Servo pressing device for Micro-LED laser transfer printing

Abstract

The utility model discloses a servo pressing device for Micro-LED laser transfer printing, which comprises a mounting frame and a fine tuning assembly, and the fine tuning assembly is arranged at the bottom of the mounting frame. The lifting mechanism is arranged on the fine adjustment assembly; the pressure sensor is arranged at the upper end of the lifting mechanism; the receiving substrate fixing part is arranged at the upper end of the pressure sensor; and the original substrate fixing part is arranged at the upper end of the mounting frame. On one hand, alignment and attachment of the receiving base and the original substrate can be rapidly achieved; on the other hand, the force required by fitting can be quantitatively controlled; therefore, quality guarantee is provided for the whole transfer printing process, and the whole processing period is shortened. The pressing degree is accurately controlled, so that leveling is accurately carried out, and the lifting stroke of the lifting mechanism is accurately set; and the system can be compatible with chips and receiving substrates in various forms, especially receiving substrates with microstructures on the surfaces.

Description

Technical Field

[0001] The utility model belongs to the technical field of Micro-LED, and in particular relates to a servo pressing device for Micro-LED laser transfer. Background Art

[0002] Laser transfer technology is a method of transferring Micro-LED chips using laser energy. It separates the chip from the original substrate through laser peeling, and then performs ablation on the target substrate to transfer the chip to a substrate with an adhesive material. Finally, the metal bonding force on the TFT backplane is used to transfer the chip from the PDM substrate to the TFT backplane.

[0003] The Chinese patent document with publication number CN116691151B discloses a laser transfer machine, including a film feed guide, a film discharge guide, a transfer mechanism, an alignment mechanism, a glass mounting mechanism, a laser mechanism, a slurry replenishment mechanism, a visual mechanism and a lifting mechanism. The laser transfer machine replaces the existing screen and slurry printing, uses a high-energy continuous beam generated by a laser to instantly melt the slurry in the groove on the transfer glass onto the silicon wafer, controls the printing condition by controlling the path of the laser and the transfer glass, reduces damage caused by hard contact, and has a faster processing speed than screen printing. The molding surface of the silicon wafer is smooth and flat, suitable for wide use.

[0004] During the laser transfer process, the receiving substrate and the original substrate need to be bonded with a certain pressure, and due to different processing materials and processing tasks, the corresponding chip thickness is not the same, so it is required to initialize the lifting stroke of the lifting mechanism when the equipment starts to be used or after changing the printing task. In addition, the receiving substrate material may have customized microstructures, such as rectangular protrusions, so it is also necessary to have a fine-tuning function to keep the chip arrangement of the original substrate and the arrangement of the microstructure of the receiving substrate consistent. The above patent solution obviously cannot meet the use requirements. Utility Model Content

[0005] In order to overcome the technical problems in the prior art that the movement stroke of the lifting mechanism cannot be quickly and conveniently initialized according to the transfer task, and there is no fine-tuning function between the original substrate and the receiving substrate; one purpose of the utility model is to provide a servo pressing device for Micro-LED laser transfer, by arranging a horizontal displacement mechanism and a rotation mechanism on the lifting mechanism, and arranging a pressure sensor at the lower end of the fixed part of the receiving substrate, and leveling and adjusting the lifting stroke of the lifting mechanism through the feedback result of the pressure sensor.

[0006] In order to achieve the above-mentioned purpose, the utility model adopts the following technical solutions: a servo pressing device for Micro-LED laser transfer, comprising a mounting frame, which is arranged on a horizontal displacement platform; a fine-tuning component, which is arranged at the bottom of the mounting frame; a lifting mechanism, which is arranged on the fine-tuning component; a pressure sensor, which is arranged at the upper end of the lifting mechanism; a receiving substrate fixing part, which is arranged at the upper end of the pressure sensor; an original substrate fixing part, which is arranged at the upper end of the mounting frame, and the original substrate fixing part is located directly above the receiving substrate fixing part; wherein the pressure sensor is used to output the pressure value when the receiving substrate fixing part and the original substrate fixing part are in a state of being against each other.

