Inverter and energy storage system

Abstract

The utility model provides an inverter and an energy storage system. The inverter comprises a housing; the inductance device is arranged on the shell; the power device is arranged on the shell, and the power device and the inductance device are arranged on the two sides of the shell respectively; the heat dissipation assembly is arranged on the shell, the power device is connected with the heat dissipation assembly, and the heat dissipation assembly is used for conducting heat exchange with the power device. In other words, the electric devices generating heat are arranged in a dispersed mode, the distance between the power device and the inductance device is increased, and a heat source is dispersed, so that the local high temperature phenomenon caused by heat concentration of the inductance device and the power device is eliminated, and the risk of high temperature and even thermal faults caused by heat concentration of the inverter is reduced; the heat dissipation efficiency of the inductor and the power device is improved, the service life of the inverter is prolonged, and the reliability of the product is improved.

Description

Technical Field

[0001] The utility model relates to the technical field of inverters, and in particular to an inverter and an energy storage system. Background Art

[0002] At present, the inverter in the related technology generally arranges the boost and inverter inductors on both sides of the transistor, that is, the boost, inverter inductors and transistors are located on the same side of the inverter. Since the boost, inverter inductors and transistors generate a lot of heat when the inverter is working, the heat concentration phenomenon is serious, resulting in excessively high local temperatures in the inverter, which is not conducive to the heat dissipation of various electrical components. Moreover, the boost, inverter inductors and transistors are in a high temperature environment for a long time, which increases the risk of failure. In severe cases, it causes damage to various electrical components and reduces the reliability of the product. Utility Model Content

[0003] The embodiments of the utility model are intended to solve at least one of the technical problems existing in the related art.

[0004] To this end, a first aspect of an embodiment of the present utility model provides an inverter.

[0005] A second aspect of the embodiments of the present utility model provides an energy storage system.

[0006] In view of this, according to the first aspect of an embodiment of the utility model, an inverter is provided, the inverter comprising: a shell; an inductor device, arranged in the shell; a power device, arranged in the shell and arranged on both sides of the shell respectively with the inductor device; a heat dissipation assembly, arranged in the shell, the power device is connected to the heat dissipation assembly, and the heat dissipation assembly is used to perform heat exchange with the power device.

[0007] The housing, inductor, power device and heat dissipation assembly provided by the embodiment of the utility model are specifically provided with the inductor and the power device on the housing, and optionally, the inductor comprises a device body, and the device body comprises a boost module and an inverter module. Optionally, the power device comprises a plurality of transistors.

[0008] It is understandable that during the operation of the inverter, both the inductor and the power device will generate a lot of heat. If the inductor and the power device are arranged on the same side of the housing, that is, the distance between the inductor and the power device is close, the heat will be concentrated. Such a layout will form a superposition effect of multiple heat sources, resulting in excessive local temperature rise of the inverter, which is not conducive to the heat dissipation of the inductor and the power device. Moreover, the inductor and the power device are in a high temperature environment for a long time, which is prone to failure.

[0009] The power device and the inductor are located on both sides of the shell respectively, that is, the electrical devices that generate heat are dispersed, the distance between the power device and the inductor is increased, and the heat source is dispersed, thereby eliminating the local high temperature phenomenon caused by heat concentration in the inductor and the power device, reducing the risk of high temperature or even thermal failure of the inverter due to heat concentration, improving the heat dissipation efficiency of the inductor and the power device, extending the service life of the inverter, and improving the reliability of the product.

[0010] The heat dissipation component is connected to the power device and is used for heat exchange with the power device. That is to say, the heat dissipation component can dissipate heat from the power device, thereby reducing the surface temperature of the power device, preventing the power device from malfunctioning, and improving the reliability of the inverter during operation.

[0011] Optionally, the power device is located at the rear of the housing, and the inductor is located at the top of the housing. Alternatively, the power device is located at the rear of the housing, and the inductor is located at the bottom of the housing. These are not listed here. The specific configuration can be made according to actual needs.

[0012] In addition, the inverter provided according to the above technical solution of the utility model also has the following additional technical features:

[0013] In some technical solutions, optionally, the shell is provided with a containing cavity, the power device is located in the containing cavity, and the inductor device is located outside the containing cavity.

[0014] In this technical solution, it is defined that the shell is provided with a accommodating cavity. Specifically, the power device is arranged in the accommodating cavity, and the inductor device is arranged outside the accommodating cavity. That is to say, on the basis that the inductor device and the power device are respectively located on both sides of the shell, the power device and the inductor device are distributed on the inner and outer sides of the accommodating cavity, thereby further increasing the distance between the power device and the inductor device, thereby achieving the purpose of further dispersing the heat source.

[0015] Since the power devices and the inductor devices are further located on the inner and outer sides of the accommodating cavity, the local high temperature phenomenon caused by heat concentration in the inductor devices and the power devices can be further eliminated, the risk of high temperature or even thermal failure of the inverter due to heat concentration can be reduced, the heat dissipation efficiency of the inductor devices and the power devices can be improved, and the reliability of the product can be improved.

[0016] In addition, arranging the power device in the accommodating cavity facilitates the wiring between the power device and other electrical devices, thereby avoiding the problem of increased product cost due to complicated wiring inside the inverter.

[0017] In some technical schemes, optionally, the shell includes a shell body and a cover plate, wherein the shell body includes a connected bottom plate and a surrounding plate, the surrounding plate and the bottom plate are combined to form a groove, the cover plate is connected to one end of the surrounding plate away from the bottom plate, and is combined with the groove wall of the groove to form a accommodating cavity, the heat dissipation component is arranged on the bottom plate, and the inductor device is arranged on the surrounding plate.

[0018] In the technical solution, it is defined that the shell includes a shell body and a cover plate. Specifically, the shell body includes a bottom plate and a surrounding plate. The cover plate and the bottom plate are respectively located on opposite sides of the surrounding plate. The bottom plate and the surrounding plate are enclosed to form a groove. The cover plate and the groove wall of the groove are enclosed to form a receiving cavity. Optionally, the surrounding plate includes four side plates, and the four side plates are sequentially connected end to end to form the surrounding plate.

[0019] The heat dissipation assembly is arranged on the bottom plate, and the power device is arranged on the heat dissipation assembly, that is, the power device is located on the bottom plate. And the inductor device is arranged on the enclosure, so that the power device and the inductor device are respectively located on both sides of the shell, that is, the electrical devices that generate heat are dispersed, the distance between the power device and the inductor device is increased, and the heat source is dispersed, thereby eliminating the local high temperature phenomenon caused by heat concentration of the inductor device and the power device, and reducing the risk of high temperature or even thermal failure of the inverter caused by heat concentration.

