Multi-wavelength color mixing LED packaging device

Abstract

The utility model relates to the technical field of semiconductor luminescence, and discloses a multi-wavelength color-mixed LED packaging device. The multi-wavelength color mixing LED packaging device comprises a support, an LED light-emitting chip and a light-transmitting glue layer. The LED light-emitting chip is arranged on the support. The number of the LED light-emitting chips is at least two. The light-transmitting glue layer is arranged on the support and covers the upper surfaces and the side faces of the LED light-emitting chips and the space among the LED light-emitting chips. Scattering particles are arranged in the light-transmitting glue layer, a reflecting surface is arranged on the side surface of the light-transmitting glue layer, and the reflecting surface is used for reflecting light emitted by the LED light-emitting chips for multiple times, so that the light is emitted after being staggered and mixed for multiple times. According to the utility model, the reflecting surface is arranged, a'reflecting channel 'is preset in the light-transmitting glue layer, and light emitted by the plurality of LED light-emitting chips is totally reflected for many times in the'reflecting channel', so that uniform light mixing of light rays is realized, and the problem that light with different colors is easy to disperse when passing through the secondary light distribution edge of the lens is solved; meanwhile, the device has the advantages of accurate light control and high light energy utilization rate.

Description

Technical Field

[0001] The utility model belongs to the technical field of semiconductor light emitting, and in particular relates to a multi-wavelength mixed-color LED packaging device. Background Art

[0002] Most existing LED light mixing devices are packaged with LED light emitting chips with different light emitting properties to meet different light mixing requirements. Figure 15-16 As shown, most white light LED mixing devices use a transparent adhesive layer 3 to encapsulate a red LED chip, a green LED chip and a blue LED chip (three LED chips 2) in a bracket 1. The red light emitted by the red LED chip, the green light emitted by the green LED chip and the blue light emitted by the blue LED chip are mixed into white light in the transparent adhesive layer 3. However, due to the limitation of the initial emission angle of the LED chip, the light emitted by the LED chip is not evenly mixed, and the edge is prone to dispersion after light distribution by the secondary lens 5, resulting in the edge of the existing LED mixing device being prone to light spots that are inconsistent with the center color.

[0003] Based on the above, the problem to be solved at present is: to provide a multi-wavelength color-mixing LED packaging device that is not prone to dispersion at the edge of the light spot, has uniform light mixing, has high light energy utilization and precise light control. Utility Model Content

[0004] The purpose of the utility model is to provide a multi-wavelength color mixing LED packaging device, aiming to solve the problems in the prior art of uneven light mixing, easy dispersion at the edge of the light spot, low light energy utilization and inaccurate light control of the multi-wavelength color mixing LED packaging device.

[0005] The utility model is implemented as follows: a multi-wavelength mixed color LED packaging device, comprising:

[0006] Bracket;

[0007] An LED light-emitting chip is arranged on the bracket, and the number of the LED light-emitting chips is at least 2;

[0008] A light-transmitting adhesive layer is arranged on the bracket and covers the upper surface and side surfaces of the LED light-emitting chip, as well as the space between a plurality of the LED light-emitting chips; scattering particles are arranged in the light-transmitting adhesive layer; a reflective surface is arranged on the side surface of the light-transmitting adhesive layer, and the reflective surface is used to reflect the light emitted by a plurality of LED light-emitting chips multiple times, so that the light is emitted after being interlaced and mixed multiple times.

[0009] Furthermore, the reflecting surface is configured as a concave arc surface, and the cross section enclosed by the reflecting surface is narrow in the middle and wide at both ends, or gradually narrows in the direction away from the bracket.

[0010] Furthermore, a high-reflective adhesive layer is provided around the light-transmitting adhesive layer, and the high-reflective adhesive layer is provided on the bracket and covers the reflective surface.

[0011] Furthermore, the upper surface of the light-transmitting adhesive layer is a curved surface or a flat surface.

[0012] Furthermore, a lens is provided on a side of the light-transmitting adhesive layer away from the bracket, and a cavity structure is provided between the lens and the light-transmitting adhesive layer; the lens is a Fresnel lens.

