Silicon wafer conveying mechanism

Abstract

The utility model discloses a silicon wafer conveying mechanism, which comprises two groups of conveying units, the two groups of conveying units are arranged at intervals along a first direction to form a conveying space, and each group of conveying units comprises a plurality of first conveying assemblies and a plurality of second conveying assemblies which are alternately arranged along a second direction. The first conveying assembly comprises a first fixing piece, a first supporting rod and a first driving piece, the first connecting end of the first supporting rod is movably connected to the first fixing piece, the first free end of the first supporting rod faces the conveying space, and the first driving piece is connected with the first connecting end. The second conveying assembly comprises a second fixing piece, a second supporting rod and a second driving piece. The first driving part is configured to drive the first free end to move from the first position to the second position, and the second driving part is configured to drive the second free end to move from the second position to the first position so as to convey the silicon wafer. According to the silicon wafer conveying mechanism, the problem that particles or dust falling from the belt is adhered to the silicon wafer can be solved, so that the influence on the quality of the silicon wafer is reduced.

Description

Technical Field

[0001] The utility model relates to the technical field of photovoltaics, in particular to a silicon wafer conveying mechanism. Background Art

[0002] There are multiple steps in the production of solar cells, and different steps use different transmission methods. For example, between some steps, the silicon wafers need to be placed on a belt for transmission. However, when using the belt transmission method, the belt is usually driven by a motor to circulate and roll. During long-term use, the belt will be constantly bent and stretched, and cracks will appear, and even particles will fall off. In addition, dust will adhere to the belt during the transmission process. These particles and dust will adhere to the surface of the silicon wafer and enter the production process, such as high-temperature processes, diffusion or passivation processes. Under high temperature conditions, they will burn and decompose, causing the electrical performance of the solar cell, thereby affecting the quality of the solar cell. Utility Model Content

[0003] The embodiment of the utility model discloses a silicon wafer conveying mechanism, which can solve the problem of particles dropped from a belt or dust adhering to silicon wafers, thereby reducing the impact on the quality of the silicon wafers.

[0004] In order to achieve the above-mentioned purpose, the embodiment of the utility model discloses a silicon wafer conveying mechanism, comprising:

[0005] Two groups of conveying units, the two groups of conveying units are arranged at intervals along a first direction, and a conveying space for carrying silicon wafers is formed between the two groups, each group of conveying units includes a plurality of first conveying assemblies and a plurality of second conveying assemblies, and the plurality of first conveying assemblies and the plurality of second conveying assemblies are alternately arranged along a second direction;

[0006] The first conveying assembly includes a first fixing member, a first supporting rod and a first driving member, the first supporting rod has a first connecting end and a first free end, the first connecting end is movably connected to the first fixing member, the first free end faces the conveying space and is used to carry the silicon wafer, and the first driving member is connected to the first connecting end;

[0007] The second conveying assembly includes a second fixing member, a second supporting rod and a second driving member, the second supporting rod has a second connecting end and a second free end, the second connecting end is movably connected to the second fixing member, the second free end faces the conveying space and is used to carry the silicon wafer, and the second driving member is connected to the second connecting end;

[0008] In an initial state, the first free end is located at a first position, and the second free end is located at a second position, so as to support the silicon wafer;

[0009] The first driving member is configured to drive the first free end to move from the first position to the second position, and the second driving member is configured to drive the second free end to move from the second position to the first position, so as to transport the silicon wafer;

[0010] The first direction is perpendicular to the second direction.

[0011] As an optional implementation, in the first position and the second position, the first free end and the second free end are located at the same horizontal height to form a bearing plane.

[0012] As an optional embodiment, the first driving member is further configured to drive the first free end to move from the second position to the first position, and the second driving member is further configured to drive the second free end to move from the first position to the second position.

[0013] As an optional embodiment, the time for the first free end to move from the first position to the second position is equal to the time for the first free end to move from the second position to the first position, and the time for the second free end to move from the first position to the second position is equal to the time for the second free end to move from the second position to the first position.

