Radiator, motor controller, motor and vehicle

Abstract

The utility model relates to a radiator, a motor controller, a motor and a vehicle, the radiator is used for a power module of the motor controller, and the radiator comprises a substrate; the heat conducting plate comprises a body plate and an annular surrounding plate, the annular surrounding plate is connected to the edge of the body plate in a surrounding mode, a mounting groove is defined by the annular surrounding plate and the body plate, the body plate and the annular surrounding plate jointly form a plate-shaped structure with a U-shaped section, and the annular surrounding plate is connected to the base plate; and the sealing element is arranged between the heat conducting plate and the substrate and is partially accommodated in the mounting groove. The radiator can solve the technical problem that the rigidity of the heat conducting plate is poor, and leakage of cooling liquid is avoided.

Description

Technical Field

[0001] The present disclosure relates to the technical field of motor controllers, and in particular, to a radiator, a motor controller, a motor and a vehicle. Background Art

[0002] At present, the power module of the motor controller needs to be equipped with a radiator to ensure the heat dissipation performance of the power module. For a liquid-cooled radiator, the radiator includes a substrate and a heat conducting plate. The substrate is provided with a flow channel groove for the flow of coolant. A seal is provided between the substrate and the heat dissipation plate to provide a seal at the connection between the substrate and the heat conducting plate. The heat conducting plate is connected to the power module.

[0003] In the related art, the heat conducting plate has poor rigidity and is easily deformed, which may cause the local compression amount of the seal to become smaller, thereby causing coolant leakage. Utility Model Content

[0004] The purpose of the present disclosure is to provide a radiator, which can solve the technical problem of poor stiffness of a heat conducting plate and avoid leakage of coolant.

[0005] In order to achieve the above object, the present disclosure provides a heat sink for a power module of a motor controller, the heat sink comprising:

[0006] substrate;

[0007] A heat conducting plate, comprising a main body plate and an annular surrounding plate, wherein the annular surrounding plate is circumferentially connected to the edge of the main body plate and forms a mounting groove with the main body plate, wherein the main body plate and the annular surrounding plate are jointly constructed into a plate-like structure with a U-shaped cross section, and the annular surrounding plate is connected to the base plate; and

[0008] The sealing member is arranged between the heat conducting plate and the base plate and is partially accommodated in the mounting groove.

[0009] Optionally, the main body plate has a first plate surface abutting against the seal, and the annular enclosure plate has a side wall surface abutting against the seal, wherein an angle between the first plate surface and the side wall surface is 90°.

[0010] Optionally, the thickness of the main body plate is at least 1 mm to 2 mm.

[0011] Optionally, the main body plate has a second plate surface on a side facing away from the mounting groove, and the second plate surface is provided with a boss, and the boss is used to be connected to the power module.

[0012] Optionally, an annular protrusion is provided on the boss, and the annular protrusion and the boss form a receiving groove, and the receiving groove is used to accommodate solder connecting the boss and the power module.

[0013] Optionally, a positioning protrusion located in the accommodating groove is provided on the boss, and the positioning protrusion is used to abut against the power module.

[0014] Optionally, there are multiple positioning protrusions, and the multiple positioning protrusions are arranged in rows and columns.

[0015] Optionally, the main body plate has a first plate surface surrounding the mounting groove, and a portion of the first plate surface corresponding to the boss is connected to a heat dissipation fin, and the heat dissipation fin extends into the flow channel groove of the base plate.

[0016] Optionally, one of the annular enclosure plate and the base plate is provided with a positioning column, and the other is provided with a positioning hole, and the positioning column is arranged in the positioning hole.

[0017] Optionally, the annular enclosure is provided with a connecting ear, and the connecting ear has a connecting hole for cooperating with a fastener.

[0018] According to a second aspect of the present disclosure, a motor controller is provided, comprising a power module and the heat sink as described above, wherein the power module is connected to the heat conducting plate.

[0019] According to a third aspect of the present disclosure, there is provided a motor, comprising the motor controller as described above.