[0013] Furthermore, the lens includes a lower optical interface for inputting light and an upper optical interface for outputting light; the lower optical interface includes a first optical interface, a second optical interface and a third optical interface in sequence from the middle to the periphery.

[0014] The first optical interface is a plane or a curved surface; the second optical interface is set as an inclined curved surface or a plane for increasing the incident angle of light; the third optical interface is set as a plane or a curved surface for reflecting light and having an inclination direction opposite to that of the second optical interface.

[0015] Furthermore, on the cross-sectional plane passing through the optical axis in the direction from the lens to the bracket, the contour line of the first optical interface is a binary Nth power curve, and the contour line of the third optical interface is a binary Mth power curve, where N and M are integers greater than or equal to 3 respectively.

[0016] Furthermore, the connection between the second optical interface and the third optical interface is arranged outside the four sides of the reflective surface and is lower than the connection between the reflective surface and the upper surface of the light-transmitting adhesive layer.

[0017] The method for manufacturing a multi-wavelength color-mixing LED package device is as follows:

[0018] Step S1, fixing a plurality of light-emitting chips on a bracket;

[0019] Step S2, distributing the light-transmitting glue on the pressing surface of the mold, and filling the space between the plurality of light-emitting chips on the bracket with the light-transmitting glue;

[0020] Step S3, pressing the light-transmitting glue with a mold so that the light-transmitting glue covers the upper surface and side surfaces of all light-emitting chips, the space between the light-emitting chips, and part of the upper surface of the bracket; and controlling the amount of the light-transmitting glue and the pressing height of the mold so that the side surface of the light-transmitting glue forms a reflective structure for reflecting the light emitted by the LED light-emitting chip;

[0021] Step S4: After curing, the mold is removed, and the light-transmitting adhesive is cured on the light-emitting chip to form a light-transmitting adhesive layer, and the side of the light-transmitting adhesive layer has a reflective surface.

[0022] Furthermore, after step S4, step S5 is also included;

[0023] Step S5: Fill high-reflective adhesive around the light-transmitting adhesive layer on the bracket, and after curing, the reflective surface is tightly covered with the high-reflective adhesive layer.

[0024] Compared with the prior art, the multi-wavelength color-mixing LED packaging device provided by the utility model has the following beneficial effects:

[0025] 1. In the present invention, a plurality of scattering particles are arranged inside the light-transmitting adhesive layer 3, and a reflective surface 31 is arranged on the side of the light-transmitting adhesive layer 3, that is, a "reflection channel" is preset in the light-transmitting adhesive layer 3. The light emitted by the plurality of LED light-emitting chips 2 is totally reflected multiple times in the "reflection channel", which increases the optical path of the light and the probability of light scattering. Figure 6 , so that the light emitted by the LED light-emitting chip 2 can be fully mixed to achieve uniform light mixing, and further solve the problem that light of different colors is prone to dispersion at the edge after secondary light distribution through the lens 5.

[0026] 2. By setting the shape of the reflective surface 31, the reflection route of light is precisely controlled, so that the light emitted by multiple LED light-emitting chips 2 is evenly mixed after multiple total reflections according to the preset reflection route, with good light control effect and high light energy utilization rate. The reflective surface 31 coated with a high-reflective adhesive layer 4 is provided to ensure that the light reaching the reflective surface 31 is fully totally reflected, further improving the light energy utilization rate and light control accuracy.

[0027] 3. Compared with the prior art, the utility model reduces the volume of the light-transmitting adhesive layer 3, and the integrated multiple LED light-emitting chips 2 are arranged more concentratedly, thereby reducing the light mixing space, increasing the number of times that lights of different wavelengths intersect with each other in the light mixing space, and achieving a better light mixing effect.

[0028] 4. The lower optical interface 51 includes a first optical interface 511, a second optical interface 512 and a third optical interface 513 from the middle to the periphery. The second optical interface 512 and the third optical interface 513 are set as inclined surfaces with opposite inclined directions. The second optical interface 512 increases the incident angle of the light, and the light refracted by the second optical interface 512 is easy to be totally reflected when it is incident on the third optical interface 513. The reflected light propagates in the direction close to the optical axis, thereby having the advantages of uniform light mixing, high light energy utilization and good optical shaping effect.