[0020] Optionally, the inductor device is arranged on a side plate located at the top of the enclosure.

[0021] In some technical solutions, optionally, the shell is further provided with a avoidance opening, which is connected to the accommodating cavity; a part of the heat dissipation component is located at the avoidance opening, and the part of the heat dissipation component located at the avoidance opening is connected to the power device.

[0022] In this technical solution, it is defined that the housing is also provided with an escape opening, specifically, the escape opening is connected to the accommodating cavity. Part of the heat dissipation component is located at the escape opening and is connected to the power device. By providing the escape opening, the power device can be connected to the heat dissipation component, so that the heat exchange between the heat dissipation component and the heat dissipation of the power device is achieved, and the power device can be located in the accommodating cavity through the escape opening, thereby facilitating the wiring between the power device and other electrical devices, and avoiding the problem of increased product cost due to complicated wiring inside the inverter.

[0023] In some technical schemes, optionally, the power device includes a plurality of transistors, and the heat dissipation component includes a shell, a heat dissipation part and a fan, wherein the shell is provided with a heat dissipation cavity, an air inlet and an air outlet, the air inlet and the air outlet are respectively connected to the heat dissipation cavity, the heat dissipation part is arranged in the heat dissipation cavity, a plurality of transistors are arranged on the heat dissipation part, and the fan is arranged in the heat dissipation cavity and is connected to the air inlet.

[0024] In this technical solution, it is defined that the housing is provided with a heat dissipation cavity, an air inlet and an air outlet. Specifically, the air inlet is connected to the heat dissipation cavity, the air outlet is connected to the heat dissipation cavity, and the fan is connected to the air inlet. Specifically, when the fan is started, the airflow enters the heat dissipation cavity from the air inlet, flows through the heat dissipation part, takes away the heat on the surface of the heat dissipation part, and then flows out from the air outlet.

[0025] Since multiple transistors are arranged on the heat dissipation part, that is, the heat generated by the multiple transistors when working can be transferred to the heat dissipation part, and the air flow can take away the heat transferred to the heat dissipation part during the flow in the heat dissipation cavity, thereby realizing air cooling of multiple transistors, improving the heat dissipation efficiency of multiple transistors, improving the reliability of the inverter, and helping to extend the service life of the inverter.

[0026] In some technical solutions, optionally, the multiple transistors include at least a first transistor and a second transistor, the power of the first transistor is greater than the power of the second transistor, and the first transistor is closer to the air inlet than the second transistor.

[0027] In this technical solution, it is defined that the multiple transistors include at least a first transistor and a second transistor. Specifically, the power of the first transistor is greater than the power of the second transistor, that is, when the inverter is in working state, the heat generated by the first transistor is greater than the heat generated by the second transistor.

[0028] The first transistor is closer to the air inlet than the second transistor. That is, among the multiple transistors, the transistor that generates more heat during operation is arranged closer to the air inlet.

[0029] It is understandable that when the fan is started, the air flow enters the heat dissipation cavity from the air inlet. Therefore, the temperature of the air flow at the air inlet is lower than the temperature of the air flow at other positions. The transistor that generates more heat is set close to the air inlet, which is beneficial to improving the heat dissipation effect of the first transistor with larger power, meeting the overall heat dissipation requirements of multiple transistors, further reducing the probability of failure of power devices, extending the service life of power devices, and improving the reliability of the inverter.

[0030] In some technical schemes, optionally, the heat dissipation part includes a substrate, a first heat sink and a second heat sink, wherein the first heat sink is arranged on the substrate along the direction from the air inlet to the air outlet, the first heat sink is closer to the air inlet than the second heat sink, and the surface area of ​​the first heat sink is larger than the surface area of ​​the second heat sink; the first transistor is arranged on the substrate, and is located on two opposite sides of the substrate with the first heat sink, and the second transistor is arranged on the substrate, and is located on two opposite sides of the substrate with the second heat sink.

[0031] In this technical solution, it is defined that the heat dissipation part includes a substrate, a first heat sink and a second heat sink. Specifically, the first heat sink and the second heat sink are arranged on the substrate along the direction from the air inlet to the air outlet, and the first heat sink is close to the air inlet. Optionally, the direction from the air inlet to the air outlet is the height direction of the shell. Alternatively, the direction from the air inlet to the air outlet is perpendicular to the height direction of the shell, that is, the horizontal direction. It can be set according to actual needs.

[0032] The surface area of ​​the first heat sink is greater than the surface area of ​​the second heat sink. Specifically, the extension length of the first heat sink in the horizontal direction is greater than the extension length of the second heat sink in the horizontal direction, so that the surface area of ​​the first heat sink is greater than the surface area of ​​the second heat sink. And / or, the extension length of the first heat sink in the height direction of the housing is greater than the extension length of the second heat sink in the height direction of the housing, so that the surface area of ​​the first heat sink is greater than the surface area of ​​the second heat sink. It can be understood that the larger the surface area of ​​the heat sink, the stronger the heat dissipation capacity.

[0033] The first transistor is opposite to the first heat sink, that is, the transistor that generates more heat during operation is opposite to the first heat sink with greater heat dissipation capacity. The second transistor is opposite to the second heat sink, that is, the transistor that generates relatively less heat during operation is opposite to the second heat sink with relatively less heat dissipation capacity, that is, the heat dissipation part adopts a segmented design, which is conducive to improving the heat dissipation effect of the first transistor with greater power while meeting the overall heat dissipation requirements of multiple transistors, further reducing the probability of failure of the power device and extending the service life of the power device.

[0034] In addition, since the first heat sink and the second heat sink are arranged in the direction from the air inlet to the air outlet, that is, after the airflow enters from the air inlet, it flows through the first heat sink and the second heat sink in sequence, and then flows out through the air outlet. Since the surface area of ​​the second heat sink is relatively small, there is a certain distance between the second heat sink and the inner wall of the shell, so that while meeting the overall heat dissipation requirements of multiple transistors, it is helpful to reduce the flow resistance of the airflow in the heat dissipation cavity. When at least a part of the inductor device is close to the air outlet, it is helpful to reduce the resistance of the airflow to the inductor device, so that more airflow can reach the inductor device for convective heat exchange, increase the convective heat exchange effect between the inductor device and the air, and then improve the heat dissipation efficiency of the inductor device.

