Electronic equipment
By designing a movable push member in the electronic device and applying a first thrust to separate the heating device and the heat dissipation structure along the thermally conductive bonding area, the problem of difficulty in separation between the heating device and the heat dissipation structure in the prior art is solved, and a safer and more labor-saving separation process is achieved.
Patent Information
- Application Number
- CN202421486572.0
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-06-26
- Publication Date
- 2025-04-22
- Estimated Expiration
- 2034-06-26
AI Technical Summary
It is difficult to effectively separate the existing heating devices and heat dissipation structures when separated, and forced separation may lead to damage.
An electronic device is designed, including heating devices, heat dissipation structures and push members. The push member is movably arranged in the heating device and the heat dissipation structure. By applying the first thrust, the heating device and the heat dissipation structure are gradually separated in a certain direction in the thermally conductive bonding area.
The convenient separation between the heating device and the heat dissipation structure is achieved, and damage caused by forced separation is avoided, and the separation process is more labor-saving.
Smart Images

Figure CN222786219U_ABST
Abstract
Description
Technical Field
[0001] The present application relates to the technical field of electronic equipment, and in particular to an electronic equipment. Background Art
[0002] The heating element is generally thermally connected to the heat dissipation structure by bonding. This makes it difficult to separate the heating element from the heat dissipation structure when it is necessary to separate the heating element from the heat dissipation structure during maintenance or other work. Forced separation may even cause damage to the heating element and the heat dissipation structure. Summary of the Invention
[0003] The present application provides an electronic device. The electronic device includes a heating device, a heat dissipation structure, and a pushing member. The heat dissipation structure is thermally bonded to a first side surface of the heating device, and the bonding area extends along a first direction; the pushing member is movably arranged on the first one of the heating device and the heat dissipation structure, and is located at one end of the bonding area along the first direction, so that relative to the first one, the pushing member can move in a direction close to the second one of the heating device and the heat dissipation structure, and the movement direction has an angle with the first side surface, so that the pushing member can abut against the side of the second one that is thermally bonded to the first one to apply a first thrust.
[0004] In one implementation of the present application, the pusher is connected to the first rotation, and the axis of the pusher relative to the first rotation and the normal of the first side have an angle so that the pusher can apply a first thrust along the circumference of the axis relative to the first rotation.
[0005] In one implementation of the present application, the pushing member has an included angle with the first direction relative to the first rotation axis.
[0006] In one implementation of the present application, the electronic device also includes an operating handle, a first end of the operating handle is fixedly connected to the part of the pushing member connected to the first, and a second end extends in a direction away from the axis of rotation of the pushing member relative to the first, and along the circumference of the axis, the second end of the operating handle and an end of the pushing member for applying the first thrust have a first gap.
[0007] In one implementation of the present application, the electronic device also includes a base, and the second one is fixed on the base; the first one includes a supporting portion, and the supporting portion is located on the path of rotation of the operating handle relative to the first one, so that when the first thrust is applied, the operating handle can apply a second thrust to the supporting portion along the circumferential direction of its axis of rotation relative to the first one.
[0008] In one implementation of the present application, a first force-applying protrusion is formed on the side surface of one side of the operating handle in the circumferential direction of the pushing member relative to the first rotation axis, and the end of the first force-applying protrusion along the protrusion direction is used to apply a second thrust.
[0009] In one implementation of the present application, the electronic device also includes a base, and the first one is fixed on the base; an operating part is formed at one end of the pushing member away from its axis of rotation relative to the first one, and the operating part is used to be operated to make the pushing member rotate relative to the first one, and the operating part is used to apply a first thrust.
[0010] In one implementation of the present application, a second force-applying protrusion is formed on the side surface of one side of the pushing member along the circumferential direction of the pushing member relative to the first rotation axis, and the end of the second force-applying protrusion along the protrusion direction is used to apply the first thrust.
[0011] In one implementation of the present application, the electronic device also includes an insert, which is slidably disposed on the pushing member, and the direction in which the insert slides relative to the pushing member is a first direction, so that when the thermal conductive bond is disconnected, the sliding of the insert relative to the pushing member can enable the insert to extend into the second gap between the first side surface and the corresponding part of the heat dissipation structure.