[0014] As an optional implementation, the starting time for the first free end to move from the first position to the second position is T1, and the starting time for the second free end to move from the second position to the first position is T2, T2 is delayed from T1, and the time interval △T between T2 and T1 is less than the time T0 for the first free end to move from the first position to the second position.

[0015] As an optional embodiment, the movement trajectory of the first free end and the second free end from the first position to the second position is a straight line, the first free end and the second free end move from the second position to the position below the bearing plane to the first position, and the movement trajectory of the first free end and the second free end from the second position to the first position is an arc.

[0016] As an optional implementation, the angle between the first connecting end and the first fixing member is an acute angle, and the angle between the second connecting end and the second fixing member is an acute angle.

[0017] As an optional implementation, the first free end and the second free end are made of wear-resistant material.

[0018] As an optional embodiment, the first conveying assembly further includes a first connecting member, the first connecting member is arranged between the first connecting end and the first fixing member, the first connecting member includes a first movable part and a second movable part hinged to each other, one end of the first movable part is connected to the first fixing member, and one end of the second movable part is connected to the first connecting end, so that the first free end can rotate in multiple dimensions relative to the first fixing member under the drive of the driving member;

[0019] The second conveying assembly also includes a second connecting member, which is arranged between the second connecting end and the second fixed member. The second connecting member includes a third movable part and a fourth movable part that are hinged to each other. One end of the third movable part is connected to the second fixed member, and one end of the fourth movable part is connected to the second connecting end, so that the second free end can rotate in multiple dimensions relative to the second fixed member under the drive of the driving member.

[0020] As an optional implementation, the conveying mechanism further includes a frame, and the first fixing members and the second fixing members of the two groups of conveying units are arranged on the frame.

[0021] Compared with the prior art, the beneficial effects of the utility model are:

[0022] The utility model discloses a silicon wafer conveying mechanism, which comprises two groups of conveying units, which are arranged at intervals along a first direction to form a conveying space for carrying silicon wafers, and each group of conveying units comprises a plurality of first conveying assemblies and a plurality of second conveying assemblies arranged alternately along a second direction. The first conveying assembly comprises a first fixing member, a first support rod and a first driving member, the first connecting end of the first support rod can be movably connected to the first fixing member, the first free end faces the conveying space, and is used to carry silicon wafers, and the first driving member is connected to the first connecting end. Correspondingly, the second conveying assembly comprises a second fixing member, a second support rod and a second driving member. In an initial state, the first free end is located at a first position, and the second free end is located at a second position, so as to carry silicon wafers. The utility model drives the first free end to move from the first position to the second position by the first driving member, and the second driving member is configured to drive the second free end to move from the second position to the first position, so as to convey silicon wafers. In this way, the method of supporting and conveying silicon wafers by using support rods arranged on the fixed parts can reduce the contact area with the silicon wafers during the conveying process, thereby reducing the impact on the surface of the silicon wafers, and on the other hand, the support rods can avoid the problem of dust accumulation and adhesion to the silicon wafers due to large-scale circulation rotation such as belt-type, thereby effectively reducing the impact on the quality of the silicon wafers. BRIEF DESCRIPTION OF THE DRAWINGS

[0023] In order to more clearly illustrate the technical solutions in the embodiments of the present invention, the drawings required for use in the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without creative work.

[0024] Figure 1 It is a structural schematic diagram of the transmission mechanism disclosed in the utility model;

[0025] Figure 2 It is a side view schematic diagram of the transmission mechanism disclosed in the utility model;

[0026] Figure 3 It is a top view schematic diagram of the first support rod in the first position and the second support rod in the second position disclosed in the utility model;

[0027] Figure 4 It is a top view schematic diagram of the first support rod in the second position and the second support rod in the first position disclosed in the utility model;

[0028] Figure 5 It is a schematic structural diagram of the first connecting member and the second connecting member disclosed in the utility model.

