipping slide component 403 installed on the up-and-down moving component 404, a tooling positioning component 402 installed on the flipping slide component 403, a tooling repetitive motion cylinder 401 and a flipping power component 405.

[0051] like Figure 6 As shown, the slide mechanism 5 of this embodiment includes a tooling circulation slide assembly 501, a tooling precision positioning assembly 502 installed on the tooling circulation slide assembly 501, a defective product rejection assembly 503, a tooling pushing assembly 504, a conveyor belt assembly 505 and a buckle opening assembly 506.

[0052] like Figure 7 As shown, the shift fork mechanism 6 of this embodiment includes a shift fork forward and backward moving component 602 , a left and right moving component 603 installed on the shift fork forward and backward moving component 602 , and a shift fork component 601 installed on the left and right moving component 603 .

[0053] like Figure 8 As shown, the carrier tool 7 of this embodiment includes a carrier tool body 701 and a buckle pressing assembly 702 installed on the carrier tool body 701 .

[0054] Working principle:

[0055] First, put the product on the carrier tooling body 701, buckle the product with the buckle pressing assembly 702, put the carrier tooling 7 on the front tooling circulation slide assembly 501 of the cleaning mechanism 1, and after the induction optical fiber senses in place, the fork forward and backward moving assembly 602 moves, the fork assembly 601 is clamped into the carrier tooling 7, the left and right moving assembly 603 moves, and the carrier tooling 7 is moved to the cleaning mechanism 1. The tooling precision positioning assembly 502 moves to position the tooling, the front moving slide cylinder 103 and the rear moving slide cylinder 106 move forward, the front brush assembly 101 and the rear brush assembly 104 move to hold the product, the front left and right moving slide cylinder 102 and the rear left and right moving slide cylinder 105 move to circulate and brush the product After the action is completed, the fork forward and backward moving component 602 moves, the fork component 601 is stuck in the carrier tooling 7, the left and right moving component 603 moves, the carrier tooling 7 is to the wire management mechanism 2, the tooling precision positioning component 502 moves the tooling positioning, the wire management upper and lower slide cylinder 203 moves, the wire management component 201 is in place, the wire management front and rear slide cylinder 202 moves to complete the first wire management, after the wire management mechanism 2 cylinder is reset, the wire management left and right slide cylinder 204 moves, the wire management upper and lower slide cylinder 203 moves, the wire management component 201 is in place, the wire management front and rear slide cylinder 202 moves to complete the second wire management, the fork mechanism 6 moves, the carrier tooling 7 is transferred to the test mechanism 3, and the tooling precision positioning component 502 moves The tooling is positioned, the upper and lower slide cylinders 302 are tested, the test assembly 301 is in place to test the product, after completion, the fork mechanism 6 is activated, the carrier tooling 7 is transferred to the flip chute assembly 403, the tooling positioning assembly 402 is activated, the carrier tooling 7 is positioned, the upper and lower moving assembly 404 moves the platform up, the plasma gun is sprayed, the tooling repeatedly moves the cylinder 401, after reaching the required number of repetitions, the upper and lower moving assembly 404 is reset, the flip power assembly 405 is activated, the carrier tooling 7 is completed, 180° flipped, the front and rear moving assembly 406 is activated, the upper and lower moving assembly 404 moves the platform up for the second time, the plasma gun is sprayed, the tooling repeatedly moves the cylinder 401, and reaches the required number of repetitions. After the number of repetitions, the slide chute flipping mechanism 4 is reset to complete the plasma blowing process, the fork mechanism 6 is actuated, the carrier tooling 7 is shifted to the position of the buckle opening component 506, the buckle opening component 506 is actuated, the buckle pressing component 702 is opened, the fork mechanism 6 is actuated, the carrier tooling 7 is at the position of the defective product rejection component 503, the defective product rejection component 503 is actuated to reject, the good product fork mechanism 6 is actuated, the carrier tooling 7 is at the position of the tooling pushing component 504, and the tooling pushing component 504 is actuated after the optical fiber sensing is in place to push the carrier tooling 7 out, the material is manually picked up, and the empty carrier tooling 7 is pushed into the conveyor belt component 505 in turn, and the empty carrier tooling 7 flows back to the loading station, completing one action cycle of the machine.

