Grinding and cleaning machine for removing overflowing glue on four edges of laminated printed circuit board

Abstract

The utility model discloses a grinding and cleaning machine for removing overflowing glue on four edges of a laminated printed circuit board, which relates to the technical field of grinding and cleaning integration and comprises a main frame, and a feeding beating plate mechanism, a first brushing and grinding mechanism, a rotating plate mechanism, a second brushing and grinding mechanism and a washing and cleaning mechanism which are sequentially arranged along the horizontal direction of the main frame, the feeding beating plate mechanism is located at the feeding end of the first brushing and grinding mechanism, and the washing and cleaning mechanism is located at the discharging end of the second brushing and grinding mechanism. According to the scheme, the feeding beating plate mechanism, the first brushing and grinding mechanism, the rotating plate mechanism, the second brushing and grinding mechanism and the water cleaning mechanism are integrally designed, and grinding and cleaning are integrated, so that the occupied area of the equipment is smaller, and the energy consumption is smaller; the grinding and cleaning are fully automatic, so that the labor burden is greatly reduced, the production efficiency is improved, and meanwhile, the excessive glue generated by the printed circuit board is reduced, so that the product quality is improved.

Description

Technical Field

[0001] The utility model relates to a grinding and cleaning machine for removing glue overflow from four edges of a printed circuit board after lamination, belonging to the technical field of integrated grinding and cleaning. Background Art

[0002] As attached Figure 1-2 As shown in the figure, during the production process of printed circuit boards, insulating layers such as PP or ABF need to be pressed onto the substrate by hot pressing. Since the material has fluidity and expansibility after being melted by heat, some of it will overflow outside the effective area, resulting in a circle of ABF or PP overflow (hereinafter referred to as overflow glue).

[0003] The above-mentioned overflow glue will affect the quality of subsequent processing of the product, so it needs to be removed. Currently, the industry uses laser ablation to perform the removal operation. This method has the disadvantages of low efficiency, high cost, poor quality, large equipment footprint and energy consumption. Utility Model Content

[0004] The utility model aims to overcome the shortcomings of the prior art and provide a grinding and cleaning machine for removing glue overflow from the four edges of a printed circuit board after lamination.

[0005] To achieve the above-mentioned purpose, the technical solution adopted by the utility model is: a grinding and cleaning machine for removing overflow glue on the four edges of a printed circuit board after lamination, comprising a main frame and a feed clapper mechanism, a first brushing mechanism, a rotating plate mechanism, a second brushing mechanism and a water washing and cleaning mechanism arranged in sequence along the horizontal direction of the main frame; the feed clapper mechanism is located at the feeding end of the first brushing mechanism, and the water washing and cleaning mechanism is located at the discharging end of the second brushing mechanism; the feed clapper mechanism is used to center the printed circuit board, and the printed circuit board after centering enters the first brushing mechanism, the first brushing mechanism is used to brush overflow glue on the printed circuit board, and the printed circuit board brushed by the first brushing mechanism enters the rotating plate mechanism, the rotating plate mechanism is used for adjusting the horizontal direction of the printed circuit board, and the printed circuit board after adjusting the direction enters the second brushing mechanism, the second brushing mechanism is used to brush the printed circuit board for the second time, and the printed circuit board after the second brushing enters the water cleaning mechanism, and the water cleaning mechanism is used to clean the residual glue on the printed circuit board with water.

[0006] Preferably, the feed clapper mechanism includes a feed frame, a first transmission assembly, a first drive device, and a plurality of first feed rollers, a clamping plate, a movable plate, a first sliding assembly and a clapper rod; the first feed roller is rotatably arranged on the feed frame, and the first feed rollers are used to drive the printed circuit board to move; the first transmission assembly and the first drive device are both installed below the feed frame, and the first drive device is used to drive the first transmission assembly; the movable plate is installed on the feed frame through the first sliding assembly, and the first sliding assembly is used for horizontal movement of the movable plate; one end of the clamping plate is connected and fixed to the first transmission assembly, and the other end is connected and fixed to the movable plate, and the first transmission assembly drives the movable plate to move horizontally through the clamping plate; the clapper rod is connected and fixed to the upper end of the movable plate, and the clapper rod is located between adjacent first feed rollers, and the clapper rod is used to drive the printed circuit board to the center.