[0012] In one implementation of the present application, the heating device includes at least one of the following: a processor, a memory, a network card, and a connection terminal. BRIEF DESCRIPTION OF THE DRAWINGS
[0013] Various other advantages and benefits will become apparent to those skilled in the art upon reading the detailed description of the preferred embodiment below. The accompanying drawings are for illustration purposes only and are not to be considered as limiting the present application. The same reference numerals are used throughout the drawings to denote the same components. In the drawings:
[0014] Figure 1 This is one of the structural diagrams of an electronic device in some embodiments of the present application;
[0015] Figure 2 This is one of the structural schematic diagrams of a pushing member pushing a heating device in some embodiments of the present application;
[0016] Figure 3 This is a second structural diagram of an electronic device in some embodiments of the present application;
[0017] Figure 4 This is one of the exploded views of an electronic device in some embodiments of the present application;
[0018] Figure 5 This is one of the structural diagrams of the installation of the pushing member and the heating device in some embodiments of the present application;
[0019] Figure 6 This is a second structural diagram of the installation of the pushing member and the heating device in some embodiments of the present application;
[0020] Figure 7This is a schematic structural diagram of the pushing member in some embodiments of the present application not pushing the heating device;
[0021] Figure 8 This is a second structural diagram of a pushing member pushing a heating device in some embodiments of the present application;
[0022] Figure 9 This is a schematic diagram of a structure in which the extending member is not extended in some embodiments of the present application;
[0023] Figure 10 This is a schematic diagram of the structure of the extending member in some embodiments of the present application;
[0024] Figure 11 This is a structural schematic diagram of the pushing member in some embodiments of the present application not pushing the heat dissipation structure;
[0025] Figure 12 This is a schematic structural diagram of a pushing member pushing a heat dissipation structure in some embodiments of the present application;
[0026] Figure 13 This is a third structural diagram of an electronic device in some embodiments of the present application;
[0027] Figure 14 This is the second exploded view of an electronic device in some embodiments of the present application;
[0028] Figure 15 This is the third structural diagram of the installation of the pushing member and the heating device in some embodiments of the present application;
[0029] Figure 16 An exploded schematic diagram of the installation structure of the pusher and the heating element in some embodiments of the present application;
[0030] Figure 17 This is a structural schematic diagram of the pushing member in some embodiments of the present application not pushing the heat dissipation structure;
[0031] Figure 18 This is a structural schematic diagram of a pushing member pushing a heat dissipation structure in some embodiments of the present application.
[0032] Description of reference numerals:
[0033] 1-heating device; 11-heat conducting plate; 111-first side; 2-heat dissipation structure; 3-pushing member; 31-operating portion; 311-second force-applying protrusion; 4-thermal grease layer; 5-operating handle; 51-bending portion; 6-extending member; 7-circuit board; 8-mounting frame; a-first direction; b-first axis; c-normal to the first side. DETAILED DESCRIPTION
[0034] The following embodiments of the technical solution of the present application will be described in detail with reference to the accompanying drawings. The following embodiments are only used to more clearly illustrate the technical solution of the present application and are therefore only examples and are not intended to limit the scope of protection of the present application.
[0035] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by those skilled in the art to which this application belongs. The terms used herein are only for the purpose of describing specific embodiments and are not intended to limit this application.
[0036] References herein to "embodiments" mean that a particular feature, structure, or characteristic described in connection with the embodiments may be included in at least one embodiment of the present application. The appearance of this phrase in various places in the specification does not necessarily refer to the same embodiment, nor does it constitute an independent or alternative embodiment that is mutually exclusive of other embodiments. It is understood, both explicitly and implicitly, by those skilled in the art that the embodiments described herein may be combined with other embodiments.
[0037] In the description of the embodiments of the present application, the technical steps may be interchanged in a specific order or sequence, unless there is a conflict, so that the embodiments of the present application described herein can be implemented in an order other than that illustrated or described herein.
