Two-side packaged LED vehicle lamp light source for vehicle lamp

Abstract

The utility model provides a two-sided packaged LED car lamp light source for a car lamp, which comprises a heat-conducting insulating substrate, copper foil routing covering layers are symmetrically laid on two sides of the heat-conducting insulating substrate, and LED chips are mounted on one sides of the copper foil routing covering layers; the outer side of each LED chip is sequentially covered with a fluorescent ceramic film and a silica gel coating from inside to outside. According to the utility model, by adopting the heat-conducting insulating substrate made of ceramic materials, an insulating layer does not need to be additionally arranged, and the advantages of lower thermal resistance and better heat-conducting effect are achieved; the LED chips are directly packaged on the heat-conducting insulating substrate with the thickness of 0.4-0.5 mm, and the distance between the LED light-emitting points on the two surfaces is closer, so that the light-emitting center of the filament is simulated, the light-emitting efficiency is superior to that of a surface-mounted method, the surface-mounted process is reduced, and the precision is higher.

Description

Technical Field

[0001] The utility model belongs to the technical field of automobile light sources, and more specifically, particularly relates to a double-sided packaged LED light source for automobile lamps. Background Art

[0002] Traditional headlight bulbs use halogen lamps, and the halogen lamp's luminous filament is located at the focal point of the headlight reflector cup. In order to approach the optical effect of halogen filaments, LED alternative light sources are mostly used. The length of the light source must also be close to the length of the filament. Only by replacing the halogen bulbs can the light type that meets the vehicle regulations be illuminated. Since the filament emits light 360 degrees, and the LED is a flat light source, an LED light source is attached to each side of a substrate to get closer to the luminous effect of the filament.

[0003] Existing LED light source patches usually use copper substrates. Since the power of car light sources is relatively high, copper substrates are generally used. However, copper has high conductivity. In order to realize the pads and traces required by LED light source patches, an insulating layer needs to be made on the copper substrate, and then copper foil needs to be etched to etch out the pads and traces. However, adding an insulating layer will increase thermal resistance, which has a certain impact on heat dissipation. Therefore, in view of this, the existing structure and defects are studied and improved, and a double-sided packaged LED car light source for car lights is provided, in order to achieve a more practical purpose. Utility Model Content

[0004] In order to solve the above technical problems, the utility model provides a double-sided packaged LED headlight light source for headlights, which is achieved by the following specific technical means:

[0005] A double-sided packaged LED light source for a vehicle lamp comprises a heat-conducting insulating substrate, both sides of which are symmetrically provided with copper foil wiring covering layers, one side of which is provided with an LED chip; the outer side of the LED chip is sequentially covered with a fluorescent ceramic film and a silicone coating from the inside to the outside.

[0006] Furthermore, the thermally conductive insulating substrate is a ceramic substrate.

[0007] Furthermore, the fluorescent ceramic film is encapsulated inside the silicone coating, and the silicone coating is connected to the copper foil wiring covering layer.

[0008] Furthermore, a heat-conducting silver-plated layer is provided on the surface of the heat-conducting insulating substrate.

[0009] Furthermore, two groups of pads are provided at one end of the copper foil wiring covering layer, and the two groups of pads are respectively a positive electrode and a negative electrode.

[0010] Furthermore, the thickness of the thermally conductive insulating substrate is 0.4-0.5 mm.

[0011] Compared with the prior art, the utility model has the following beneficial effects:

[0012] 1. The utility model adopts a thermally conductive insulating substrate made of ceramic material, which eliminates the need for an insulating layer and has the advantages of lower thermal resistance and better thermal conductivity;

[0013] 2. The utility model directly packages the LED chip on a heat-conductive insulating substrate with a thickness of 0.4 to 0.5 mm, so that the distance between the LED light-emitting points on both sides is closer, thereby better simulating the light-emitting center of the filament, and the light-emitting efficiency is better than the SMD method, and the SMD process is reduced, with higher precision. BRIEF DESCRIPTION OF THE DRAWINGS

[0014] Figure 1 It is a schematic diagram of the structure plug-in of the utility model.

[0015] Figure 2 It is a schematic diagram of the general assembly of the utility model.

[0016] In the figure, the corresponding relationship between the component names and the figure numbers is as follows:

[0017] 1. Thermally conductive insulating substrate; 2. LED chip; 3. Fluorescent ceramic film; 4. Silicone coating;

[0018] 101. Thermal conductive silver plating layer; 102. Copper foil wiring covering layer; 103. Solder pad. DETAILED DESCRIPTION

[0019] The following is a further detailed description of the implementation of the present invention in conjunction with the accompanying drawings and examples. The following examples are used to illustrate the present invention, but cannot be used to limit the scope of the present invention.

[0020] In the description of the present invention, unless otherwise specified, "multiple" means two or more; the terms "upper", "lower", "left", "right", "inner", "outer", "front end", "rear end", "head", "tail" and the like indicate the orientation or positional relationship based on the orientation or positional relationship shown in the drawings, which is only for the convenience of describing the present invention and simplifying the description, and does not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operate in a specific orientation, and therefore cannot be understood as limiting the present invention. In addition, the terms "first", "second", "third" and the like are only used for descriptive purposes and cannot be understood as indicating or implying relative importance.

