Camera

Abstract

The embodiment of the utility model discloses a camera, relates to the technical field of imaging devices, and aims to improve the working reliability of the camera in a high-temperature environment. According to the camera, a camera shooting window is arranged on the side wall of a shell; the lens module is arranged in the shell, and a lens in the lens module corresponds to the camera shooting window; the first end of the semiconductor chilling plate abuts against the outer wall of the shell; the motor assembly comprises a motor body part and an output shaft connected with the motor body part; the motor body part is fixed in the shell, and an output shaft penetrates through a shaft hole in the shell and extends out of the shell; the blades are arranged outside the shell and are fixedly connected with the output shaft; wherein the motor body part drives the output shaft to rotate, and the output shaft drives the blades to rotate so as to dissipate heat of the second end of the semiconductor chilling plate; the first end of the semiconductor chilling plate is a cold end, and the second end is a hot end. The method is suitable for image shooting.

Description

Technical Field

[0001] The present application relates to the technical field of imaging devices, and in particular to a camera. Background Art

[0002] Cameras usually include high-temperature series cameras that work in high-temperature environments. Currently, the more common high-temperature series cameras include water-cooled cameras, which require a wind source or water source with a relatively low external temperature as a working medium; there is also a structure of a high-temperature camera, in which a semiconductor refrigeration plate (device) is arranged on the camera, and the hot end and the cold end of the semiconductor refrigeration plate are connected to a heat sink and a fan. The heat sink and the fan at the hot end are connected to the outside world, and the heat is dissipated to the external environment; the cold energy generated by the cold end is blown into the shield cavity through the heat sink and the fan, so that the air temperature in the cavity is reduced, thereby achieving the effect of reducing the temperature of the camera. However, due to the limitation of the high temperature resistance of the motor in the fan, the reliability of the camera operation is reduced when the ambient temperature is high. Utility Model Content

[0003] In view of this, an embodiment of the present application provides a camera to improve the reliability of the camera working in a high temperature environment.

[0004] In a first aspect, an embodiment of the present application provides a camera, comprising: a housing, a side wall of which is provided with a camera window; a lens module, the lens module being disposed in the housing, the lens in the lens module corresponding to the camera window; a semiconductor refrigeration plate, the first end of which is abutted against the outer wall of the housing; a motor assembly, the motor assembly comprising a motor body and an output shaft connected to the motor body; the motor body is fixed in the housing, and the output shaft extends to the outside of the housing through an axial hole on the housing; blades, the blades are disposed outside the housing and fixedly connected to the output shaft; wherein the motor body drives the output shaft to rotate, and the output shaft drives the blades to rotate to dissipate heat from the second end of the semiconductor refrigeration plate; the first end of the semiconductor refrigeration plate is a cold end, and the second end is a hot end.

[0005] According to a specific implementation method of the embodiment of the present application, the shell includes a shell and a cover body covering the shell; the camera window is arranged on the shell, and the lens module is fixed in the shell; the cover body is provided with a seat body on the side facing the shell, and the motor body is installed on the seat body; the seat body is provided with the axial hole.

[0006] According to a specific implementation method of an embodiment of the present application, the output shaft of the motor assembly includes a motor main shaft and a transmission shaft; wherein the motor main shaft is connected to the motor body, the first end of the transmission shaft is fixedly connected to the motor main shaft, and the blade is fixed to the second end of the transmission shaft.

[0007] According to a specific implementation method of the embodiment of the present application, an oil seal receiving groove is provided on a side of the cover body away from the shell and at a position corresponding to the seat body, an oil seal is provided in the oil seal receiving groove, and an oil seal pressure plate is provided on a side of the oil seal away from the seat body, the oil seal pressure plate is fixed on the cover body and abuts against the oil seal.