[0029] 5. The manufacturing method of the utility model fills the light-transmitting glue between the light-emitting chips 2 before pressing and molding, so as to avoid bubbles during the pressing process, which will affect the molding quality of the light-transmitting glue layer 3, and the yield rate is high. The manufacturing method of the utility model can batch mold multi-wavelength mixed color LED packagers with a single mold, which is simple to operate and has high production efficiency. BRIEF DESCRIPTION OF THE DRAWINGS

[0030] Figure 1 This is a schematic cross-sectional structure diagram of a multi-wavelength color-mixing LED packaging device provided by the utility model;

[0031] Figure 2 This is a schematic cross-sectional structure diagram of a multi-wavelength color-mixing LED packaging device according to the first embodiment of the present invention;

[0032] Figure 3 This is a schematic cross-sectional structure diagram of a multi-wavelength color-mixing LED packaging device according to Embodiment 2 of the present invention;

[0033] Figure 4 This is a schematic cross-sectional structure diagram of a multi-wavelength color-mixing LED packaging device according to Embodiment 3 of the present invention;

[0034] Figure 5 This is a top view of the multi-wavelength color-mixing LED packaging device provided by the utility model;

[0035] Figure 6 This is a light path diagram of a multi-wavelength color-mixing LED package device provided by the utility model;

[0036] Figure 7 This is a schematic cross-sectional structure diagram of a multi-wavelength color-mixing LED packaging device according to a fourth embodiment of the present invention;

[0037] Figure 8 This is a schematic cross-sectional structure diagram of a multi-wavelength color-mixing LED packaging device according to a fifth embodiment of the present invention;

[0038] Fig. 9 This is a schematic cross-sectional structure diagram of a multi-wavelength color-mixing LED packaging device according to a sixth embodiment of the present invention;

[0039] Fig.10 It is a schematic diagram of the cross-sectional structure after the implementation of step S1 and step S2 provided by the utility model;

[0040] Fig.11 It is a top view of the bracket and LED light-emitting chip combination after the implementation of step S2 provided by the utility model;

[0041] Fig.12 It is a schematic diagram of the cross-sectional structure after the step S3 provided by the utility model is implemented;

[0042] Fig.13 It is a schematic diagram of the cross-sectional structure after the step S4 provided by the utility model is implemented;

[0043] Fig.14 It is a schematic diagram of the cross-sectional structure of a multi-wavelength color-mixing LED packaging device in the prior art;

[0044] Fig.15 It is a top view of a multi-wavelength color-mixing LED packaging device of the prior art;

[0045] Fig.16 It is a light path diagram of a multi-wavelength color-mixing LED package device in the prior art;

[0046] In the figure: 1- bracket; 2-LED light-emitting chip; 3-transparent adhesive layer; 31-reflective surface; 4-high reflective adhesive layer; 5-lens; 51-lower optical interface; 511-first optical interface; 512-second optical interface; 513-third optical interface; 52-upper optical interface; 6-cavity structure; 7-mold; 71-pressing part; 711-pressing surface; 72-supporting part. DETAILED DESCRIPTION

[0047] In order to make the purpose, technical solution and advantages of the utility model more clear, the utility model is further described in detail below in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described here are only used to explain the utility model and are not used to limit the utility model.

[0048] The implementation of the present utility model is described in detail below in conjunction with specific embodiments.

[0049] The same or similar numbers in the drawings of this embodiment correspond to the same or similar parts; in the description of the present utility model, it should be understood that if the terms "upper", "lower", "left", "right" and the like indicate directions or positional relationships based on the directions or positional relationships shown in the drawings, it is only for the convenience of describing the present utility model and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific direction, be constructed and operated in a specific direction. Therefore, the terms describing the positional relationship in the drawings are only used for illustrative purposes and cannot be understood as limitations on this patent. For ordinary technicians in this field, the specific meanings of the above terms can be understood according to specific circumstances.

[0050] Reference Figure 1-16 As shown, it is a preferred embodiment provided by the utility model.

