Wafer lamination and separation device

Abstract

The utility model provides a wafer lamination and separation device, which comprises a first adsorption finger, a second adsorption finger, a lifting unit, a vacuum control unit and a main frame, the second adsorption finger is connected with the main frame, and the lifting end of the lifting unit is connected with the first adsorption finger so as to adjust the relative parallel distance between the first adsorption finger and the second adsorption finger. Wherein the first adsorption finger comprises a first layer frame and a first adsorption part, the second adsorption finger comprises a second layer frame and a second adsorption part, supporting parts of the first layer frame and the second layer frame are in an open ring shape, openings of the first layer frame and the second layer frame are located on the same side and are coaxially arranged, and the first adsorption part and the second adsorption part are coaxially arranged. The first adsorption parts and the second adsorption parts are respectively and correspondingly arranged on the top surfaces and the bottom surfaces of the first shelf and the second shelf, and are respectively communicated with a vacuum control unit. Therefore, the wafer lamination and separation process automation is realized, and the wafer is not contacted with the front process area of the wafer.

Description

Technical Field

[0001] The utility model relates to semiconductor processing equipment technology, in particular to a wafer stacking and separation device based on vacuum adsorption. Background Art

[0002] In the field of semiconductor processing, chemical vapor deposition (CVD) is a process technology that allows reactants to undergo chemical reactions under gaseous conditions to generate solid substances that are deposited on the surface of a heated solid substrate, thereby producing solid materials. In order to allow chemical reactions to proceed at lower temperatures, the prior art introduces plasma processing technology into the CVD process, using the activity of plasma to promote the reaction, thereby forming plasma-enhanced chemical vapor deposition (PECVD) technology. PECVD uses microwaves or radio frequencies to ionize the gas containing the film components, forming plasma locally, and the plasma is highly chemically active and very easy to react, thereby depositing the desired film on the wafer.

[0003] When chemical vapor deposition is performed on one side of a traditional wafer, each wafer needs to be processed separately. However, with the development of technology, the prior art has proposed a variety of wafer double-sided deposition technologies, such as "A Single-Chamber Double-Sided Plasma Chemical Vapor Deposition System" Patent Publication No.: CN109055917A, "Double-Sided Deposition Equipment and Method" Patent Publication No.: 113445029A. For this reason, the inventors considered trying to adapt this type of double-sided deposition process by stacking wafers back to back and laminating two wafers at a time, so that the processed surfaces of the two wafers can be chemically deposited at the same time, thereby improving the production efficiency of the wafer in the chemical vapor deposition process.

[0004] However, corresponding to the above concept, a problem currently faced is how to achieve wafer stacking and separation without contacting the single-side process area of ​​the wafer, and there is currently no precedent equipment in this field. Utility Model Content

[0005] To this end, the main purpose of the utility model is to provide a wafer stacking and separation device to realize the automation of wafer stacking and separation processes without contacting the front process area of ​​the wafer.

[0006] In order to achieve the above-mentioned purpose, according to one aspect of the utility model, a wafer stacking and separation device is provided, which includes: a first suction finger, a second suction finger, a lifting unit, a vacuum control unit, and a main frame, wherein the second suction finger is connected to the main frame, and the lifting end of the lifting unit is connected to the first suction finger to adjust the relative parallel distance between the first and second suction fingers, wherein the first suction finger includes: a first layer frame and a first suction component, and the second suction finger includes: a second layer frame and a second suction component, and the first and second suction components are respectively arranged on the top and bottom surfaces of the first and second layer frames, and are respectively connected to the vacuum control unit.

[0007] In a possible preferred embodiment, a cantilever wall is provided on the first side of the first adsorbent, and the cantilever wall and the bottom surface of the first adsorbent have a step difference to define a first wafer accommodating space, and the bottom of the cantilever wall is located at the first wafer accommodating space and is provided with a first adsorption port; a gear platform is extended on one side of the top of the second adsorbent, and the gear platform has tooth edges and tooth valleys, and there is a step difference between the two to define a second wafer accommodating space, and the top of the tooth valley is located at the second wafer accommodating space and is provided with a second adsorption port; the height of the first and second wafer accommodating spaces is slightly greater than the thickness of a single wafer; when the bottom surface of the first adsorbent and the tooth edges of the second adsorbent engage with the movement of the lifting unit, the first and second wafer accommodating spaces form a space channel.