[0008] According to a specific implementation method of an embodiment of the present application, the semiconductor refrigeration plate includes two semiconductor refrigeration plate groups; the at least two semiconductor refrigeration plate groups are arranged side by side on the outer wall of the shell; wherein the at least two semiconductor refrigeration plate groups include a first semiconductor refrigeration plate group; the first semiconductor refrigeration plate group includes one semiconductor refrigeration plate; or, the first semiconductor refrigeration plate group includes more than two semiconductor refrigeration plates, and the more than two semiconductor refrigeration plates include a first semiconductor refrigeration plate and a second semiconductor refrigeration plate arranged adjacent to each other, and the hot end of the first semiconductor refrigeration plate is adjacent to the cold end of the second semiconductor refrigeration plate.

[0009] According to a specific implementation method of the embodiment of the present application, it also includes: a thermal insulation layer, which is wrapped around the outside of the outer shell; a first through hole and a second through hole are provided on the thermal insulation layer; the first through hole corresponds to the second end of the semiconductor refrigeration plate; the second through hole corresponds to the shaft hole; the output shaft is fixedly connected to the blade after passing through the shaft hole and the second through hole.

[0010] According to a specific implementation method of the embodiment of the present application, it also includes: a heat sink, which is arranged between the semiconductor refrigeration plate and the blade, and abuts against the second end of the semiconductor refrigeration plate.

[0011] According to a specific implementation of the embodiment of the present application, a boss is provided on the end surface of the heat sink facing the semiconductor refrigeration plate; the end of the boss extends into the first through hole and contacts the second end of the semiconductor refrigeration plate.

[0012] According to a specific implementation method of the embodiment of the present application, a third through hole is provided on the radiator, and the third through hole corresponds to the second through hole; the output shaft passes through the shaft hole, the second through hole and the third through hole and is fixedly connected to the blade.

[0013] According to a specific implementation method of an embodiment of the present application, the lens module includes a main board; a first heat-conducting layer is provided between the main board and the inner wall of the outer shell; a second heat-conducting layer is provided between the first end of the semiconductor refrigeration plate and the outer wall of the outer shell; and a third heat-conducting layer is provided between the second end of the semiconductor refrigeration plate and the radiator.

[0014] The camera of this embodiment can increase the temperature difference between the cold end and the hot end of the first semiconductor refrigeration plate group by connecting the hot end of the first semiconductor refrigeration plate adjacent to the cold end of the second semiconductor refrigeration plate, thereby facilitating the reduction of the temperature of the cold end, further improving the heat dissipation capacity of the outer casing, and thereby improving the reliability of the normal operation of the camera in a higher temperature environment. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] In order to more clearly illustrate the embodiments of the utility model or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the utility model. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative work.

[0016] Figure 1 A schematic diagram of the structure of a camera provided in one embodiment of the present application;

[0017] Figure 2 A schematic structural diagram of a camera provided in yet another embodiment of the present application. DETAILED DESCRIPTION

[0018] The embodiments of the utility model are described in detail below with reference to the accompanying drawings.

[0019] It should be clear that the described embodiments are only part of the embodiments of the utility model, not all of them. Based on the embodiments of the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.

[0020] As mentioned in the background technology, the structure of the existing high-temperature series cameras can generally only adapt to 85°C, and cannot work normally in an environment above 100°C. The main bottleneck is that the motor industry in the fan can only withstand a temperature of 85°C, that is, the temperature resistance of the motor limits the normal use of the camera.

[0021] During the research of this technical solution, the inventor found that the semiconductor cooling chip is used to cool the camera components, the hot end of the semiconductor cooling chip adopts active heat dissipation, and the motor that is not resistant to high temperatures can be placed in the refrigeration cavity, and the blades that are resistant to high temperatures can be placed outside. In the specific implementation process, the fan can be disassembled, and the blades can be separated from the motor, so that the camera in this application is suitable for environments above 85°C.

[0022] In order to enable those skilled in the art to better understand the technical concept, implementation plan and beneficial effects of the embodiments of the present application, specific embodiments are described in detail below.

[0023] Figure 1A schematic diagram of the structure of a camera provided in an embodiment of the present application is shown in FIG. Figure 2 A schematic diagram of the structure of a camera provided in another embodiment of the present application is shown in FIG. Figure 1 and Figure 2 As shown, the camera of this embodiment may include: a housing 1, a lens module 2, a semiconductor cooling sheet 3, a motor assembly 4 and blades 5.

