Multiple MOS tube fixing and heat dissipation device applied to controller

Abstract

The utility model discloses a device for fixing and radiating a plurality of MOS (Metal Oxide Semiconductor) tubes applied to a controller, which comprises a radiating bottom plate, an insulating heat-conducting plate is arranged on the radiating bottom plate, and a plurality of MOS tubes are arranged on the insulating heat-conducting plate; the heat dissipation structure comprises a heat dissipation bottom plate and a plurality of MOS transistors, and further comprises a pressing piece connected with the heat dissipation bottom plate, a rubber cushion layer is arranged between the MOS transistors and the pressing piece, and the pressing piece is provided with pressing protrusions corresponding to the MOS transistors and used for pressing the top faces of the MOS transistors. The device has the beneficial effects that in one-time fixing of the pressing piece, a plurality of MOS tubes can be fixed, the structure is simple, and installation is convenient; the MOS tube is pressed by the pressing protrusions on the pressing piece, so that the MOS tube can be in close contact with the insulating heat-conducting plate, a better fixing effect is achieved, heat can be more uniformly transmitted to the insulating heat-conducting plate from the MOS tube, and the heat conduction efficiency is improved.

Description

Technical Field

[0001] The utility model relates to the field of industrial vehicle controllers, in particular to a plurality of MOS tube fixing and heat dissipation devices applied to the controllers. Background Art

[0002] In industrial electric vehicle controllers, MOS tubes are used for efficient switching to control motor current, regulate speed and power. They keep battery voltage stable in power management and perform voltage conversion in DC-DC converters to improve energy efficiency. MOS tubes also help manage heat generation to ensure stable system operation. Their high input impedance and fast switching capabilities make them essential in electric vehicle control. In addition to the method of directly welding MOS tubes to aluminum substrates, the fixing methods of MOS tubes in industrial electric vehicle controllers are usually to directly tighten the MOS tubes with screws, or to fix them with pressure plates. Most of the pressure plates are one-press-one or one-press-two. For the pressing and fixing of multiple MOS tubes, this fixing method has relatively low installation efficiency. If multiple MOS tubes are arranged in a centralized manner, the heat dissipation effect will be less than ideal.

[0003] In contrast, a utility model patent with a publication number of CN 221379343 U discloses a MOS tube fixing structure, including a mainboard, a MOS tube is fixedly connected to the top of the mainboard, a pin is fixedly connected to the top of the mainboard, a male buckle is fixedly connected to the top of the mainboard, a female buckle is movably connected to the top of the male buckle, a female buckle is fixedly connected to one side of the MOS tube, and a removable adhesive is fixedly connected to the bottom of the MOS tube. In the above application document, the MOS tube is fixed by the cooperation of the male buckle and the female buckle, and the MOS tube needs to be fixed by welding in the later stage. The operation of installing the MOS tube is relatively cumbersome, and there is great inconvenience when installing multiple MOS tubes.

[0004] Therefore, providing a plurality of MOS tube fixing and heat dissipation devices applied to a controller has become an issue worthy of study. Utility Model Content

[0005] In order to solve the deficiencies in the above-mentioned prior art, the purpose of the utility model is to fix multiple MOS tubes in one fixation of the pressing piece, which is convenient to install, has a good fixing effect on the MOS tube, and can improve the heat dissipation effect of the MOS tube;

[0006] The purpose of the utility model is achieved in this way:

[0007] The utility model provides a device for fixing and cooling multiple MOS tubes used in a controller, comprising a heat dissipation base plate, an insulating heat-conducting plate provided on the heat dissipation base plate, and multiple MOS tubes provided on the insulating heat-conducting plate; and also comprising a pressing piece connected to the heat dissipation base plate, a rubber cushion layer provided between the MOS tube and the pressing piece, and a pressing protrusion corresponding to the MOS tube provided on the pressing piece for pressing the top surfaces of the multiple MOS tubes.

[0008] As an optional solution to the technical solution of the present application document, a plurality of the insulating heat-conducting plates are provided on each of the heat dissipation base plates.

[0009] As an optional solution of the technical solution of the present application document, a graphene layer is provided on the surface of the insulating heat-conducting plate facing the heat dissipation base plate.