[0029] Description of reference numerals:

[0030] 100, conveying mechanism; 10, conveying unit; 11, first conveying assembly; 111, first fixing member; 112, first supporting rod; 112a, first connecting end; 112b, first free end; 113, first driving member; 114, first connecting member; 114a, first movable part; 114b, second movable part; 12, second conveying assembly; 121, second fixing member; 122, second supporting rod; 122a, second connecting end; 122b, second free end; 123, second driving member; 124, second connecting member; 124a, third movable part; 124b, fourth movable part; 20, conveying space; 30, frame; O1, first position; O2, second position; X, first direction; Y, second direction. DETAILED DESCRIPTION

[0031] The following will be combined with the drawings in the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments of the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.

[0032] In the present invention, the terms "upper", "lower", "horizontal" and the like indicate positions or positional relationships based on the positions or positional relationships shown in the accompanying drawings. These terms are mainly used to better describe the present invention and its embodiments, and are not used to limit the indicated devices, elements or components to have a specific orientation, or to be constructed and operated in a specific orientation.

[0033] In addition, some of the above terms may be used to express other meanings in addition to indicating orientation or positional relationship. For example, the term "on" may also be used to express a certain dependency or connection relationship in some cases. For those skilled in the art, the specific meanings of these terms in this utility model can be understood according to specific circumstances.

[0034] In addition, the terms "disposed", "provided with", and "connected" should be understood in a broad sense. For example, it can be a fixed connection, a detachable connection, or an integral structure; it can be a mechanical connection, or an electrical connection; it can be a direct connection, or an indirect connection through an intermediate medium, or it can be an internal connection between two devices, elements, or components. For those of ordinary skill in the art, the specific meanings of the above terms in this utility model can be understood according to specific circumstances.

[0035] In addition, the terms "first", "second", etc. are mainly used to distinguish different devices, elements or components (the specific types and structures may be the same or different), and are not used to indicate or imply the relative importance and quantity of the indicated devices, elements or components. Unless otherwise specified, "plurality" means two or more.

[0036] At present, most silicon wafers are transported by belts, which are placed on rollers to achieve reciprocating motion. However, since the belts are made of large-molecule plastics or organic materials such as rubber, they will be constantly bent and stretched during the reciprocating motion, causing tiny cracks to appear on the belts and even particles to fall off. This part of the powder adheres to the surface of the silicon wafer and enters the battery production process, especially high-temperature processes such as diffusion or passivation. Direct combustion and decomposition under high temperature will contaminate the battery and even the furnace tube, causing the quality of the silicon wafer to decline.

[0037] In addition, the motor that drives the belt is set under the belt, with a relatively complex structure and close to the silicon wafer on the belt. During the continuous high-speed rotation, dust is easily accumulated and is not easy to clean. In the long run, it may cause pollution to the surface of the silicon wafer.

[0038] Based on this, the present invention provides a new type of silicon wafer conveying mechanism, which realizes the conveying of silicon wafers by movably connecting the first support rod to the first fixing member, movably connecting the second support rod to the second fixing member, and driving the first free end from the first position to the second position by the first driving member, and the second driving member is configured to drive the second free end from the second position to the first position. In this way, the method of supporting and conveying silicon wafers by using a movable support rod arranged on the fixing member can reduce the contact area with the silicon wafers during the conveying process of the silicon wafers, thereby reducing the impact on the surface of the silicon wafers, and on the other hand, the support rods can avoid the problem of dust easily accumulating and adhering to the silicon wafers due to large-scale circulation of the belt type, thereby effectively reducing the impact on the quality of the silicon wafers.

[0039] The technical solution of the utility model will be further described below in conjunction with embodiments and drawings.