[0024] The housing 1 can be made of a material with good thermal conductivity, such as a metal material, specifically an aluminum alloy. The housing 1 forms a relatively independent cavity, which can form a refrigeration cavity after being cooled.

[0025] In this embodiment, a camera window is provided on the side wall of the housing 1, and the camera window may be specifically made of transparent glass.

[0026] The lens module 2 is arranged in the housing 1, and the lens in the lens module 2 corresponds to the camera window. Through the camera window, the lens module 2 can capture images.

[0027] The semiconductor cooling sheet 3 (semiconductor cooler (TEC, Thermo Electric Cooler)) of this embodiment is made by using the Peltier effect of semiconductor materials. When a direct current passes through a galvanic couple composed of two semiconductor materials, one end of the semiconductor cooling sheet absorbs heat and the other end releases heat, and cooling is performed by using the heat-absorbing end. In this embodiment, the first end of the semiconductor cooling sheet 3 is disposed against the outer wall of the housing 1.

[0028] In one example, a semiconductor refrigerator 3 with a large temperature difference may be used, that is, the temperature difference between the cold end and the hot end of the semiconductor refrigerator 3 is large during operation.

[0029] In order to improve the heat conduction efficiency, in some examples, a heat conduction layer is provided between the first end of the semiconductor cooling sheet 3 and the outer wall of the housing 1. Specifically, the heat conduction layer can be made of heat-conducting silicone grease or heat-conducting gel material.

[0030] The motor assembly 4 includes a motor body and an output shaft connected to the motor body. The motor body is fixed in the housing 1, and the output shaft extends out of the housing 1 through the shaft hole on the housing 1. The motor body is a device that can realize electric energy conversion or transmission.

[0031] The blade 5 in this embodiment is arranged outside the housing 1 and is fixedly connected to the output shaft. The blade 5 can be made of high temperature resistant material, such as high temperature resistant plastic or metal; the blade 5 is transmission-connected to the motor assembly 4, and the transmission part is connected to the housing 1 by an oil seal 6 to meet the requirements of rotation while maintaining the cavity sealing.

[0032] During operation, the motor body drives the output shaft to rotate, and the output shaft drives the blades 5 to rotate to dissipate heat from the second end of the semiconductor cooling plate 3. The output shaft drives the blades 5 to rotate, and the blades 5 can blow or absorb air after rotating.

[0033] In this embodiment, the first end of the semiconductor cooling plate 3 is a cold end, and the second end is a hot end.

[0034] The rotation of the blades 5 can take away the heat from the hot end of the semiconductor refrigeration plate 3 , and the temperature difference between the hot end and the cold end is fixed, so that the temperature of the cold end can be further reduced, thereby reducing the temperature of the shell 10 .

[0035] In a specific embodiment, the camera is suitable for high temperature resistant application scenarios of 85°C-120°C.

[0036] In this embodiment, the motor assembly 4 is arranged in the outer shell 1, and the blades 5 are arranged outside the outer shell 1. During the operation of the camera, the heat of the shell 10 is dissipated by the semiconductor cooling plate 3, so that the temperature in the shell 10 is lower than the ambient temperature. Furthermore, the motor assembly 4 in the shell 10 is in a low temperature environment. In this way, the reliability of the camera working in a higher temperature environment is improved.

[0037] To facilitate manufacturing and installation, in a specific embodiment, the housing 1 may include a shell 10 and a cover 12 covering the shell 10; a camera window is provided on the shell 10, and the lens module 2 is fixed in the shell 10; a seat 14 is provided on the side of the cover 12 facing the shell 10, and the motor body is installed on the seat 14; an axial hole is opened on the seat 14.

[0038] In the specific embodiment where the motor assembly 4 is connected to the blade 5, the output shaft of the motor assembly 4 includes a motor main shaft and a transmission shaft. The motor main shaft is connected to the motor body, the first end of the transmission shaft is fixedly connected to the motor main shaft, and the blade 5 is fixed to the second end of the transmission shaft.