[0035] In some technical solutions, optionally, one end of the first heat sink away from the substrate is in contact with the inner wall of the housing.

[0036] In this technical solution, one end of the first heat sink away from the substrate is in contact with the inner wall of the outer shell. Since the first heat sink is arranged close to the air inlet, that is to say, most of the airflow entering from the air inlet can flow through the first heat sink and then be discharged through the air outlet, thereby increasing the heat exchange efficiency and improving the heat dissipation effect of multiple transistors.

[0037] In some technical solutions, optionally, at least a portion of the inductor is configured to be close to the air outlet.

[0038] In this technical solution, at least part of the inductor is limited to be close to the air outlet. That is to say, under the action of the fan, the air flows into the heat dissipation cavity through the air inlet, flows through the heat dissipation part, and dissipates heat for multiple transistors. When the air flows out from the air outlet, since at least part of the inductor is close to the air outlet, the airflow flowing out from the air outlet can flow to the inductor, thereby enhancing the convective heat exchange between the inductor and the air, improving the heat dissipation effect of the inductor, and realizing the common air cooling of the power device and the inductor, reducing the probability of failure of each electrical component in the inverter, and improving the operating stability and reliability of the inverter.

[0039] In some technical solutions, optionally, the inductor device includes a cover, a third heat sink and a device body, wherein the cover is connected to the shell, the third heat sink is arranged on the outside of the cover, at least a portion of the third heat sink is configured to be close to the air outlet and opposite to the air outlet, and the device body is arranged inside the cover.

[0040] In this technical solution, it is defined that the inductor device includes a housing, a third heat sink and a device body. Specifically, the third heat sink is arranged on the outside of the housing, and the device body is arranged inside the housing. That is to say, the heat generated by the device body during operation is transferred to the third heat sink via the housing, and heat is exchanged with the external air via the third heat sink to dissipate the heat of the device body. By providing the third heat sink, the contact area with the air is increased, the heat exchange effect is improved, and the heat dissipation effect of the device body is improved.

[0041] The device body includes a boost module and an inverter module.

[0042] At least a portion of the third heat sink is close to the air outlet, and at least a portion of the third heat sink is opposite to the air outlet, that is, at least a portion of the third heat sink extends to the air outlet, so that the airflow flowing out of the air outlet can flow to the third heat sink, thereby enhancing the convective heat exchange between the third heat sink and the air, achieving air-cooled heat dissipation of the inductor device, improving the heat dissipation effect of the inductor device, and extending the service life of the inductor device, which is beneficial to reduce the probability of inverter failure and improve the reliability of the inverter.

[0043] Optionally, the third heat sink and the housing are an integral structure.

[0044] In some technical solutions, optionally, the inductor device further includes a heat conductor, and the heat conductor is arranged between the device body and the cover.

[0045] In this technical solution, it is defined that the inductor device also includes a heat conductor. Specifically, the heat conductor is arranged between the device body and the cover. That is to say, the heat generated by the device body during operation is transferred to the cover via the heat conductor, and then transferred to the third heat sink by the cover.

[0046] It is understandable that the heat conducting member has heat conducting properties. By arranging the heat conducting member between the cover and the device body, the heat generated by the device body can be quickly transferred outwards, that is, the efficiency of heat transfer outwards can be improved, the inductor device can be quickly dissipated, the heat dissipation effect of the inductor device can be improved, the service life of the inductor device can be extended, and the reliability of the inverter can be improved.

[0047] In some technical solutions, optionally, the heat conducting member includes heat conducting glue, and the device body is connected to the cover shell through the heat conducting glue.

[0048] In this technical solution, it is defined that the heat-conducting part includes thermally conductive adhesive. Specifically, the device body is fixed in the cover shell by the thermally conductive adhesive. That is to say, the thermally conductive adhesive can quickly transfer the heat generated by the device body to the outside to improve the heat dissipation efficiency, and at the same time, it can also play a role in fixing the device body. While improving the heat dissipation effect, there is no need to set up other structural parts to fix the device body, which is beneficial to reducing the production cost of the inverter.

[0049] In some technical schemes, optionally, the shell includes a first wind shield, a second wind shield and a third wind shield, wherein the first wind shield and the second wind shield are arranged along the height direction of the shell, the first wind shield is closer to the top of the shell than the second wind shield, the first wind shield is provided with an air outlet, the second wind shield is provided with an air inlet, the fan is provided on the second wind shield, the third wind shield is provided between the first wind shield and the second wind shield, and is connected to the first wind shield and the second wind shield, and the first wind shield, the second wind shield and the third wind shield enclose a heat dissipation cavity.

[0050] In this technical solution, it is defined that the housing includes a first windshield, a second windshield and a third windshield. Specifically, the first windshield and the second windshield are arranged along the height direction of the housing, and the first windshield is arranged near the top of the housing, and the second windshield is arranged near the bottom of the housing. The air inlet is arranged on the second windshield, that is, the air inlet is at the bottom, and the air outlet is arranged on the first windshield, that is, the air outlet is at the top, that is, the air inlet and the air outlet are respectively located on opposite sides of the housing, which is conducive to extending the flow path of the airflow in the heat dissipation cavity and improving the heat dissipation effect of multiple transistors.

[0051] The fan is arranged on the second wind shield plate, that is, the fan is arranged close to the air inlet, which is beneficial to ensure the air intake efficiency of the heat dissipation cavity and improve the heat dissipation effect of multiple transistors.

[0052] The third wind shield is located between the first wind shield and the second wind shield. Specifically, one end of the third wind shield is connected to the first wind shield, and the other end of the third wind shield is connected to the second wind shield, so that the first wind shield, the second wind shield and the third wind shield are combined to form a heat dissipation cavity.

[0053] Optionally, the first wind shield and the third wind shield are an integrated structure. Alternatively, the first wind shield, the third wind shield and the second wind shield are an integrated structure.

[0054] Optionally, the outer shell is a sheet metal part, and the first wind deflector and the third wind deflector are formed by bending the sheet metal part.

[0055] According to the second aspect of the utility model, there is provided an energy storage system, comprising an inverter as provided by any of the above technical solutions, and thus having all the beneficial technical effects of the inverter, which will not be described in detail herein.

[0056] Optionally, the energy storage system further includes a battery module, and the battery module is electrically connected to the inverter.