[0007] Preferably, the first brushing mechanism includes a first brushing frame and a plurality of second feed rollers, a second transmission assembly, a second drive device, a cleaning wheel and a pressing wheel; the plurality of second feed rollers are rotatably arranged on the first brushing frame, and the second feed rollers are used to drive the printed circuit board to move; the plurality of cleaning wheels are rotatably arranged on both sides of the first brushing frame, and the cleaning wheels on the same side are respectively located on the upper and lower sides of the second feed roller; the second transmission assembly and the second drive device are both installed on the first brushing frame, the second drive device is used to drive the second transmission assembly, and the second transmission assembly is used to drive the cleaning wheel to rotate, and the cleaning wheel is used to brush the overflow glue on the printed circuit board; the pressing wheel is rotatably arranged on the first brushing frame, and the pressing wheel is used to press the printed circuit board; the second brushing mechanism is the same as the first brushing mechanism.

[0008] Preferably, the transfer plate mechanism includes a transfer plate frame, a third feed roller, a support plate, a lifting drive device, a lifting plate and a rotation drive device; the third feed roller is installed on the transfer plate frame, and the third feed roller is used to drive the printed circuit board to move; a bottom plate is provided at the bottom of the transfer plate frame, the lifting drive device is connected and fixed to the bottom plate, the lifting plate is installed on the output shaft of the lifting drive device, and the lifting drive device is used to drive the lifting plate to rise and fall; the rotation drive device is connected and fixed to the bottom of the lifting plate, the support plate is installed on the output shaft of the rotation drive device, and the rotation drive device drives the support plate to rotate, and when the support plate rotates, it drives the printed circuit board to rotate.

[0009] Preferably, a third driving device, a third transmission assembly and two third sliding assemblies are arranged under the base plate; the third driving device is connected and fixed to the turntable frame, the third transmission assembly is connected and fixed to the base plate, and the third driving device is used to drive the third transmission assembly to move; the two third sliding assemblies are both arranged between the base plate and the turntable frame, and the base plate is slidably matched with the turntable frame through the two third sliding assemblies.

[0010] Preferably, the water cleaning mechanism includes a water cleaning frame, a water collecting trough, and a plurality of fourth feeding rollers, a nozzle, a sponge wheel and a high-pressure air knife; the plurality of fourth feeding rollers are rotatably arranged on the water cleaning frame, and the plurality of fourth feeding rollers are used to drive the printed circuit board to move; the plurality of nozzles are connected and fixed on the water cleaning frame, and the plurality of nozzles are respectively located on both sides of the fourth feeding roller, and the nozzles clean the residual glue on the printed circuit board by spraying water; the water collecting trough is connected and fixed under the water cleaning frame, and the water collecting trough is used to temporarily store the water sprayed by the nozzle; the plurality of sponge wheels are rotatably arranged on the water cleaning frame, and the plurality of sponge wheels are respectively located on both sides of the moving path of the printed circuit board, and the sponge wheels are used to absorb water on the printed circuit board; the plurality of high-pressure air knives are respectively arranged on both sides of the fourth feeding roller, and the plurality of high-pressure air knives are used to dry the printed circuit board after being adsorbed by the sponge wheel.

[0011] Preferably, a water circulation groove is provided on the side of the water collecting groove, and the water temporarily stored in the water collecting groove flows into the water circulation groove and is filtered through the water circulation groove.

