Cooling structure for silicon carbide epitaxial equipment

Abstract

The utility model discloses a cooling structure for silicon carbide epitaxy equipment, which comprises an epitaxy equipment body, the right side of the epitaxy equipment body is provided with a cooling box, the left side surface of the cooling box is fixedly embedded with a mounting cylinder, the mounting cylinder is internally provided with an exhaust fan, the inner wall of the cooling box is fixedly connected with a group of first guide plates, and the inner wall of the first guide plates is fixedly connected with a group of second guide plates. And the inner top wall of the cooling box is fixedly connected with a permeable net plate, the right side face of the permeable net plate is fixedly connected with a set of second flow guide plates, and a pump body is installed on the right side face of the cooling box. According to the device, through cooperation of the pump body, the water pumping pipe, the water conveying pipe, the first flow guide plate, the second flow guide plate and the exhaust fan, cooling water can be pumped through work of the pump body, the cooling water can flow on the first flow guide plate and the second flow guide plate to form a water curtain, and the flowing water curtain can cool air; and the exhaust fan conveys the cooled air into the epitaxial equipment body, so that the damage to the equipment can be avoided.

Description

Technical Field

[0001] The utility model relates to the technical field of silicon carbide cooling, in particular to a cooling structure for silicon carbide epitaxial equipment. Background Art

[0002] When preparing silicon carbide single wafers, the temperature in the reaction chamber of the silicon carbide epitaxial equipment needs to be strictly controlled to ensure the wafer quality and production efficiency. The growth of silicon carbide epitaxial wafers usually adopts chemical vapor deposition, using hydrogen as the cyclone floating gas to drive the rotating base to rotate at a uniform speed. While rotating, there will be a certain floating height. Nitrogen is used as a dopant. Under certain growth temperature, pressure and process parameters, carbon and silicon atoms are arranged periodically in a certain order to form a silicon carbide epitaxial layer.

[0003] Current epitaxial equipment is usually water-cooled when in use, but the cooling water is directly injected into the epitaxial equipment during cooling. The pollutants in the cooling water may cause damage to the equipment. Therefore, we propose a cooling structure for silicon carbide epitaxial equipment to solve the above problem. Utility Model Content

[0004] The purpose of the utility model is to provide a cooling structure for silicon carbide epitaxial equipment to solve the problems raised in the above background technology.

[0005] In order to achieve the above purpose, the utility model provides the following technical solutions:

[0006] A cooling structure for silicon carbide epitaxial equipment comprises an epitaxial equipment body, a cooling box is arranged on the right side of the epitaxial equipment body, a mounting cylinder is fixedly embedded on the left side surface of the cooling box, an exhaust fan is installed inside the mounting cylinder, a group of first guide plates are fixedly connected to the inner wall of the cooling box, a transparent mesh plate is fixedly connected to the inner top wall of the cooling box, a group of second guide plates are fixedly connected to the right side surface of the transparent mesh plate, a pump body is installed on the right side surface of the cooling box, an input end of the pump body is fixedly connected to a water pumping pipe, the bottom end of the water pumping pipe passes through the cooling box and extends to the inside of the cooling box, and an output end of the pump body is fixedly connected to a water supply pipe, the top end of the water supply pipe passes through the cooling box and extends to above the first guide plate.

[0007] In a further embodiment, a partition is fixedly connected to the inner wall of the cooling box, the upper surface of the partition is connected to the bottom surface of the mesh plate, and a leakage groove is opened on the upper surface of the partition.

[0008] In a further embodiment, the outer surface of the water pumping pipe and the outer surface of the water delivery pipe are fixedly connected with pillars, and the left end of each of the pillars is connected to the right side surface of the cooling box.

[0009] In a further embodiment, a ventilation hole is provided on the right side of the cooling box.

[0010] In a further embodiment, the outer surface of the mounting tube is fixedly connected with connecting rods arranged in a ring, and the ends of each group of connecting rods close to each other are connected to the outer surface of the epitaxial device body.

[0011] In a further embodiment, a vertical plate is fixedly connected to the bottom surface of the epitaxial device body, and a substrate is fixedly connected to the bottom surface of the vertical plate.