[0057] Additional aspects and advantages of the present invention will be given in the following description, and some will become apparent from the following description, or will be understood through the practice of the present invention. BRIEF DESCRIPTION OF THE DRAWINGS

[0058] The above and / or additional aspects and advantages of the present invention will become apparent and easily understood from the description of the embodiments in conjunction with the following drawings, in which:

[0059] Figure 1 One of the structural schematic diagrams of an inverter according to an embodiment of the utility model is shown;

[0060] Figure 2 A second schematic diagram of the structure of an inverter according to an embodiment of the utility model is shown;

[0061] Figure 3 A third structural schematic diagram of an inverter according to an embodiment of the utility model is shown;

[0062] Figure 4 A schematic structural diagram of a housing according to an embodiment of the utility model is shown;

[0063] Figure 5 A schematic structural diagram of a heat dissipation unit according to an embodiment of the utility model is shown;

[0064] Figure 6 One of the partial structural schematic diagrams of an inverter according to an embodiment of the utility model is shown;

[0065] Figure 7A second partial structural schematic diagram of an inverter according to an embodiment of the utility model is shown;

[0066] Figure 8 A partial structural schematic diagram of a heat dissipation assembly according to an embodiment of the utility model is shown;

[0067] Fig. 9 A schematic structural diagram of an inductor device according to an embodiment of the utility model is shown;

[0068] Fig.10 A partial structural schematic diagram of a power device according to an embodiment of the utility model is shown.

[0069] in, Figures 1 to 10 The corresponding relationship between the reference numerals and the component names is as follows:

[0070] 100 inverter, 110 housing, 111 accommodating cavity, 112 housing body, 113 bottom plate, 114 enclosure, 115 groove, 116 cover plate, 117 avoidance opening, 120 inductor, 121 third heat sink, 122 cover, 123 device body, 124 heat conductor, 130 power device, 131 transistor, 132 first transistor, 133 second transistor, 140 heat dissipation assembly, 141 housing, 142 heat dissipation cavity, 143 air inlet, 144 air outlet, 145 heat dissipation part, 146 fan, 150 substrate, 160 first heat sink, 170 second heat sink, 180 first wind shield, 190 second wind shield, 210 third wind shield, 220 pressing block. DETAILED DESCRIPTION

[0071] In order to more clearly understand the above-mentioned purpose, features and advantages of the utility model, the utility model is further described in detail below in conjunction with the accompanying drawings and specific implementation methods. It should be noted that the embodiments of the present application and the features in the embodiments can be combined with each other without conflict.

[0072] In the following description, many specific details are set forth to facilitate a full understanding of the present invention. However, the present invention may also be implemented in other ways different from those described herein. Therefore, the protection scope of the present invention is not limited to the specific embodiments disclosed below.

[0073] Refer to the following Figures 1 to 10 The inverter 100 and the energy storage system provided according to some embodiments of the present invention are described.

[0074] In one embodiment according to the present application, Figure 1 , Figure 2 and Figure 3As shown, an inverter 100 is proposed, and the inverter 100 includes: a housing 110; an inductor 120, which is arranged in the housing 110; a power device 130, which is arranged in the housing 110 and is arranged on both sides of the housing 110 respectively with the inductor 120; a heat dissipation component 140, which is arranged in the housing 110, and the power device 130 is connected to the heat dissipation component 140, and the heat dissipation component 140 is used for heat exchange with the power device 130.

[0075] The embodiment of the utility model provides a housing 110, an inductor 120, a power device 130 and a heat dissipation assembly 140. Specifically, the inductor 120 and the power device 130 are arranged on the housing 110. Optionally, the inductor 120 includes a device body 123, and the device body 123 includes a boost module and an inverter module. Optionally, the power device 130 includes a plurality of transistors 131.

[0076] It is understandable that during the operation of the inverter 100, both the inductor 120 and the power device 130 will generate a large amount of heat. If the inductor 120 and the power device 130 are arranged on the same side of the housing 110, that is, the distance between the inductor 120 and the power device 130 is close, the heat is concentrated. Such a layout will form a superposition effect of multiple heat sources, resulting in excessive local temperature rise of the inverter 100, which is not conducive to the heat dissipation of the inductor 120 and the power device 130. Moreover, the inductor 120 and the power device 130 are in a high temperature environment for a long time, which is prone to failure.

[0077] The power device 130 and the inductor device 120 are respectively located on both sides of the shell 110, that is, the electrical devices that generate heat are dispersed, the distance between the power device 130 and the inductor device 120 is increased, and the heat source is dispersed, thereby eliminating the local high temperature phenomenon caused by heat concentration in the inductor device 120 and the power device 130, reducing the risk of high temperature or even thermal failure of the inverter 100 due to heat concentration, improving the heat dissipation efficiency of the inductor device 120 and the power device 130, extending the service life of the inverter 100, and improving the reliability of the product.

[0078] The heat dissipation component 140 is connected to the power device 130 and is used for heat exchange with the power device 130. That is, the heat dissipation component 140 can dissipate heat for the power device 130, thereby reducing the surface temperature of the power device 130, preventing the power device 130 from malfunctioning, and improving the reliability of the inverter 100 during operation.

[0079] Optionally, the power device 130 is located at the rear of the housing 110, and the inductor 120 is located at the top of the housing 110. Alternatively, the power device 130 is located at the rear of the housing 110, and the inductor 120 is located at the bottom of the housing 110. These are not listed here. They can be set according to actual needs.

[0080] like Figure 1 , Figure 4 and Figure 6 As shown, in some embodiments, optionally, the housing 110 is provided with a receiving cavity 111 , the power device 130 is located in the receiving cavity 111 , and the inductor device 120 is located outside the receiving cavity 111 .

[0081] In this embodiment, it is defined that the shell 110 is provided with a accommodating cavity 111. Specifically, the power device 130 is arranged in the accommodating cavity 111, and the inductor device 120 is arranged outside the accommodating cavity 111. That is to say, on the basis that the inductor device 120 and the power device 130 are respectively located on both sides of the shell 110, the power device 130 and the inductor device 120 are distributed on the inner and outer sides of the accommodating cavity 111, so as to further increase the distance between the power device 130 and the inductor device 120, so as to achieve the purpose of further dispersing the heat source.

[0082] Since the power device 130 and the inductor device 120 are further located on the inner and outer sides of the accommodating cavity 111, the local high temperature phenomenon caused by heat concentration in the inductor device 120 and the power device 130 can be further eliminated, the risk of high temperature or even thermal failure of the inverter 100 due to heat concentration can be reduced, the heat dissipation efficiency of the inductor device 120 and the power device 130 can be improved, and the reliability of the product can be improved.