[0012] Due to the application of the above technical solution, the utility model has the following advantages compared with the prior art:

[0013] The utility model provides a grinding and cleaning machine for removing overflow glue on the four edges of a printed circuit board after lamination, which realizes integrated grinding and cleaning by integrating a feeding plate mechanism, a first brush grinding mechanism, a rotating plate mechanism, a second brush grinding mechanism and a water cleaning mechanism, thereby making the equipment occupy a smaller area and consume less energy; the grinding and cleaning are fully automatic, which greatly reduces the labor burden and improves production efficiency, and at the same time reduces the overflow glue generated by the printed circuit board, thereby improving product quality. BRIEF DESCRIPTION OF THE DRAWINGS

[0014] The technical solution of the utility model is further described below in conjunction with the accompanying drawings:

[0015] Attached Figure 1 Schematic diagram of glue overflow in the process of printed circuit board manufacturing in the prior art Figure 1 ;

[0016] Attached Figure 2 Schematic diagram of glue overflow in the process of printed circuit board manufacturing in the prior art Figure 2 ;

[0017] Attached Figure 3 It is a cross-sectional view of a grinding and cleaning machine for removing overflow glue on the four edges of a printed circuit board after lamination according to the utility model;

[0018] Attached Figure 4 It is a structural schematic diagram of a feeding clapper mechanism of a grinding cleaning machine for removing overflow glue on four edges of a printed circuit board after lamination according to the utility model;

[0019] Attached Figure 5 For attachment Figure 4 The enlarged view of point A in the middle;

[0020] Attached Figure 6 It is a structural schematic diagram of a first brush grinding mechanism of a grinding cleaning machine for removing overflow glue on four edges of a printed circuit board after lamination according to the utility model;

[0021] Attached Figure 7 It is a schematic diagram of the structure of the cooperation among the second transmission assembly, the second driving device and the cleaning wheel in the utility model;

[0022] Attached Figure 8 It is a structural schematic diagram of a rotating plate mechanism of a grinding cleaning machine for removing overflow glue on four edges of a printed circuit board after lamination according to the utility model;

[0023] Attached Fig. 9 For attachment Figure 8 The enlarged view of point B in the middle;

[0024] Attached Fig.10 For attachment Figure 8 Enlarged view of point C in the middle;

[0025] Attached Fig.11 For attachment Figure 8 The enlarged view of point D in the middle;

[0026] Attached Fig.12 It is a schematic diagram of the structure of a water cleaning mechanism of a grinding cleaning machine for removing overflow glue on four edges of a printed circuit board after lamination according to the utility model;

[0027] Attached Fig.13 It is a cross-sectional view of the structure of a water cleaning mechanism of a grinding cleaning machine for removing overflow glue on four edges of a printed circuit board after lamination according to the utility model;

[0028] Attached Fig.14 The present invention is a working flow diagram of a grinding and cleaning machine for removing overflow glue on the four edges of a printed circuit board after lamination.

[0029] In the figure: 1, substrate; 2, ABF or PP; 3, overflowed ABF or PP; 4, PET or copper foil; 5, printed circuit board; 10, main frame; 20, feeding clapper mechanism; 21, feeding frame; 22, first transmission assembly; 23, first driving device; 24, first feeding roller; 25, clamping plate; 26, moving plate; 27, first sliding assembly; 28, clapper rod; 30, first brush grinding mechanism; 31, first brush grinding frame; 32, second feeding roller; 33, second transmission assembly; 34, second driving device; 3 5. Cleaning wheel; 36. Pressing wheel; 40. Turntable mechanism; 41. Turntable frame; 42. Third feeding roller; 43. Support plate; 44. Lifting drive device; 45. Lifting plate; 46. Rotating drive device; 47. Bottom plate; 48. Third driving device; 49. Third transmission assembly; 50. Third sliding assembly; 60. Second brush grinding mechanism; 70. Water washing cleaning mechanism; 71. Water washing frame; 72. Water collecting tank; 73. Fourth feeding roller; 74. Spray pipe; 75. Sponge wheel; 76. High-pressure air knife; 77. Water circulation tank. DETAILED DESCRIPTION

[0030] The present invention will be further described in detail below in conjunction with the accompanying drawings and specific embodiments.