[0051] The multi-wavelength color-mixing LED packaging device includes: a bracket 1, an LED light-emitting chip 2 and a light-transmitting adhesive layer 3, referring to Figure 1 The bracket 1 is a flat bracket, a bowl-shaped bracket, etc. The LED light-emitting chip 2 is arranged on the bracket 1, and the number of the LED light-emitting chips 2 is at least 2. The light-transmitting adhesive layer 3 is arranged on the bracket 1 and covers the upper surface and side surfaces of the plurality of LED light-emitting chips 2, as well as the space between the plurality of LED light-emitting chips 2, for improving the light effect and reducing the light mixing space.

[0052] The arrangement of the light-transmitting adhesive layer 3 and the light-emitting chip 2 of the utility model has the following beneficial effects: 1. The light-transmitting adhesive layer 3 only covers part of the upper surface of the bracket 1. Figure 1 Prior art light-transmitting adhesive layer 3 covers the entire upper surface of the bracket 1, refer to Figure 14-15 2. The arrangement of multiple light-emitting chips 2 is more compact than that of the prior art (see Figure 5 ),exist Figure 1 In the cross-sectional structural diagram of the multi-wavelength color-mixing LED package device, multiple light-emitting chips 2 overlap. The above arrangement of the utility model reduces the light mixing space, increases the number of times that lights of different wavelengths intersect each other in the space, and has a good light mixing effect.

[0053] Scattering particles with scattering effect are arranged in the light-transmitting adhesive layer 3. A reflective surface 31 is arranged on the side of the light-transmitting adhesive layer 3. The reflective surface 31 is used to perform multiple total reflections on the light emitted by the multiple LED light-emitting chips 2, increase the optical path, and increase the light scattering probability, so that the light is evenly mixed after multiple total reflections and then emitted; on the other hand, the large-angle light emitted to the surroundings is reflected upward after the action of the reflective surface 31, and is emitted from the upper surface of the light-transmitting adhesive layer 3, thereby improving the utilization rate of light energy and facilitating the adjustment of the divergence angle.

[0054] The first preferred solution of the reflective surface 31 is that the reflective surface 31 is an inwardly concave arc surface, and the cross section formed by the reflective surfaces 31 on both sides is set to be narrow in the middle and wide at both ends. Figure 1-3 Preferred solution 2, the reflecting surface 31 is a concave arc surface, and the cross section surrounded by the reflecting surfaces 31 on both sides gradually narrows in the direction away from the bracket 1, referring to Figure 4 The reflective surface 31 is not limited to the above two solutions, and any configuration that can realize multiple total reflection of light emitted by multiple LED light-emitting chips 2 so that the light is evenly emitted after multiple interlaced mixing is within the scope of the present invention.

[0055] Furthermore, a highly reflective adhesive layer 4 is provided on the bracket 1 and around the transparent adhesive layer 3, referring to Figure 2-4 The highly reflective adhesive layer 4 tightly covers the reflective surface 31, ensuring that the light incident on the reflective surface 31 is fully reflected. The light emitted by the multiple LED light-emitting chips 2 is reflected multiple times in the light-transmitting adhesive layer 3, increasing the number of times that light of different wavelengths intersects with each other in space, and achieving a good light mixing effect. The highly reflective adhesive layer 4 also plays a fixing role. There is no restriction on the filling method of the highly reflective adhesive layer 4. The highly reflective adhesive layer 4 can cover part or all of the upper surface of the bracket 1, and can also extend to the inner side of the bracket 1. The upper surface of the highly reflective adhesive layer 4 can be set to a plane (refer to Figure 2 , Figure 4 ), or it can be set to a concave surface (see Figure 3 ) etc. The upper surface of the light-transmitting adhesive layer 3 is set as a curved surface (refer to Figure 1 ) or plane (reference Figure 2-4The utility model adds a high-reflection adhesive layer 4 to ensure that the light reaching the reflective surface 31 is fully reflected, so as to improve the light energy utilization and light control accuracy.