[0008] In a possible preferred embodiment, the bottom of the first adsorption member is located on one side of the first wafer accommodating space, and presents an arc-shaped guiding surface similar to the outer contour of the wafer; the tooth edge of the second adsorption member is located on one side of the second wafer accommodating space, and presents an arc-shaped guiding surface similar to the outer contour of the wafer.

[0009] In a possible preferred embodiment, the lower edge of the cantilever wall of the first adsorption member is chamfered to narrow the contact surface of the first adsorption port; and one side wall of the tooth valley of the second adsorption member is chamfered to narrow the contact surface of the second adsorption port.

[0010] In a possible preferred embodiment, the contact surface widths of the first and second adsorption ports are less than or equal to 2 mm.

[0011] In a possible preferred embodiment, there is a preset height difference between the gear platform of the second suction member and the second shelf to define a wafer loading and unloading space, allowing wafer fingers to enter and exit to load and unload wafers.

[0012] In a possible preferred embodiment, the first adsorption opening of the first adsorption member at the positions corresponding to the first and second adsorption fingers and the second adsorption opening of the second adsorption member are arranged in a mirror image.

[0013] In a possible preferred embodiment, the wafer stacking and separation device also includes: an optical fiber sensor and a control unit. The optical fiber sensors are respectively arranged on the first and second shelves, with their sensing surfaces facing the wafer supporting areas of the first and second shelves. The optical fiber sensors, lifting unit and vacuum control unit are respectively controlled and connected to the control unit.

[0014] In a possible preferred embodiment, the wafer stacking and separation device also includes: a photoelectric switch, a shading sheet, and a control unit. The shading sheet is arranged on the first shelf, and the photoelectric switch is arranged on the main frame, and is located on the moving path of the shading sheet as the first shelf is lifted and lowered. The photoelectric switch, lifting unit, and vacuum control unit are respectively controlled and connected to the control unit.

[0015] In a possible preferred embodiment, the vacuum control unit includes: a vacuum air circuit, a solenoid valve, a pressure sensor, an air pipe, and an air circuit connector. The solenoid valve and the factory vacuum pipeline are connected via a vacuum air circuit, the solenoid valve and the pressure sensor are connected via an air pipe, the air circuit connector is arranged on the first and second shelves and is connected to the first and second adsorption members, the air circuit connectors are connected in series via air pipes, and the pressure sensor is connected to at least one air circuit connector via an air pipe.

[0016] The wafer stacking and separation device provided by the utility model cleverly designs the edge adsorption and bite limit structure of the first and second adsorption fingers. On the one hand, the first and second adsorption fingers can automatically stack and separate wafers without contacting the front process area of ​​the wafer. On the other hand, the design of the bite limit structure can reduce the precision control requirements for the lifting unit, avoid over-limit pressure damage to the wafer when the first adsorption finger descends, thereby improving the reliability of the stacking and separation process. At the same time, the first and second wafer accommodating spaces defined by the first and second adsorption components can form a space channel with the bite limit during the wafer stacking and separation process, so as to guide the wafers to be accurately aligned during the stacking process, or to make the separated wafers accurately aligned with the first adsorption ports of the first adsorption component, so as to avoid the risk of wafer falling due to insufficient suction, so as to improve reliability, thereby meeting the processing requirements of the double-sided deposition process. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] The drawings constituting a part of this application are used to provide a further understanding of the present invention. The illustrative embodiments of the present invention and their descriptions are used to explain the present invention and do not constitute an improper limitation on the present invention. In the drawings:

[0018] Figure 1 It is a schematic diagram of the overall structure of the wafer stacking and separation device of the utility model;

[0019] Figures 2 to 3It is a schematic structural diagram of a first adsorption finger in the wafer lamination and separation device of the utility model;

[0020] Figures 4 to 5 It is a structural schematic diagram of the first adsorption member in the wafer lamination and separation device of the utility model;

