Chip anti-flying device

Abstract

The utility model discloses a chip anti-flying device, which comprises a film sticking machine bottom shell, a cutting adhesive tape and a DAF film, the upper end surface of the film sticking machine bottom shell is provided with a positioning support plate, the upper end of the film sticking machine bottom shell is provided with a horizontal chute, and the cutting adhesive tape and the DAF film are installed in the horizontal chute in a sliding manner. The horizontal sliding groove is formed below the positioning hole in the positioning supporting plate in a communicating mode, a guide groove is formed in the lower end of the horizontal sliding groove in a communicating mode, a heating disc is arranged in the guide groove in a lifting mode, and a first annular cutter is fixedly connected to the surface of the upper end of the heating disc. According to the utility model, after the placement of the adhesive tape, the DAF film, the wafer and the protective film is completed and the flip cover is turned down, the packaging of the adhesive tape, the DAF film and the protective film can be completed at the same time, so that the packaging efficiency of the DAF film, the cutting adhesive tape and the protective film is improved.

Description

Technical Field

[0001] The utility model relates to the technical field of chip cutting, in particular to a chip flying prevention device. Background Art

[0002] In the chip production process, different wafer cutting processes are selected for wafers of different thicknesses: 1) wafers with a thickness of more than 100um are generally cut with blades, 2) wafers with a thickness of less than 100um are generally cut with lasers, and 3) wafers with a thickness of less than 30um are cut with plasma. Among them, blade cutting has always been the most widely used traditional cutting method. Its biggest advantage is that a large number of wafers can be cut in a short time. Before dicing, DAF film and dicing tape will be glued to the back of the wafer, and a protective film will be glued to the upper surface of the wafer. The function of DAF film and dicing tape is to stick the chip to the film, which can keep the wafer intact during the cutting process and reduce problems such as breakage, displacement, falling and debris splashing during the cutting process. The protective film is used to shield and protect the uncut upper surface of the crystal.

[0003] At present, the packaging of DAF film and dicing tape and the packaging of protective film are all independently set and cannot be packaged at the same time, that is, the packaging efficiency of DAF film, dicing tape and protective film is low. Utility Model Content

[0004] The utility model aims to solve the problem of low packaging efficiency of DAF film, dicing tape and protective film in the prior art, and proposes a chip flying material prevention device.

[0005] In order to achieve the above purpose, the utility model adopts the following technical solutions:

[0006] A chip flying prevention device comprises a film laminating machine bottom shell, a cutting tape and a DAF film, a positioning support plate is arranged on the upper end surface of the film laminating machine bottom shell, a horizontal slide groove is arranged on the upper end of the film laminating machine bottom shell, the cutting tape and the DAF film are slidably installed in the horizontal slide groove, and the horizontal slide groove is connected and arranged below the positioning hole in the positioning support plate;

[0007] The lower end of the horizontal slide groove is connected to a guide groove, a heating disc is lifted and lowered in the guide groove, and a ring-shaped cutting knife is fixedly connected to the upper end surface of the heating disc.

[0008] Preferably, a plurality of tension springs are fixedly mounted on the lower end of the heating disc, and the lower ends of the tension springs are fixedly mounted on the inner bottom surface of the guide groove.

[0009] Preferably, two rocker bars are symmetrically arranged on both sides of the inner cavity at the lower end of the guide groove, and the middle ends of the rocker bars are rotatably connected to the bottom shell of the film laminating machine.

[0010] Preferably, two lifting rods are symmetrically installed on both sides of the bottom shell of the film laminating machine, and the two ends of the rocker are respectively arranged on the lower ends of the heating disc and the lifting rods.

[0011] Preferably, both sides of the positioning support plate are provided with through holes, the top ends of the two lifting rods slide through the two through holes respectively, and a round wafer is arranged in the positioning hole in the positioning support plate.

[0012] Preferably, a flap is rotatably mounted on one side of the bottom shell of the film laminating machine, a second annular cutter is fixedly mounted on the inner wall of the flap, and a protective film is arranged between the flap and the positioning support plate.

[0013] Compared with the prior art, the utility model provides a chip flying prevention device, which has the following beneficial effects:

[0014] According to the utility model, after the placement of the adhesive tape, the DAF film, the round wafer and the protective film is completed, when the flip cover is flipped downward, one is used to drive the annular cutter 2 to cut the protective film into a circle, and squeeze it to adhere to the round wafer below; the second is to drive the two lifting rods to move downward, and then the synchronous transmission of the two rocker rods is used to drive the heating disc to move upward along the guide groove, and push the annular cutter 1 on the heating disc to cut the cutting tape and the DAF film upward, and the circuit of the heating ring is connected to the pressure switch to heat the heating disc, and the cutting tape and the DAF film that are melted and solidified can be firmly adhered to the bottom of the round wafer, that is, the present application can complete the packaging of the adhesive tape, the DAF film and the protective film at the same time when the flip cover is flipped downward, thereby improving the packaging efficiency of the DAF film, the cutting tape and the protective film. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] Figure 1 This is a schematic structural diagram of a chip flying prevention device proposed by the utility model;

[0016] Figure 2 This is an exploded view of a chip flying prevention device proposed by the utility model;

[0017] Figure 3 This is a cross-sectional view of a chip flying prevention device proposed by the utility model.