[0083] In addition, the power device 130 is disposed in the accommodating cavity 111, which facilitates the wiring between the power device 130 and other electrical devices, thereby avoiding the problem of increased product cost due to complicated wiring inside the inverter 100.

[0084] like Figure 1 , Figure 2 and Figure 4 As shown, in some embodiments, optionally, the shell 110 includes a shell body 112 and a cover plate 116, wherein the shell body 112 includes a connected bottom plate 113 and a surrounding plate 114, the surrounding plate 114 and the bottom plate 113 are combined to form a groove 115, the cover plate 116 is connected to one end of the surrounding plate 114 away from the bottom plate 113, and is combined with the groove wall of the groove 115 to form a accommodating cavity 111, the heat dissipation assembly 140 is arranged on the bottom plate 113, and the inductor device 120 is arranged on the surrounding plate 114.

[0085] In this embodiment, the housing 110 is defined to include a housing body 112 and a cover plate 116. Specifically, the housing body 112 includes a bottom plate 113 and a surrounding plate 114. The cover plate 116 and the bottom plate 113 are respectively located on opposite sides of the surrounding plate 114. The bottom plate 113 and the surrounding plate 114 are enclosed to form a groove 115. The cover plate 116 and the groove wall of the groove 115 are enclosed to form a receiving cavity 111. Optionally, the surrounding plate 114 includes four side plates, and the four side plates are sequentially connected end to end to form the surrounding plate 114.

[0086] The heat dissipation assembly 140 is arranged on the bottom plate 113. Since the power device 130 is arranged on the heat dissipation assembly 140, that is, the power device 130 is located on the bottom plate 113. And the inductor device 120 is arranged on the enclosure 114, so that the power device 130 and the inductor device 120 are respectively located on both sides of the housing 110, that is, the electrical devices that generate heat are dispersed, the distance between the power device 130 and the inductor device 120 is increased, and the heat source is dispersed, thereby eliminating the local high temperature phenomenon caused by heat concentration of the inductor device 120 and the power device 130, and reducing the risk of high temperature or even thermal failure of the inverter 100 due to heat concentration.

[0087] Optionally, the inductor 120 is disposed on a side plate at the top of the enclosure 114 .

[0088] Optionally, the shell body 112 is provided with a first through hole, the cover plate 116 is provided with a blind hole, and the bolt passes through the first through hole and is connected to the blind hole, that is, the shell body 112 and the cover plate 116 are connected by bolts.

[0089] like Figure 4 and Figure 6 As shown, in some embodiments, optionally, the shell 110 is also provided with an avoidance opening 117, which is connected to the accommodating cavity 111; a portion of the heat dissipation component 140 is located at the avoidance opening 117, and the portion of the heat dissipation component 140 located at the avoidance opening 117 is connected to the power device 130.

[0090] In this embodiment, it is defined that the housing 110 is also provided with a avoidance opening 117. Specifically, the avoidance opening 117 is communicated with the accommodating cavity 111. Part of the heat dissipation assembly 140 is located at the avoidance opening 117 and is connected to the power device 130. By providing the avoidance opening 117, the power device 130 can be connected to the heat dissipation assembly 140, so that the heat dissipation of the power device 130 is achieved through heat exchange with the heat dissipation assembly 140. At the same time, the power device 130 can be located in the accommodating cavity 111 through the avoidance opening 117, thereby facilitating the wiring between the power device 130 and other electrical devices, and avoiding the problem of increased product cost due to the complicated wiring inside the inverter 100.

[0091] like Figure 1 , Figure 2 , Figure 5 , Figure 6 and Figure 7As shown, in some embodiments, optionally, the power device 130 includes a plurality of transistors 131, and the heat dissipation assembly 140 includes a shell 141, a heat dissipation portion 145 and a fan 146, wherein the shell 141 is provided with a heat dissipation cavity 142, an air inlet 143 and an air outlet 144, the air inlet 143 and the air outlet 144 are respectively connected to the heat dissipation cavity 142, the heat dissipation portion 145 is arranged in the heat dissipation cavity 142, a plurality of transistors 131 are arranged on the heat dissipation portion 145, and the fan 146 is arranged in the heat dissipation cavity 142 and is connected to the air inlet 143.

[0092] In this embodiment, it is defined that the housing 141 is provided with a heat dissipation cavity 142, an air inlet 143 and an air outlet 144. Specifically, the air inlet 143 is communicated with the heat dissipation cavity 142, the air outlet 144 is communicated with the heat dissipation cavity 142, and the fan 146 is communicated with the air inlet 143. Specifically, when the fan 146 is started, the airflow enters the heat dissipation cavity 142 from the air inlet 143, flows through the heat dissipation portion 145, takes away the heat on the surface of the heat dissipation portion 145, and then flows out from the air outlet 144.

[0093] Since the multiple transistors 131 are arranged on the heat dissipation part 145, that is, the heat generated by the multiple transistors 131 during operation can be transferred to the heat dissipation part 145, and the air flow can take away the heat transferred to the heat dissipation part 145 during the flow in the heat dissipation cavity 142, thereby realizing air-cooling of the multiple transistors 131, improving the heat dissipation efficiency of the multiple transistors 131, and improving the reliability of the inverter 100, which is conducive to extending the service life of the inverter 100.

[0094] like Fig.10 As shown, optionally, the power device 130 further includes a plurality of pressing blocks 220 , and any two adjacent transistors 131 are fixed on the heat dissipation portion 145 through the pressing blocks 220 .

[0095] Optionally, each pressing block 220 is provided with a circular hole, and a screw passes through the circular hole to be connected to the heat dissipation portion 145 , thereby fixing the plurality of transistors 131 on the heat dissipation portion 145 .

[0096] like Figure 1 and Figure 5 As shown, in some embodiments, optionally, the plurality of transistors 131 include at least a first transistor 132 and a second transistor 133 , the power of the first transistor 132 is greater than the power of the second transistor 133 , and the first transistor 132 is closer to the air inlet 143 than the second transistor 133 .

[0097] In this embodiment, it is defined that the plurality of transistors 131 include at least a first transistor 132 and a second transistor 133. Specifically, the power of the first transistor 132 is greater than the power of the second transistor 133. That is, when the inverter 100 is in working state, the heat generated by the first transistor 132 is greater than the heat generated by the second transistor 133.