[0012] Compared with the prior art, the beneficial effects of the utility model are:

[0013] The device cooperates with the pump body, the water suction pipe, the water delivery pipe, the first guide plate, the second guide plate and the exhaust fan. The cooling water can be sucked by the operation of the pump body. The cooling water will flow on the first guide plate and the second guide plate to form a water curtain. The flowing water curtain will cool the air. The exhaust fan will transport the cooled air to the inside of the epitaxial equipment body, thereby avoiding damage to the equipment. BRIEF DESCRIPTION OF THE DRAWINGS

[0014] Figure 1 A schematic diagram of the three-dimensional structure of a cooling structure for silicon carbide epitaxial equipment.

[0015] Figure 2 A schematic perspective view of a side view of a mounting barrel of a cooling structure for a silicon carbide epitaxial device.

[0016] Figure 3 A schematic diagram of the three-dimensional structure of a front cross-section view of a cooling box for a cooling structure of a silicon carbide epitaxial device.

[0017] In the figure: 1. epitaxial equipment body; 2. vertical plate; 3. substrate; 4. connecting rod; 5. water pipe; 6. cooling box; 7. mounting cylinder; 8. exhaust fan; 9. support; 10. pump body; 11. water extraction pipe; 12. leakage trough; 13. partition; 14. first guide plate; 15. second guide plate; 16. mesh plate; 17. vent. DETAILED DESCRIPTION

[0018] In the description of the present invention, it should be noted that, unless otherwise clearly specified and limited, the terms "installation", "connection" and "connection" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection, or it can be an indirect connection through an intermediate medium, or it can be the internal communication of two components. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood by specific circumstances.

[0019] The following will be combined with the drawings in the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.

[0020] See also Figure 1-3 In the utility model, a cooling structure for silicon carbide epitaxial equipment includes an epitaxial equipment body 1, a vertical plate 2 is fixedly connected to the bottom surface of the epitaxial equipment body 1, and a substrate 3 is fixedly connected to the bottom surface of the vertical plate 2. By using the cooperation of the vertical plate 2 and the substrate 3, a stable support can be formed for the epitaxial equipment body 1.

[0021] A cooling box 6 is arranged on the right side of the epitaxial equipment body 1, and a mounting tube 7 is fixedly embedded on the left side of the cooling box 6. An exhaust fan 8 is installed inside the mounting tube 7. By utilizing the operation of the exhaust fan 8, the cold air inside the cooling box 6 can be sucked into the epitaxial equipment body 1, thereby achieving a cooling effect.

[0022] The outer surface of the mounting tube 7 is fixedly connected with connecting rods 4 arranged in a ring, and the ends of each group of connecting rods 4 close to each other are connected to the outer surface of the epitaxial device body 1. The mounting tube 7 can be connected to the epitaxial device body 1 by the set connecting rods 4, thereby stabilizing the mounting tube 7.

[0023] A vent hole 17 is provided on the right side of the cooling box 6 , and the vent hole 17 can be used to ensure that the air inside the cooling box 6 is in a flowing state.

[0024] A group of first guide plates 14 are fixedly connected to the inner wall of the cooling box 6 , and a transparent mesh plate 16 is fixedly connected to the inner top wall of the cooling box 6 . The transparent mesh plate 16 can intercept impurities in the air and prevent the impurities from entering the interior of the epitaxial equipment body 1 .

[0025] A group of second guide plates 15 are fixedly connected to the right side of the mesh plate 16, and a pump body 10 is installed on the right side of the cooling box 6. The input end of the pump body 10 is fixedly connected to a water pumping pipe 11, and the bottom end of the water pumping pipe 11 passes through the cooling box 6 and extends to the inside of the cooling box 6. The output end of the pump body 10 is fixedly connected to a water delivery pipe 5, and the top end of the water delivery pipe 5 passes through the cooling box 6 and extends to the top of the first guide plate 14. The cooling water can be sucked and flowed by the operation of the pump body 10, and the cooling water will form a water curtain on the first guide plate 14 and the second guide plate 15, and the air will be cooled when passing through the water curtain.

[0026] The outer surface of the water extraction pipe 11 and the outer surface of the water delivery pipe 5 are fixedly connected with pillars 9, and the left end of each pillar 9 is connected to the right side of the cooling box 6. The provided pillars 9 can enhance the stability of the water extraction pipe 11 and the water delivery pipe 5.