[0038] In the description of the embodiments of the present application, the technical terms "first", "second", "third", etc. are only used to distinguish objects and cannot be understood as indicating or implying relative importance or implicitly indicating the number, specific order, or primary and secondary relationship of the indicated technical features. In some embodiments of the present application, "first", "second", "third", etc. may also refer to the same object. In the description of the embodiments of the present application, the meaning of "plurality" is two or more, unless otherwise clearly and specifically defined.
[0039] In the description of the embodiments of this application, the term "and / or" is simply a description of the association relationship between associated objects, indicating that three relationships can exist. For example, A and / or B can represent the following three situations: A exists alone, A and B exist simultaneously, and B exists alone. In addition, the character " / " in this document generally indicates that the associated objects are in an "or" relationship.
[0040] In the description of the embodiments of the present application, unless otherwise expressly specified or limited, technical terms such as "installed," "connected," "connect," and "fixed" should be understood in a broad sense. For example, they can refer to fixed connections, detachable connections, or integration; mechanical connections or electrical connections; direct connections or indirect connections through an intermediate medium; internal connections between two components or interactions between two components. Those skilled in the art can understand the specific meanings of the above terms in the embodiments of the present application based on specific circumstances.
[0041] In the description of the embodiments of the present application, unless otherwise clearly specified and limited, the technical term "abutment" should be understood in a broad sense, and can refer to direct contact, contact through an intermediate medium layer, contact with essentially no interaction force between the two contacting parties, or contact with interaction force between the two contacting parties.
[0042] Below, this application is described in detail.
[0043] The present application provides an electronic device. The electronic device can be implemented in various forms, for example, it can be a computer, a mobile phone, a server, a workstation, a network switching device, a storage device, or an input / output (I / O) device such as an input / output acquisition board, etc.
[0044] Please refer to Figure 1 and Figure 2 The electronic device provided in an embodiment of the present application includes a heating device 1, a heat dissipation structure 2, and a pusher 3. The heat dissipation structure 2 is thermally bonded to a first side surface 111 of the heating device 1, and the bonding area extends along a first direction a. The pusher 3 is movably disposed on the first of the heating device 1 and the heat dissipation structure 2, and is located at one end of the bonding area along the first direction a, so that the pusher 3 can move relative to the first toward the second of the heating device 1 and the heat dissipation structure 2, and the movement direction forms an angle with the first side surface 111, so that the pusher 3 can abut against the side of the second thermally bonded to the first to apply a first thrust.
[0045] By movably setting a pusher 3 on the first one, when the heating device 1 and the heat dissipation structure 2 need to be separated, a first thrust can be applied to the second one by the first pusher 3. The direction of the first thrust is at an angle to the first side surface 111, that is, the first thrust can move the heating device 1 and the heat dissipation structure 2 away from each other in the direction of the first side surface 111, thereby breaking the bond between the heating device 1 and the heat dissipation structure 2. The pusher 3 is set near one end of the bonding area along the first direction a, that is, the position of action of the first thrust is near one end of the bonding area. In this way, during the separation process of the heating device 1 and the heat dissipation structure 2, as the first pusher 3 gradually moves in a direction close to the second one, the mutually bonded areas can be gradually separated from one end to the other along the first direction a, making the separation process more convenient, labor-saving, and less likely to damage the heating device 1 and the heat dissipation structure 2.
[0046] The pusher 3 can move toward the second one of the heating device 1 and the heat dissipation structure 2, and the movement direction forms an angle with the first side surface 111, so that the pusher 3 can abut against the side of the second one thermally bonded to the first one to apply a first thrust, thereby breaking the thermal bond between the heat dissipation structure 2 and the heating device 1.