[0031] As attached Figure 3 As shown, the present invention is a grinding and cleaning machine for removing glue overflow from the four edges of a printed circuit board after lamination, comprising a main frame 10 and a feeding clapper mechanism 20, a first brushing mechanism 30, a rotating plate mechanism 40, a second brushing mechanism 60 and a water washing and cleaning mechanism 70 arranged in sequence along the horizontal direction of the main frame 10; the feeding clapper mechanism 20 is located at the feeding end of the first brushing mechanism 30, and the water washing and cleaning mechanism 70 is located at the discharging end of the second brushing mechanism 60; the feeding clapper mechanism 20 is used to center the printed circuit board 5, and the printed circuit board 5 after centering is cleaned. The circuit board 5 enters the first brushing mechanism 30, which is used to brush the overflow glue on the printed circuit board 5. The printed circuit board 5 brushed by the first brushing mechanism 30 enters the rotating plate mechanism 40, which is used for the printed circuit board 5 to adjust its direction horizontally. After the direction is adjusted, the printed circuit board 5 enters the second brushing mechanism 60, which is used to brush the printed circuit board 5 for the second time. The printed circuit board 5 that has been brushed for the second time enters the water cleaning mechanism, which is used to clean the residual glue on the printed circuit board 5 with water.

[0032] As attached Figure 4-5As shown, the feed clapper mechanism 20 includes a feed frame 21, a first transmission assembly 22, a first drive device 23, and a plurality of first feed rollers 24, a clamping plate 25, a movable plate 26, a first sliding assembly 27 and a clapper rod 28; the first feed roller 24 is arranged on the feed frame 21, and the first feed roller 24 is used to drive the printed circuit board 5 to move; the first transmission assembly 22 and the first drive device 23 are both installed below the feed frame 21, and the first drive device 23 is used to drive the first transmission assembly 22. In this embodiment, the first drive device 23 is a motor, and the first transmission assembly 22 is a synchronous belt structure. The first drive device 23 drives the first transmission assembly 22 to rotate; the movable plate 26 is installed on the feed frame 21 through the first sliding assembly 27, and the first sliding assembly 27 is used to In order to allow the movable plate 26 to move horizontally, in the present embodiment, the first sliding assembly 27 is a structure in which a slider and a slide rail cooperate with each other, the two ends of the slide rail are fixed on the feed frame 21, the slider is fixed on the bottom of the movable plate 26, and the movable plate 26 slides with the slide rail through the slider; one end of the clamping plate 25 is connected and fixed on the first transmission assembly 22, and the other end is connected and fixed on the movable plate 26, and the first transmission assembly 22 drives the movable plate 26 to move horizontally through the clamping plate 25, wherein a long strip through hole is provided on the feed frame 21 for the movable plate 26 to move; the clapping rod 28 is connected and fixed on the upper end of the movable plate 26, and the clapping rod 28 is located between adjacent first feeding rollers 24, and the clapping rod 28 is used to drive the printed circuit board 5 to be centered, and the clapping rod 28 positions and centers the printed circuit board 5 by moving left and right.

[0033] As attached Figure 6-7As shown, the first brush grinding mechanism 30 includes a first brush grinding frame 31 and a plurality of second feeding rollers 32, a second transmission assembly 33, a second driving device 34, a cleaning wheel 35 and a pressing wheel 36; the plurality of second feeding rollers 32 are rotatably arranged on the first brush grinding frame 31, and the second feeding rollers 32 are used to drive the printed circuit board 5 to move; the plurality of cleaning wheels 35 are rotatably arranged on both sides of the first brush grinding frame 31, and the cleaning wheels 35 on the same side are respectively located on the upper and lower sides of the second feeding roller 32. In this embodiment, two cleaning wheels 35 are respectively arranged on both sides of the first brush grinding frame 31, and the two cleaning wheels 35 are arranged up and down to clean the upper and lower sides of the printed circuit board 5 respectively; the second transmission assembly 33 and the second driving device 34 are both installed on the first brush grinding frame 31. On the grinding frame 31, the second driving device 34 is used to drive the second transmission assembly 33, and the second transmission assembly 33 is used to drive the cleaning wheel 35 to rotate. The cleaning wheel 35 is used to brush the overflow glue on the printed circuit board 5. In this embodiment, the second driving device 34 is a motor, and the second transmission assembly 33 is a synchronous belt structure. The second driving device 34 drives the second transmission assembly 33 to rotate, and the second transmission assembly 33 drives the cleaning wheel 35 to rotate to clean the overflow glue on the printed circuit board 5; the pressing wheel 36 is rotatably arranged on the first brushing frame 31, and the pressing wheel 36 is used to press the printed circuit board 5 to prevent the printed circuit board 5 from moving when being brushed; the second brushing mechanism 60 is the same as the first brushing mechanism 30, and the implementation method of the second brushing mechanism 60 is not repeated here.