[0021] Figure 6 It is a schematic cross-sectional structure diagram of a first adsorption finger in the wafer lamination and separation device of the utility model;

[0022] Figures 7 and 8 It is a structural schematic diagram of the second adsorption member in the wafer lamination and separation device of the utility model;

[0023] Fig. 9 It is a schematic cross-sectional structure diagram of the second adsorption finger in the wafer lamination and separation device of the present utility model;

[0024] Fig.10 It is a schematic diagram of a partial cross-sectional structure of the wafer stacking and separation device of the utility model, in which the first and second adsorption fingers adsorb the wafers and are in a separated state;

[0025] Fig.11 It is a schematic structural diagram of the wafer stacking and separation device of the utility model, in which the first and second adsorption fingers adsorb the wafers and are in a separated state;

[0026] Fig.12 It is a schematic diagram of a partial cross-sectional structure of the wafer stacking and separation device of the utility model, in which the first and second suction fingers suction the wafer and are in a bite state;

[0027] Fig.13 It is a schematic structural diagram of the wafer stacking and separation device of the utility model, in which the first and second suction fingers suction the wafer and are in a bite state;

[0028] Fig.14 for Fig.12 A schematic diagram of the partially enlarged cross-sectional structure of AA;

[0029] Fig.15 It is a schematic diagram of the arrangement structure of the control device on the back of the main frame in the wafer stacking and separation device of the utility model;

[0030] Fig.16 The figure is a schematic diagram of the pipeline structure of the vacuum control unit in the wafer stacking and separation device of the present invention.

[0031] Description of Reference Numerals

[0032] The first suction finger 1, the second suction finger 2, the lifting unit 3, the vacuum control unit 4, the main frame 5, the arc-shaped guide surface 6, the optical fiber sensor 7, the photoelectric switch 8, the wafer 9, the first layer shelf 11, the first suction component 12, the first wafer accommodating space 13, the second wafer accommodating space 14, the second layer shelf 21, the second suction component 22, the solenoid valve 41, the pressure sensor 42, the air path connector 43, the vacuum air path 44, the shading sheet 111, the first air groove 121, the cantilever wall 122, the first air channel 123, the first suction port 124, the second air groove 221, the tooth edge 222, the tooth valley 223, the second suction port 224, the second air channel 225. DETAILED DESCRIPTION

[0033] In order to make the purpose, technical scheme and advantages of the embodiments of the utility model clearer, the technical scheme in the embodiments of the utility model will be clearly and completely described below in conjunction with the drawings in the embodiments of the utility model. Obviously, the described embodiments are part of the embodiments of the utility model, not all of the embodiments. Generally, the components of the embodiments of the utility model described and shown in the drawings here can be arranged and designed in various different configurations.

[0034] Therefore, the following detailed description of the embodiments of the present invention provided in the accompanying drawings is not intended to limit the scope of the present invention to be protected, but merely represents selected embodiments of the present invention. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0035] It should be noted that similar reference numerals and letters denote similar items in the following drawings, and therefore, once an item is defined in one drawing, further definition and explanation thereof is not required in subsequent drawings.

[0036] In the description of the present utility model, it should be noted that the terms "center", "up", "down", "left", "right", "vertical", "horizontal", "inside", "outside", etc. indicate positions or positional relationships based on the positions or positional relationships shown in the accompanying drawings, or the positions or positional relationships in which the utility model product is usually placed when in use. They are only for the convenience of describing the present utility model and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on the present utility model. In addition, the terms "first", "second", "third", etc. are only used to distinguish the description, and cannot be understood as indicating or implying relative importance. The terms "including" and "having" and any variations thereof are intended to cover non-exclusive inclusions.

[0037] In addition, the terms "horizontal", "vertical", "overhanging" and the like do not mean that the components are required to be absolutely horizontal or overhanging, but can be slightly tilted. For example, "horizontal" only means that its direction is more horizontal than "vertical", and does not mean that the structure must be completely horizontal, but can be slightly tilted.