[0047] In the embodiment of the present application, the implementation form of the heating device 1 can be various, for example, it can include at least one of the following: a processor, a memory, a network card, a connection terminal. Exemplarily, the processor can include a central processing unit, a display processor or an audio processor, etc., the memory can include a memory or a hard disk, etc., the connection terminal can include an optical module or a wiring terminal, etc., and the optical module can be an octal small form-factor pluggable optical module, a small form pluggable (SFP) optical module, a high-speed Ethernet interface converter (Gigabit Interface Converter, GBIC), or a decimal small form factor pluggable (10Gigabit Small Form Factor Pluggable, XFP), etc. In some embodiments of the present application, the heating device 1 can be integrated on the circuit board 7, and along the thickness direction of the circuit board 7, the side of the heating device 1 facing away from the side of the circuit board 7 is thermally connected to the heating device 1. In some embodiments of the present application, heating devices 1 can be set on opposite sides of the circuit board 7. The heating devices 1 on both sides can be arranged correspondingly along the thickness direction of the circuit board 7, or can have a spacing in the extension direction of the circuit board 7. For example, they can be arranged at opposite ends of the circuit board 7 in the extension direction.
[0048] In the embodiment of the present application, the heat dissipation structure 2 can be implemented in various forms, and illustratively can include at least one of the following: a heat pipe, a water-cooling pipe, and a heat sink.
[0049] A heat pipe has the same meaning as commonly understood by those skilled in the art within the present application, and generally comprises a tube shell and a wick. The wick is disposed on the inner wall of the tube shell and may be made of a porous material. The wick is filled with a working liquid. One end of the tube shell is the evaporation end, connected to the heating element 1, and the other end is the condensation end. During heating at the evaporation end, the working liquid in the wick evaporates and vaporizes, forming steam. This steam flows along the extension direction of the heat pipe toward the condensation end under a pressure differential, releasing heat and condensing to form liquid. The resulting liquid can then flow back to the evaporation end under the action of the capillary force of the wick.
[0050] The heat spreader has the same meaning as that generally understood by technicians in the technical field to which this application belongs. The heat spreader generally includes a shell and a liquid absorption structure. The liquid absorption structure is arranged on the inner wall of the shell and can be made of a porous material. The liquid absorption structure is filled with coolant. The outer wall of the shell is connected to the heating device 1. The coolant evaporates and vaporizes after being subjected to the heat generated by the heating device 1 to form steam. The steam flows along the extension direction of the heat spreader under the pressure difference, releases heat after flowing to the part with lower temperature, and condenses to form liquid. The formed liquid can flow back under the action of the capillary force of the liquid absorption structure.
[0051] The water-cooling tube has the same meaning as that generally understood by those skilled in the art of the present application. A heat dissipation medium flows in the water-cooling tube, and the heat dissipation medium may be water or liquid nitrogen, etc. The heat dissipation medium may repeatedly pass through the heating element 1 during the flow process to remove the heat of the heating element 1.
[0052] In the embodiments of the present application, it is understood that the heat dissipation structure 2 is attached to the first side surface 111, and the first direction a is parallel to the first side surface 111. In the embodiments of the present application, the heat dissipation structure 2 can be bonded to the first side surface 111 by a silicone thermally conductive adhesive layer, a polyurethane adhesive layer, a polyurethane thermally conductive and electrically conductive adhesive layer, or a thermal grease layer 4. In some embodiments of the present application, the heating device 1 can have a heat conducting plate 11, and the side surface of one side of the heat conducting plate 11 is the first side surface 111. The heat conducting plate 11 can be a copper plate or a graphene plate, etc.
[0053] In the embodiment of the present application, the bonding area is the area where the heat dissipation structure 2 and the heating device 1 are bonded to each other.
[0054] In the embodiment of the present application, the pusher 3 is movably disposed on the first one of the heating device 1 and the heat dissipation structure 2. The first one can refer to the heating device 1 or the heat dissipation structure 2. When the first one refers to the heating device 1, the second one of the heating device 1 and the heat dissipation structure 2 refers to the heat dissipation structure 2. When the first one refers to the heat dissipation structure 2, the second one of the heating device 1 and the heat dissipation structure 2 refers to the heating device 1.
[0055] In the embodiment of the present application, the above-mentioned movement direction forms an angle with the first side surface 111, that is, the direction of the first movement of the pusher 3 forms an angle with the first side surface 111. For example, it can be a direction perpendicular to the first side surface 111.