[0056] A lens 5 for optical shaping can also be provided on the side of the light-transmitting adhesive layer 3 away from the bracket 1, see 7. The upper surface of the lens 5 can be set as a plane or a curved surface as required. The lens 5 and the light-transmitting adhesive layer 3 can be set to be tightly connected or a cavity structure 6 (i.e., there is a gas layer) can be provided between the two. The light emitted by the multiple LED light-emitting chips 2 is evenly mixed after the light-transmitting adhesive layer 3 acts on the light-transmitting adhesive layer 3, so the light entering the lens 5 is not easy to be dispersed, and the light output is uniform, see Figure 6 The refractive index of lens 5 is preferably greater than or equal to 1.41. Lens 5 can be configured as a Fresnel lens, see Figure 7 .

[0057] Reference Figure 7-8 The lens 5 includes a lower optical interface 51 for inputting light and an upper optical interface 52 for outputting light. The upper optical interface 52 can be set as a plane or a slightly curved surface, and the middle part of the lower optical interface 51 is set as a plane or a curved surface, and at least one annular convex surface is arranged around it, and the cross section of the annular convex surface is in a sawtooth shape. When the lower optical interface 51 is provided with two or more annular convex surfaces, the multiple annular convex surfaces are preferably arranged concentrically.

[0058] Optimization plan: refer to Fig. 9 , the lower optical interface 51 includes a first optical interface 511, a second optical interface 512 and a third optical interface 513 from the middle to the surrounding. The first optical interface 511, the second optical interface 512 and the third optical interface 513 are connected in sequence. The first optical interface 511 is set as a plane or a curved surface, preferably a convex curved surface. The second optical interface 512 is set as an inclined curved surface or a plane for increasing the incident angle of light. The second optical interface 512 can be set as an inclined curved surface or a plane that gradually moves away from the optical axis from the first optical interface 511 to the bracket 1. The third optical interface 513 is set as a plane or a curved surface for reflecting light and in an opposite direction to the inclination of the second optical interface 512. The third optical interface 513 can be set as an inclined curved surface or a plane that gradually approaches the optical axis from the first optical interface 511 to the bracket 1. The second optical interface 512 increases the incident angle of the light, and the light is easily totally reflected when it reaches the third optical interface 513 after being refracted by the second optical interface 512, so that the light propagates toward the direction close to the optical axis, making the light mixing uniform, improving the light energy utilization rate and facilitating optical shaping.

[0059] Furthermore, the connection between the second optical interface 512 and the third optical interface 513 is arranged outside the four sides of the reflective surface 31 and is lower than the connection between the reflective surface 31 and the upper surface of the light-transmitting adhesive layer 3, that is, the lowest point of the second optical interface 512 is closer to the bracket 1 than the lowest point of the upper surface of the light-transmitting adhesive layer 3. The combination of the first optical interface 511 and the second optical interface 512 covers the upper surface of the light-transmitting adhesive layer 3, and a cavity structure 6 is arranged between the first optical interface 511, the second optical interface 512 and the light-transmitting adhesive layer 3. This arrangement can improve the utilization rate of light energy, make the light mixing more uniform, achieve good light shaping effect, and realize precise light control.

[0060] Furthermore, a section is formed by cutting from the lens 5 to the bracket 1 through the optical axis (or the center of the lens 5), and the contour line of the first optical interface 511 on the section surface is a binary N-th power curve, and the contour line of the third optical interface 513 on the section surface is a binary M-th power curve, where N and M are integers greater than or equal to 3. This setting allows light of different colors to be mixed evenly and accurately reach a preset divergence angle, for example, the divergence angle range after mixing is: 20° to 90°.

[0061] Reference Fig. 9 The lens 5 also includes a receiving portion 53, and the receiving portion 53 is connected to the edges of the upper optical interface 52 and the lower optical interface 51. The bottom of the receiving portion 53 is connected to the bracket 1. The inner side surface and the outer side surface of the receiving portion 53 are set as inclined surfaces, and the inner side surface and the outer side surface of the receiving portion 53 gradually move away from the optical axis (or the center of the lens 5) in the direction from the upper optical interface 52 to the lower optical interface 51. This structure is easy to pull out the mold during production. The bottom of the receiving portion 53 is set as a plane. The setting of this structure is conducive to forming a plurality of multi-wavelength color-mixing LED packagers through array splicing, and then forming a single multi-wavelength color-mixing LED package with the sides of the bracket 1 and the lens 5 in the same plane through cutting.