[0038] In the description of the present utility model, it is also necessary to explain that, unless otherwise clearly specified and limited, the terms "set", "layout", "installation", "connection" and "connection" should be understood in a broad sense. For example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection, or it can be indirectly connected through an intermediate medium, or it can be the internal connection of two components. For ordinary technicians in this field, the specific meanings of the above terms in the present utility model can be understood according to specific circumstances and in combination with the prior art. In addition, the embodiments of the present utility model and the features in the embodiments can be combined with each other without conflict. And one or more of the components in the diagram may be necessary or non-essential, and the relative position relationship between the components in the above diagram can be adjusted according to actual needs.

[0039] In order to adapt to the double-sided deposition process, the wafer stacking and separation process is automated without contacting the front process area of ​​the wafer 9, such as Figures 1 to 15 As shown, the utility model illustrates a wafer stacking and separation device, which includes: a first suction finger 1, a second suction finger 2, a lifting unit 3, a vacuum control unit 4, and a main frame 5. The second suction finger 2 is connected to the main frame 5, and the lifting end of the lifting unit 3 (such as a lifting electric cylinder, a lifting cylinder or a lifting hydraulic cylinder, etc.) is connected to the first suction finger 1 to adjust the relative parallel distance between the first and second suction fingers 1 and 2.

[0040] Among them Figures 1 to 3 As shown, the first suction finger 1 includes: a first shelf 11, a first suction member 12; the second suction finger 2 includes: a second shelf 21, a second suction member 22, wherein the support parts of the first and second shelves 11, 21 are in an open ring shape, and the openings of the two shelves are located on the same side and are coaxially arranged with each other, so that the wafer fingers of the prior art can receive or load the wafer 9 at this opening, wherein the first and second suction members 12, 22 are respectively arranged on the top and bottom surfaces of the first and second shelves 11, 21, so as to roughly correspond to the edge position of the circumferential contour of the wafer 9. Each of the first and second suction members 12, 22 is respectively connected to the vacuum control unit 4.

[0041] Among them Figure 1 , Fig.15 , Fig.16As shown, the vacuum control unit 4, the example of the present invention includes: a vacuum air circuit 44, a solenoid valve 41, a pressure sensor 42, an air pipe, and an air circuit connector 43, wherein the solenoid valve 41 is connected to the factory vacuum pipeline via the vacuum air circuit 44, and the solenoid valve 41 and the pressure sensor 42 are connected via an air pipe (in order to avoid blocking the structure, the air pipe is not shown in the figure, and those skilled in the art can know the pipeline position of the air pipe based on the arrangement of the air circuit connector 43), the air circuit connector 43 is arranged on the first and second shelves 11, 21, and is connected to the first and second adsorption components 12, 22, and each of the air circuit connectors 43 is connected in series via an air pipe, and the pressure sensor 42 is connected to at least one air circuit connector 43 via an air pipe.

[0042] Among them Fig.16 As shown, in an optional example, the vacuum control unit 4 is divided into two vacuum pipelines, which are uniformly connected to the factory vacuum pipeline by a vacuum air line 44, and are divided into two solenoid valves 41 to respectively control the connection between the first and second adsorption components 12 and 22 on the first and second shelves 11 and 21. At the same time, a pressure sensor 42 is arranged at each air pipe connected to the air line connector 43 to monitor the pressure values ​​of the first and second adsorption fingers 1 and 2.

[0043] Thus, the vacuum suction output is controlled by the solenoid valve 41 and the vacuum air path 44, and the pressure change is detected by the pressure sensor 42, and a corresponding signal is output according to the set detection value, so that the solenoid valve 41 in the air path is in the initial position and connected to the atmosphere when there is no wafer 9. At this time, the air pressure of the first and second adsorbing members 12 and 22 is the atmospheric pressure. When the wafer 9 is adsorbed, when the corresponding pressure value is detected by the pressure sensor 42, it can be determined that the wafer 9 is adsorbed in place.