[0056] Please refer to Figure 1 、 Figure 2 and Figure 3In some embodiments of the present application, there can be multiple heating devices 1, and the multiple heating devices 1 are arranged along a second direction that is perpendicular to the first direction a. The first side surfaces 111 of the multiple heating devices 1 face the same direction and are all thermally bonded to the heat dissipation structure 2. They can be thermally bonded to the same heat dissipation structure 2, so that there are multiple heat dissipation structures 2, and the multiple heat dissipation structures 2 are arranged in a one-to-one correspondence with the heating devices 1. When a pusher 3 rotates relative to the first one, it can abut against the side of the multiple second ones that are thermally bonded to the corresponding first one, thereby applying a first thrust to the multiple second ones.
[0057] Please refer to Figure 1 、 Figure 2 and Figure 3 In some embodiments of the present application, the pusher 3 is connected to the first rotation, and the pusher 3 has an angle with the axis of the first rotation and the normal c of the first side surface relative to the axis of the first rotation, so that the pusher 3 can apply a first thrust along the circumference of the axis relative to the first rotation.
[0058] By making the pusher 3 connected to the first rotation, processing and manufacturing are more convenient. By rotating the pusher 3 to apply the first thrust, operation is more convenient and labor-saving.
[0059] In the embodiment of the present application, the pushing member 3 is relative to the first rotation axis, please refer to Figure 6 The first axis b is located in the middle. In some embodiments of the present application, the axis of rotation of the pusher 3 relative to the first side is perpendicular to the normal c of the first side. In this way, the pusher 3 can maintain more stable contact with the second side during rotation relative to the first side, which can increase the first thrust and make it easier to separate the heat dissipation structure 2 from the heat-generating device 1. In some embodiments of the present application, the second direction can be parallel to the axis of rotation of the pusher 3 relative to the first side.
[0060] Please refer to Figure 1 、 Figure 2 and Figure 3 In some embodiments of the present application, the axis of the first rotation of the pusher 3 relative to the first direction a forms an angle with the first direction a. This helps improve the compactness of the structure and reduce the space occupied by the electronic device. In some embodiments of the present application, the axis of the first rotation of the pusher 3 relative to the first direction a is perpendicular to the first direction a. This helps further improve the compactness of the structure and further reduce the space occupied by the electronic device.
[0061] Please refer to Figure 4 、 Figure 5 and Figure 6In some embodiments of the present application, the electronic device further includes an operating handle 5, a first end of the operating handle 5 being fixedly connected to the portion of the pushing member 3 connected to the first, and a second end extending in a direction away from an axis of rotation of the pushing member 3 relative to the first, and along the circumference of the axis, the second end of the operating handle 5 and an end of the pushing member 3 for applying the first thrust have a first gap.
[0062] By setting up an operating handle 5, a person can use the operating handle 5 to drive the pushing member 3 to rotate relative to the first one, so that the pushing member 3 is away from one end of the operating handle 5 and applies a first thrust. The operating handle 5 and the pushing member 3 form a lever structure as a whole, and the first part that is rotatably connected to the pushing member 3 is the fulcrum of the lever structure, making the process of operating the pushing member 3 to apply the first thrust more labor-saving.
[0063] Please refer to Figure 4 、 Figure 5 and Figure 6 In some embodiments of the present application, along the circumference of the pusher 3 relative to the first rotation axis, the central angle corresponding to the first interval is greater than or equal to 90 degrees. For example, the central angle can be 90 degrees, 120 degrees, 150 degrees, or 180 degrees, etc. This helps further improve the convenience of operating the pusher 3 and can save more effort.
[0064] Please refer to Figure 4 、 Figure 5 and Figure 6 In some embodiments of the present application, the extending direction of the operating handle 5 can be radially relative to the first rotation axis of the pusher 3. This facilitates processing and manufacturing.
[0065] Please refer to Figure 4 、 Figure 5 and Figure 6 In some embodiments of the present application, the operating handle 5 and the pushing member 3 can be integrally formed. This facilitates manufacturing. In some embodiments of the present application, the operating handle 5 and the pushing member 3 can together form a rod-like structure extending in a straight line, with the middle portion of the rod-like structure extending in the direction of rotation being connected to the first rotating member. In this way, one end of the rod-like structure is the pushing member 3, and the other end is the operating handle 5.