[0040] Please also read Figures 1 to 4 The utility model discloses a silicon wafer conveying mechanism 100, which comprises two groups of conveying units 10, which are arranged at intervals along a first direction X, and a conveying space 20 for carrying silicon wafers is formed between the two groups of conveying units 10, and each group of conveying units 10 comprises a plurality of first conveying assemblies 11 and a plurality of second conveying assemblies 12, and the plurality of first conveying assemblies 11 and the plurality of second conveying assemblies 12 are alternately arranged along a second direction Y. The first conveying assembly 11 comprises a first fixing member 111, a first support rod 112 and a first driving member 113, the first support rod 112 has a first connecting end 112a and a first free end 112b, the first connecting end 112a can be movably connected to the first fixing member 111, and the first free end 112b faces the conveying space 20, and is used to carry silicon wafers, and the first driving member 113 is connected to the first connecting end 112a. The second conveying assembly 12 includes a second fixing member 121, a second support rod 122 and a second driving member 123. The second support rod 122 has a second connection end 122a and a second free end 122b. The second connection end 122a can be movably connected to the second fixing member 121. The second free end 122b faces the conveying space 20 and is used to carry silicon wafers. The second driving member 123 is connected to the second connection end 122a. In the initial state, the first free end 112b is located at the first position O1, and the second free end 122b is located at the second position O2 to carry silicon wafers. The first driving member 113 is configured to drive the first free end 112b to move from the first position O1 to the second position O2, and the second driving member 123 is configured to drive the second free end 122b to move from the second position O2 to the first position O1 to convey silicon wafers. Wherein, the first direction X is perpendicular to the second direction Y.

[0041] The utility model realizes the conveying of silicon wafers by movably connecting the first support rod 112 to the first fixing member 111, movably connecting the second support rod 122 to the second fixing member 121, and driving the first free end 112b from the first position O1 to the second position O2 by the first driving member 113, and the second driving member 123 is configured to drive the second free end 122b from the second position O2 to the first position O1. In this way, the method of supporting and conveying silicon wafers by using the movable support rods arranged on the fixing member is compared with the conveying method using the belt in the related art. On the one hand, the support rods are arranged at intervals, and only a small local position of the silicon wafer contacts the support rods. Compared with the integral contact of the belt with the silicon wafer, the method of the utility model can reduce the contact area with the silicon wafer during the conveying process of the silicon wafer, thereby reducing the impact on the surface of the silicon wafer; on the other hand, it can avoid the cracks of the belt due to continuous bending and stretching during long-term use, and even the impact of falling particles on the silicon wafer.

[0042] In addition, by arranging support rods on multiple fixing parts and separately arranging driving parts to drive the support rods to move, the support rods only swing in a small range and do not rotate with the silicon wafers. This can avoid the problem of dust accumulation and adhesion to the silicon wafers due to large-scale circulation rotation such as belt-type, and can effectively reduce the impact on the quality of the silicon wafers.

[0043] It should be noted that the above initial state is the state when the conveying mechanism 100 is carrying silicon wafers but has not started to transport the silicon wafers. At this time, the spatial positions of the first free end 112b of the first support rod 112 and the second free end 122b of the second support rod 122 in the conveying space 20 are as described above.

[0044] In addition, the first free end 112b of the first support rod 112 and the second free end 122b of the second support rod 122 should be understood in a broad sense, that is, the free ends do not only refer to the ends opposite to the connecting ends, but also include the parts of the support rods outside the free ends that are close to the connecting ends.

[0045] It is understandable that, see Figure 3 and Figure 4 The first free end 112b and the second free end 122b have the first position O1 and the second position O2 respectively. The first free end 112b moves from the first position O1 to the second position O2, and the second free end 122b moves from the second position O2 to the first position O1, so as to drive the carried silicon wafer to move. In addition, the plurality of first conveying components 11 and the plurality of second conveying components 12 alternately arranged in sequence are used to perform repeated movements, so that the silicon wafer can be conveyed.

[0046] Optionally, the fixing member may be a shaft-shaped, plate-shaped, or other supporting structure. The support rod may have different shapes, such as a square rod, a cylindrical rod, etc., as long as it can support the silicon wafer, and this embodiment does not specifically limit this.