[0044] Among them Figures 4 to 5 As shown, in this example, the top of the first adsorption component 12 is provided with a first air groove 121, and the first side is provided with a cantilever wall 122, and the cantilever wall 122 has a height difference with the bottom surface of the first adsorption component 12 to define a first wafer accommodating space 13, and the bottom of the cantilever wall 122 is located in the first wafer accommodating space 13, and is provided with a first adsorption port 124 connected to the first air groove 121.

[0045] Among them Figure 2 , Figure 3 , Figure 6 As shown, the first adsorption component 12 is arranged on the bottom surface of the first layer frame 11, corresponding to the position of the gas circuit connector 43, and is preferably arranged at equal intervals to roughly surround the wafer 9. One side of the first air groove 121 of the first adsorption component 12 is connected to the bottom surface of the first layer frame 11 to define a first air channel 123, and the first air channel 123 is connected to the gas circuit connector 43.

[0046] Among them Figures 7 and 8 As shown, the second adsorption member 22 has a second air groove 221 at the bottom and a gear platform extending from one side of the top. The gear platform has a tooth edge 222 and a tooth valley 223 with a step therebetween to define a second wafer accommodating space 14. The top of the tooth valley 223 is located in the second wafer accommodating space 14 and is provided with a second adsorption port 224 connected to the second air groove 221.

[0047] Among them Figure 1 As shown, the second adsorption component 22 is arranged on the top surface of the second layer frame 21, corresponding to the position of the gas circuit connector 43, and is preferably arranged at equal intervals and corresponds to the position of the first adsorption component 12, so as to be distributed roughly around the wafer 9. One side of the second air groove 221 of the second adsorption component 22 is connected to the top surface of the second layer frame 21 to define a second air channel 225, and the second air channel 225 is connected to the gas circuit connector 43.

[0048] Among them, in order to ensure that the positions where the two wafers 9 are subjected to the adsorption force are consistent during the wafer separation process, thereby facilitating the separation of the wafers 9, the first adsorption port 124 of the first adsorption component 12 at the corresponding positions of the first and second adsorption fingers 1 and 2 and the second adsorption port 224 of the second adsorption component 22 are arranged in a mirror image.

[0049] In addition, in order to facilitate the wafer finger to load the material at the second suction finger 2, and also to facilitate the cooperation of the wafer finger, the laminated wafer 9 is taken away from the second suction finger 2, as shown in FIG. Fig. 9 , Fig.12 As shown, in this example, there is a preset height difference between the gear platform of the second suction member 22 and the second shelf 21 to define a wafer loading and unloading space, allowing wafer fingers to enter and exit to load and unload the wafer 9.

[0050] Among them, it is worth mentioning that Fig.12 , 14 As shown, the heights of the first and second wafer accommodating spaces 13 and 14 are slightly larger than the thickness of the single wafer 9. On the one hand, when the bottom surface of the first adsorption component 12 and the tooth edge 222 of the second adsorption component 22 are engaged with the lifting unit 3, the travel limit is prevented from being exceeded and crushing the wafer 9. On the other hand, in the engaged state, the first and second wafer accommodating spaces 13 and 14 will overlap, thereby establishing a spatial channel for guiding wafer stacking and separation adsorption, thereby guiding the wafer 9 to be precisely aligned during the stacking process. At the same time, during the separation process, the wafer 9 can be accurately aligned with the first adsorption ports 124 of the first adsorption component 12 to prevent the wafer 9 from being misplaced and causing the problem of insufficient adsorption force at a local position, thereby avoiding the risk of the wafer 9 falling due to insufficient suction force.

[0051] Further, such as Figures 5 and 6As shown, in order to facilitate the positioning of the wafer 9 on the first and second suction fingers 1 and 2, the bottom of the first suction member 12 is located on one side of the first wafer accommodating space 13, and presents an arc-shaped guide surface 6 similar to the outer contour of the wafer 9; the tooth edge 222 of the second suction member 22 is located on one side of the second wafer accommodating space 14, and presents an arc-shaped guide surface 6 similar to the outer contour of the wafer 9. This arrangement can accurately locate the relative positions of the stacked wafers 9 to improve the accuracy of the stacking of the two, and also improve the docking accuracy of the wafer 9 with the wafer fingers when the wafer 9 is separated.