[0066] Please refer to Figure 7 and Figure 8 In some embodiments of the present application, the second end of the operating handle 5 is provided with a bent portion 51, and the bent portion 51 is bent in the circumferential direction of the first axis b. This facilitates operation of the operating handle 5, and the operator can rotate the operating handle 5 via the bent portion 51, thereby rotating the pusher 3.
[0067] Please refer to Figure 9 and Figure 10In some embodiments of the present application, the electronic device further includes an insert 6, which is slidably disposed on the pushing member 3, and the direction in which the insert 6 slides relative to the pushing member 3 is a first direction a, so that when the thermal conductive bond is disconnected, the sliding of the insert 6 relative to the pushing member 3 can enable the insert 6 to extend into the second gap between the first side surface 111 and the corresponding portion of the heat dissipation structure 2.
[0068] By setting up the insertion member 6, when the pushing member 3 rotates relative to the first one, so that the first and second ends in the first direction a are separated, the sliding of the insertion member 6 relative to the pushing member 3 can enable the bonding area to be separated from one end to the other end along the first direction a more quickly and conveniently, which is beneficial to improving the convenience of separating the heat dissipation structure 2 from the heating device 1.
[0069] Please refer to Figure 11 and Figure 12 In some embodiments of the present application, the electronic device also includes a base, and the second one is fixed on the base; the first one includes a supporting portion, and the supporting portion is located on the path of rotation of the operating handle 5 relative to the first one, so that when the first thrust is applied, the operating handle 5 can apply a second thrust to the supporting portion along the circumferential direction of its axis of rotation relative to the first one.
[0070] By enabling the operating handle 5 to apply a second thrust to the abutment portion along the circumferential direction of its first rotation axis when the first thrust is applied, the convenience of separating the operating handle 5 from the pushing member 3 can be improved. It is understood that in the embodiment of the present application, the first thrust and the second thrust diverge, causing the first to move in a direction away from the second.
[0071] In the embodiment of the present application, during the separation process of the heating device 1 and the heat dissipation structure 2, the one fixed to the base can remain relatively fixed, and the other moves relative to the base to achieve separation. Figure 6 、 Figure 7 and Figure 8 , or it can be the first one fixed to the base.
[0072] Please refer to Figure 11 and Figure 12 In some embodiments of the present application, a first force-applying protrusion is formed on the side surface of one side of the operating handle 5 in the circumferential direction of the pushing member 3 relative to the first rotation axis, and the end of the first force-applying protrusion along the protrusion direction is used to apply a second thrust.
[0073] By making the end of the first force-applying protrusion along the protruding direction be used to apply the second thrust, the first force-applying protrusion can be more firmly supported with the first support during the rotation of the pushing member 3 relative to the first one, which is conducive to further improving the convenience of separating the operating handle 5 from the pushing member 3.
[0074] Please refer to Figure 13 and Figure 14 In some embodiments of the present application, the electronic device also includes a base, and the first one is fixed on the base; an operating part 31 is formed at one end of the pushing member 3 away from its axis of rotation relative to the first one, and the operating part 31 is used to be operated to make the pushing member 3 rotate relative to the first one, and the operating part 31 is used to apply a first thrust.
[0075] By setting up the operating part 31, a person can drive the pushing member 3 to rotate relative to the first rotation through the operating part 31, and make the operating part 31 apply the first thrust, so that the process of operating the pushing member 3 to apply the first thrust is more labor-saving, and it is beneficial to make the size of the pushing member 3 smaller and the structure more compact.
[0076] Please refer to Figure 15 and Figure 16 On this basis, in some embodiments of the present application, the first one is a heating element 1, and the electronic device further includes a mounting bracket 8, which is fixed to the circuit board 7, and the pusher 3 is rotatably connected to the mounting bracket 8 to be rotatably connected to the heating element 1. In this way, the rotational connection between the pusher 3 and the heating element 1 is relatively stable and reliable.