[0034] As attached Figure 8-11As shown, the rotating plate mechanism 40 includes a rotating plate frame 41, a third feeding roller 42, a support plate 43, a lifting drive device 44, a lifting plate 45 and a rotating drive device 46; the third feeding roller 42 is installed on the rotating plate frame 41, and the third feeding roller 42 is used to drive the printed circuit board 5 to move; a bottom plate 47 is provided at the bottom of the rotating plate frame 41, the lifting drive device 44 is connected and fixed on the bottom plate 47, and the lifting plate 45 is installed on the output shaft of the lifting drive device 44, and the lifting drive device 44 is used to drive the lifting plate 45 to rise and fall. In this embodiment, the lifting drive device 44 is a cylinder; the rotating drive device 46 is connected and fixed to the bottom of the lifting plate 45, and the support plate 43 is installed on the output shaft of the rotating drive device 46, and the rotating drive device 46 drives the support plate 43 to rotate, and the support plate 4 3 drives the printed circuit board 5 to rotate. In this embodiment, the rotation drive device 46 is a cam divider; a third drive device 48, a third transmission assembly 49 and two third sliding assemblies 50 are arranged below the bottom plate 47; the third drive device 48 is connected and fixed to the rotating plate frame 41, and the third transmission assembly 49 is connected and fixed to the bottom plate 47. The third drive device 48 is used to drive the third transmission assembly 49 to move. In this embodiment, the third drive device 48 is a motor, and the third transmission assembly 49 is a screw structure; the two third sliding assemblies 50 are both arranged between the bottom plate 47 and the rotating plate frame 41, and the bottom plate 47 is slidably matched with the rotating plate frame 41 through the two third sliding assemblies 50. In this embodiment, the third sliding assembly 50 is a structure in which a slider and a slide rail cooperate.

[0035] When the printed circuit board 5 moves onto the support plate 43, the lifting drive device 44 drives the lifting plate 45 to lift, so that the printed circuit board 5 is higher than the third feeding roller 42, and the rotating drive device 46 drives the support plate 43 to rotate horizontally by 90 degrees, so that the printed circuit board 5 adjusts its direction. While adjusting the direction of the printed circuit board 5, the third drive device 48 drives the third transmission assembly 49 to move, and the third transmission assembly 49 drives the bottom plate 47 and the lifting drive device 44 on the bottom plate 47 to move along the forward direction of the printed circuit board 5. The bottom plate 47 and the printed circuit board 5 move at the same speed so that the printed circuit board 5 passes the board transfer process. After the printed circuit board 5 passes, the third drive device 48 drives the third transmission assembly 49 to move to its original position, and the lifting drive device 44 drives the lifting plate 45 to descend, so that the support plate 43 descends to the third feeding roller 42. It should be noted that a plurality of rollers are arranged on the third feeding roller 42, and a plurality of long holes for avoiding the rollers are arranged on the support plate 43, so that the support plate 43 will not interfere with the rollers when lifting and descending.