[0007] The pressing state between the receiving substrate fixing part and the original substrate fixing part is judged by the pressure value, so that the receiving substrate fixing part and the original substrate fixing part are horizontally attached and pressed, that is, leveling is performed. Then, according to the current lifting height of the lifting mechanism, according to the thickness of the transfer stamp, the substrate, the chip and the desired Gap, the lifting stroke of the lifting mechanism is set, that is, initialization setting is performed.

[0008] Further, the fine-tuning assembly includes an X-direction fine-tuning table, which is arranged at the bottom end of the installation frame; a Y-direction fine-tuning table, which is arranged on the X-direction fine-tuning table, and the X-direction fine-tuning table drives the Y-direction fine-tuning table to slide horizontally along the X direction, and the lifting mechanism is arranged on the Y-direction fine-tuning table, and the Y-direction fine-tuning table drives the lifting mechanism to slide horizontally along the Y direction; a rotation fine-tuning table, which is arranged at the upper end of the lifting mechanism, and the pressure sensor is arranged at the upper end of the rotation fine-tuning table.

[0009] The X-axis fine-tuning stage, the Y-axis fine-tuning stage, and the rotation fine-tuning stage horizontally adjust the relative positions of the receiving substrate fixing portion and the original substrate fixing portion to meet the requirements of receiving substrate materials under special conditions.

[0010] Furthermore, the mounting frame includes a bottom plate, which is arranged on the horizontal displacement platform; a side frame, which is arranged on the upper end of the bottom plate, and an opening is arranged on one side of the side frame; a top plate, which is arranged on the upper end of the side frame; a through hole, which is arranged at the central position of the upper end of the top plate, and the original substrate fixing portion is arranged on the upper end of the through hole.

[0011] Specifically, the side frame includes three side panels respectively perpendicular to the bottom plate; two adjacent side panels are perpendicular to each other; and rectangular holes are penetrated through the side panels.

[0012] Specifically, a through groove communicating with the through hole is provided at one end of the top plate close to the opening; the width of the through groove is equal to the diameter of the through hole.

[0013] The opening provided in the mounting frame facilitates fine-tuning of the fine-tuning assembly and provides a stable mounting structure, so that the original substrate and the receiving substrate move relative to the laser under the drive of the horizontal displacement table to achieve selective printing of Micro-LED; at the same time, the through groove facilitates the installation of the Micro-LED stamp at the lower end of the original substrate fixing portion.

[0014] Furthermore, a controller is provided in the installation frame; a preset pressure value is pre-stored in the controller, and the preset pressure value is the bonding pressure value required for laser transfer of the receiving base and the original substrate; the controller is used to compare the pressure value output by the pressure sensor with the preset pressure value.

[0015] Preferably, when the pressure value output by the pressure sensor is greater than or equal to 90% of the preset pressure value, the controller controls the lifting mechanism to move up and down in a jog drive manner.

[0016] The preset pressure value is obtained by repeated test measurements under a relatively ideal environment in the laboratory; the controller jogs the lifting mechanism to lift and lower to reach the preset pressure value, thereby improving the leveling effect and the setting stroke accuracy of the lifting mechanism, and helping to improve the accuracy and quality of laser transfer.

[0017] Specifically, the lifting mechanism includes a base, a lifting platform longitudinally slidably connected to the upper end of the base, and a lifting motor arranged on the base; the lifting motor is transmission-connected to the lifting platform.

[0018] Specifically, the X-axis fine-tuning stage and the Y-axis fine-tuning stage are two identical linear fine-tuning stages arranged perpendicular to each other; the linear fine-tuning stage includes a fixed part, a sliding part horizontally slidably connected to the fixed part, and a displacement fine-tuning knob rotatably connected to the fixed part and transmission-connected to the sliding part.

[0019] Specifically, the rotary fine-tuning platform includes a fixed plate, a rotating plate coaxially rotatably connected to the upper end of the fixed plate, and a rotary fine-tuning knob rotatably connected to the fixed plate and drivingly connected to the rotating plate.