[0021] In the description of the present invention, it should be noted that, unless otherwise clearly specified and limited, the terms "connected" and "connection" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances. Example

[0022] As attached Figure 1 To Attachment Figure 2 As shown:

[0023] The utility model provides a double-sided packaged LED light source for a vehicle lamp, comprising a heat-conducting insulating substrate 1, wherein copper foil wiring covering layers 102 are symmetrically laid on both sides of the heat-conducting insulating substrate 1, and LED chips 2 are installed on one side of the copper foil wiring covering layers 102; the outer sides of the LED chips 2 are sequentially covered with fluorescent ceramic films 3 and silicone coatings 4 from the inside to the outside.

[0024] The thermally conductive insulating substrate 1 is a ceramic substrate. Ceramics are insulating and have better thermal conductivity than copper. Therefore, they are a better light source carrier. There is no need to add an additional insulating layer, and copper can be directly laid to make pads and circuits.

[0025] The fluorescent ceramic film 3 is encapsulated inside the silicone coating 4 , and the silicone coating 4 is connected to the copper foil wiring covering layer 102 , so as to achieve stable encapsulation of the fluorescent ceramic film 3 and the LED chip 2 .

[0026] The surface of the thermally conductive insulating substrate 1 is provided with a thermally conductive silver-plated layer 101 to further improve the heat dissipation performance of the thermally conductive insulating substrate 1 .

[0027] Among them, two groups of pads 103 are provided at one end of the copper foil wiring covering layer 102, and the two groups of pads 103 are respectively positive and negative, so as to facilitate rapid power connection during installation and use.

[0028] Among them, the thickness of the thermally conductive insulating substrate 1 is 0.4-0.5mm; compared with the traditional SMD LED light source board, the utility model adopts a ceramic substrate with both insulation and better thermal conductivity, while the traditional SMD light source board, through the 1mm thick copper substrate plus the height of the LED package, the distance between the light points on both sides is more than 2mm, and the utility model directly packages the LED chip 2 on the 0.5mm thick thermally conductive insulating substrate 1, reducing the thickness of the SMD LED package, and the distance between the light points on both sides can be achieved within 1mm, so as to achieve a more simulated filament optical property, closer to the optical effect of the filament, the light type meets the regulatory requirements, and the central brightness of the utility model is higher for the same vehicle lamp and the same power.

[0029] The working principle of this embodiment is as follows: by adopting a thermally conductive insulating substrate 1 made of ceramic material, there is no need to add an insulating layer, the thermal resistance is lower and the thermal conductivity effect is better; by directly encapsulating the LED chip 2 on the thermally conductive insulating substrate 1 with a thickness of 0.4 to 0.5 mm, the distance between the LED light-emitting points on both sides is closer, so the light-emitting center of the filament is more simulated, the light-emitting efficiency is better than the SMD method, and the SMD process is reduced, with higher precision.

[0030] The embodiments of the present invention are provided for the purpose of illustration and description, and are not intended to be exhaustive or to limit the present invention to the disclosed forms. Many modifications and variations will be apparent to those of ordinary skill in the art. The embodiments are selected and described to better illustrate the principles and practical applications of the present invention, and to enable those of ordinary skill in the art to understand the present invention and thereby design various embodiments with various modifications suitable for specific uses.

Claims

1. A double-sided packaged LED light source for a vehicle lamp, comprising a thermally conductive insulating substrate (1), characterized in that: Copper foil wiring covering layers (102) are symmetrically laid on both sides of the thermally conductive insulating substrate (1), and an LED chip (2) is installed on one side of the copper foil wiring covering layer (102); and the outer side of the LED chip (2) is sequentially covered with a fluorescent ceramic film (3) and a silicone coating (4) from the inside to the outside.

2. The double-sided packaged LED light source for vehicle lamps as claimed in claim 1, characterized in that: The thermally conductive insulating substrate (1) is a ceramic substrate.

3. The double-sided packaged LED light source for vehicle lamps as claimed in claim 1, characterized in that: The fluorescent ceramic film (3) is encapsulated inside the silicone coating (4), and the silicone coating (4) is connected to the copper foil wiring covering layer (102).

4. The double-sided packaged LED light source for vehicle lamps as claimed in claim 2, characterized in that: A heat-conductive silver-plated layer (101) is provided on the surface of the heat-conductive insulating substrate (1).

5. The double-sided packaged LED light source for vehicle lamps as claimed in claim 1, characterized in that: Two groups of pads (103) are provided at one end of the copper foil wiring covering layer (102), and the two groups of pads (103) are respectively a positive electrode and a negative electrode.

6. The double-sided packaged LED light source for vehicle lamps as claimed in claim 2, characterized in that: The thickness of the thermally conductive insulating substrate (1) is 0.4-0.5 mm.

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