[0036] As attached Figure 12-13As shown, the water cleaning mechanism includes a water cleaning frame 71, a water collecting tank 72, and a plurality of fourth feeding rollers 73, a nozzle 74, a sponge wheel 75 and a high-pressure air knife 76; the plurality of fourth feeding rollers 73 are rotatably arranged on the water cleaning frame 71, and the plurality of fourth feeding rollers 73 are used to drive the printed circuit board 5 to move; the plurality of nozzles 74 are connected and fixed on the water cleaning frame 71, and the plurality of nozzles 74 are respectively located on both sides of the fourth feeding roller 73, and the nozzles 74 clean the residual glue on the printed circuit board 5 by spraying water; the water collecting tank 72 is connected and fixed below the water cleaning frame 71, and the water collecting tank 72 is used to temporarily store the water sprayed by the nozzle 74; the plurality of sponge wheels 75 are rotatably arranged on the water cleaning frame 71, and the plurality of sponge wheels 75 are respectively located on both sides of the moving path of the printed circuit board 5, and the sponge wheels 75 are used to absorb the water on the printed circuit board 5; the plurality of high-pressure air knives 76 are respectively arranged on both sides of the fourth feeding roller 73, and the plurality of high-pressure air knives 76 are used to dry the printed circuit board 5 after being adsorbed by the sponge wheel 75.

[0037] A water circulation trough 77 is provided on the side of the water collecting trough 72, and a water pipe (not shown) is provided between the water collecting trough 72 and the water circulation trough 77. The water temporarily stored in the water collecting trough 72 flows into the water circulation trough 77 through the water pipe and is filtered through the water circulation trough 77 to realize the recycling of water resources.

[0038] As attached Fig.14 As shown, the working process of the grinding and cleaning machine of the utility model is as follows: the printed circuit board 5 with overflowing glue is automatically processed by the feeding plate mechanism 20, the first brushing mechanism 30, the rotating plate mechanism 40, the second brushing mechanism 60 and the water washing and cleaning mechanism 70 in sequence, thereby reducing the overflowing glue generated by the printed circuit board 5 and improving the product quality.

[0039] Working principle:

[0040] The printed circuit board 5 with overflowed glue enters the feeding clapper mechanism 20 through the first feeding roller 24, and the first driving device 23 cooperates with the clamping plate 25 through the first transmission assembly 22 to drive the movement and the clapper rod 28 to move left and right, thereby driving the printed circuit board 5 to be centered; the centered printed circuit board 5 enters the first brushing mechanism 30, and the pressing wheel 36 first presses the printed circuit board 5, and the second driving device 34 drives the cleaning wheel 35 to rotate through the second transmission assembly 33, and the cleaning wheels 35 on the upper and lower sides respectively brush the two sides of the printed circuit board 5 The overflow glue is brushed; the printed circuit board 5 after the first brushing enters the rotating plate mechanism 40, and when the printed circuit board 5 moves to the support plate 43, the lifting drive device 44 drives the lifting plate 45 and the support plate 43 to lift, so that the printed circuit board 5 is higher than the third feeding roller 42, and the rotating drive device 46 drives the support plate 43 to rotate horizontally by 90 degrees. When the support plate 43 rotates, it drives the printed circuit board 5 to rotate and adjust the direction. While adjusting the direction of the printed circuit board 5, the third driving device 48 drives the third transmission assembly 49 to rotate. The bottom plate 47 moves along the forward direction of the printed circuit board 5, and the bottom plate 47 and the printed circuit board 5 move at the same speed so that the printed circuit board 5 passes the board transfer process. After the printed circuit board 5 passes, the third driving device 48 drives the third transmission assembly 49 to move to the original position, and the lifting driving device 44 drives the lifting plate 45 to descend, so that the support plate 43 descends to the third feeding roller 42, waiting for the next printed circuit board 5 to enter; the printed circuit board 5 with a good direction is adjusted to enter the second brushing mechanism 60 for a second brushing, and the second brushing process is consistent with the first brushing; the printed circuit board 5 after the second brushing enters the water cleaning mechanism, firstly, the residual glue on the printed circuit board 5 is washed by spraying water through the nozzle 74, and the washed water enters the water circulation tank 77 through the water collecting tank 72, is filtered and reused, and after the washing is completed, the water droplets on the upper and lower sides of the printed circuit board 5 are adsorbed by the sponge wheel 75. After the water droplets are adsorbed, the high-pressure wind knife 76 blows out strong wind to clean the water stains on the printed circuit board 5 for a second time until it is completely dried, and finally the material is discharged.