[0039] In order to improve the sealing performance of the housing 1, an oil seal receiving groove is provided at a position corresponding to the seat 14 on the side of the cover 12 away from the housing 10, an oil seal 6 is provided in the oil seal receiving groove, and an oil seal pressing plate 7 is provided on the side of the oil seal 6 away from the seat 14, the oil seal pressing plate 7 is fixed on the cover 12 and abuts against the oil seal 6. The oil seal 6 is a mechanical element used to seal grease to prevent lubricating oil leakage, which can not only realize the relative rotation of the output shaft and the housing 1 but also maintain the sealing of the housing 1, so that the inside and outside of the housing 1 are isolated from each other.

[0040] In order to improve the heat dissipation effect and improve the reliability of the camera working in a high temperature environment, in some examples, the semiconductor refrigeration plate 3 may include at least two semiconductor refrigeration plate groups; at least two semiconductor refrigeration plate groups are arranged side by side on the outer wall of the shell 1.

[0041] Since at least two semiconductor refrigeration plate groups are arranged side by side on the outer wall of the shell 1, more cold ends can dissipate heat to the shell 1 during operation, thereby reducing the temperature inside the shell 1. In this way, the camera can work reliably at a higher ambient temperature.

[0042] The semiconductor refrigeration sheet group may include a semiconductor refrigeration sheet 3. In some examples, at least two semiconductor refrigeration sheet groups include a first semiconductor refrigeration sheet group, and the first semiconductor refrigeration sheet group includes a semiconductor refrigeration sheet.

[0043] The semiconductor refrigeration plate group may also include at least two semiconductor refrigeration plates 3. In order to further improve the heat dissipation capacity of the outer casing 1 and thereby improve the reliability of the camera working at higher temperatures, the at least two semiconductor refrigeration plate groups include a first semiconductor refrigeration plate group. The first semiconductor refrigeration plate group includes more than two semiconductor refrigeration plates 3. The more than two semiconductor refrigeration plates 3 include a first semiconductor refrigeration plate and a second semiconductor refrigeration plate arranged adjacent to each other. The hot end of the first semiconductor refrigeration plate is adjacent to the cold end of the second semiconductor refrigeration plate.

[0044] In the present embodiment, by connecting the hot end of the first semiconductor refrigeration plate adjacent to the cold end of the second semiconductor refrigeration plate, the temperature difference between the cold end and the hot end of the first semiconductor refrigeration plate group can be increased, thereby facilitating the reduction of the temperature of the cold end, further improving the heat dissipation capacity of the housing 1, and thereby improving the reliability of the normal operation of the camera in a higher temperature environment.

[0045] It is understandable that the first semiconductor refrigeration plate group may further include a third semiconductor refrigeration plate, and the third semiconductor refrigeration plate is arranged adjacent to the second semiconductor refrigeration plate, so that the cold end of the third semiconductor refrigeration plate is adjacent to the hot end of the second semiconductor refrigeration plate.

[0046] In order to improve the reliable operation of the camera in a high temperature environment, in some examples, the camera of this embodiment further includes a heat insulation layer 8. The heat insulation layer 8 is wrapped around the outside of the housing 1; the heat insulation layer 8 is provided with a first through hole and a second through hole. The first through hole corresponds to the second end of the semiconductor cooling sheet 3; the second through hole corresponds to the shaft hole; the output shaft passes through the shaft hole and the second through hole and is fixedly connected to the blade 5.

[0047] The heat insulation layer 8 can be made of a heat insulation material with good heat preservation performance. During operation, due to the setting of the semiconductor cooling sheet 3, the temperature inside the housing 1 is lower than the ambient temperature. The heat insulation layer 8 of this embodiment can reduce the heat exchange between the inside and outside of the housing 1, so that the temperature inside the housing 1 is kept low.