[0020] According to a fourth aspect of the present disclosure, a vehicle is provided, comprising the motor as described above.

[0021] Through the above technical solution, in the radiator provided by the present disclosure, compared with the heat conducting plate with only the main body plate, the present disclosure sets an annular enclosure surrounding the edge of the main body plate, so that the annular enclosure can strengthen the main body plate from the edge of the main body plate, and by constructing the main body plate and the annular enclosure together as a plate-like structure with a U-shaped cross-section, the deformation resistance of the main body plate can be effectively improved, and then the setting of the annular enclosure effectively improves the overall rigidity of the heat conducting plate. After the radiator is assembled, the seal is partially in the installation groove, that is, it will abut against the main body plate and the annular enclosure. Since the overall rigidity of the heat conducting plate is improved, that is, the heat conducting plate is not easy to deform, the compression amount of the seal is more consistent, thereby avoiding leakage of coolant.

[0022] Other features and advantages of the present disclosure will be described in detail in the following detailed description. BRIEF DESCRIPTION OF THE DRAWINGS

[0023] The accompanying drawings are used to provide a further understanding of the present disclosure and constitute a part of the specification. Together with the following specific embodiments, they are used to explain the present disclosure but do not constitute a limitation of the present disclosure. In the accompanying drawings:

[0024] Figure 1 is an exploded schematic diagram of a heat sink and a power module provided according to an embodiment of the present disclosure;

[0025] Figure 2 is a schematic diagram of the three-dimensional structure of a heat conducting plate in a radiator provided according to an embodiment of the present disclosure;

[0026] Figure 3 yes Figure 2 A top view schematic diagram of

[0027] Figure 4 yes Figure 3 Sectional view of AA in the middle;

[0028] Figure 5 yes Figure 2 Schematic diagram from top view;

[0029] Figure 6 is another three-dimensional structural schematic diagram of a heat conducting plate in a radiator provided according to an embodiment of the present disclosure;

[0030] Figure 7 is another structural schematic diagram of the heat dissipation fins in the heat sink provided according to an embodiment of the present disclosure.

[0031] Description of Reference Numerals

[0032] 1-substrate, 11-flow channel, 12-positioning column, 2-heat conducting plate, 21-main body plate, 211-first plate surface, 212-second plate surface, 22-annular enclosure plate, 221-side wall surface, 222-positioning hole, 23-mounting groove, 24-boss, 25-annular protrusion, 26-accommodating groove, 27-positioning protrusion, 3-seal, 4-heat sink fin, 5-connecting ear, 51-connecting hole, 100-power module. DETAILED DESCRIPTION

[0033] The specific implementation of the present disclosure is described in detail below in conjunction with the accompanying drawings. It should be understood that the specific implementation described herein is only used to illustrate and explain the present disclosure, and is not used to limit the present disclosure.

[0034] In the present disclosure, unless otherwise stated, the directional words used, such as "inside" and "outside", refer to the inside and outside of the contour of each component itself. The terms "first" and "second" are used to distinguish one element from another element and do not have order or importance. In addition, when the following description refers to the drawings, the same reference numerals in different drawings represent the same or similar elements, and this disclosure will not repeat them.

[0035] At present, the heat conducting plate in the related art only includes the main plate 21 disclosed in the present invention, that is, the heat conducting plate in the related art is generally in the shape of a flat plate with a rectangular cross-section. As the size of the heat conducting plate gradually increases, the stiffness of the heat conducting plate will deteriorate and the deformation resistance will be weak. When the heat conducting plate and the substrate are jointly clamped with a seal, the heat conducting plate is easily deformed by the reaction force of the seal, resulting in a decrease in the local compression of the seal, thereby causing leakage of the coolant.

