Suspension device used in semiconductor wet process and semiconductor production equipment

Abstract

The utility model discloses a suspension device used in a semiconductor wet process, which comprises a clamping plug used for loading a semiconductor product, a bearing mechanism connected with the clamping plug and a lifting mechanism arranged on the bearing mechanism, and the lifting mechanism is configured to provide support for the semiconductor product in the clamping plug. And separating the semiconductor product from the groove bottom part of the card plug. According to the suspension device used in the semiconductor wet process, a semiconductor product can be prevented from being attached to the bottom of the clamping plug groove, the problem that bottom corners are not corroded completely when the semiconductor product is corroded is solved, other positions of the semiconductor product are not corroded excessively, and the quality of the semiconductor product can be improved. The utility model also discloses semiconductor production equipment.

Description

Technical Field

[0001] The utility model belongs to the technical field of semiconductor production equipment, and specifically relates to a suspension device used in a semiconductor wet process and semiconductor production equipment. Background Art

[0002] During the production of semiconductor products, wet etching and cleaning are required. The semiconductor product is placed in the positioning groove set on the plug, and the plug is connected to the suspension mechanism. The semiconductor product in the positioning groove is in a vertical state, and the bottom part of the semiconductor product is in contact with the bottom surface of the plug positioning groove. When the semiconductor product is corroded, it will be attached to the bottom surface of the plug positioning groove, resulting in the corrosion of the contact part of the semiconductor product with the plug.

[0003] In this way, the semiconductor product needs to replace the incompletely corroded position and then corrode again, which will cause over-corrosion at other positions on the semiconductor product, thereby affecting the product quality.

[0004] For example, the patent document with publication number CN203225239U discloses a tank-type wet process device, including a solution tank, a first baffle and a wafer loading device loaded with multiple silicon wafers, the solution tank includes at least one reaction tank, each reaction tank includes a pure water tank and a liquid medicine tank, and the first baffle is provided on both side walls of the solution tank, each silicon wafer is perpendicular to the first baffle, and the gap between two adjacent silicon wafers is projected onto the position of the first baffle and a sensor device is provided. The technical solution disclosed in the patent document also cannot solve the technical problems such as those recorded above. Utility Model Content

[0005] The utility model aims to solve at least one of the technical problems existing in the prior art. To this end, the utility model provides a suspension device used in a semiconductor wet process, the purpose of which is to improve the quality of semiconductor products.

[0006] In order to achieve the above-mentioned purpose, the technical solution adopted by the utility model is: a suspension device used in a semiconductor wet process, comprising a plug for loading a semiconductor product, a supporting mechanism connected to the plug and a lifting mechanism placed on the supporting mechanism, wherein the lifting mechanism is constructed to provide support for the semiconductor product in the plug so that the semiconductor product is separated from the bottom of the groove of the plug.

[0007] The lifting mechanism comprises a lifting portion for providing support to the semiconductor product in the plug, and the lifting portion is located below the plug.

[0008] The lifting portion is arranged to be tilted downward or tilted upward.

[0009] The supporting portion is provided with a contact portion for contacting the semiconductor product, and the width of the contact portion does not exceed 1 mm.

[0010] The lifting mechanism further includes a connecting portion connected to the lifting portion, the connecting portion is connected to the lower end of the carrying mechanism, and the lifting portion extends obliquely downwardly from the connecting portion or obliquely upwardly from the connecting portion.

[0011] The bearing mechanism comprises a mounting plate and a fixing seat arranged on the mounting plate, and the fixing seat is provided with a mounting groove for the plug to be inserted.

[0012] The mounting groove is arranged obliquely.

[0013] Two fixing seats are provided, the lifting mechanism is connected to the mounting plate, and the lifting mechanism is located between the two fixing seats.

[0014] The utility model also provides a semiconductor production device, comprising the suspension device used in the semiconductor wet process.