[0048] In order to improve the heat dissipation efficiency, in some examples, the camera of this embodiment further includes a radiator 9. The radiator 9 is disposed between the semiconductor cooling sheet 3 and the blade 5, and abuts against the second end of the semiconductor cooling sheet 3.

[0049] The heat sink 9 may include a plurality of heat sinks. The heat sink 9 abuts against the second end of the semiconductor cooling sheet 3, and the heat of the second end (hot end) of the semiconductor cooling sheet 3 can be dissipated through the heat sink 9, and the heat dissipation area of ​​the heat sink may be larger than the area of ​​the second end of the semiconductor cooling sheet 3. Thus, by providing the heat sink 9, it is convenient to increase the heat dissipation area, and further to improve the heat dissipation efficiency.

[0050] In this embodiment, the blades 5 can face the radiator 9 , and the blades 5 can blow or suck air toward the radiator 9 when rotating.

[0051] In order to ensure that the heat sink 9 is easy to install when it abuts against the second end of the semiconductor cooling plate 3, in some examples, a boss is provided on the end surface of the heat sink 9 facing the semiconductor cooling plate 3; the end of the boss extends into the first through hole and contacts the second end of the semiconductor cooling plate 3.

[0052] The semiconductor refrigeration sheet 3 in this embodiment is arranged in the first through hole, and the end of the boss on the heat sink 9 extends into the first through hole and contacts the second end of the semiconductor refrigeration sheet 3. In this way, it is not only convenient to install but also can ensure that the end of the boss contacts the second end of the semiconductor refrigeration sheet 3.

[0053] In some examples, a third through hole is provided on the heat sink 9 , and the third through hole corresponds to the second through hole; the output shaft passes through the shaft hole, the second through hole and the third through hole and is fixedly connected to the blade 5 .

[0054] In order to reduce the axial length of the camera, in some examples, the lens module 2 and the motor assembly 4 are staggered in the radial direction of the lens module 2 .

[0055] In order to improve the heat dissipation efficiency, in some examples, the lens module 2 includes a main board. In this embodiment, a first heat-conducting layer is provided between the main board and the inner wall of the housing 1.

[0056] Since more electronic components are installed on the mainboard, more heat is generated during operation. In this embodiment, a first heat-conducting layer is set between the mainboard and the inner wall of the outer shell 1, so that the heat generated by the mainboard can be dissipated through the first heat-conducting layer, the outer shell 1, and the hot end of the semiconductor cooling plate 3.

[0057] The material of the first heat-conducting layer is an interface material such as thermal conductive silicone grease or thermal conductive gel.

[0058] Similarly, in one embodiment, a second heat-conducting layer is provided between the first end of the semiconductor cooling sheet 3 and the outer wall of the housing 1 .

[0059] The material of the second heat-conducting layer may also be an interface material such as heat-conducting silicone grease or heat-conducting gel.

[0060] In yet another embodiment, a third heat conducting layer is provided between the second end of the semiconductor cooling sheet 3 and the heat sink 9 .

[0061] The material of the third heat-conducting layer may also be an interface material such as heat-conducting silicone grease or heat-conducting gel, etc. The material of the third heat-conducting layer may be the same as or different from the material of the second heat-conducting layer.

[0062] It is understandable that a second heat-conducting layer is provided between the first end of the semiconductor cooling sheet 3 and the outer wall of the housing 1 , and a third heat-conducting layer may also be provided between the second end of the semiconductor cooling sheet 3 and the heat sink 9 .

[0063] It should be noted that, in this article, relational terms such as first and second, etc. are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Moreover, the terms "include", "comprise" or any other variants thereof are intended to cover non-exclusive inclusion, so that a process, method, article or device including a series of elements includes not only those elements, but also other elements not explicitly listed, or also includes elements inherent to such process, method, article or device. In the absence of further restrictions, the elements defined by the sentence "comprise a ..." do not exclude the existence of other identical elements in the process, method, article or device including the elements.

[0064] The above is only a specific implementation of the utility model, but the protection scope of the utility model is not limited thereto. Any changes or substitutions that can be easily thought of by a person skilled in the art within the technical scope disclosed by the utility model should be included in the protection scope of the utility model. Therefore, the protection scope of the utility model should be based on the protection scope of the claims.