[0098] The first transistor 132 is closer to the air inlet 143 than the second transistor 133 . That is, among the plurality of transistors 131 , the transistor 131 that generates more heat during operation is disposed closer to the air inlet 143 .

[0099] It can be understood that when the fan 146 is started, the air flow enters the heat dissipation cavity 142 from the air inlet 143. Therefore, the temperature of the air flow at the air inlet 143 is lower than the temperature of the air flow at other positions. The transistor 131 that generates more heat is set close to the air inlet 143, which is beneficial to improving the heat dissipation effect of the first transistor 132 with larger power, meeting the overall heat dissipation requirements of multiple transistors 131, further reducing the probability of failure of the power device 130, extending the service life of the power device 130, and improving the reliability of the inverter 100.

[0100] like Figure 1 and Figure 5 As shown, in some embodiments, optionally, the heat dissipation portion 145 includes a substrate 150, a first heat sink 160 and a second heat sink 170, wherein the first heat sink 160 is arranged on the substrate 150 along the direction from the air inlet 143 to the air outlet 144, the first heat sink 160 is closer to the air inlet 143 than the second heat sink 170, and the surface area of ​​the first heat sink 160 is larger than the surface area of ​​the second heat sink 170; the first transistor 132 is arranged on the substrate 150, and is located on two sides opposite to the first heat sink 160, and the second transistor 133 is arranged on the substrate 150, and is located on two sides opposite to the second heat sink 170.

[0101] In this embodiment, it is defined that the heat dissipation portion 145 includes a substrate 150, a first heat sink 160 and a second heat sink 170. Specifically, the first heat sink 160 and the second heat sink 170 are arranged on the substrate 150 along the direction from the air inlet 143 to the air outlet 144, and the first heat sink 160 is close to the air inlet 143. Optionally, the direction from the air inlet 143 to the air outlet 144 is the height direction of the housing 110. Alternatively, the direction from the air inlet 143 to the air outlet 144 is perpendicular to the height direction of the housing 110, that is, the horizontal direction. It can be set according to actual needs.

[0102] The surface area of ​​the first heat sink 160 is greater than the surface area of ​​the second heat sink 170. Specifically, the extension length of the first heat sink 160 in the horizontal direction is greater than the extension length of the second heat sink 170 in the horizontal direction, so that the surface area of ​​the first heat sink 160 is greater than the surface area of ​​the second heat sink 170. And / or, the extension length of the first heat sink 160 in the height direction of the housing 110 is greater than the extension length of the second heat sink 170 in the height direction of the housing 110, so that the surface area of ​​the first heat sink 160 is greater than the surface area of ​​the second heat sink 170. It can be understood that the larger the surface area of ​​the heat sink, the stronger the heat dissipation capacity.

[0103] The first transistor 132 is opposite to the first heat sink 160, that is, the transistor 131 that generates more heat during operation is opposite to the first heat sink 160 with a larger heat dissipation capacity. The second transistor 133 is opposite to the second heat sink 170, that is, the transistor 131 that generates relatively less heat during operation is opposite to the second heat sink 170 with a relatively smaller heat dissipation capacity, that is, the heat dissipation portion 145 adopts a segmented design, which is conducive to improving the heat dissipation effect of the first transistor 132 with a larger power, while meeting the overall heat dissipation requirements of multiple transistors 131, further reducing the probability of failure of the power device 130, and extending the service life of the power device 130.

[0104] In addition, since the first heat sink 160 and the second heat sink 170 are arranged in the direction from the air inlet 143 to the air outlet 144, that is, after the airflow enters from the air inlet 143, it flows through the first heat sink 160 and the second heat sink 170 in sequence, and then flows out through the air outlet 144. Since the surface area of ​​the second heat sink 170 is relatively small, there is a certain distance between the second heat sink 170 and the inner wall of the housing 141, so that while meeting the overall heat dissipation requirements of the multiple transistors 131, it is helpful to reduce the flow resistance of the airflow in the heat dissipation cavity 142. When at least a part of the inductor 120 is close to the air outlet 144, it is helpful to reduce the resistance of the airflow to the inductor 120, so that more airflow can reach the inductor 120 for convective heat exchange, increase the convective heat exchange effect between the inductor 120 and the air, and then improve the heat dissipation efficiency of the inductor 120.

[0105] Optionally, the shell body 112 is further provided with a second through hole, the base plate 150 is provided with a first connecting hole, and the bolt passes through the second through hole and is connected to the first connecting hole, that is, the shell body 112 and the base plate 150 are connected by bolts.

[0106] In some embodiments, optionally, one end of the first heat sink 160 away from the base plate 150 contacts the inner wall of the housing 141 .

[0107] In this embodiment, one end of the first heat sink 160 away from the substrate 150 is in contact with the inner wall of the outer shell 141. Since the first heat sink 160 is arranged close to the air inlet 143, that is to say, most of the airflow entering from the air inlet 143 can flow through the first heat sink 160 and be discharged through the air outlet 144, thereby increasing the heat exchange efficiency and improving the heat dissipation effect of the multiple transistors 131.

[0108] like Figure 1 and Figure 2 As shown, in some embodiments, optionally, at least a portion of the inductor 120 is configured to be close to the air outlet 144 .

[0109] In this embodiment, at least part of the inductor 120 is limited to be close to the air outlet 144, that is, under the action of the fan 146, the air flows into the heat dissipation cavity 142 through the air inlet 143, flows through the heat dissipation portion 145, and dissipates heat for the multiple transistors 131. When the air flows out from the air outlet 144, since at least part of the inductor 120 is close to the air outlet 144, the airflow flowing out from the air outlet 144 can flow to the inductor 120, thereby enhancing the convective heat exchange between the inductor 120 and the air, improving the heat dissipation effect of the inductor 120, and realizing the common air cooling of the power device 130 and the inductor 120, reducing the probability of failure of each electrical component in the inverter 100, and improving the operating stability and reliability of the inverter 100.

[0110] like Figure 1 , Figure 2 and Fig. 9 As shown, in some embodiments, optionally, the inductor device 120 includes a cover 122, a third heat sink 121 and a device body 123, wherein the cover 122 is connected to the housing 110, the third heat sink 121 is disposed on the outside of the cover 122, at least a portion of the third heat sink 121 is configured to be close to the air outlet 144 and opposite to the air outlet 144, and the device body 123 is disposed inside the cover 122.