[0015] The utility model is used for a suspension device in a semiconductor wet process, which can prevent the semiconductor product from being attached to the bottom of the plug slot, and the problem of unclean corrosion of the bottom corners is not likely to occur when the semiconductor product is corroded. Other positions of the semiconductor product will not be over-corroded, and the quality of the semiconductor product can be improved. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] This specification includes the following drawings, which show the following contents:

[0017] Figure 1 It is a structural schematic diagram of the suspension device used in the semiconductor wet process of the utility model;

[0018] Figure 2 This is a front view of the suspension device used in the semiconductor wet process of the utility model;

[0019] Figure 3 It is a top view of the suspension device used in semiconductor wet process of the utility model;

[0020] Figure 4 It is a side view of the suspension device used in semiconductor wet process of the utility model;

[0021] The markings in the figure are:

[0022] 1. Mounting plate; 2. Fixing seat; 3. Connecting part; 4. Mounting groove; 5. Lifting part; 6. First outer surface; 7. Second outer surface; 8. Contact part. DETAILED DESCRIPTION

[0023] The specific implementation methods of the utility model are further explained in detail below with reference to the accompanying drawings through the description of embodiments, with the aim of helping technicians in the field to have a more complete, accurate and in-depth understanding of the concept and technical solution of the utility model and facilitating its implementation.

[0024] It should be noted that, in the following embodiments, the “first” and “second” mentioned do not represent an absolute distinction in structure and / or function, nor do they represent a sequential order of execution, but are merely for the convenience of description.

[0025] like Figures 1 to 4 As shown, the utility model provides a suspension device for semiconductor wet process, including a plug for loading semiconductor products, a bearing mechanism connected to the plug, and a lifting mechanism placed on the bearing mechanism, the lifting mechanism is configured to provide support for the semiconductor product in the plug, so that the semiconductor product is separated from the bottom of the slot of the plug. The plug is provided with a positioning groove for embedding the semiconductor product, the positioning groove is an L-shaped groove provided on the plug, all the positioning grooves on the plug are arranged in two rows, the two rows of positioning grooves are arranged oppositely, and the two sides of the semiconductor product are respectively embedded in the two oppositely arranged positioning grooves.

[0026] When the semiconductor product needs to be corroded or cleaned, the lifting mechanism provides support for the semiconductor product from below the semiconductor product so that the semiconductor product will not fit into the bottom of the positioning groove of the plug. In this way, when the semiconductor product is corroded, it is not easy for the bottom corners to be not corroded or not cleaned thoroughly. The semiconductor product can be corroded or cleaned at one time, thereby improving the quality of the semiconductor product and improving work efficiency.

[0027] like Figures 1 to 4 As shown, the lifting mechanism includes a lifting portion 5 for supporting the semiconductor product in the plug, and the lifting portion 5 is located below the plug. The lifting portion 5 is inclined and contacts the bottom of the semiconductor product. A contact portion 8 for contacting the semiconductor product is provided on the lifting portion 5, and the width of the contact portion 8 does not exceed 1 mm. The contact area between the contact portion 8 and the semiconductor product is small, which will not affect the corrosion or cleaning of the semiconductor product.

[0028] like Figures 1 to 4As shown, the outer surface of the lifting portion 5 includes a first outer surface 6 and a second outer surface 7, and the first outer surface 6 and the second outer surface 7 are distributed in a V-shape. The first outer surface 6 and the second outer surface 7 are inclined and extend downward toward the opposite sides of the contact portion 8. The upper end of the first outer surface 6 and the upper end of the second outer surface 7 are respectively connected to the opposite ends of the upper end of the contact portion 8 in the width direction, and a contact portion 8 with a relatively small width is formed at the top of the lifting portion 5. The width direction of the contact portion 8 is a horizontal direction and perpendicular to the length direction of the lifting portion 5. The contact portion 8 is the top surface of the lifting portion 5.

[0029] like Figures 1 to 4 As shown, the lifting mechanism further includes a connecting portion 3 connected to the lifting portion 5, the connecting portion 3 is connected to the lower end of the carrying mechanism, and the lifting portion 5 is inclined and extends toward the outside of the connecting portion 3. The first end of the lifting portion 5 is fixedly connected to the connecting portion 3, the second end of the lifting portion 5 is different in height from the first end, and the first end and the second end of the lifting portion 5 are opposite ends of the lifting portion 5 in the length direction.