Claims

1. A camera, characterized in that: include: A housing, wherein a camera window is provided on a side wall of the housing; A lens module, wherein the lens module is disposed in the housing, and a lens in the lens module corresponds to the camera window; A semiconductor refrigeration sheet, wherein a first end of the semiconductor refrigeration sheet is disposed against an outer wall of the housing; A motor assembly, the motor assembly comprising a motor body and an output shaft connected to the motor body; the motor body is fixed in the housing, and the output shaft extends through an axial hole on the housing to the outside of the housing; A blade, wherein the blade is arranged outside the housing and is fixedly connected to the output shaft; The motor body drives the output shaft to rotate, and the output shaft drives the blades to rotate to dissipate heat from the second end of the semiconductor refrigeration plate; the first end of the semiconductor refrigeration plate is a cold end, and the second end is a hot end.

2. The camera according to claim 1, characterized in that The housing comprises a shell and a cover body covering the shell; the camera window is arranged on the shell, and the lens module is fixed in the shell; A seat is arranged on one side of the cover body facing the shell, and the motor body is mounted on the seat; the shaft hole is arranged on the seat.

3. The camera according to claim 1, characterized in that The output shaft of the motor assembly includes a motor main shaft and a transmission shaft; Wherein, the motor main shaft is connected to the motor body, the first end of the transmission shaft is fixedly connected to the motor main shaft, and the blade is fixed to the second end of the transmission shaft.

4. The camera according to claim 2, characterized in that An oil seal receiving groove is provided at a position corresponding to the seat body on a side of the cover body away from the shell, an oil seal is provided in the oil seal receiving groove, and an oil seal pressure plate is provided on a side of the oil seal away from the seat body, the oil seal pressure plate is fixed on the cover body and abuts against the oil seal.

5. The camera according to claim 1, characterized in that The semiconductor refrigeration sheet comprises at least two semiconductor refrigeration sheet groups; the at least two semiconductor refrigeration sheet groups are arranged side by side on the outer wall of the housing; Wherein, the at least two semiconductor refrigeration sheet groups include a first semiconductor refrigeration sheet group; The first semiconductor refrigeration sheet group includes a semiconductor refrigeration sheet; or The first semiconductor refrigeration plate group includes more than two semiconductor refrigeration plates, and the more than two semiconductor refrigeration plates include a first semiconductor refrigeration plate and a second semiconductor refrigeration plate that are adjacently arranged. The hot end of the first semiconductor refrigeration plate is adjacent to the cold end of the second semiconductor refrigeration plate.

6. The camera according to claim 1, characterized in that Also includes: A heat insulation layer, the heat insulation layer is wrapped around the outside of the shell; the heat insulation layer is provided with a first through hole and a second through hole; The first through hole corresponds to the second end of the semiconductor refrigeration plate; The second through hole corresponds to the shaft hole; the output shaft is fixedly connected to the blade after passing through the shaft hole and the second through hole.

7. The camera according to claim 6, characterized in that Also includes: A heat sink is disposed between the semiconductor refrigeration sheet and the blades and is in contact with the second end of the semiconductor refrigeration sheet.

8. The camera according to claim 7, characterized in that A boss is provided on the end surface of the heat sink facing the semiconductor cooling plate; the end of the boss extends into the first through hole and contacts the second end of the semiconductor cooling plate.

9. The camera according to claim 7, characterized in that: The heat sink is provided with a third through hole, and the third through hole corresponds to the second through hole; the output shaft passes through the shaft hole, the second through hole and the third through hole and is fixedly connected to the blade.

10. The camera according to claim 7, characterized in that The lens module comprises a main board; a first heat-conducting layer is provided between the main board and the inner wall of the housing; A second heat-conducting layer is provided between the first end of the semiconductor refrigeration sheet and the outer wall of the shell; A third heat-conducting layer is provided between the second end of the semiconductor refrigeration plate and the heat sink.

Images