[0047] In addition, the first support rod 112 and the second support rod 122 can be of the same structure and have the same length. In this way, on the one hand, during the production process of the support rods, it is beneficial to maintain the consistency of the process, and when any support rod is damaged, it can be easily replaced, thereby improving the versatility of the structure; on the other hand, the first support rod 112 and the second support rod 122 maintain the same length, and the interval between the relative first support rod 112 and the second support rod 122 can be arranged more reasonably, so that the conveying space 20 has a suitable size to carry the silicon wafers, thereby maintaining the integrity of the structural layout of the conveying mechanism 100.

[0048] In some embodiments, when the first position O1 and the second position O2 are in the same horizontal height, the first free end 112b and the second free end 122b are located at the same level to form a bearing plane, so that the silicon wafer can be stably located on the support rod in both the initial state and during the conveying process of the silicon wafer, thereby maintaining the stability of the conveying of the silicon wafer.

[0049] It can be understood that the carrying plane is a plane for carrying silicon wafers formed in the conveying space 20 when the first free end 112b and the second free end 122b are at the same horizontal height when they are in the first position O1 and the second position O2. As a result, when the silicon wafers are supported at the first free end 112b and the second free end 122b, they can be in a horizontal plane, ensuring that the silicon wafers can be smoothly conveyed.

[0050] Optionally, the first driving member 113 is further configured to drive the first free end 112b to move from the second position O2 to the first position O1, and the second driving member 123 is further configured to drive the second free end 122b to move from the first position O1 to the second position O2. That is, both the first free end 112b and the second free end 122b can perform bidirectional movement. The movement from the first position O1 to the second position O2 is defined as the first movement, and the movement from the second position O2 to the first position O1 is defined as the second movement. Then, when the first free end 112b performs the first movement, the second free end 122b performs the second movement; when the first free end 112b performs the second movement, the second free end 122b performs the first movement, and the two are alternated in sequence, so as to realize the effective forward conveyance of the silicon wafer.

[0051] Furthermore, the motion trajectory of the first free end 112b and the second free end 122b from the first position O1 to the second position O2 is a straight line, the first free end 112b and the second free end 122b move from the second position O2 to the position below the bearing plane to the first position O1, and the motion trajectory of the first free end 112b and the second free end 122b from the second position O2 to the first position O1 is an arc. That is, the first free end 112b and the second free end 122b move from the first position O1 to the second position O2 for directional rotation, and the first free end 112b and the second free end 122b move from the second position O2 to the first position O1 for swinging from below the bearing plane. With the above design, the first free end 112b or the second free end 122b does not contact the silicon wafer when moving from the second position O2 to the first position O1, thereby avoiding interference with the silicon wafer being transported. In addition, with the setting of the motion trajectory as an arc, the motion form is single, the control method is simple, and it is more conducive to the structural design of the driving member.

[0052] In some embodiments, the time taken for the first free end 112b to move from the first position O1 to the second position O2 may be equal to the time taken for the first free end 112b to move from the second position O2 to the first position O1, and the time taken for the second free end 122b to move from the first position O1 to the second position O2 may be equal to the time taken for the second free end 122b to move from the second position O2 to the first position O1. That is, the time taken for the first free end 112b to directional rotate from the first position O1 to the second position O2 is equal to the time taken for the first free end 112b to swing back to the second position O2 from the second position O2, and the movements of the first free ends 112b of all the first support rods 112 in the entire conveying unit 10 are kept synchronous, and the movements of the second free ends 122b of all the second support rods 122 are kept synchronous. In this way, it can be ensured that after the first free end 112b is directional-rotated from the first position O1 to the second position O2 to transport the silicon wafer forward, it can be swung back to the first position O1 from the second position O2 in the same time to continuously connect with the subsequently transported silicon wafer. Correspondingly, the second free end 122b has the same function, thereby ensuring that the silicon wafer can continuously flow between the first support rod 112 and the second support rod 122.