[0020] Compared with the prior art, the beneficial effects of the utility model are: on the one hand, the alignment and bonding of the receiving substrate and the original substrate can be achieved more quickly; on the other hand, the force required for bonding can be quantitatively controlled; thereby providing quality assurance for the entire transfer process and reducing the overall processing cycle.

[0021] The degree of pressing between the original substrate fixing part and the receiving substrate fixing part is accurately controlled, and then the original substrate fixing part and the receiving substrate fixing part are accurately leveled, and the lifting stroke of the lifting mechanism is accurately set; in addition, by adjusting the relative position of the original substrate fixing part and the receiving substrate fixing part, it is also possible to be compatible with various forms of chips and receiving substrates, especially receiving substrates with microstructures on the surface, thereby improving the applicability. BRIEF DESCRIPTION OF THE DRAWINGS

[0022] Figure 1 It is a schematic diagram of the structure of the utility model;

[0023] Figure 2 It is a schematic diagram of the exploded parts of the utility model.

[0024] In the figure: 11, side frame; 111, opening; 112, rectangular hole; 12, top plate; 13, bottom plate; 2, lifting mechanism; 31, X-axis fine-tuning stage; 32, Y-axis fine-tuning stage; 33, rotation fine-tuning stage; 4, pressure sensor; 5, receiving substrate fixing part; 6, original substrate fixing part; 71, first adapter plate; 72, second adapter plate; 73, third adapter plate. DETAILED DESCRIPTION

[0025] The present invention is further described below in conjunction with the accompanying drawings and specific implementation methods. It should be noted that, under the premise of no conflict, the various embodiments or technical features described below can be arbitrarily combined to form a new embodiment.

[0026] In the description of the present invention, it should be noted that directional words, such as the terms "center", "lateral", "longitudinal", "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", "clockwise", "counterclockwise", etc., indicating directions and positional relationships are based on the directions or positional relationships shown in the accompanying drawings, and are only for the convenience of narrating the present invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and cannot be understood as limiting the specific protection scope of the present invention.

[0027] In addition, the terms "first" and "second" are used for descriptive purposes only and cannot be understood as indicating or implying relative importance or implicitly indicating the number of technical features. Therefore, the definition of "first" and "second" features can explicitly or implicitly include one or more of the features. In the description of the utility model, the meaning of "several" is two or more, unless otherwise clearly and specifically defined.

[0028] In the present invention, unless otherwise specified and limited, the terms "setting", "installation" and the like should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can also be a mechanical connection; it can be directly connected, or it can be connected through an intermediate medium, or two elements can be internally connected. For those of ordinary skill in the art, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0029] See also Figure 1-Figure 2 A servo pressing device for Micro-LED laser transfer includes a mounting frame, which is arranged on a horizontal displacement table; a lifting mechanism 2, which is arranged in the mounting frame; a fine-tuning component, which is arranged on the lifting mechanism 2; a pressure sensor 4, which is arranged at the upper end of the lifting mechanism 2; a receiving substrate fixing part 5, which is arranged at the upper end of the pressure sensor 4; an original substrate fixing part 6, which is arranged at the upper end of the mounting frame, and the original substrate fixing part 6 is located directly above the receiving substrate fixing part 5.

[0030] The fine-tuning assembly includes an X-direction fine-tuning platform 31, which is arranged at the bottom end of the installation frame; a Y-direction fine-tuning platform 32, which is arranged on the X-direction fine-tuning platform 31, and the X-direction fine-tuning platform 31 drives the Y-direction fine-tuning platform 32 to slide horizontally along the X direction, the lifting mechanism 2 is arranged on the Y-direction fine-tuning platform 32, and the Y-direction fine-tuning platform 32 drives the lifting mechanism 2 to slide horizontally along the Y direction; a rotation fine-tuning platform 33, which is arranged at the upper end of the lifting mechanism 2, and the pressure sensor 4 is arranged at the upper end of the rotation fine-tuning platform 33.