[0062] Example 1: Reference Figure 2 The multi-wavelength color-mixing LED package device includes a bracket 1, an LED light-emitting chip 2 and a light-transmitting adhesive layer 3. The bracket 1 is a bowl-shaped bracket. The LED light-emitting chip 2 is arranged on the bracket 1, and the number of the LED light-emitting chips 2 is 3. The 3 LED light-emitting chips 2 are arranged in a triangle (refer to Figure 5 ) and on the cutaway diagram (refer to Figure 2), three LED light-emitting chips 2 overlap, that is, the overall arrangement is relatively compact. The light-transmitting adhesive layer 3 is arranged on the bracket 1 and covers all the LED light-emitting chips 2, as well as the space between the three aLED light-emitting chips 2. Scattering particles are arranged in the light-transmitting adhesive layer 3. The upper surface of the light-transmitting adhesive layer 3 is set as a plane. A reflecting surface 31 is arranged on the side of the light-transmitting adhesive layer 3. The reflecting surface 31 is a concave arc surface, and the cross-section surrounded by the reflecting surfaces 31 on both sides is set to be narrow in the middle and wide at both ends. A high-reflective adhesive layer 4 is arranged on the bracket 1 and around the light-transmitting adhesive layer 3. The high-reflective adhesive layer 4 tightly covers the reflecting surface 31. The high-reflective adhesive layer 4 covers the entire upper surface of the bracket 1 and extends to the inner side of the bracket 1. The upper surface of the high-reflective adhesive layer 4 is set to be a plane.

[0063] Example 2: Reference Figure 3 The main difference from the first embodiment is that the upper surface of the high-reflective adhesive layer 4 is a concave curved surface. The other configurations are the same as the first embodiment.

[0064] Example 3: Reference Figure 4 The main difference from the first embodiment is that the reflective surface 31 is a concave arc surface, and the cross section surrounded by the reflective surfaces 31 on both sides gradually narrows in the direction away from the bracket 1. Other settings are the same as the first embodiment.

[0065] Example 4: Reference Figure 7 The multi-wavelength color-mixing LED packaging device includes a bracket 1, an LED light-emitting chip 2 and a light-transmitting adhesive layer 3. The bracket 1 is a bowl-shaped bracket. The LED light-emitting chip 2 is arranged on the bracket 1, and the number of the LED light-emitting chips 2 is 3. The light-transmitting adhesive layer 3 is arranged on the bracket 1 and covers all the LED light-emitting chips 2, as well as 3 LED light-emitting chips 2. Scattering particles are arranged in the light-transmitting adhesive layer 3. The upper surface of the light-transmitting adhesive layer 3 is set as a micro-arc surface. A reflecting surface 31 is arranged on the side of the light-transmitting adhesive layer 3. The reflecting surface 31 is a concave arc surface, and the cross-section surrounded by the reflecting surfaces 31 on both sides is set to be narrow in the middle and wide at both ends. The light-transmitting adhesive layer 3 covers part of the upper surface of the bracket 1, and there is a cavity around the inner side of the bracket 1 and the light-transmitting adhesive layer 3.

[0066] A lens 5 is also provided on the side of the light-transmitting adhesive layer 3 away from the bracket 1. The lens 5 is a Fresnel lens. A cavity structure 6 is provided between the lens 5 and the light-transmitting adhesive layer 3. The lens 5 includes a lower optical interface 51 for inputting light and an upper optical interface 52 for outputting light. The upper optical interface 52 can be set as a plane, the middle part of the lower optical interface 51 is set as a curved surface, and the surrounding parts are set as a plurality of concentric annular convex surfaces, and the cross section of the annular convex surface is in a sawtooth shape.

[0067] Example 5: Reference Figure 8, the main differences from the fourth embodiment are as follows: 1. The upper surface of the light-transmitting adhesive layer 3 is set as a plane. A high-reflective adhesive layer 4 is set on the bracket 1 and around the light-transmitting adhesive layer 3. The high-reflective adhesive layer 4 tightly covers the reflective surface 31. The high-reflective adhesive layer 4 covers the entire upper surface of the bracket 1 and extends to the inner side of the bracket 1. The upper surface of the high-reflective adhesive layer 4 is set as a concave curved surface. Other settings are the same as those of the fourth embodiment.