[0077] Please refer to Figure 17 and Figure 18 In some embodiments of the present application, a second force-applying protrusion 311 is formed on the side surface of one side of the pushing member 3 along the circumferential direction of the pushing member 3 relative to the first rotation axis, and the end of the second force-applying protrusion 311 along the protrusion direction is used to apply the first thrust.
[0078] By applying the first thrust at the end of the second force-applying protrusion 311 along the protruding direction, the second force-applying protrusion 311 can be more firmly supported with the second support during the rotation of the pushing member 3 relative to the first one, which is conducive to further improving the convenience of separating the operating handle 5 from the pushing member 3.
[0079] The above embodiments are intended only to illustrate the technical solutions of the present application, and are not intended to limit them. Although the present application has been described in detail with reference to the above embodiments, those skilled in the art should understand that they may modify the technical solutions described in the above embodiments, or replace some or all of the technical features therein with equivalents. Such modifications or replacements do not deviate from the essence of the corresponding technical solutions and are intended to be included in the scope of the present application. In particular, as long as there is no structural conflict, the various technical features described in the various embodiments may be combined in any manner.
Claims
1. An electronic device, characterized in that: include: Heating device; A heat dissipation structure is thermally bonded to the first side surface of the heat generating device, and a bonding area extends along a first direction; A pushing member is movably arranged on the first one of the heating device and the heat dissipation structure, and is located at one end of the bonding area along the first direction, so that relative to the first one, the pushing member can move in a direction close to the second one of the heating device and the heat dissipation structure, and the movement direction has an angle with the first side surface, so that the pushing member can abut against the side of the second one that is thermally bonded to the first one to apply a first thrust.
2. The electronic device according to claim 1, characterized in that: The pushing member is connected to the first rotation, and the axis of the pushing member relative to the first rotation and the normal of the first side have an angle, so that the pushing member can apply the first thrust along the circumferential direction of the axis relative to the first rotation.
3. The electronic device according to claim 2, characterized in that: The axis of the pushing member relative to the first rotation forms an angle with the first direction.
4. The electronic device according to claim 2, characterized in that: The electronic device also includes an operating handle, a first end of the operating handle is fixedly connected to the part of the pushing member connected to the first part, and a second end extends in a direction away from the axis of rotation of the pushing member relative to the first part. Along the circumference of the axis, the second end of the operating handle and the part of the pushing member used to apply the first thrust have a first gap.
5. The electronic device according to claim 4, characterized in that: The electronic device also includes a base, and the second one is fixed on the base; the first one includes a supporting portion, and the supporting portion is located on the path of rotation of the operating handle relative to the first one, so that when the first thrust is applied, the operating handle can apply a second thrust to the supporting portion along the circumferential direction of its axis of rotation relative to the first one.
6. The electronic device according to claim 5, characterized in that: A first force-applying protrusion is formed on the side surface of one side of the operating handle in the circumferential direction of the pushing member relative to the first rotation axis, and the end of the first force-applying protrusion along the protrusion direction is used to apply the second thrust.
7. The electronic device according to claim 2, characterized in that: The electronic device also includes a base, and the first one is fixed on the base; an operating part is formed at one end of the pushing member away from its axis of rotation relative to the first one, and the operating part is used to be operated to make the pushing member rotate relative to the first one, and the operating part is used to apply the first thrust.
8. The electronic device according to claim 7, characterized in that: A second force-applying protrusion is formed on a side surface of one side of the pushing member along the circumferential direction of the pushing member relative to the first rotation axis, and the end of the second force-applying protrusion along the protrusion direction is used to apply the first thrust.
9. The electronic device according to any one of claims 1 to 8, characterized in that: The electronic device also includes an insertion piece, which is slidably disposed on the pushing piece, and the direction in which the insertion piece slides relative to the pushing piece is the first direction, so that when the thermal conductive adhesive is disconnected, the sliding of the insertion piece relative to the pushing piece can enable the insertion piece to extend into the second gap between the first side surface and the corresponding part of the heat dissipation structure.
10. The electronic device according to any one of claims 1 to 8, characterized in that: The heating device includes at least one of the following: a processor, a memory, a network card, and a connection terminal.