[0056] By means of the slide mechanism 5, the cleaning mechanism 1, the wire management mechanism 2, the testing mechanism 3, the slideway flipping mechanism 4, the fork mechanism 6 and the carrier tooling 7 arranged on the operating table 8, the PCB board can be cleaned of dirt, the automatic spraying of board washing water can be realized, and the residual sewage can be automatically removed. The use of the automated board washing station can operate continuously and stably, and an automatic wire management process and a defective product rejection process are added. The performance of the processed boards is tested to ensure that the products meet the preset standards. The automatic testing mechanism can quickly and accurately detect various performance indicators, which is convenient for plasma surface treatment testing and wire management of special products. The old process is integrated to achieve automation, thereby improving the cleaning effect and production efficiency.

[0057] The present invention is not limited to the above-mentioned implementation modes. Anyone should be aware of the structural changes made under the inspiration of the present invention. Any technical solution that is the same or similar to the present invention falls within the protection scope of the present invention. The technology, shape, and structure that are not described in detail in the present invention are all known technologies.

Claims

1. A plasma surface treatment testing machine, characterized in that: include: An operating table (8), a slide mechanism (5) is installed on the upper side of the operating table (8), and a cleaning mechanism (1), a wire management mechanism (2), a testing mechanism (3), a slideway turning mechanism (4), a fork mechanism (6) and a carrier tool (7) are installed on the slide mechanism (5); The cleaning mechanism (1) is used for cleaning solder joints of PCB boards; The wire management mechanism (2) is used for straightening the core wires; Testing organizations (3) are used to test product performance; The slideway turning mechanism (4) is used for positioning, repetitive movement and 180° turning of the tooling; The slideway mechanism (5) is used for the transfer and positioning of the carrier tooling; The shift fork mechanism (6) is used for the slide tooling movement function; The carrier tooling (7) is used for product transfer and positioning.

2. A plasma surface treatment testing machine according to claim 1, characterized in that: The cleaning mechanism (1) comprises a rear movable slide cylinder (106) and a front movable slide cylinder (103), a rear left and right movable slide cylinder (105) mounted on the rear movable slide cylinder (106), a rear brush assembly (104) mounted on the rear left and right movable slide cylinder (105), a front left and right movable slide cylinder (102) mounted on the front movable slide cylinder (103), and a front brush assembly (101) mounted on the front left and right movable slide cylinder (102).

3. A plasma surface treatment testing machine according to claim 1, characterized in that: The cable management mechanism (2) comprises a cable management left and right slide cylinders (204), a cable management upper slide cylinder (203) mounted on the cable management left and right slide cylinders (204), a cable management front and rear slide cylinders (202) mounted on the cable management upper slide cylinder (203), and a cable management component (201) mounted on the cable management front and rear slide cylinders (202).

4. The plasma surface treatment testing machine according to claim 1, characterized in that: The testing mechanism (3) comprises a testing upper and lower slide cylinder (302) and a testing mechanism (3) installed on the testing upper and lower slide cylinder (302).

5. The plasma surface treatment testing machine according to claim 1, characterized in that: The slideway flipping mechanism (4) comprises a front-to-back moving assembly (406), an up-down moving assembly (404) mounted on the front-to-back moving assembly (406), a flip slideway assembly (403) mounted on the up-down moving assembly (404), a tool positioning assembly (402) mounted on the flip slideway assembly (403), a tool repetitive motion cylinder (401) and a flipping power assembly (405).

6. The plasma surface treatment testing machine according to claim 1, characterized in that: The slide mechanism (5) comprises a tooling circulation slide assembly (501), a tooling precision positioning assembly (502) mounted on the tooling circulation slide assembly (501), a defective product rejection assembly (503), a tooling material pushing assembly (504), a conveyor belt assembly (505) and a buckle opening assembly (506).

7. The plasma surface treatment testing machine according to claim 1, characterized in that: The shift fork mechanism (6) comprises a shift fork forward and backward moving assembly (602), a left and right moving assembly (603) mounted on the shift fork forward and backward moving assembly (602), and a shift fork assembly (601) mounted on the left and right moving assembly (603).

8. The plasma surface treatment testing machine according to claim 1, characterized in that: The carrier tool (7) comprises a carrier tool body (701) and a buckle pressing assembly (702) mounted on the carrier tool body (701).