[0027] A partition 13 is fixedly connected to the inner wall of the cooling box 6, and the upper surface of the partition 13 is connected to the bottom surface of the mesh plate 16. A leakage groove 12 is opened on the upper surface of the partition 13, and the falling cooling water can flow from the leakage groove 12 to the bottom of the cooling box 6. The partition 13 can isolate the cooling water to prevent the cooling water from splashing into the inside of the mounting tube 7.

[0028] The working principle of the utility model is: when in use, cooling water is injected into the bottom of the cooling box 6, and then the pump body 10 is started, the pump body 10 will transport the cooling water from the water pumping pipe 11 and the water delivery pipe 5 to the top of the first guide plate 14, and the water will be diverted to the second guide plate 15. The flowing cooling water will form a water curtain on the first guide plate 14 and the second guide plate 15, and the water curtain will cool the air inside the cooling box 6. Then the exhaust fan 8 is started, and the exhaust fan 8 will suck the cooled air into the inside of the epitaxial equipment body 1, thereby achieving a cooling effect and avoiding damage to the equipment.

[0029] It is obvious to those skilled in the art that the present invention is not limited to the details of the exemplary embodiments described above, and that the present invention can be implemented in other specific forms without departing from the spirit or essential features of the present invention. Therefore, the embodiments should be regarded as exemplary and non-restrictive from any point of view, and the scope of the present invention is defined by the appended claims rather than the above description, and it is intended that all changes falling within the meaning and scope of the equivalent elements of the claims be included in the present invention. Any reference numeral in a claim should not be regarded as limiting the claim to which it relates.

[0030] In addition, it should be understood that although the present specification is described according to implementation modes, not every implementation mode contains only one independent technical solution. This description of the specification is only for the sake of clarity. Those skilled in the art should regard the specification as a whole. The technical solutions in each embodiment may also be appropriately combined to form other implementation modes that can be understood by those skilled in the art.

Claims

1. A cooling structure for silicon carbide epitaxial equipment, characterized in that: The invention comprises an epitaxial device body (1), a cooling box (6) is arranged on the right side of the epitaxial device body (1), a mounting tube (7) is fixedly embedded on the left side of the cooling box (6), an exhaust fan (8) is installed inside the mounting tube (7), a group of first guide plates (14) are fixedly connected to the inner wall of the cooling box (6), a mesh plate (16) is fixedly connected to the inner top wall of the cooling box (6), a group of second guide plates (15) are fixedly connected to the right side of the mesh plate (16), a pump body (10) is installed on the right side of the cooling box (6), an input end of the pump body (10) is fixedly connected to a water pumping pipe (11), the bottom end of the water pumping pipe (11) passes through the cooling box (6) and extends to the inside of the cooling box (6), and an output end of the pump body (10) is fixedly connected to a water delivery pipe (5), the top end of the water delivery pipe (5) passes through the cooling box (6) and extends to the top of the first guide plate (14).

2. A cooling structure for silicon carbide epitaxial equipment according to claim 1, characterized in that: A partition (13) is fixedly connected to the inner wall of the cooling box (6), the upper surface of the partition (13) is connected to the bottom surface of the mesh plate (16), and a leakage groove (12) is opened on the upper surface of the partition (13).

3. The cooling structure for silicon carbide epitaxial equipment according to claim 1, characterized in that: The outer surface of the water extraction pipe (11) and the outer surface of the water delivery pipe (5) are both fixedly connected with pillars (9), and the left end of each pillar (9) is connected to the right side surface of the cooling box (6).

4. The cooling structure for silicon carbide epitaxial equipment according to claim 1, characterized in that: A vent hole (17) is provided on the right side of the cooling box (6).

5. The cooling structure for silicon carbide epitaxial equipment according to claim 1, characterized in that: The outer surface of the installation cylinder (7) is fixedly connected with connecting rods (4) arranged in a ring, and the ends of each group of connecting rods (4) close to each other are connected to the outer surface of the epitaxial device body (1).

6. The cooling structure for silicon carbide epitaxial equipment according to claim 1, characterized in that: The bottom surface of the epitaxial device body (1) is fixedly connected to a vertical plate (2), and the bottom surface of the vertical plate (2) is fixedly connected to a substrate (3).

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