[0053] Furthermore, the starting time of the first free end 112b moving from the first position O1 to the second position O2 is T1, and the starting time of the second free end 122b moving from the second position O2 to the first position O1 is T2, T2 is delayed from T1, and the time interval △T between T2 and T1 is less than the time T0 of the first free end 112b moving from the first position O1 to the second position O2. That is, in the initial state, after the first free end 112b starts to move from the first position O1 to the second position O2 for a certain period of time, the second free end 122b starts to move from the second position O2 to the first position O1. In this way, in the initial state, the silicon wafer can be sufficiently supported, and when the first free end 112b starts to move and smoothly transports the silicon wafer, the second free end 122b starts to move, which is more conducive to allowing the silicon wafer to gradually enter a stable transport state.

[0054] It is understandable that when the time interval △T between T2 and T1 is less than the time T0 for the first free end 112b to move from the first position O1 to the second position O2, the time interval △T should not be too large to avoid too large a difference in the frequency of movement of the second free end 122b and the first free end 112b, which would affect the efficiency of silicon wafer transportation.

[0055] For example, the time T0 for the first free end 112b to move from the first position O1 to the second position O2 is 0.1S, and the time for the first free end 112b to move from the second position O2 to the first position O1 is also 0.1S. The time interval △T between the start time T1 of the first free end 112b moving from the first position O1 to the second position O2 and the start time T2 of the second free end 122b moving from the second position O2 to the first position O1 can be 0.05S, as long as △T is less than T0. The specific time interval △T can be adjusted according to the speed requirement of the silicon wafer conveying, and the embodiment of the utility model is not limited thereto.

[0056] In some embodiments, the angle between the first connection end 112a and the first fixing member 111 is an acute angle, and the angle between the second connection end 122a and the second fixing member 121 is an acute angle. That is, when the support rod is capable of supporting the silicon wafer, it is arranged in an inclined manner relative to the fixing member, so that the support rod can contact the edge of the silicon wafer rather than the surface of the silicon wafer. On the one hand, the small contact area can reduce the impact on the silicon wafer, and at the same time, it can also reduce the probability of impurities on the support rod adhering to the surface of the silicon wafer, effectively avoiding dust and cleanliness problems at the center of the silicon wafer; on the other hand, the edge of the silicon wafer has the least impact on the overall electrical performance of the battery cell, and the method of only supporting the edge of the silicon wafer can minimize the impact on the quality of the silicon wafer.

[0057] It is understandable that, by using the method of using independently arranged support rods to support and transport the silicon wafer in the embodiment of the utility model, the number of contact points of the silicon wafer is at least 4, thereby minimizing the contact between the support rods and the silicon wafer during the transportation process. Of course, the specific number of contact points can be changed according to the size of the silicon wafer or the distance between the support rods, and can be selected according to actual needs.

[0058] In one example, the material of the first free end 112b and the second free end 122b can be a wear-resistant material. That is, the material of the free end for receiving the silicon wafer is a wear-resistant material. It is understandable that in the process of conveying the silicon wafer, the friction between the support rod and the silicon wafer is mainly relied on, so the material of the free end needs to be wear-resistant, so as to reduce the degree of wear of the free end during long-term use, thereby extending the service life of the support rod.

[0059] Of course, in another example, the first support rod 112 and the second support rod 122 can be made of wear-resistant material.

[0060] Optionally, the wear-resistant material mentioned above can be wear-resistant metal, ceramic, quartz or silicon material, etc.