[0041] The above are only specific application examples of the utility model and do not constitute any limitation to the protection scope of the utility model; any technical solutions formed by equivalent transformation or equivalent replacement shall fall within the protection scope of the utility model.

Claims

1. A grinding and cleaning machine for removing excess glue from the four edges of a printed circuit board after lamination, characterized in that: The invention comprises a main frame (10) and a feeding clapper mechanism (20), a first brushing mechanism (30), a rotating plate mechanism (40), a second brushing mechanism (60) and a water washing and cleaning mechanism (70) which are arranged in sequence in the horizontal direction of the main frame (10); the feeding clapper mechanism (20) is located at the feeding end of the first brushing mechanism (30), and the water washing and cleaning mechanism (70) is located at the discharging end of the second brushing mechanism (60); the feeding clapper mechanism (20) is used to center the printed circuit board (5), and the centered printed circuit board (5) enters the first brushing mechanism (30), and the first The brushing mechanism (30) is used to brush off the overflow glue on the printed circuit board (5). The printed circuit board (5) brushed by the first brushing mechanism (30) enters the rotating plate mechanism (40). The rotating plate mechanism (40) is used to adjust the direction of the printed circuit board (5) horizontally. After the direction is adjusted, the printed circuit board (5) enters the second brushing mechanism (60). The second brushing mechanism (60) is used to brush off the printed circuit board (5) for a second time. The printed circuit board (5) brushed for the second time enters the water cleaning mechanism. The water cleaning mechanism is used to clean the residual glue on the printed circuit board (5) with water.

2. The grinding and cleaning machine for removing glue overflow from the four edges of a printed circuit board after lamination according to claim 1, characterized in that: The feeding clapper mechanism (20) comprises a feeding frame (21), a first transmission assembly (22), a first driving device (23), a plurality of first feeding rollers (24), a clamping plate (25), a moving plate (26), a first sliding assembly (27) and a clapper rod (28); the first feeding rollers (24) are rotatably arranged on the feeding frame (21), and the first feeding rollers (24) are used to drive the printed circuit board (5) to move; the first transmission assembly (22) and the first driving device (23) are both installed below the feeding frame (21), and the first driving device (23) is used to drive the first transmission assembly (22); The movable plate (26) is installed on the feed frame (21) through a first sliding component (27), and the first sliding component (27) is used for allowing the movable plate (26) to move horizontally; one end of the clamping plate (25) is connected and fixed to the first transmission component (22), and the other end is connected and fixed to the movable plate (26), and the first transmission component (22) drives the movable plate (26) to move horizontally through the clamping plate (25); the clapping rod (28) is connected and fixed to the upper end of the movable plate (26), and the clapping rod (28) is located between adjacent first feeding rollers (24), and the clapping rod (28) is used to drive the printed circuit board (5) to be centered.

3. The grinding and cleaning machine for removing glue overflow from the four edges of a printed circuit board after lamination according to claim 1, characterized in that: The first brushing mechanism (30) comprises a first brushing frame (31), a plurality of second feeding rollers (32), a second transmission assembly (33), a second driving device (34), a cleaning wheel (35) and a pressing wheel (36); the plurality of second feeding rollers (32) are rotatably arranged on the first brushing frame (31), and the second feeding rollers (32) are used to drive the printed circuit board (5) to move; the plurality of cleaning wheels (35) are rotatably arranged on both sides of the first brushing frame (31), and the cleaning wheels (35) on the same side are respectively located on the upper and lower sides of the second feeding rollers (32). The second transmission assembly (33) and the second driving device (34) are both mounted on the first brushing frame (31), the second driving device (34) is used to drive the second transmission assembly (33), the second transmission assembly (33) is used to drive the cleaning wheel (35) to rotate, the cleaning wheel (35) is used to brush the overflow glue on the printed circuit board (5); the pressing wheel (36) is rotatably arranged on the first brushing frame (31), the pressing wheel (36) is used to press the printed circuit board (5); the second brushing mechanism (60) is the same as the first brushing mechanism (30).

