Chip production cleaning device

Abstract

The utility model discloses a chip production cleaning device which comprises a cleaning bin, a bin door is installed on the front side of the cleaning bin, an observation window is installed on the bin door, supporting plates are fixedly connected to the inner walls of the two sides of the cleaning bin respectively, a cleaning table is placed on the tops of the supporting plates, a recycling cavity is formed in the cleaning table, and the recycling cavity is communicated with the cleaning bin. The bottom of the cleaning table is provided with a recycling opening, guide blocks are arranged on the two sides of the recycling opening, a plurality of recycling holes are formed in the top of the cleaning table, a pair of positioning assemblies is arranged over each recycling hole, a cleaning mechanism is arranged on the cleaning bin, and a recycling groove is formed in the bottom of an inner cavity of the cleaning bin. The surface of the chip can be purged through high-pressure gas, direct contact with the chip is not needed, the integrity of the surface of the chip is ensured, the cleaning efficiency is high, batch cleaning can be achieved, particulate matter can be recycled in a unified mode, and scattering and splashing of the particulate matter are effectively avoided.

Description

Technical Field

[0001] The utility model belongs to the technical field of chip cleaning, in particular to a chip production cleaning device. Background Art

[0002] During the chip manufacturing process, the surface of the silicon wafer may be contaminated by organic matter, inorganic matter, metal ions, particulate matter, etc. If these pollutants are not removed in time, they will affect the electrical performance and integration of the chip, and even cause device failure. Therefore, the chip needs to be cleaned in time.

[0003] At present, there are some chip cleaning devices on the market. For example, a chip surface cleaning device disclosed on the Chinese Patent Network has a publication number of CN212018794U. This cleaning device cleans the chip simultaneously through the first electrostatic roller and the second electrostatic roller, which is very good at cleaning the surface of the chip, improves the efficiency of chip production, and greatly meets people's practical needs. However, there are some defects and deficiencies that need to be improved: (1) Some existing cleaning devices mainly use mechanical or chemical cleaning methods, which require direct contact with the chip during cleaning, which can easily cause mechanical or chemical damage to the surface of the chip, especially for tiny and precise structures, which destroys the integrity of the chip surface; (2) Due to structural design reasons, some existing cleaning devices can often only clean a single chip, and it is difficult to clean multiple chips in batches at the same time, and the cleaning efficiency is low; (3) When some existing cleaning devices clean the chip, the silicon, photoresist and other particles remaining on the chip surface are easy to scatter and splash, which is difficult to uniformly recover, which not only affects the surrounding working environment, but also easily endangers the safety of related staff. Therefore, in view of the above problems, a chip production cleaning device provided by the utility model is of great significance. Utility Model Content

[0004] The utility model provides a chip production cleaning device, which can use the air pressure generated by high-pressure gas to blow the surface of the chip through a cleaning mechanism to remove particles and slight pollutants on the chip surface, thereby achieving a cleaning effect. The entire cleaning process does not require direct contact with the chip, thereby effectively avoiding mechanical or chemical damage to the chip surface and ensuring the integrity of the chip surface; multiple air blowing pipes in the cleaning mechanism can simultaneously perform batch cleaning on multiple chips, thereby greatly improving the efficiency of the entire chip cleaning work; silicon, photoresist and other particles remaining on the chip surface can be uniformly recovered through a recovery groove, and scattered particles can be blocked by a baffle so that the particles are left on the surface of the cleaning table, thereby facilitating subsequent unified recovery, and the chip cleaning work can be performed in a closed environment by closing the warehouse door, thereby effectively avoiding splashing of particles during chip cleaning and causing harm to the safety of workers, and in summary, the problems in the background technology are solved.

[0005] In order to solve the above technical problems, the utility model is realized by the following technical solutions:

[0006] The utility model discloses a chip production cleaning device, comprising a cleaning chamber, a plurality of feet are fixedly connected to the bottom of the cleaning chamber, a chamber door is installed on the front side of the cleaning chamber, an observation window is installed on the chamber door, both inner walls of the cleaning chamber are fixedly connected to supporting plates, a cleaning table is placed on the top of the supporting plates, a recovery cavity is opened inside the cleaning table, a recovery port is opened at the bottom of the cleaning chamber, the recovery port is connected with the recovery cavity, guide blocks are arranged on both sides of the cleaning table, the guide blocks are fixedly connected to the inner walls of the recovery cavity on both sides, a plurality of recovery holes are opened on the top of the cleaning table, the recovery holes are connected with the recovery cavity and are distributed in a linear array, and a pair of positioning components are arranged directly above each of the recovery holes, a pipe hole is opened on the top of the cleaning chamber, and a cleaning mechanism is arranged on the cleaning chamber, a recovery groove is placed at the bottom of the inner cavity of the cleaning chamber, and the recovery groove is located directly below the cleaning table;