[0111] In this embodiment, the inductor device 120 is defined to include a housing 122, a third heat sink 121, and a device body 123. Specifically, the third heat sink 121 is disposed on the outside of the housing 122, and the device body 123 is disposed inside the housing 122. That is, the heat generated by the device body 123 during operation is transferred to the third heat sink 121 via the housing 122, and heat is exchanged with the external air via the third heat sink 121 to dissipate heat from the device body 123. By providing the third heat sink 121, the contact area with the air is increased, the heat exchange effect is improved, and the heat dissipation effect of the device body 123 is improved.

[0112] The device body 123 includes a boost module and an inverter module.

[0113] At least a portion of the third heat sink 121 is close to the air outlet 144, and at least a portion of the third heat sink 121 is opposite to the air outlet 144, that is, at least a portion of the third heat sink 121 extends to the air outlet 144, so that the airflow flowing out of the air outlet 144 can flow to the third heat sink 121, thereby enhancing the convective heat exchange between the third heat sink 121 and the air, achieving air-cooled heat dissipation of the inductor device 120, improving the heat dissipation effect of the inductor device 120, and extending the service life of the inductor device 120, which is beneficial to reducing the probability of failure of the inverter 100 and improving the reliability of the inverter 100.

[0114] Optionally, the third heat sink 121 and the cover 122 are an integral structure.

[0115] Optionally, the shell body 112 is further provided with a third through hole, the cover shell 122 is provided with a second connecting hole, and the bolt passes through the third through hole and is connected to the second connecting hole, that is, the cover shell 122 is connected to the shell body 112 by bolts.

[0116] like Figure 1 As shown, in some embodiments, optionally, the inductor device 120 further includes a heat conductor 124 , and the heat conductor 124 is disposed between the device body 123 and the cover 122 .

[0117] In this embodiment, it is defined that the inductor device 120 also includes a heat conductor 124. Specifically, the heat conductor 124 is arranged between the device body 123 and the cover 122. That is to say, the heat generated by the device body 123 during operation is transferred to the cover 122 via the heat conductor 124, and then transferred to the third heat sink 121 by the cover 122.

[0118] It is understandable that the heat conducting member 124 has heat conducting properties. By arranging the heat conducting member 124 between the cover 122 and the device body 123, the heat generated by the device body 123 can be quickly transferred outward, that is, the efficiency of heat transfer outward can be improved, the inductor device 120 can be quickly dissipated, the heat dissipation effect of the inductor device 120 can be improved, the service life of the inductor device 120 can be extended, and the reliability of the inverter 100 can be improved.

[0119] In some embodiments, optionally, the heat conducting member 124 includes a thermally conductive adhesive, and the device body 123 is connected to the cover 122 via the thermally conductive adhesive.

[0120] In this embodiment, the heat conducting member 124 is defined to include a thermally conductive adhesive. Specifically, the device body 123 is fixed in the cover 122 by the thermally conductive adhesive. That is to say, the thermally conductive adhesive can quickly transfer the heat generated by the device body 123 to the outside to improve the heat dissipation efficiency while also fixing the device body 123. While improving the heat dissipation effect, there is no need to set up other structural parts to fix the device body 123, which is beneficial to reducing the production cost of the inverter 100.

[0121] like Figure 7 and Figure 8 As shown, in some embodiments, optionally, the shell 141 includes a first wind shield 180, a second wind shield 190 and a third wind shield 210, wherein the first wind shield 180 and the second wind shield 190 are arranged along the height direction of the shell 110, the first wind shield 180 is closer to the top of the shell 110 than the second wind shield 190, the first wind shield 180 is provided with an air outlet 144, the second wind shield 190 is provided with an air inlet 143, the fan 146 is provided on the second wind shield 190, the third wind shield 210 is provided between the first wind shield 180 and the second wind shield 190, and is connected to the first wind shield 180 and the second wind shield 190, and the first wind shield 180, the second wind shield 190 and the third wind shield 210 enclose a heat dissipation cavity 142.

[0122] In this embodiment, the housing 141 is defined to include a first windshield 180, a second windshield 190 and a third windshield 210. Specifically, the first windshield 180 and the second windshield 190 are arranged along the height direction of the housing 110, and the first windshield 180 is arranged near the top of the housing 110, and the second windshield 190 is arranged near the bottom of the housing 110. The air inlet 143 is arranged on the second windshield 190, that is, the air inlet at the bottom, and the air outlet 144 is arranged on the first windshield 180, that is, the air outlet at the top, that is, the air inlet 143 and the air outlet 144 are respectively located on opposite sides of the housing 141, which is conducive to extending the flow path of the airflow in the heat dissipation cavity 142 and improving the heat dissipation effect of multiple transistors 131.

[0123] The fan 146 is disposed on the second wind shield 190 , that is, the fan 146 is disposed close to the air inlet 143 , which is beneficial to ensuring the air intake efficiency of the heat dissipation cavity 142 and improving the heat dissipation effect of the plurality of transistors 131 .

[0124] The third wind shield 210 is located between the first wind shield 180 and the second wind shield 190. Specifically, one end of the third wind shield 210 is connected to the first wind shield 180, and the other end of the third wind shield 210 is connected to the second wind shield 190, so that the first wind shield 180, the second wind shield 190 and the third wind shield 210 enclose a heat dissipation cavity 142.

[0125] Optionally, the first wind shield 180 and the third wind shield 210 are an integrated structure. Alternatively, the first wind shield 180, the third wind shield 210 and the second wind shield 190 are an integrated structure.

[0126] Optionally, the housing 141 is a sheet metal part, and the first wind shield 180 and the third wind shield 210 are formed by bending the sheet metal part.

[0127] Optionally, the first wind shield 180 is connected to the shell body 112 by bolts, the second wind shield 190 is connected to the third wind shield 210 and the shell body 112 by bolts, and the fan 146 is connected to the second wind shield 190 by bolts.

[0128] In a specific embodiment, the host bottom shell (shell body 112) and the host top cover (cover plate 116) are fastened together by bolts, and the transistor 131 and the boost and inverter inductors (inductor device 120) are arranged at the rear and top of the host bottom shell respectively, so as to disperse the heat generated by the transistor 131 and the boost and inverter inductors and reduce the device temperature.