[0061] In some embodiments, see Figure 5 The first conveying assembly 11 also includes a first connecting member 114, which is arranged between the first connecting end 112a and the first fixed member 111. The first connecting member 114 includes a first movable portion 114a and a second movable portion 114b that are hinged to each other. One end of the first movable portion 114a is connected to the first fixed member 111, and one end of the second movable portion 114b is connected to the first connecting end 112a, so that the first free end 112b can rotate in multiple dimensions relative to the first fixed member 111 under the drive of the driving member. By setting the first connecting member 114 to include a first movable portion 114a and a second movable portion 114b that are hinged to each other, the second movable portion 114b can rotate in multiple free ends relative to the first movable portion 114a. Under the drive of the driving member, the first free end 112b described above can be rotated from the first position O1 to the second position O2 in a directional manner, or can be rotated downward from the second position O2 and then swung back to the first position O1 in an arc trajectory. This method has a simple structure and is easy to implement.

[0062] In one example, the first connecting member 114 may be a universal joint including a first movable portion 114a and a second movable portion 114b, and the first movable portion 114a and the second movable portion 114b are hinged with a cross axis to achieve multi-dimensional rotation therebetween.

[0063] In another example, the first connecting member 114 may be a ball joint structure including a first movable part 114a and a second movable part 114b, wherein the first movable part 114a is a ball seat, and the second movable part 114b is a ball bracket, and the two are connected by a spherical pair, and the ball bracket can rotate in multiple dimensions relative to the ball seat.

[0064] It should be noted that the first driving member 113 that controls the movement of the first free end 112b may include a motor and a connecting rod mechanism, which is connected between the motor and the first connecting end 112a through the connecting rod mechanism. The motor controls the connecting rod mechanism to realize directional rotation and cyclic swing of the first support rod 112. The specific structure of the motor and the connecting rod mechanism can adopt the existing design and will not be described in detail here.

[0065] Correspondingly, the second conveying component 12 also includes a second connecting member 124, which is arranged between the second connecting end 122a and the second fixed member 121. The second connecting member 124 includes a third movable part 124a and a fourth movable part 124b that are hinged to each other. One end of the third movable part 124a is connected to the second fixed member 121, and one end of the fourth movable part 124b is connected to the second connecting end 122a, so that the second free end 122b can rotate in multiple dimensions relative to the second fixed member 121 under the drive of the driving member.

[0066] That is, the above-mentioned first connecting member 114 and the second connecting member 124, the first driving member 113 and the second driving member 123 all have the same structure, except that the initial states of the first support rod 112 and the second support rod 122 connected thereto are different. Therefore, they also have the same technical effect as the first connecting member 114, and the details are not repeated here.

[0067] In some embodiments, the conveying mechanism 100 may further include a frame 30, and the first fixing members 111 and the second fixing members 121 of the two groups of conveying units 10 are arranged on the frame 30. On the one hand, arranging the first fixing members 111 and the second fixing members 121 on the frame 30 is more conducive to structural integration and the integrity of the conveying mechanism 100; on the other hand, the conveying mechanism 100 can be erected to a certain height by using the frame 30, so that the conveying mechanism 100 can be more suitable for different production processes.

[0068] The process of conveying silicon wafers by the conveying mechanism 100 of the present invention is described in detail below:

[0069] The utility model provides a silicon wafer conveying mechanism 100. From the perspective of the conveying mechanism 100 as a whole, all the first free ends 112b carry silicon wafers during the directional rotation from the first position O1 to the second position O2, and rely on friction to move the silicon wafers horizontally. At the same time, all the second free ends 122b swing from the second position O2 back to the first position O1 to receive the silicon wafers, and then directional rotate from the first position O1 to the second position O2 to convey the silicon wafers. At this time, the first free ends 112b swing from the second position O2 back to the first position O1 to receive the silicon wafers again, and this cycle is repeated.

[0070] The silicon wafer conveying mechanism disclosed in the embodiment of the utility model is introduced in detail above. Specific examples are used in this article to illustrate the principle and implementation mode of the utility model. The description of the above embodiments is only used to help understand the silicon wafer conveying mechanism of the utility model and its core idea; at the same time, for general technical personnel in this field, according to the idea of ​​the utility model, there will be changes in the specific implementation mode and application scope. In summary, the content of this specification should not be understood as a limitation on the utility model.