[0068] Example 6: Reference Fig. 9 , the main differences from the fifth embodiment are as follows:

[0069] 1. The upper surface of the light-transmitting adhesive layer 3 is set to be a slightly curved surface.

[0070] 2. The lower optical interface 51 includes a first optical interface 511, a second optical interface 512 and a third optical interface 513 from the middle to the surrounding. The first optical interface 511, the second optical interface 512 and the third optical interface 513 are connected in sequence. The first optical interface 511 is set as a convex curved surface. The second optical interface 512 is set as an inclined plane for increasing the incident angle of light. The third optical interface 513 is set as an inclined curved surface for reflecting light. The inclination direction of the third optical interface 513 is opposite to the inclination direction of the second optical interface 512.

[0071] The connection between the second optical interface 512 and the third optical interface 513 is arranged outside the four sides of the reflective surface 31 and is lower than the connection between the reflective surface 31 and the upper surface of the light-transmitting adhesive layer 3. The combination of the first optical interface 511 and the second optical interface 512 covers the upper surface of the light-transmitting adhesive layer 3, and a cavity structure 6 is arranged between the first optical interface 511, the second optical interface 512 and the light-transmitting adhesive layer 3. Other configurations are the same as those in the fifth embodiment.

[0072] The manufacturing method of the multi-wavelength color-mixing LED package device of the utility model is as follows:

[0073] Step S1: fix a plurality of light emitting chips 2 on the bracket 1. The plurality of light emitting chips 2 are arranged relatively compactly. Fig.10 .

[0074] Step S2: distribute the light-transmitting glue on the pressing surface 711 of the mold 7, and fill the space between the plurality of light-emitting chips 2 on the bracket 1 with the light-transmitting glue. Fig.11 Filling the spaces between the light-emitting chips 2 with light-transmitting adhesive in advance can prevent bubbles from being generated between the light-emitting chips 2 during the pressing process, thereby affecting the molding quality of the light-transmitting adhesive layer 3 .

[0075] The pressing surface 711 can be set to a flat surface or a curved surface, see Fig.10 The mold 7 includes a support portion 72 and a pressing portion 71 fixed to one side of the support portion 72. The pressing portion 71 is provided with a pressing surface 711 on a side away from the support portion 72.

[0076] The side of the support portion 72 close to the pressing portion 71 is preferably a plane, and a plurality of pressing portions 71 may be arrayed on the plane of the support portion 72 for batch molding of multi-wavelength mixed-color LED packaging devices at the same time.

[0077] Step S3, reference Fig.12 The mold 7 is used to press the light-transmitting adhesive so that the light-transmitting adhesive covers the upper surface and side surfaces of all the light-emitting chips 2, the space between several light-emitting chips 2, and part of the upper surface of the light-transmitting adhesive layer bracket 1. The amount of light-transmitting adhesive and the pressing height of the mold 7 are controlled so that the side surface of the light-transmitting adhesive forms a reflective structure for reflecting the edge large-angle light emitted by the light-emitting chip 2.

[0078] During the pressing process, the planes of the supporting parts 72 around the pressing part 71 are against the upper surfaces around the bracket 1, and the supporting parts 72 play a role in supporting and controlling stability. The pressing part 71 extends into the cavity structure 6 to press the light-transmitting glue onto the LED light-emitting chip 2. By utilizing the thixotropy of the light-transmitting glue in contact with the LED light-emitting chip 2, a structure with a concave middle part and large upper and lower dimensions is formed on the side of the light-transmitting glue. This structure can reflect the large-angle edge light emitted by the LED light-emitting chip 2. During the pressing and molding process, the heights from the upper surfaces around the bracket 1, the pressing surface 711, and the upper surface of the LED light-emitting chip 2 to the bottom surface of the bracket 1 are D, L, and S, respectively, and preferably D>L>S.