[0052] Furthermore, in order to reduce the contact area between the first and second adsorbing members 12 and 22 and the wafer 9 as much as possible, as shown in FIG. Figure 6 , Fig. 9 As shown, the lower edge of the cantilever wall 122 of the first adsorption member 12 is chamfered to narrow the contact surface of the first adsorption port 124; the side wall of the tooth valley 223 of the second adsorption member 22 is chamfered to narrow the contact surface of the second adsorption port 224, wherein the contact surface width of the first and second adsorption ports 124, 224 after narrowing is preferably less than or equal to 2 mm, so as to adsorb the edge of the wafer 9 as much as possible and stay away from the front process area of ​​the wafer 9 to prevent damage to the surface of the process area of ​​the wafer 9.

[0053] Furthermore, in order to sense whether the wafer 9 is loaded, as Figure 1 , Figure 2 , Fig.15 As shown, the wafer stacking and separation device can be selected in this example, and also includes: an optical fiber sensor 7, a control unit (not shown in the figure), the optical fiber sensor 7 is respectively arranged on the first and second shelves 11, 21, and its sensing surface faces the wafer carrying area of ​​the first and second shelves 11, 21 to sense whether the first and second suction fingers 1, 2 carry the wafer 9, and the optical fiber sensor 7, the lifting unit 3, and the vacuum control unit 4 are respectively controlled and connected to the control unit.

[0054] Furthermore, in order to prevent the lifting unit 3 from moving beyond the limit, as Figure 2 , Figure 3 , Fig.15 As shown, the wafer stacking and separation device also includes: a photoelectric switch 8, a shading sheet 111, the shading sheet 111 is arranged on the first layer shelf 11, the photoelectric switch 8 is arranged on the main frame 5, and is located on the moving path of the shading sheet 111 as the first layer shelf 11 rises and falls, and the photoelectric switch 8, the lifting unit 3, and the vacuum control unit 4 are respectively connected to the control unit for control.

[0055] For the above example, see Figures 10 to 13 As shown, the working method of the wafer stacking and separation device of the utility model is as follows:

[0056] When the backs of two wafers 9 are placed facing each other on the first and second adsorption members 12 and 22 of the first and second adsorption fingers 1 and 2, the optical fiber sensor 7 detects the wafer 9 and outputs a signal indicating the presence of the wafer 9 to the control unit, so that the control unit can control the solenoid valve 41 of the vacuum control unit 4 connected to the first and second adsorption members 12 and 22 to switch to the vacuum mode, so that the air pressure at the first and second adsorption ports 124 and 224 of the first and second adsorption members 12 and 22 is a vacuum negative pressure, and the wafer 9 is adsorbed on the first and second adsorption fingers 1 and 2. When the pressure sensor 42 detects that the set pressure value reaches the standard, it outputs a signal indicating that the wafer 9 is adsorbed in place.

[0057] After receiving the signal that the wafer 9 is adsorbed in place, the control unit controls the lifting unit 3 to drive the first shelf 11 to descend until the light shielding sheet 111 triggers the photoelectric switch 8 at the descending position. At this time, it is determined that the stacking position has been reached, and the first and second adsorbents 12 and 22 are basically engaged, and the two wafers 9 are close together and about to touch. At the same time, the photoelectric switch 8 at this position outputs a signal that the wafer 9 has been adsorbed in place, and at least the solenoid valve 41 of the air path connected to the first adsorbent 12 is switched back to the initial position and connected to the atmosphere, so that the upper wafer 9 loses suction and slowly falls along the space channel, stacking the two wafers 9 together.

[0058] After that, the lifting unit 3 drives the first shelf 11 to rise until it returns to the initial position. At this time, the light shielding sheet 111 triggers the photoelectric switch 8 in the rising position and outputs a rising position signal. At this time, the wafer stacking process is completed. The robot takes the stacked wafer 9 on the second suction finger 2 and transports it to the double-sided deposition process equipment to process the stacked wafer 9.