[0007] The positioning assembly includes a pair of positioning blocks, the front faces of which are C-shaped and are symmetrically distributed on both sides of the corresponding recovery holes, and the outer wall of each positioning block is fixedly connected to a bracket, and the bottom of the bracket is fixedly connected to the cleaning table;

[0008] The cleaning mechanism includes an electric telescopic rod and a high-pressure air pump, both of which are installed on the top of the cleaning bin, the bottom end of the output end of the electric telescopic rod passes through the top of the cleaning bin and is fixedly connected to the air storage bin, the interior of the air storage bin is a hollow structure, an air inlet is opened on the top, and a plurality of air blowing pipes are installed at the bottom of the air storage bin, the air blowing pipes are connected to the inner cavity of the air storage bin, an air guide pipe is installed on the high-pressure air pump, and the end of the air guide pipe passes through the pipe hole and is connected to the air inlet on the top of the air storage bin.

[0009] Furthermore, the number of the air blowing pipes is the same as the recovery holes, and the center of each air blowing pipe corresponds to the center of each recovery hole one by one.

[0010] Furthermore, a layer of anti-skid pad is provided on the inner wall surface of each positioning block, and the surface of the anti-skid pad is engraved with herringbone anti-skid patterns.

[0011] Furthermore, a baffle is fixedly connected to the top of the cleaning table. The baffle is a rectangular frame structure and is located at the edge of the cleaning table.

[0012] Furthermore, a plurality of positioning holes are opened on the surface of the support plate, and a plurality of positioning rods are fixedly connected to both sides of the bottom of the cleaning table. The number of the positioning rods is the same as that of the positioning holes, the diameters are equal, and the center of each positioning rod corresponds one-to-one to the center of each positioning hole.

[0013] Furthermore, a support block is fixedly connected to the bottom of the support plate, and the support block is a triangular block structure, one side of which is fixedly connected to the inner wall of the cleaning chamber.

[0014] Furthermore, blocks are fixedly connected to both sides of the bottom of the recovery groove, and a pair of slots are opened at the bottom of the inner cavity of the cleaning chamber. The slots and blocks are both rectangular, with correspondingly equal widths, and the center of each slot corresponds one-to-one to the center of each block.

[0015] Compared with the prior art, the utility model has the following beneficial effects:

[0016] (1) When a chip production cleaning device in the utility model is used, the cleaning mechanism can use the air pressure generated by the high-pressure gas to purge the surface of the chip to remove particles and slight pollutants on the surface of the chip, thereby achieving a cleaning effect. The entire cleaning process does not require direct contact with the chip, thereby effectively avoiding mechanical or chemical damage to the surface of the chip and ensuring the integrity of the chip surface;

[0017] (2) When a chip production cleaning device in the utility model is used, multiple chips can be cleaned in batches at the same time through multiple air blowing pipes in the cleaning mechanism, thereby greatly improving the efficiency of the entire chip cleaning work;

[0018] (3) When a chip production cleaning device in the utility model is in use, the silicon, photoresist and other particles remaining on the chip surface can be uniformly recovered through the recovery groove, and the scattered particles can be blocked by the baffle plate so as to leave the particles on the surface of the cleaning table, thereby facilitating subsequent unified recovery. In addition, the chip cleaning work can be carried out in a closed environment by closing the door, thereby effectively avoiding the splashing of particles during the chip cleaning process and causing harm to the safety of the staff.

[0019] Of course, any product implementing the present invention does not necessarily need to achieve all of the advantages described above at the same time. BRIEF DESCRIPTION OF THE DRAWINGS

[0020] In order to more clearly illustrate the technical solutions of the embodiments of the utility model, the drawings required for describing the embodiments are briefly introduced below. Obviously, the drawings described below are only some embodiments of the utility model. For ordinary technicians in this field, other drawings can be obtained based on these drawings without creative work.