Claims

1. A silicon wafer conveying mechanism, characterized in that: include: Two groups of conveying units, the two groups of conveying units are arranged at intervals along a first direction, and a conveying space for carrying silicon wafers is formed between the two groups, each group of conveying units includes a plurality of first conveying assemblies and a plurality of second conveying assemblies, and the plurality of first conveying assemblies and the plurality of second conveying assemblies are alternately arranged along a second direction; The first conveying assembly includes a first fixing member, a first supporting rod and a first driving member, the first supporting rod has a first connecting end and a first free end, the first connecting end is movably connected to the first fixing member, the first free end faces the conveying space and is used to carry the silicon wafer, and the first driving member is connected to the first connecting end; The second conveying assembly includes a second fixing member, a second supporting rod and a second driving member, the second supporting rod has a second connecting end and a second free end, the second connecting end is movably connected to the second fixing member, the second free end faces the conveying space and is used to carry the silicon wafer, and the second driving member is connected to the second connecting end; In an initial state, the first free end is located at a first position, and the second free end is located at a second position, so as to support the silicon wafer; The first driving member is configured to drive the first free end to move from the first position to the second position, and the second driving member is configured to drive the second free end to move from the second position to the first position, so as to transport the silicon wafer; The first direction is perpendicular to the second direction.

2. The silicon wafer conveying mechanism according to claim 1, characterized in that: In the first position and the second position, the first free end and the second free end are located at the same horizontal height to form a bearing plane.

3. The silicon wafer conveying mechanism according to claim 2, characterized in that: The first driving member is further configured to drive the first free end to move from the second position to the first position, and the second driving member is further configured to drive the second free end to move from the first position to the second position.

4. The silicon wafer conveying mechanism according to claim 3, characterized in that: The time for the first free end to move from the first position to the second position is equal to the time for the first free end to move from the second position to the first position, and the time for the second free end to move from the first position to the second position is equal to the time for the second free end to move from the second position to the first position.

5. The silicon wafer conveying mechanism according to claim 4, characterized in that: The starting time when the first free end moves from the first position to the second position is T1, and the starting time when the second free end moves from the second position to the first position is T2. T2 is delayed from T1, and the time interval ΔT between T2 and T1 is less than the time T0 when the first free end moves from the first position to the second position.

6. The silicon wafer conveying mechanism according to claim 3, characterized in that: The motion trajectory of the first free end and the second free end from the first position to the second position is a straight line, the first free end and the second free end move from the second position to the position below the bearing plane to the first position, and the motion trajectory of the first free end and the second free end from the second position to the first position is an arc.

7. The silicon wafer conveying mechanism according to any one of claims 1 to 6, characterized in that: An angle between the first connection end and the first fixing member is an acute angle, and an angle between the second connection end and the second fixing member is an acute angle.

8. The silicon wafer conveying mechanism according to any one of claims 1 to 6, characterized in that: The first free end and the second free end are made of wear-resistant material.

9. The silicon wafer conveying mechanism according to any one of claims 1 to 6, characterized in that: The first conveying assembly further includes a first connecting member, the first connecting member is arranged between the first connecting end and the first fixing member, the first connecting member includes a first movable portion and a second movable portion hinged to each other, one end of the first movable portion is connected to the first fixing member, and one end of the second movable portion is connected to the first connecting end, so that the first free end can rotate in multiple dimensions relative to the first fixing member under the drive of the driving member; The second conveying assembly also includes a second connecting member, which is arranged between the second connecting end and the second fixed member. The second connecting member includes a third movable part and a fourth movable part that are hinged to each other. One end of the third movable part is connected to the second fixed member, and one end of the fourth movable part is connected to the second connecting end, so that the second free end can rotate in multiple dimensions relative to the second fixed member under the drive of the driving member.

10. The silicon wafer conveying mechanism according to any one of claims 1 to 6, characterized in that: The conveying mechanism further comprises a frame, and the first fixing members and the second fixing members of the two groups of conveying units are arranged on the frame.

Images