[0031] The mounting frame includes a bottom plate 13, which is arranged on the horizontal displacement platform; a side frame 11, which is arranged on the upper end of the bottom plate 13, and an opening 111 is arranged on one side of the side frame 11; a top plate 12, which is arranged on the upper end of the side frame 11: a through hole, which is arranged at the central position of the upper end of the top plate 12, and the original substrate fixing part 6 is arranged on the upper end of the through hole; the side frame 11 includes three side plates respectively perpendicular to the bottom plate 13; two adjacent side plates are perpendicular to each other; a rectangular hole 112 is penetrated on the side plate; a through groove connected to the through hole is arranged at one end of the top plate 12 close to the opening 111; the width of the through groove is equal to the diameter of the through hole.

[0032] A controller is provided in the installation frame; the controller pre-stores a preset pressure value when the receiving substrate fixing part 5 and the original substrate fixing part 6 are in a fully pressed state; the pressure sensor 4 is used to output the pressure value when the receiving substrate fixing part 5 and the original substrate fixing part 6 are in a pressed state; the controller is used to compare the pressure value output by the pressure sensor 4 with the preset pressure value; when the pressure value output by the pressure sensor 4 is greater than or equal to 90% of the preset pressure value, the controller controls the lifting mechanism 2 to lift and lower in a jog drive manner until the pressure value output by the pressure sensor 4 is equal to the preset pressure value; the preset pressure value is obtained by repeated test measurements under a relatively ideal environment in the laboratory.

[0033] The lifting mechanism 2 includes a base, a lifting platform longitudinally slidably connected to the upper end of the base, and a lifting motor arranged on the base; the lifting motor is transmission-connected to the lifting platform;

[0034] The X-axis fine-tuning stage 31 and the Y-axis fine-tuning stage 32 are two identical linear fine-tuning stages arranged perpendicular to each other; the linear fine-tuning stage includes a fixed portion, a sliding portion horizontally slidably connected to the fixed portion, and a displacement fine-tuning knob rotatably connected to the fixed portion and transmission-connected to the sliding portion.

[0035] The rotary fine-tuning platform 33 includes a fixed plate, a rotating plate coaxially connected to the upper end of the fixed plate, and a rotary fine-tuning knob rotatably connected to the fixed plate and drivingly connected to the rotating plate.

[0036] A first adapter plate 71 is provided between the pressure sensor 4 and the receiving substrate fixing portion 5 ; a second adapter plate 72 is provided between the rotary fine-tuning stage 33 and the pressure sensor 4 ; and a third adapter plate 73 is provided between the Y-axis fine-tuning stage 32 and the lifting mechanism 2 .

[0037] The receiving substrate is installed at the upper end of the receiving substrate fixing part 5, and the original substrate is installed at the lower end of the original substrate part 6. The lifting mechanism 2, driven by the controller, drives the receiving substrate fixing part 5 to approach the original substrate fixing part 6 at a faster speed. After reaching a preset position (the receiving substrate fixing part 5 is as close as possible but does not touch the original substrate fixing part 6), the lifting mechanism 2 reduces the speed and observes the force value indicated by the pressure sensor 4 while rising; when the force value indicated by the pressure sensor 4 is close to 90% of the preset pressure value, the lifting mechanism 2 is driven in a jog manner until the force value indicated by the pressure sensor 4 reaches the preset pressure value, that is, the automatic bonding is completed. After reaching a preset position, the lifting mechanism 2 is also manually driven to move upward in a jog manner until the force value indicated by the pressure sensor 4 reaches the preset pressure value.

[0038] Then, the lifting mechanism 2 descends to a specified height H, replaces the receiving substrate and the original substrate respectively, sets the lifting stroke H of the lifting mechanism 2, and the lifting mechanism 2, driven by the controller, drives the receiving substrate to fit with the original substrate at a preset pressure value. Through the combined action of the laser vision module and the horizontal displacement stage, the width step length and the height step length (i.e., the width and length of the Micro-LED chip matrix) are set to allow the laser to trigger once at each matrix point, and then automatic laser printing can be achieved.

[0039] During the above initialization process, the receiving substrate and the original substrate may not be placed. After the receiving substrate fixing part and the original substrate fixing part reach the preset pressure value, the lifting stroke of the lifting mechanism 2 is calculated through known parameters (corresponding thickness of the receiving substrate, original substrate, chip, etc.).