[0010] As an optional solution of the technical solution of this application document, the number of the MOS tubes is greater than or equal to 3 and is distributed in a strip shape.

[0011] As an optional solution of the technical solution of the present application document, a boss is provided on the heat dissipation base plate, and the insulating heat conductive plate is arranged on the boss to form a support for the boss.

[0012] As an optional solution of the technical solution of the present application document, the cross-section of the clamping member is "U"-shaped, and the clamping protrusion is arranged to protrude downward toward the bottom surface of the clamping member.

[0013] As an optional solution of the technical solution of the present application document, a mounting hole is provided on the clamping member, and a bolt for fixing the clamping member and the heat dissipation base plate is provided in the mounting hole.

[0014] As an optional solution of the technical solution of the present application document, there are two mounting holes, which are respectively close to both sides of the length of the clamping member.

[0015] Positive beneficial effects:

[0016] In one fixation of the pressing piece, multiple MOS tubes can be fixed, with a simple structure and convenient installation;

[0017] The MOS tube is compressed by the compression protrusion on the compression piece, so that the MOS tube can be in close contact with the insulating heat-conducting plate, which not only has a better fixing effect but also allows the heat to be more evenly transferred from the MOS tube to the insulating heat-conducting plate, thereby improving the heat conduction efficiency;

[0018] In addition, the rubber cushion layer can play a buffering role between the MOS tube and the pressing piece, making the MOS tube more stable during operation and improving the heat dissipation effect of the MOS tube;

[0019] After the pressing piece is disassembled, the MOS tube can be easily replaced and maintained, thereby reducing the maintenance cost of the MOS tube and achieving higher economic benefits. BRIEF DESCRIPTION OF THE DRAWINGS

[0020] Figure 1 It is a schematic diagram of the structure of the utility model;

[0021] Figure 2 This is a schematic diagram of the structure of the pressing member in the utility model;

[0022] Figure 3 This is a schematic diagram of the structure of the back side of the pressing member in the utility model;

[0023] The figure shows: a heat dissipation base plate 1, a boss 101, an insulating heat conducting plate 2, a MOS tube 3, a rubber cushion layer 4, a pressing member 5, a pressing boss 501, and a mounting hole 502; DETAILED DESCRIPTION

[0024] The utility model is further described below in conjunction with the accompanying drawings and embodiments.

[0025] First embodiment:

[0026] See also Figure 1-Figure 3 As shown, the device for fixing and cooling multiple MOS tubes used in a controller provided by the utility model comprises a heat dissipation base plate 1, an insulating heat conducting plate 2 is arranged on the heat dissipation base plate 1, and multiple MOS tubes 3 are arranged on the insulating heat conducting plate 2;

[0027] It also includes a clamping piece 5 connected to the heat dissipation base plate 1. The clamping piece 5 and the heat dissipation base plate 1 are detachably connected. Specifically, they can be installed and connected by bolts and screws. A rubber cushion layer 4 is provided between the MOS tube 3 and the clamping piece 5. The rubber cushion layer 4 is arranged corresponding to the bottom surface of the clamping piece 5. The clamping piece 5 is provided with a clamping protrusion 501 corresponding to the MOS tube 3, which is used to clamp the top surfaces of multiple MOS tubes 3.

[0028] During installation, an insulating heat conducting plate 2 is placed at a corresponding position on the heat dissipation base plate 1, and the MOS tube 3 is installed at a corresponding position. Then, a rubber cushion layer 4 is placed on the MOS tube 3, and a pressing piece 5 is placed on the rubber cushion layer 4 and fixed to the heat dissipation base plate 1. The device can use one pressing piece 5 to fix multiple MOS tubes 3 at the same time. Since the pressing piece 5 will have a certain deformation in the process of being fixed at both ends, a pressing protrusion 501 is designed at the position of the MOS tube 3 corresponding to the pressing piece 5. At the same time, a rubber cushion layer 4 is placed in the middle of the MOS tube 3 corresponding to the pressing piece 5 to compensate for the deformation of the pressing piece 5. Finally, with the pressing protrusion 501, multiple MOS tubes 3 can withstand a certain pressing force, ensuring that the MOS tube 3 is fully fitted with the insulating heat conducting plate 2, which is beneficial to the heat dissipation of the MOS tube 3.