[0079] Step S4: After curing, the mold 7 is removed, and the light-transmitting adhesive is cured on the light-emitting chip 2 to form a light-transmitting adhesive layer 3. Fig.13 The side of the light-transmitting adhesive layer 3 has a reflective surface 31. The light emitted by the multiple LED light-emitting chips 2 is incident on the reflective surface 31 and is reflected multiple times in the light-transmitting adhesive layer 3, which increases the number of times that lights of different wavelengths intersect each other in space, and has a good light mixing effect.

[0080] Furthermore, step S5 is included after step S4.

[0081] Step 5: Fill the bracket 1 with highly reflective glue around the transparent glue layer 3. After curing, the reflective surface 31 is tightly covered with the highly reflective glue layer 4. The highly reflective glue can be filled naturally or mechanically by vibration after dispensing, or by molding.

[0082] After step S4 or step S5, there may be a step of gluing lens 5, a step of cutting a plurality of batch-formed multi-wavelength color-mixing LED packagers, etc. The manufacturing method of the utility model can batch-form multi-wavelength color-mixing LED packagers with a single mold, and has simple operation, high production efficiency and high yield.

[0083] This does not limit the present invention. Any modifications, equivalent substitutions and improvements made within the spirit and principles of the present invention should be included in the protection scope of the present invention.

Claims

1. A multi-wavelength color-mixing LED package device, characterized in that: include: Bracket (1); LED light-emitting chips (2), which are arranged on the bracket (1), and the number of the LED light-emitting chips (2) is at least 2; A light-transmitting adhesive layer (3) is arranged on the support (1) and covers the upper surface and side surfaces of the LED light-emitting chips (2), as well as the space between a plurality of the LED light-emitting chips (2); scattering particles are arranged in the light-transmitting adhesive layer (3); a reflective surface (31) is arranged on the side surface of the light-transmitting adhesive layer (3), and the reflective surface (31) is used to reflect light emitted by a plurality of LED light-emitting chips (2) multiple times, so that the light is mixed multiple times and then emitted.

2. The multi-wavelength color-mixing LED package device according to claim 1, characterized in that: The reflecting surface (31) is configured as an inwardly concave arc surface, and the cross section enclosed by the reflecting surface (31) is narrow in the middle and wide at both ends, or gradually narrows in a direction away from the bracket (1).

3. The multi-wavelength color-mixing LED package device according to claim 1, characterized in that: A high-reflective adhesive layer (4) is provided around the light-transmitting adhesive layer (3); the high-reflective adhesive layer (4) is provided on the bracket (1) and covers the reflective surface (31).

4. The multi-wavelength color-mixing LED package device according to claim 1, characterized in that: The upper surface of the light-transmitting adhesive layer (3) is a curved surface or a flat surface.

5. The multi-wavelength color-mixing LED package device according to claim 1, characterized in that: A lens (5) is also provided on the side of the light-transmitting adhesive layer (3) away from the bracket (1), and a cavity structure (6) is provided between the lens (5) and the light-transmitting adhesive layer (3); the lens (5) is a Fresnel lens.

6. The multi-wavelength color-mixing LED package device according to claim 5, characterized in that: The lens (5) comprises a lower optical interface (51) for inputting light and an upper optical interface (52) for outputting light; the lower optical interface (51) comprises, in order from the middle to the periphery, a first optical interface (511), a second optical interface (512) and a third optical interface (513); The first optical interface (511) is a plane or a curved surface; the second optical interface (512) is set as an inclined curved surface or a plane for increasing the incident angle of light; and the third optical interface (513) is set as a plane or a curved surface for reflecting light and having an inclination direction opposite to that of the second optical interface (512).

7. The multi-wavelength color-mixing LED package device according to claim 6, characterized in that: On a section plane passing through the optical axis in a direction from the lens (5) to the bracket (1), the contour line of the first optical interface (511) is a binary Nth-order curve, and the contour line of the third optical interface (513) is a binary Mth-order curve, where N and M are integers greater than or equal to 3, respectively.

8. The multi-wavelength color-mixing LED package device according to claim 6, characterized in that: The connection between the second optical interface (512) and the third optical interface (513) is arranged outside the four sides of the reflective surface (31) and is lower than the connection between the reflective surface (31) and the upper surface of the light-transmitting adhesive layer (3).

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