[0030] like Figures 1 to 4 As shown, the bearing mechanism includes a mounting plate 1 and a fixing seat 2 arranged on the mounting plate 1, and a mounting groove 4 for inserting the plug is arranged on the fixing seat 2. Two fixing seats 2 are arranged opposite to each other, and the connecting portion 3 of the lifting mechanism is fixedly connected to the lower end of the mounting plate 1, and the lifting mechanism is located in the middle of the two fixing seats 2. The mounting groove 4 is arranged obliquely, and the distance between the upper end of the mounting groove 4 and the mounting plate 1 is different from the distance between the lower end of the mounting groove 4 and the mounting plate 1. The end of the plug is inserted into the mounting groove 4 of the two fixing seats 2 to achieve connection with the bearing mechanism. The extension direction of the positioning groove on the plug is parallel to the extension direction of the mounting groove 4, and the positioning groove is also in an inclined state. After the semiconductor product is placed in the positioning groove, it is in an inclined state. The width of the positioning groove is greater than the thickness of the semiconductor product, so that the surface of the semiconductor product that needs to be corroded or cleaned can be completely exposed and will not contact the positioning groove.

[0031] like Figures 1 to 4 As shown, the lifting portion 5 is arranged to be inclined upward, and the height of the second end of the lifting portion 5 is greater than the height of the first end. The mounting groove 4 extends downwardly and the distance between the upper end of the mounting groove 4 and the mounting plate 1 is less than the distance between the lower end of the mounting groove 4 and the mounting plate 1. At this time, it is suitable for etching or cleaning the first surface of the semiconductor product, the semiconductor product is in an inclined state, and the first surface of the semiconductor product does not contact the inner wall surface of the positioning groove, nor does it contact the lifting portion 5.

[0032] As a modified embodiment, the lifting portion 5 is tilted downward, and the height of the second end of the lifting portion 5 is less than the height of the first end. The mounting groove 4 extends upward, and the distance between the upper end of the mounting groove 4 and the mounting plate 1 is greater than the distance between the lower end of the mounting groove 4 and the mounting plate 1. At this time, it is suitable for etching or cleaning the second surface of the semiconductor product. The semiconductor product is in an inclined state, and the second surface of the semiconductor product does not contact the inner wall surface of the positioning groove, nor does it contact the lifting portion 5. The first surface and the second surface of the semiconductor product are two opposite surfaces in the thickness direction of the semiconductor product.

[0033] The utility model also provides a semiconductor production equipment, comprising the suspension device of the above structure used in semiconductor wet process. The semiconductor production equipment can be an etching machine or a cleaning machine used in semiconductor wet process.

[0034] The above is an exemplary description of the utility model in conjunction with the accompanying drawings. Obviously, the specific implementation of the utility model is not limited to the above-mentioned method. As long as various non-substantial improvements are made using the method concept and technical solution of the utility model; or the above concept and technical solution of the utility model are directly applied to other occasions without improvement, they are all within the protection scope of the utility model.

Claims

1. A suspension device for a semiconductor wet process, comprising a plug for loading semiconductor products and a carrying mechanism connected to the plug, characterized in that: It also includes a lifting mechanism disposed on the carrying mechanism, and the lifting mechanism is configured to provide support for the semiconductor product in the plug so that the semiconductor product is separated from the bottom of the slot of the plug.

2. The suspension device for semiconductor wet process according to claim 1, characterized in that: The lifting mechanism comprises a lifting portion for providing support to the semiconductor product in the plug, and the lifting portion is located below the plug.

3. The suspension device for semiconductor wet process according to claim 2, characterized in that: The lifting portion is arranged to be tilted downward or tilted upward.

4. The suspension device for semiconductor wet process according to claim 2, characterized in that: The supporting portion is provided with a contact portion for contacting the semiconductor product, and the width of the contact portion does not exceed 1 mm.

5. The suspension device for semiconductor wet process according to any one of claims 2 to 4, characterized in that: The lifting mechanism further includes a connecting portion connected to the lifting portion, the connecting portion is connected to the lower end of the carrying mechanism, and the lifting portion extends obliquely downwardly from the connecting portion or obliquely upwardly from the connecting portion.

6. The suspension device for semiconductor wet process according to any one of claims 1 to 4, characterized in that: The bearing mechanism comprises a mounting plate and a fixing seat arranged on the mounting plate, and the fixing seat is provided with a mounting groove for the plug to be inserted.

7. The suspension device for semiconductor wet process according to claim 6, characterized in that: The mounting groove is arranged obliquely.

8. The suspension device for semiconductor wet process according to claim 6, characterized in that: Two fixing seats are provided, the lifting mechanism is connected to the mounting plate, and the lifting mechanism is located between the two fixing seats.

9. Semiconductor production equipment, characterized in that: The invention comprises a suspension device for use in a semiconductor wet process as described in any one of claims 1 to 8.

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