[0036] In order to solve the above technical problems, the present disclosure provides a heat sink for a power module 100 of a motor controller, referring to Figures 1 to 4 As shown in the figure, the radiator includes: a substrate 1; a heat conducting plate 2, including a main body plate 21 and an annular surrounding plate 22, the annular surrounding plate 22 is circumferentially connected to the edge of the main body plate 21, and forms a mounting groove 23 with the main body plate 21, the main body plate 21 and the annular surrounding plate 22 are together constructed as a plate-like structure with a U-shaped cross-section, and the annular surrounding plate 22 is connected to the substrate 1; and a sealing member 3, which is arranged between the heat conducting plate 2 and the substrate 1 and is partially accommodated in the mounting groove 23.

[0037] Through the above technical solution, in the radiator provided by the present disclosure, compared with the heat conducting plate with only the main body plate 21, the present disclosure sets an annular enclosure 22 surrounding the edge of the main body plate 21, so that the annular enclosure 22 can strengthen the main body plate 21 from the edge of the main body plate 21, and by constructing the main body plate 21 and the annular enclosure 22 together as a plate-like structure with a U-shaped cross-section, the deformation resistance of the main body plate 21 can be effectively improved, and then the setting of the annular enclosure 22 effectively improves the overall rigidity of the heat conducting plate 2. After the radiator is assembled, the seal 3 is partially in the installation groove 23, that is, it will abut against the main body plate 21 and the annular enclosure 22. Since the overall rigidity of the heat conducting plate 2 is improved, that is, the heat conducting plate 2 is not easy to deform, the compression amount of the seal 3 is more consistent, thereby avoiding leakage of the coolant. In addition, compared with the heat conducting plate with a rectangular cross-section in the related art, the heat conducting plate 2 disclosed in the present invention has better rigidity, and because the main plate 21 and the annular surrounding plate 22 are jointly constructed as a plate-like structure with a U-shaped cross-section, when the size of the heat conducting plate 2 becomes larger, the heat conducting plate 2 will also have better rigidity, making the heat conducting plate 2 not easy to deform.

[0038] In some embodiments of the present disclosure, reference Figures 1 to 4 As shown in , the body plate 21 may have a first plate surface 211 abutting against the seal 3, and the annular enclosure plate 22 may have a side wall surface 221 abutting against the seal 3, wherein the angle between the first plate surface 211 and the side wall surface 221 is 90°. In this way, on the one hand, it is convenient to arrange the seal 3 in the installation groove 23, and it is conducive to the uniform compression of the seal 3, thereby facilitating the improvement of the consistency of the compression amount of the seal 3; on the other hand, it can reduce the manufacturing difficulty of the heat conducting plate 2, which is conducive to the production of the heat conducting plate 2.

[0039] In some embodiments of the present disclosure, the thickness of the main body plate 21 can be at least 1mm~2mm, for example, at least 1.5mm. Here, appropriately increasing the thickness of the main body plate 21 can improve the rigidity of the main body plate 21. Therefore, the present disclosure designs the thickness of the main body plate 21 to be greater than or equal to 1mm~2mm, which can avoid the main body plate 21 being too thin, thereby affecting the rigidity of the main body plate 21.

[0040] In some embodiments of the present disclosure, reference Figure 1 as well as Figures 4 to 6 As shown in , the body plate 21 has a second plate surface 212 on one side away from the mounting groove 23, and the second plate surface 212 may be provided with a boss 24, which is used to connect with the power module 100. In this way, by providing the boss 24, on the one hand, the thickness of the heat conducting plate 2 as a whole can be increased, thereby facilitating the increase of the rigidity of the heat conducting plate 2; on the other hand, the provision of the boss 24 facilitates the connection between the heat conducting plate 2 and the power module 100, wherein the boss 24 can play the role of providing positioning for the power module 100. Here, in some embodiments, the boss 24 can be welded to the power module 100, and the present disclosure will be described in detail in the following embodiments.

[0041] In some embodiments of the present disclosure, reference Figure 6 As shown in , the boss 24 may be provided with an annular protrusion 25, and the annular protrusion 25 and the boss 24 may enclose a receiving groove 26, and the receiving groove 26 is used to accommodate the solder connecting the boss 24 and the power module 100. Here, the receiving groove 26 enclosed by the annular protrusion 25 and the boss 24 can accommodate the solder, which facilitates the welding of the boss 24 and the power module 100. The provision of the annular protrusion 25 can also prevent the solder in the receiving groove 26 from overflowing, which is conducive to ensuring the welding effect of the boss 24 and the power module 100.