[0021] Figure 1 This is a schematic diagram of the structure of a chip production cleaning device of the utility model;

[0022] Figure 2This is a schematic diagram of the structure of the cleaning bin in the utility model;

[0023] Figure 3 It is a structural schematic diagram of the cleaning table in the utility model;

[0024] Figure 4 It is a front cross-sectional view of the cleaning table in the utility model;

[0025] Figure 5 It is a structural schematic diagram of the positioning component in the utility model;

[0026] Figure 6 It is a structural schematic diagram of the cleaning mechanism in the utility model;

[0027] Figure 7 It is a structural schematic diagram of the recovery tank in the utility model.

[0028] In the accompanying drawings, the components represented by the reference numerals are listed as follows:

[0029] 1. Cleaning chamber; 2. Foot pad; 3. Chamber door; 4. Observation window; 5. Support plate; 6. Cleaning table; 7. Recovery chamber; 8. Recovery port; 9. Guide block; 10. Recovery hole; 11. Pipe hole; 12. Recovery slot; 13. Positioning block; 14. Bracket; 15. Electric telescopic rod; 16. High-pressure air pump; 17. Air storage chamber; 18. Air inlet; 19. Air blowing pipe; 20. Air guide pipe; 21. Anti-slip mat; 22. Baffle; 23. Positioning hole; 24. Positioning rod; 25. Support block; 26. Card block; 27. Card slot. DETAILED DESCRIPTION

[0030] The following will be combined with the drawings in the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments of the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.

[0031] In the description of the present invention, it should be understood that terms such as "relative", "one end", "inside", "lateral", "end", "two ends", "both sides", "front", "one end face", "the other end face" and the like indicating orientation or positional relationship are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the components or elements referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as limiting the present invention.

[0032] See also Figure 1-7As shown, a chip production cleaning device of the utility model comprises a cleaning chamber 1, a plurality of feet 2 are fixedly connected to the bottom of the cleaning chamber 1, a chamber door 3 is installed on the front side thereof, and the chip cleaning work can be carried out in a closed environment by closing the chamber door 3, thereby effectively avoiding the splashing of particles in the chip cleaning process and causing harm to the safety of the staff, an observation window 4 is installed on the chamber door 3, the observation window 4 is made of transparent glass material, and when the chamber door 3 is closed, the situation in the cleaning chamber 1 can be observed in real time through the observation window 4, the inner walls on both sides of the cleaning chamber 1 are fixedly connected with support plates 5, a cleaning table 6 is placed on the top of the support plates 5, a recovery chamber 7 is provided inside the cleaning table 6, a recovery port 8 is provided at the bottom thereof, the recovery port 8 is connected to the recovery chamber 7, and guide blocks 9 are provided on both sides thereof, and the guide The block 9 is fixedly connected to the inner walls on both sides of the recovery chamber 7. A plurality of recovery holes 10 are provided on the top of the cleaning table 6. The recovery holes 10 are connected to the recovery chamber 7 and are distributed in a linear array. A pair of positioning components are provided directly above each recovery hole 10. A pipe hole 11 is provided on the top of the cleaning chamber 1, and a cleaning mechanism is provided on the cleaning chamber 1. A recovery groove 12 is placed at the bottom of the inner cavity of the cleaning chamber 1. The recovery groove 12 is located directly below the cleaning table 6. When cleaning the chip, silicon, photoresist and other particles remaining on the surface of the chip can enter the recovery chamber 7 through each recovery hole 10, and fall into the recovery groove 12 along the guide block 9 and the recovery port 8, so that the particles can be uniformly recovered through the recovery groove 12, effectively avoiding the particles from scattering and affecting the surrounding working environment;

[0033] The positioning assembly includes a pair of positioning blocks 13, the front of the positioning blocks 13 is C-shaped, and are symmetrically distributed on both sides of the corresponding recovery holes 10, and the outer wall of each positioning block 13 is fixedly connected to a bracket 14, and the bottom of the bracket 14 is fixedly connected to the cleaning table 6. When the chip needs to be cleaned, the two sides of the chip can be inserted into the positioning blocks 13 respectively. At this time, the chip can be positioned by the positioning blocks 13 to prevent it from shifting during the cleaning process and affecting the cleaning effect;