[0129] The boost and inverter inductors are fixed in the inductor housing (cover 122) by injecting thermal conductive adhesive (heat conductive member 124). At the same time, the thermal conductive adhesive can reduce the resistance of heat conduction from the boost and inverter inductors to the inductor housing, which is beneficial to the heat dissipation of the boost and inverter inductors. There are integrally die-cast heat dissipation fins (third heat dissipation fins 121) on the inductor housing. These fins will increase the convective heat transfer area of ​​the boost and inverter inductors. A part of the fins is located at the air outlet 144. This arrangement can improve the convective heat transfer coefficient of the inductor housing, which is more beneficial to the heat dissipation of the boost and inverter inductors.

[0130] The heat sink (heat sink component 140) is used to dissipate heat for the transistor 131. The heat sink is fastened to the rear of the main chassis by bolts. The pressing block 220 is provided with round holes. The bolts fasten the pressing block 220 to the heat sink substrate 150 through the round holes, and at the same time, the transistor 131 is pressed onto the heat sink substrate 150. The transistor 131 inside the main chassis is pressed onto the heat sink substrate 150 by the pressing block 220 through the square hole (avoidance 117) of the main chassis.

[0131] The fan 146 is connected to the windshield (second windshield 190) by bolts, and the first windshield 180, the second windshield 190, the third windshield 210, and the bottom shell of the main unit are connected by bolts to form an air duct (heat dissipation cavity 142), and the heat dissipation portion 145 is placed in the middle of the air duct, so that the third windshield 210 is close to the first heat sink 160, and the first windshield 180 has a hole as an air outlet 144. The fan 146 blows air through the heat dissipation portion 145, so that the convection heat transfer coefficient on the surface of the heat dissipation portion 145 is increased, thereby improving the heat transfer efficiency of the transistor 131.

[0132] According to a second aspect of the present invention, an energy storage system is provided, including an inverter 100 provided by any of the above technical solutions, thereby having all the beneficial technical effects of the inverter 100, which will not be repeated here.

[0133] Optionally, the energy storage system further includes a battery module, and the battery module is electrically connected to the inverter 100 .

[0134] In the description of this specification, the terms "connection", "installation", "fixation" and the like should be understood in a broad sense. For example, "connection" can be a fixed connection, a detachable connection, or an integral connection; it can be a direct connection or an indirect connection through an intermediate medium. For ordinary technicians in this field, the specific meanings of the above terms in this utility model can be understood according to specific circumstances.

[0135] In the description of this specification, the description of the terms "one embodiment", "some embodiments", "specific embodiments", etc. means that the specific features, structures, materials or characteristics described in conjunction with the embodiment or example are included in at least one embodiment or example of the utility model. In this specification, the schematic representation of the above terms does not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials or characteristics described can be combined in any one or more embodiments or examples in a suitable manner.

[0136] The above are only preferred embodiments of the present invention and are not intended to limit the present invention. For those skilled in the art, the present invention may be subject to various modifications and variations. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present invention shall be included in the protection scope of the present invention.

Claims

1. An inverter, characterized in that: include: case; An inductor device, arranged in the housing; A power device is provided in the housing and is arranged on two sides of the housing together with the inductor device; The heat dissipation component is arranged on the shell, the power device is connected to the heat dissipation component, and the heat dissipation component is used for heat exchange with the power device.

2. The inverter according to claim 1, characterized in that: The shell is provided with a containing cavity, the power device is located in the containing cavity, and the inductor device is located outside the containing cavity.

3. The inverter according to claim 2, characterized in that: The housing comprises: A shell body, the shell body comprising a bottom plate and a surrounding plate connected to each other, the surrounding plate and the bottom plate enclose a groove; The cover plate is connected to one end of the enclosure plate away from the bottom plate, and is enclosed with the groove wall of the groove to form the accommodating cavity. The heat dissipation component is arranged on the bottom plate, and the inductor device is arranged on the enclosure plate.

4. The inverter according to claim 2, characterized in that: The shell is also provided with an escape opening, and the escape opening is communicated with the accommodating cavity; A portion of the heat dissipation component is located at the avoidance opening, and the portion of the heat dissipation component located at the avoidance opening is connected to the power device.

5. The inverter according to any one of claims 1 to 4, characterized in that: The power device includes a plurality of transistors, and the heat dissipation component includes: A housing, wherein the housing is provided with a heat dissipation cavity, an air inlet and an air outlet, and the air inlet and the air outlet are respectively connected to the heat dissipation cavity; A heat dissipation portion is disposed in the heat dissipation cavity, and a plurality of transistors are disposed on the heat dissipation portion; The fan is arranged in the heat dissipation cavity and is communicated with the air inlet.

6. The inverter according to claim 5, characterized in that: The plurality of transistors include at least a first transistor and a second transistor, the power of the first transistor is greater than the power of the second transistor, and the first transistor is closer to the air inlet than the second transistor.

7. The inverter according to claim 6, characterized in that: The heat dissipation unit comprises: substrate; A first heat sink and a second heat sink are arranged on the substrate along a direction from the air inlet to the air outlet, the first heat sink is closer to the air inlet than the second heat sink, and a surface area of ​​the first heat sink is greater than a surface area of ​​the second heat sink; The first transistor is disposed on a substrate and is located on two opposite sides of the substrate with the first heat sink respectively. The second transistor is disposed on the substrate and is located on two opposite sides of the substrate with the second heat sink respectively.

8. The inverter according to claim 7, characterized in that: One end of the first heat sink away from the base plate contacts the inner wall of the housing.

9. The inverter according to claim 5, characterized in that: At least a portion of the inductor is configured to be close to the air outlet.

10. The inverter according to claim 9, characterized in that: The inductor device comprises: A cover shell connected to the housing; a third heat sink disposed on the outer side of the housing, wherein at least a portion of the third heat sink is disposed close to the air outlet and opposite to the air outlet; The device body is arranged in the cover shell.

11. The inverter according to claim 10, characterized in that: The inductor device also includes: The heat conducting member is arranged between the device body and the cover shell.

12. The inverter according to claim 11, characterized in that: The heat conducting member includes heat conducting glue, and the device body is connected to the cover shell via the heat conducting glue.

13. The inverter according to claim 5, characterized in that: The housing comprises: A first wind shield and a second wind shield are arranged along the height direction of the shell, the first wind shield is closer to the top of the shell than the second wind shield, the first wind shield is provided with the air outlet, the second wind shield is provided with the air inlet, and the fan is provided on the second wind shield; The third wind shield is arranged between the first wind shield and the second wind shield, and is connected to the first wind shield and the second wind shield. The first wind shield, the second wind shield and the third wind shield together form the heat dissipation cavity.

14. An energy storage system, characterized in that: The invention comprises the inverter according to any one of claims 1 to 13.

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