[0042] In some embodiments, reference Figure 6 As shown in , the boss 24 may be provided with a positioning protrusion 27 located in the receiving groove 26, and the positioning protrusion 27 is used to abut against the power module 100. Here, on the one hand, the positioning protrusion 27 can play an auxiliary positioning role for the power module 100, for example, the power module 100 may be provided with a positioning groove or a positioning convex point that matches the positioning protrusion 27; on the other hand, the positioning protrusion 27 protrudes from the boss 24, which can prevent the power module 100 from directly contacting the boss 24, that is, the setting of the positioning protrusion 27 can ensure that there is a certain interval between the power module 100 and the boss 24, and the solder in the interval will not overflow, thereby ensuring the minimum thickness of the solder and preventing the solder in the receiving groove 26 from overflowing.

[0043] In some embodiments, there may be multiple positioning protrusions 27 , and the multiple positioning protrusions 27 are arranged in rows and columns. In this way, the multiple positioning protrusions 27 can also assist in supporting the power device, thereby ensuring the welding effect between the power device and the boss 24 .

[0044] It should be noted that, in the present disclosure, the number of bosses 24 may be determined according to the number of power modules 100. Figure 1 and Figure 6 As shown in , the number of power modules 100 of the motor controller is generally three. In this case, the number of bosses 24 may also be three, and each boss 24 may be welded to one power module 100 .

[0045] In some embodiments of the present disclosure, reference Figures 1 to 3 As shown in , the main body plate 21 has a first plate surface 211 that encloses the mounting groove 23, and the portion of the first plate surface 211 corresponding to the boss 24 is connected with the heat dissipation fin 4, and the heat dissipation fin 4 extends into the flow channel groove 11 of the substrate 1. Here, by utilizing the correspondence between the heat dissipation fin 4 and the boss 24, the heat dissipation effect of the power module 100 can be ensured, and by connecting the heat dissipation fin 4 to the first plate surface 211, the length of the heat dissipation fin 4, that is, the dimension in the plate thickness direction of the main body plate 21, can be increased, which is conducive to increasing the contact area between the heat dissipation fin 4 and the coolant in the flow channel groove 11. Among them, when the radiator is working, the heat generated by the power module 100 is transferred to the heat dissipation fin 4 through the boss 24, and the heat dissipation fin 4 achieves continuous heat dissipation of the power module 100 through heat exchange with the coolant.

[0046] It should be noted that the present disclosure does not limit the shape of the heat dissipation fins 4. For example, in some embodiments, Figure 2 As shown in , the heat dissipation fins 4 may include a plurality of fin pins arranged in rows and columns, and the fin pins may be constructed in a cylindrical shape, that is, a circular cross section, or may be elliptical, hexagonal, diamond, teardrop-shaped, etc. In other embodiments, refer to Figure 7 As shown in , the heat dissipation fins 4 may also include continuous fin pins, and in two adjacent rows of fin pins, adjacent fin pins are arranged alternately in sequence.

[0047] In some embodiments of the present disclosure, reference Figure 1 As shown in , one of the annular enclosure 22 and the substrate 1 may be provided with a positioning column 12, and the other may be provided with a positioning hole 222, and the positioning column 12 is arranged in the positioning hole 222. In this way, the positioning connection between the annular enclosure 22 and the substrate 1 can be achieved by the cooperation between the positioning column 12 and the positioning hole 222. Here, the annular enclosure 22 can also abut on the substrate 1, and the present disclosure does not limit this.

[0048] In some embodiments of the present disclosure, reference Figure 1 and Figure 3As shown in , the annular enclosure 22 may be provided with a connecting ear 5, and the connecting ear 5 has a connecting hole 51 for cooperating with a fastener. In this way, the fastener can be connected to the connecting ear 5 through the connecting hole 51, and then the annular enclosure 22 can be connected to other parts of the motor controller by using the fastener to fix the radiator.