[0034] The cleaning mechanism includes an electric telescopic rod 15 and a high-pressure air pump 16, both of which are installed on the top of the cleaning chamber 1. The bottom end of the output end of the electric telescopic rod 15 passes through the top of the cleaning chamber 1 and is fixedly connected to an air storage chamber 17. The interior of the air storage chamber 17 is a hollow structure, and an air inlet 18 is opened on the top. A plurality of air blowing pipes 19 are installed at the bottom of the air storage chamber 17, and the air blowing pipes 19 are connected to the inner cavity of the air storage chamber 17. An air guide pipe 20 is installed on the high-pressure air pump 16, and the end of the air guide pipe 20 passes through the pipe hole 11 and is connected to the air inlet 18 on the top of the air storage chamber 17. The air guide pipe 20 is made of plastic. The hose material is elastic and can be bent and stretched. The high-pressure air pump 16 is connected to an inert gas such as nitrogen. The inert gas can be pressurized by the high-pressure air pump 16 and introduced into the gas storage bin 17 through the air guide pipe 20. After the high-pressure gas enters the gas storage bin 17, it can be blown out through each blowing pipe 19. At this time, the air pressure generated by the high-pressure gas can be used to blow the surface of the chip to remove particles and slight pollutants on the surface of the chip, thereby achieving a cleaning effect. The entire cleaning process does not require direct contact with the chip, thereby effectively avoiding mechanical or chemical damage to the surface of the chip and ensuring the integrity of the chip surface.

[0035] Among them, the number of blowing pipes 19 is the same as the recovery holes 10, and the center of each blowing pipe 19 corresponds to the center of each recovery hole 10 one by one. By driving the electric telescopic rod 15, the air storage bin 17 can be driven to move downward together with each blowing pipe 19 until each blowing pipe 19 moves to the top of each chip. At this time, multiple chips can be batch cleaned at the same time through multiple blowing pipes 19, thereby greatly improving the efficiency of the entire chip cleaning work.

[0036] Among them, the inner wall surface of each positioning block 13 is provided with a layer of anti-skid pad 21, and the surface of the anti-skid pad 21 is engraved with a herringbone anti-skid pattern. The anti-skid pad 21 is made of elastic material such as rubber and can be fixed by glue or other means. When the two sides of the chip are inserted into the positioning block 13, the anti-skid pad 21 can play a certain anti-wear protection role to avoid direct contact between the surface of the chip and the positioning block 13 and wear. At the same time, the anti-skid pattern on the surface of the anti-skid pad 21 can increase the friction between the chip and the positioning block 13 to play an anti-skid role, thereby further improving the stability of chip positioning.

[0037] Among them, a baffle 22 is fixedly connected to the top of the cleaning table 6. The baffle 22 is a rectangular frame structure and is located at the edge of the cleaning table 6. When the chip is cleaned, the baffle 22 can block the scattered particles so that the particles are left on the surface of the cleaning table 6, thereby facilitating subsequent unified recovery.

[0038] Among them, a plurality of positioning holes 23 are opened on the surface of the support plate 5, and a plurality of positioning rods 24 are fixedly connected to both sides of the bottom of the cleaning table 6. The number of the positioning rods 24 and the positioning holes 23 are the same, the diameters are equal, and the center of each positioning rod 24 corresponds to the center of each positioning hole 23. When the cleaning table 6 is placed on the support plate 5, each positioning rod 24 can be aligned with and pass through the corresponding positioning hole 23. At this time, the mutual cooperation between the positioning rods 24 and the positioning holes 23 can play a positioning role, so as to fix the position of the cleaning table 6, thereby avoiding displacement of the cleaning table 6 during the cleaning process.

[0039] Among them, the bottom of the support plate 5 is fixedly connected with a support block 25, and the support block 25 is a triangular block structure, one side of which is fixedly connected to the inner wall of the cleaning chamber 1. The support block 25 can support and reinforce the support plate 5 to improve the structural firmness of the support plate 5, thereby avoiding deformation of the support plate 5 due to force.

[0040] Among them, blocks 26 are fixedly connected to both sides of the bottom of the recovery groove 12, and a pair of slots 27 are opened at the bottom of the inner cavity of the cleaning chamber 1. The slots 27 and the blocks 26 are both rectangular, and their widths are correspondingly equal. The center of each slot 27 corresponds to the center of each block 26. When the recovery groove 12 is placed in the cleaning chamber 1, each block 26 can be aligned and fit in the corresponding slot 27. At this time, the position of the recovery groove 12 can be fixed by the mutual cooperation between the block 26 and the slot 27 to prevent the recovery groove 12 from being displaced and affecting the recovery of particulate matter.

[0041] The circuits, electronic components and chip modules involved in the utility model are all existing technologies and can be fully implemented by those skilled in the art. Needless to say, the content protected by the utility model does not involve improvements to software and methods.