[0018] In the figure: 1. bottom shell of the film laminating machine; 2. guide groove; 3. tension spring; 4. rocker; 5. lifting rod; 6. heating disc; 7. ring cutter 1; 8. cutting tape; 9. DAF film; 10. positioning support plate; 11. round wafer; 12. perforation; 13. protective film; 14. flip cover; 15. ring cutter 2; 16. horizontal slide groove. DETAILED DESCRIPTION

[0019] The technical solutions in the embodiments of the present invention will be described clearly and completely below in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, rather than all of the embodiments.

[0020] In the description of the present invention, it should be understood that the terms "upper", "lower", "front", "back", "left", "right", "top", "bottom", "inside", "outside", etc., indicating directions or positional relationships, are based on the directions or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific direction, be constructed and operated in a specific direction, and therefore should not be understood as a limitation on the present invention.

[0021] Reference Figure 1-3 A chip flying prevention device comprises a film laminating machine bottom shell 1, which is the shell of a wafer film laminating machine in the prior art. A guide groove 2 is arranged on the film laminating machine bottom shell 1, and a plurality of tension springs 3 are fixedly installed on the inner bottom surface of the guide groove 2. A heating disc 6 is fixedly connected to the top of the tension spring 3. The tension spring 3 in the present application is always in a stretched state. The elastic force of the tension spring 3 is used to automatically pull the heating disc 6 into the guide groove 2, and the heating disc 6 is lifted and installed in the guide groove 2. An annular cutter 7 is fixedly installed at the outer ring of the top of the heating disc 6. The upper surface of the heating disc 6 and the annular cutter 7 are polished, and the surface is smooth and easy to demold.

[0022] It should be added that a heating coil is fixedly installed inside the heating disc 6, and the heating coil is connected to an external power supply through a wire, and a pressure switch is connected in series on the wire. The pressure switch is fixedly installed on the upper end surface of the heating disc 6, and the pressure switch is in a normally closed state. When the heating disc 6 transfers the extrusion force on the upper end surface to the pressure switch, the pressure switch will connect the circuit of the heating coil. The heating disc 6 is made of high thermal conductivity steel. After the circuit of the heating coil is connected, high temperature can be generated and the generated high temperature can be transferred to the heating disc 6.

[0023] In this embodiment, rocker bars 4 are symmetrically arranged on both sides of the inner cavity at the lower end of the guide groove 2, and the middle end of the rocker bars 4 is rotatably connected to the bottom shell 1 of the film laminating machine. Two lifting rods 5 are also symmetrically arranged on both sides of the bottom shell 1 of the film laminating machine. The two ends of the rocker bars 4 are respectively arranged at the lower ends of the heating disc 6 and the lifting rods 5, and a horizontal slide groove 16 is also arranged on the upper end surface of the bottom shell 1 of the film laminating machine. The horizontal slide groove 16 is connected to the upper end of the guide groove 2, and the cutting tape 8 and the DAF film 9 are slidably connected in the horizontal slide groove 16, and the cutting tape 8 is overlapped and arranged below the DAF film 9.

[0024] It is further supplemented that, when the annular cutter 7 moves upward with the heating disc 6, it is used to cut the dicing tape 8 and the DAF film 9 directly below the wafer 11 into circles, and extrude the dicing tape 8 and the DAF film 9 directly below the wafer 11, and when the upper surface of the heating disc 6 and the dicing tape 8 are squeezed against each other, the circuit of the heating ring is connected through the pressure switch, the heating disc 6 is heated, and the dicing tape 8 and the DAF film 9 of the inner circle are heated and melted, and adhered to the wafer 11 directly below.

[0025] In this embodiment, a positioning support plate 10 is also provided above the guide groove 2. The positioning support plate 10 is provided above the DAF film 9. A positioning hole is provided in the center of the positioning support plate 10. A round wafer 11 is embedded in the positioning hole in the positioning support plate 10. The four corners of the lower end of the positioning support plate 10 are respectively lifted and installed directly above the bottom shell 1 of the film laminating machine through guide columns. Two through holes 12 are symmetrically provided on both sides of the positioning support plate 10. The top ends of the two lifting rods 5 are respectively lifted and installed in the two through holes 12. A protective film 13 is slidably installed on the upper end surface of the positioning support plate 10. The inner end surface of the protective film 13 has glue and can be adhered to the round wafer 11.