[0049] According to a second aspect of the present disclosure, a motor controller is provided, comprising a power module 100 and the heat sink as described above, wherein the power module 100 is connected to the heat conducting plate 2. The motor controller has all the beneficial effects of the heat sink as described above, which will not be described in detail in the present disclosure.

[0050] According to a third aspect of the present disclosure, a motor is provided, comprising the motor controller as described above. The motor has all the beneficial effects of the motor controller as described above, which will not be described in detail in the present disclosure.

[0051] According to a fourth aspect of the present disclosure, a vehicle is provided, comprising the motor as described above. The vehicle has all the beneficial effects of the motor as described above, which will not be described in detail in the present disclosure.

[0052] The preferred embodiments of the present disclosure are described in detail above in conjunction with the accompanying drawings; however, the present disclosure is not limited to the specific details in the above embodiments. Within the technical concept of the present disclosure, a variety of simple modifications can be made to the technical solution of the present disclosure, and these simple modifications all fall within the protection scope of the present disclosure.

[0053] It should also be noted that the various specific technical features described in the above specific embodiments can be combined in any suitable manner without contradiction. In order to avoid unnecessary repetition, the present disclosure will not further describe various possible combinations.

[0054] In addition, various embodiments of the present disclosure may be arbitrarily combined, and as long as they do not violate the concept of the present disclosure, they should also be regarded as the contents disclosed by the present disclosure.

Claims

1. A heat sink for a power module of a motor controller, characterized in that: The radiator comprises: substrate; A heat conducting plate, comprising a main body plate and an annular surrounding plate, wherein the annular surrounding plate is circumferentially connected to the edge of the main body plate and forms a mounting groove with the main body plate, wherein the main body plate and the annular surrounding plate are jointly constructed into a plate-like structure with a U-shaped cross section, and the annular surrounding plate is connected to the base plate; and The sealing member is arranged between the heat conducting plate and the base plate and is partially accommodated in the mounting groove.

2. The heat sink according to claim 1, characterized in that: The main body plate has a first plate surface abutting against the seal, and the annular enclosure plate has a side wall surface abutting against the seal, wherein the angle between the first plate surface and the side wall surface is 90°.

3. The heat sink according to claim 1, characterized in that: The thickness of the main body plate is at least 1 mm to 2 mm.

4. The heat sink according to claim 1, characterized in that: The main body plate has a second plate surface on one side away from the mounting groove, and the second plate surface is provided with a boss, and the boss is used to be connected to the power module.

5. The heat sink according to claim 4, characterized in that: The boss is provided with an annular protrusion, and the annular protrusion and the boss form a receiving groove, and the receiving groove is used to accommodate solder connecting the boss and the power module.

6. The heat sink according to claim 5, characterized in that The boss is provided with a positioning protrusion located in the accommodating groove, and the positioning protrusion is used to abut against the power module.

7. The heat sink according to claim 6, characterized in that The number of the positioning protrusions is multiple, and the multiple positioning protrusions are arranged in rows and columns.

8. The heat sink according to claim 4, characterized in that: The main body plate has a first plate surface surrounding the mounting groove, and a portion of the first plate surface corresponding to the boss is connected with a heat dissipation fin, and the heat dissipation fin extends into the flow channel groove of the base plate.

9. The heat sink according to claim 1, characterized in that: One of the annular enclosure plate and the base plate is provided with a positioning column, and the other is provided with a positioning hole, and the positioning column is arranged in the positioning hole.

10. The heat sink according to claim 1, characterized in that The annular enclosure is provided with a connecting ear, and the connecting ear has a connecting hole for cooperating with a fastener.

11. A motor controller, characterized in that: It comprises a power module and the heat sink according to any one of claims 1 to 10, wherein the power module is connected to the heat conducting plate.

12. A motor, characterized in that: Includes the motor controller as claimed in claim 11.

13. A vehicle, characterized in that: Including the motor as claimed in claim 12.

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