[0029] In addition, see Figure 1 As shown, there are two groups of insulating heat-conducting plates 2, which are respectively close to both sides of the heat dissipation base plate 1, and each group of MOS tubes 3 has three MOS tubes 3, which are distributed in a strip shape. The clamping piece 5 is fixedly connected to the heat dissipation base plate 1 by bolts. Such a design of arrangement on both sides is conducive to the heat dissipation of the MOS tube 3 and can improve the heat dissipation efficiency.

[0030] When in use, the bottom of the MOS tube 3 can transfer heat through the insulating heat-conducting plate 2, and the MOS tube 3 can be compressed by the pressing piece 5. After the MOS tube 3 is compressed by the pressing protrusion 501 on the pressing piece 5, the MOS tube 3 can be in close contact with the insulating heat-conducting plate 2, thereby improving the heat dissipation efficiency of the MOS tube 3 and reducing the overheating risk of the MOS tube 3; the rubber cushion layer 4 can make the pressing protrusion 501 evenly apply pressure to the MOS tube 3, so that the heat is more evenly transferred from the MOS tube 3 to the insulating heat-conducting plate 2 and the heat dissipation bottom plate 1, thereby improving the heat conduction efficiency. The rubber cushion layer 4 can play a buffering role between the MOS tube 3 and the pressing piece 5, and the firm mechanical connection prevents the MOS tube 3 from loosening with the insulating heat-conducting plate 2, thereby avoiding uneven heat dissipation and separation of the MOS tube 3, and improving the heat dissipation effect of the MOS tube 3; and after the pressing piece 5 is disassembled, the MOS tube 3 can be easily replaced and maintained, reducing the maintenance cost of the MOS tube 3, and having higher economic benefits.

[0031] The second embodiment is different from the first embodiment in that:

[0032] A plurality of insulating heat conducting plates 2 are provided on each heat dissipation base plate 1. A graphene layer is provided on the surface of the insulating heat conducting plate 2 facing the heat dissipation base plate 1. The graphene layer helps to quickly transfer the heat of the insulating heat conducting plate 2 to the surface of the heat dissipation base plate 1, and assists the insulating heat conducting plate 2 and the MOS tube 3 in heat dissipation, thereby maintaining the stability of the MOS tube 3 during operation.

[0033] The number of MOS tubes 3 is greater than or equal to 2, and preferably the number of MOS tubes 3 in each group is more than three. In a preferred embodiment, the MOS tubes 3 may be distributed in a rectangular or strip shape;

[0034] Specifically, when the MOS tubes 3 are distributed in strips, the pressing piece 5 extends in strips, and the pressing protrusions 501 on the pressing piece 5 are distributed in a straight line, so that the MOS tubes 3 are pressed by the pressing protrusions 501 on the pressing piece 5 .

[0035] In addition, when the MOS tubes 3 are distributed in a rectangular shape, the pressing pieces 5 may be rectangular or strip-shaped. When the pressing pieces 5 are rectangular, the pressing protrusions 501 on the pressing pieces 5 are also distributed in a rectangular shape. After the pressing pieces 5 are fixed, the pressing protrusions 501 on the pressing pieces 5 can press the MOS tubes 3 against the insulating heat-conducting plate 2 to assist in the heat dissipation of the MOS tubes 3. In addition, when the pressing pieces 5 are strip-shaped, the MOS tubes 3 distributed in a rectangular shape are correspondingly arranged with a plurality of pressing pieces 5, thereby achieving the fixation of the MOS tubes 3.

[0036] In a preferred embodiment, each group of MOS tubes 3 is distributed in a strip shape. When fixing, the entire strip of MOS tubes 3 can be used as a reference, and the pressing protrusions 501 on the pressing piece 5 can be set corresponding to the MOS tubes 3. The pressing piece 5 is installed, and the MOS tubes 3 are pressed by using the pressing protrusions 501 on the pressing piece 5, so as to avoid displacement and looseness of the MOS tubes 3 during use, and multiple MOS tubes 3 can be pressed in one installation and fixation of the pressing piece 5.