[0059] After the processing is completed, the robot moves the two stacked wafers 9 to the second suction finger 2. At this time, the optical fiber sensor 7 detects the wafer 9, and the control unit orders the lifting unit 3 to drive the first suction finger 1 to descend until the shading sheet 111 triggers the photoelectric switch 8 in the descending position, so that the first and second suction components 12 and 22 are basically engaged. At this time, the photoelectric switch 8 at this position outputs a descending position signal to make the solenoid valve 41 of the vacuum control unit 4 switch to the vacuum mode, so that the first and second suction components 12 and 22 simultaneously absorb the upper / lower stacked wafers 9, so that the upper wafer 9 is separated and enters the first wafer accommodating space 13 along the space channel, and is sucked by the first suction component 12.

[0060] When the pressure sensors 42 connected to the corresponding gas paths of the first and second adsorption parts 12 and 22 detect that the set pressure values ​​have reached the standards, a signal indicating that the wafer 9 has been adsorbed into place is outputted, and the lifting unit 3 drives the first shelf 11 to rise until it returns to the initial position. At this time, the shading sheet 111 triggers the photoelectric switch 8 in the rising position and outputs a rising into place signal. At this time, the wafer 9 has completed separation and is waiting for the robot to take away the two separated wafers 9 respectively.

[0061] Corresponding to the above-mentioned wafer stacking and separation device example, the utility model also provides a wafer stacking and separation method, the steps of which include:

[0062] When stacking wafers, start the vacuum control unit 4, load two wafers 9 with their backs facing each other onto the first and second suction fingers 1 and 2 respectively, so that each wafer 9 is adsorbed on the first and second wafer accommodating spaces 13 and 14 of the first and second suction members 12 and 22; start the lifting unit 3, adjust the parallel distance between the first and second shelves 11 and 21 until the first and second suction members 12 and 22 are engaged; pause the vacuum control unit 4, and allow the wafer 9 on the first suction finger 1 to fall naturally to be stacked with the wafer 9 on the second suction finger 2.

[0063] When separating the wafers, the stacked wafer 9 is loaded onto the second suction finger 2 and placed in the second wafer accommodating space 14; the lifting unit 3 is started to adjust the parallel distance between the first and second shelves 11 and 21 until the first and second suction components 12 and 22 are engaged; the vacuum control unit 4 is started to separate the upper stacked wafer 9, adsorbed on the first suction component 12, and placed in the second wafer accommodating space 14; the lifting unit 3 is started to adjust the parallel distance between the first and second shelves 11 and 21 to separate the first and second suction components 12 and 22.

[0064] To sum up, the wafer stacking and separation device provided by the utility model cleverly designs the edge adsorption and bite limit structure of the first and second adsorption fingers 1 and 2. On the one hand, the first and second adsorption fingers 1 and 2 can automatically stack and separate the wafer 9 without contacting the front process area of ​​the wafer 9. On the other hand, the design of the bite limit structure can reduce the precision control requirements for the lifting unit 3, avoid over-limit pressure damage to the wafer 9 when the first adsorption finger 1 descends, thereby improving the reliability of the stacking and separation process. At the same time, the first and second wafer accommodating spaces 13 and 14 defined by the first and second adsorption components 12 and 22 can form a space channel with the bite limit during the wafer stacking and separation process, so as to guide the wafer 9 to be accurately aligned during the stacking process, or to make the separated wafer 9 accurately aligned with the first adsorption ports 124 of the first adsorption component 12, so as to avoid the risk of wafer 9 falling due to insufficient suction, so as to improve reliability, thereby meeting the processing requirements of the double-sided deposition process.

[0065] The preferred embodiments of the utility model disclosed above are only used to help explain the utility model. The preferred embodiments do not describe all the details in detail, nor do they limit the utility model to the specific implementation methods described. Obviously, many modifications and changes can be made according to the contents of this specification. This specification selects and specifically describes these embodiments in order to better explain the principles and practical applications of the utility model, so that technicians in the relevant technical field can understand and use the utility model well. The utility model is only limited by the claims and their full scope and equivalents. Any modifications, equivalent substitutions, improvements, etc. made within the spirit and principles of the utility model should be included in the scope of protection of the utility model.