4. The grinding and cleaning machine for removing glue overflow from the four edges of a printed circuit board after lamination according to claim 1, characterized in that: The rotating plate mechanism (40) comprises a rotating plate frame (41), a third feeding roller (42), a supporting plate (43), a lifting drive device (44), a lifting plate (45) and a rotating drive device (46); the third feeding roller (42) is mounted on the rotating plate frame (41), and the third feeding roller (42) is used to drive the printed circuit board (5) to move; a bottom plate (47) is arranged at the bottom of the rotating plate frame (41), the lifting drive device (44) is connected and fixed on the bottom plate (47), the lifting plate (45) is mounted on the output shaft of the lifting drive device (44), and the lifting drive device (44) is used to drive the lifting plate (45) to rise and fall; the rotating drive device (46) is connected and fixed to the bottom of the lifting plate (45), the supporting plate (43) is mounted on the output shaft of the rotating drive device (46), and the rotating drive device (46) drives the supporting plate (43) to rotate, and when the supporting plate (43) rotates, it drives the printed circuit board (5) to rotate in a certain direction.

5. The grinding and cleaning machine for removing glue overflow from the four edges of a printed circuit board after lamination according to claim 4, characterized in that: A third driving device (48), a third transmission assembly (49) and two third sliding assemblies (50) are arranged below the base plate (47); the third driving device (48) is connected and fixed to the rotating plate frame (41), the third transmission assembly (49) is connected and fixed to the base plate (47), and the third driving device (48) is used to drive the third transmission assembly (49) to move; the two third sliding assemblies (50) are both arranged between the base plate (47) and the rotating plate frame (41), and the base plate (47) is slidably matched with the rotating plate frame (41) through the two third sliding assemblies (50).

6. The grinding and cleaning machine for removing glue overflow from the four edges of a printed circuit board after lamination according to claim 1, characterized in that: The water cleaning mechanism comprises a water cleaning frame (71), a water collecting tank (72), a plurality of fourth feeding rollers (73), a spray pipe (74), a sponge wheel (75) and a high-pressure air knife (76); the plurality of fourth feeding rollers (73) are rotatably arranged on the water cleaning frame (71), and the plurality of fourth feeding rollers (73) are used to drive the printed circuit board (5) to move; the plurality of spray pipes (74) are connected and fixed on the water cleaning frame (71), and the plurality of spray pipes (74) are respectively located on both sides of the fourth feeding roller (73), and the spray pipes (74) spray water to remove the residual glue on the printed circuit board (5). The water collecting tank (72) is connected and fixed below the water cleaning frame (71), and the water collecting tank (72) is used to temporarily store water sprayed by the nozzle (74); a plurality of sponge wheels (75) are rotatably arranged on the water cleaning frame (71), and the plurality of sponge wheels (75) are respectively located on both sides of the moving path of the printed circuit board (5), and the sponge wheels (75) are used to absorb water on the printed circuit board (5); a plurality of high-pressure air knives (76) are respectively arranged on both sides of the fourth feeding roller (73), and the plurality of high-pressure air knives (76) are used to dry the printed circuit board (5) after being absorbed by the sponge wheels (75).

7. The grinding and cleaning machine for removing glue overflow from the four edges of a printed circuit board after lamination according to claim 6, characterized in that: A water circulation groove (77) is provided on the side of the water collecting groove (72), and the water temporarily stored in the water collecting groove (72) flows into the water circulation groove (77) and is filtered through the water circulation groove (77).

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