[0026] In this embodiment, a flap 14 is provided on one side of the bottom shell 1 of the film laminating machine, and the flap 14 is rotatably connected to the bottom shell 1 of the film laminating machine. A ring-shaped cutter 15 is fixedly installed on the inner end surface of the flap 14. When the flap 14 is parallel to the upper end surface of the bottom shell 1 of the film laminating machine, the ring-shaped cutter 15 is arranged directly above the ring-shaped cutter 7 and the positioning hole, and the inner circle diameters of the ring-shaped cutter 15 and the ring-shaped cutter 7 are the same as the outer diameter of the wafer 11. The ring-shaped cutter 15 is used to cut the protective film 13, and the ring-shaped cutter 7 is used to cut the cutting tape 8 and the DAF film 9.

[0027] In the present invention, the chip flying material prevention device coats the wafer 11 with the dicing tape 8, the DAF film 9 and the protective film 13 in the following process:

[0028] First, pull the dicing tape 8 and the DAF film 9, and overlap the dicing tape 8 and the DAF film 9 and place them just below the positioning hole in the positioning support plate 10;

[0029] Then the wafer 11 to be laminated is positioned and clamped into the positioning hole in the positioning support plate 10;

[0030] Then pull the protective film 13 and stick the protective film 13 on the upper surface of the positioning support plate 10 and the wafer 11;

[0031] Finally, the flip cover 14 is turned downward and placed parallel to the positioning support plate 10. The turning of the flip cover 14 has a dual function.

[0032] One is used to drive the annular cutter 15 to squeeze and cover the protective film 13, and the annular cutter 15 cuts the protective film 13 into a circular shape and squeezes and adheres it to the wafer 11 below;

[0033] Secondly, the downwardly moved flip cover 14 drives the two lifting rods 5 to move downward, and at the same time presses the outer ends of the two rocker rods 4 to rotate downward, and the other ends of the two rocker rods 4 lift up the heating disc 6, and move the heating disc 6 upward along the guide groove 2, and push the annular cutter 7 on the heating disc 6 to cut the cutting tape 8 and the DAF film 9 upward, cut the cutting tape 8 and the DAF film 9 into a circular shape and fit them on the lower end surface of the wafer 11, and connect the circuit of the heating ring by the pressure switch to heat the heating disc 6, heat and melt the cutting tape 8 and the DAF film 9 on the inner circle, and the melting and solidified cutting tape 8 and the DAF film 9 can be firmly adhered to the bottom of the wafer 11, so as to keep the integrity of the wafer 11 during the cutting process and reduce the problems of collapse, displacement, falling and debris splashing generated during the cutting process, that is, when the diamond saw blade cutting the wafer 11 cuts the wafer 11, the lower end of the diamond saw blade will cut through the wafer 11, but will not pass through the solidified cutting tape 8 and the DAF film 9.

[0034] The above description is only a preferred specific implementation manner of the present invention, but the protection scope of the present invention is not limited thereto. Any technician familiar with the technical field can make equivalent replacements or changes within the technical scope disclosed by the present invention according to the technical scheme and the utility model concept of the present invention, which should be covered by the protection scope of the present invention.

Claims

1. A chip flying material prevention device, comprising a film laminating machine bottom shell (1), a dicing tape (8) and a DAF film (9), wherein a positioning support plate (10) is arranged on the upper end surface of the film laminating machine bottom shell (1), characterized in that: A horizontal slide groove (16) is provided at the upper end of the bottom shell (1) of the film laminating machine, and the cutting tape (8) and the DAF film (9) are slidably installed in the horizontal slide groove (16), and the horizontal slide groove (16) is connected and arranged below the positioning hole in the positioning support plate (10); The lower end of the horizontal slide groove (16) is connected to a guide groove (2), a heating disc (6) is lifted and lowered in the guide groove (2), an annular cutter (7) is fixedly connected to the upper surface of the heating disc (6), two rocker bars (4) are symmetrically arranged on both sides of the inner cavity at the lower end of the guide groove (2), and the middle end of the rocker bar (4) is rotatably connected to the bottom shell (1) of the film laminating machine.

2. A chip flying prevention device according to claim 1, characterized in that: A plurality of tension springs (3) are fixedly mounted on the lower end of the heating disc (6), and the lower ends of the tension springs (3) are fixedly mounted on the inner bottom surface of the guide groove (2).

3. The chip flying prevention device according to claim 1, characterized in that: Two lifting rods (5) are symmetrically installed on both sides of the bottom shell (1) of the film laminating machine, and the two ends of the rocker (4) are respectively arranged on the lower ends of the heating disc (6) and the lifting rods (5).

4. A chip flying prevention device according to claim 3, characterized in that: Both sides of the positioning support plate (10) are provided with through holes (12), the top ends of the two lifting rods (5) slide through the two through holes (12) respectively, and a round wafer (11) is arranged in the positioning hole in the positioning support plate (10).

5. The chip flying prevention device according to claim 1, characterized in that: A flip cover (14) is rotatably mounted on one side of the bottom shell (1) of the film laminating machine, a second annular cutter (15) is fixedly mounted on the inner wall of the flip cover (14), and a protective film (13) is arranged between the flip cover (14) and the positioning support plate (10).

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