[0066] In addition, various implementations of the embodiments of the present utility model can also be arbitrarily combined, as long as they do not violate the concept of the embodiments of the present utility model, they should also be regarded as the contents disclosed in the embodiments of the present utility model.

Claims

1. A wafer stacking and separation device, characterized in that include: A first suction finger, a second suction finger, a lifting unit, a vacuum control unit, and a main frame, wherein the second suction finger is connected to the main frame, and the lifting end of the lifting unit is connected to the first suction finger to adjust the relative parallel distance between the first and second suction fingers, wherein the first suction finger includes: a first layer frame and a first suction component, and the second suction finger includes: a second layer frame and a second suction component, and the first and second suction components are respectively arranged on the top and bottom surfaces of the first and second layers, and are respectively connected to the vacuum control unit.

2. The wafer stacking and separation device according to claim 1, characterized in that: A cantilever wall is provided on the first side of the first adsorption component, and a height difference is formed between the cantilever wall and the bottom surface of the first adsorption component to define a first wafer accommodating space. The bottom of the cantilever wall is located at the first wafer accommodating space and is provided with a first adsorption port. A gear platform is extended on one side of the top of the second adsorption component, and the gear platform has tooth edges and tooth valleys, and a height difference is formed between the two to define a second wafer accommodating space. The top of the tooth valley is located at the second wafer accommodating space and is provided with a second adsorption port. The height of the first and second wafer accommodating spaces is greater than the thickness of a single wafer. When the bottom surface of the first adsorption component and the tooth edges of the second adsorption component are engaged with the movement of the lifting unit, the first and second wafer accommodating spaces form a space channel.

3. The wafer stacking and separation device according to claim 2, characterized in that: The bottom of the first adsorption component is located on one side of the first wafer accommodating space and presents an arc-shaped guiding surface similar to the outer contour of the wafer; the tooth edge of the second adsorption component is located on one side of the second wafer accommodating space and presents an arc-shaped guiding surface similar to the outer contour of the wafer.

4. The wafer stacking and separation device according to claim 2, characterized in that: The lower edge of the cantilever wall of the first adsorption member is chamfered to narrow the contact surface of the first adsorption port; and one side wall of the tooth valley of the second adsorption member is chamfered to narrow the contact surface of the second adsorption port.

5. The wafer stacking and separation device according to claim 4, characterized in that: The contact surface widths of the first and second adsorption ports are less than or equal to 2 mm.

6. The wafer stacking and separation device according to claim 2, characterized in that: There is a preset height difference between the gear platform of the second suction component and the second shelf to define a wafer loading and unloading space, allowing wafer fingers to enter and exit to load and unload wafers.

7. The wafer stacking and separation device according to claim 2, characterized in that: The first suction opening of the first suction member at the positions corresponding to the first and second suction fingers and the second suction opening of the second suction member are arranged in a mirror image.

8. The wafer stacking and separation device according to claim 1, characterized in that: Also includes: Optical fiber sensor, control unit, the optical fiber sensor is respectively arranged on the first and second shelves, and its sensing surface faces the wafer bearing area of ​​the first and second shelves. The optical fiber sensor, lifting unit and vacuum control unit are respectively controlled and connected with the control unit.

9. The wafer stacking and separation device according to claim 1, characterized in that: Also includes: A photoelectric switch, a shading sheet, and a control unit. The shading sheet is arranged on the first shelf. The photoelectric switch is arranged on the main frame and is located on the moving path of the shading sheet as the first shelf is lifted or lowered. The photoelectric switch, lifting unit, and vacuum control unit are respectively connected to the control unit for control.

10. The wafer stacking and separation device according to claim 1, characterized in that: The vacuum control unit includes: a vacuum air circuit, a solenoid valve, a pressure sensor, an air pipe, and an air circuit connector. The solenoid valve and the factory vacuum pipeline are connected via a vacuum air circuit, and the solenoid valve and the pressure sensor are connected via an air pipe. The air circuit connector is arranged on the first and second shelves and is connected to the first and second adsorption members. The air circuit connectors are connected in series via air pipes, and the pressure sensor is connected to at least one air circuit connector via an air pipe.

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