[0040] The above description is only a specific embodiment of the present invention, but the technical features of the present invention are not limited thereto. Any changes or modifications made by any technician in the field of the present invention are included in the patent scope of the present invention.

Claims

1. A servo pressing device for Micro-LED laser transfer, characterized in that: It includes a mounting frame, and the mounting frame is arranged on a horizontal displacement platform; A fine-tuning component, the fine-tuning component is arranged at the bottom of the installation frame; A lifting mechanism, wherein the lifting mechanism is arranged on the fine-tuning component; A pressure sensor, wherein the pressure sensor is arranged at the upper end of the lifting mechanism; A receiving substrate fixing portion, wherein the receiving substrate fixing portion is arranged at an upper end of the pressure sensor; An original substrate fixing portion, the original substrate fixing portion is arranged at the upper end of the installation frame, and the original substrate fixing portion is located directly above the receiving base fixing portion; The pressure sensor is used to output the pressure value when the receiving substrate fixing part and the original substrate fixing part are in a state of abutting each other.

2. The servo pressing device according to claim 1, characterized in that: The fine-tuning assembly includes an X-direction fine-tuning platform, and the X-direction fine-tuning platform is arranged at the bottom end of the installation frame; A Y-direction fine-tuning platform, wherein the Y-direction fine-tuning platform is arranged on the X-direction fine-tuning platform, and the X-direction fine-tuning platform drives the Y-direction fine-tuning platform to slide horizontally along the X direction; the lifting mechanism is arranged on the Y-direction fine-tuning platform, and the Y-direction fine-tuning platform drives the lifting mechanism to slide horizontally along the Y direction; A rotary fine-tuning platform is provided at the upper end of the lifting mechanism, and the pressure sensor is provided at the upper end of the rotary fine-tuning platform.

3. The servo pressing device according to claim 1 or 2, characterized in that: The installation frame includes A bottom plate, the bottom plate is arranged on the horizontal displacement platform; A side frame, wherein the side frame is arranged at the upper end of the bottom plate, and an opening is arranged at one side of the side frame; A top plate, the top plate being arranged at the upper end of the side frame: A through hole is provided at a central position on the upper end of the top plate, and the original substrate fixing portion is provided at the upper end of the through hole.

4. The servo pressing device according to claim 3, characterized in that: The side frame includes three side panels which are respectively perpendicular to the bottom panel; two adjacent side panels are perpendicular to each other; and rectangular holes are provided through the side panels.

5. The servo pressing device according to claim 3, characterized in that: A through slot communicating with the through hole is arranged at one end of the top plate close to the opening; the width of the through slot is equal to the diameter of the through hole.

6. The servo pressing device according to claim 1 or 2, characterized in that: A controller is provided in the installation frame; a preset pressure value is pre-stored in the controller, and the preset pressure value is the bonding pressure value required for laser transfer of the receiving substrate and the original substrate; the controller is used to compare the pressure value output by the pressure sensor with the preset pressure value.

7. The servo pressing device according to claim 6, characterized in that: When the pressure value output by the pressure sensor is greater than or equal to 90% of the preset pressure value, the controller controls the lifting mechanism to move up and down in a jog drive manner.

8. The servo pressing device according to claim 1 or 2, characterized in that: The lifting mechanism comprises a base, a lifting platform longitudinally slidably connected to the upper end of the base, and a lifting motor arranged on the base; the lifting motor is drivingly connected to the lifting platform.

9. The servo pressing device according to claim 2, characterized in that: The X-axis fine-tuning stage and the Y-axis fine-tuning stage are two identical linear fine-tuning stages arranged perpendicular to each other; the linear fine-tuning stage includes a fixed part, a sliding part horizontally slidably connected to the fixed part, and a displacement fine-tuning knob rotatably connected to the fixed part and transmission-connected to the sliding part.

10. The servo pressing device according to claim 2, characterized in that: The rotary fine-tuning platform comprises a fixed disk, a rotating disk coaxially rotatably connected to the upper end of the fixed disk, and a rotary fine-tuning knob rotatably connected to the fixed disk and drivingly connected to the rotating disk.

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