[0037] Furthermore, a boss 101 is provided on the heat dissipation base plate 1, and the insulating heat conductive plate 2 is arranged on the boss 101 to form a support for the boss 101. Preferably, the thickness of the boss 101 is thinner than that of the heat dissipation base plate 1, which is more conducive to heat transfer.

[0038] The third embodiment is different from the first embodiment in that:

[0039] The cross section of the clamping piece 5 is in a "U" shape, and the clamping protrusion 501 is convexly arranged toward the bottom surface of the clamping piece 5. Furthermore, the clamping piece 5 is provided with a mounting hole 502. There are two mounting holes 502, which are respectively close to the two sides of the length of the clamping piece 5. Bolts for fixing the clamping piece 5 and the heat dissipation base plate 1 are arranged in the mounting holes 502. The bolts are used to clamp the two ends of the clamping piece 5, so that the clamping piece 5 is clamped, and a plurality of MOS tubes 3 are fixed with fewer screws. Furthermore, the MOS tubes 3 are distributed on both sides of the heat dissipation base plate 1. Such a design of arrangement on both sides is conducive to the heat dissipation of the MOS tube 3. Since the clamping protrusion 501 is convexly arranged, force can be transmitted through the rubber pad layer 4, thereby improving the clamping effect on the MOS tube 3, and the removal of the bolts is convenient for replacing and maintaining the MOS tube 3, thereby reducing the maintenance cost.

[0040] The above is only a specific implementation of the utility model, but the protection scope of the utility model is not limited thereto. Any technician familiar with the technical field can easily think of changes or substitutions within the technical scope disclosed by the utility model, which should be included in the protection scope of the utility model. Therefore, the protection scope of the utility model should be based on the protection scope of the claims.

Claims

1. A device for fixing and cooling multiple MOS tubes used in a controller, comprising a heat dissipation base plate (1), characterized in that: The heat dissipation base plate (1) is provided with an insulating heat conducting plate (2), and a plurality of MOS tubes (3) are provided on the insulating heat conducting plate (2); and further comprising a pressing piece (5) connected to the heat dissipation base plate (1), a rubber cushion layer (4) being provided between the MOS tube (3) and the pressing piece (5), and a pressing protrusion (501) corresponding to the MOS tube (3) being provided on the pressing piece (5) for pressing the top surfaces of the plurality of MOS tubes (3).

2. The device for fixing and cooling multiple MOS tubes applied to a controller according to claim 1, characterized in that: A plurality of insulating heat-conducting plates (2) are provided on each of the heat dissipation base plates (1).

3. The device for fixing and cooling multiple MOS tubes applied to a controller according to claim 2, characterized in that: A graphene layer is provided on the surface of the insulating heat-conducting plate (2) facing the heat-dissipating base plate (1).

4. The device for fixing and cooling multiple MOS tubes applied to a controller according to claim 2, characterized in that: The number of the MOS tubes (3) is greater than or equal to 3 and they are distributed in a strip shape.

5. The device for fixing and cooling multiple MOS tubes applied to a controller according to claim 1, characterized in that: A boss (101) is provided on the heat dissipation base plate (1), and the insulating heat conducting plate (2) is arranged on the boss (101) to form support for the boss (101).

6. The device for fixing and cooling multiple MOS tubes applied to a controller according to claim 5, characterized in that: The cross section of the pressing piece (5) is U-shaped, and the pressing protrusion (501) is arranged to protrude downward toward the bottom surface of the pressing piece (5).

7. The multiple MOS tube fixing and heat dissipation device applied to a controller according to claim 1 or 6, characterized in that: The clamping piece (5) is provided with a mounting hole (502), and a bolt for fixing the clamping piece (5) and the heat dissipation base plate (1) is provided in the mounting hole (502).

8. The device for fixing and cooling multiple MOS tubes applied to a controller according to claim 7, characterized in that: There are two mounting holes (502), which are respectively located close to two sides of the length of the pressing member (5).

Images