[0042] The standard parts used in the application documents can all be purchased from the market. All the components in this application document can be customized according to the description in the specification and drawings. The specific connection methods of each part adopt mature conventional means such as bolts, rivets, welding, etc. in the prior art. Machinery, parts and equipment all adopt conventional models in the prior art. The electrical components appearing in this article are all electrically connected to the external main controller and 220V AC power, and the main controller can be a conventional known device that controls the LED lamp body, etc.

[0043] The working principle of the utility model is:

[0044] When the utility model is in use, firstly, the electrical components in the cleaning device are connected to the external control switch and power supply through wires, and then the chips to be cleaned are respectively inserted between the two positioning blocks 13 in each positioning assembly on the top of the cleaning table 6, so that multiple chips can be positioned by each positioning assembly, and then the cleaning table 6 together with the chips are placed on the support plate 5, and the positioning rods 24 at the bottom of the cleaning table 6 are aligned with and pass through the corresponding positioning holes 23 on the surface of the support plate 5, and then the warehouse door 3 is closed, and the electric telescopic rod 15 is driven to drive the gas storage bin 17 together with each blowing pipe 19 to move downward until each blowing pipe 19 moves to the top of each chip, and then the external inert gas is pressurized by the high-pressure air pump 16, and the high-pressure gas is introduced into the gas storage bin 17 through the air guide pipe 20. After the high-pressure gas enters the gas storage bin 17, it can be blown out through each blowing pipe 19. At this time, the air pressure generated by the high-pressure gas can be used to purge the surface of the chip to remove particles and slight pollutants on the chip surface, thereby achieving a cleaning effect. The entire cleaning process does not need to be The chip is in direct contact, thereby effectively avoiding mechanical or chemical damage to the surface of the chip and ensuring the integrity of the chip surface. Multiple chips can be cleaned in batches at the same time through multiple air blowing pipes 19, thereby greatly improving the efficiency of the entire chip cleaning work. During cleaning, silicon, photoresist and other particles remaining on the chip surface can be blown into the various recovery holes 10 on the surface of the cleaning table 6, and enter the recovery chamber 7 through the various recovery holes 10. After entering the recovery chamber 7, the particles can fall into the recovery groove 12 along the guide block 9 and the recovery port 8, so that the particles can be uniformly recovered through the recovery groove 12, effectively avoiding the particles from scattering and affecting the surrounding working environment. A baffle 22 is fixedly connected to the top of the cleaning table 6. When cleaning the chip, the baffle 22 can block the scattered particles so that the particles are left on the surface of the cleaning table 6, thereby facilitating subsequent unified recovery. At the same time, the chip cleaning work can be carried out in a closed environment by closing the warehouse door 3, thereby effectively avoiding the splashing of particles during the chip cleaning process and causing harm to the safety of the staff.

[0045] The preferred embodiments of the utility model disclosed above are only used to help explain the utility model. The preferred embodiments do not describe all the details in detail, nor do they limit the utility model to the specific implementation methods described. Obviously, many modifications and changes can be made according to the content of this specification. This specification selects and specifically describes these embodiments in order to better explain the principles and practical applications of the utility model, so that technicians in the relevant technical field can well understand and use the utility model. The utility model is limited only by the claims and their full scope and equivalents.

Claims

1. A chip production cleaning device, characterized in that: The cleaning chamber comprises a cleaning chamber, wherein a plurality of feet are fixedly connected to the bottom of the cleaning chamber, a chamber door is installed on the front side thereof, an observation window is installed on the chamber door, and a support plate is fixedly connected to the inner walls on both sides of the cleaning chamber, a cleaning table is placed on the top of the support plate, a recovery cavity is opened inside the cleaning table, a recovery port is opened at the bottom thereof, the recovery port is connected with the recovery cavity, guide blocks are arranged on both sides thereof, the guide blocks are fixedly connected to the inner walls on both sides of the recovery cavity, a plurality of recovery holes are opened on the top of the cleaning table, the recovery holes are connected with the recovery cavity and are distributed in a linear array, and a pair of positioning components are arranged directly above each of the recovery holes, a pipe hole is opened on the top of the cleaning chamber, and a cleaning mechanism is arranged on the cleaning chamber, a recovery trough is placed at the bottom of the inner cavity of the cleaning chamber, and the recovery trough is located directly below the cleaning table; The positioning assembly includes a pair of positioning blocks, the front faces of which are C-shaped and are symmetrically distributed on both sides of the corresponding recovery holes, and the outer wall of each positioning block is fixedly connected to a bracket, and the bottom of the bracket is fixedly connected to the cleaning table; The cleaning mechanism includes an electric telescopic rod and a high-pressure air pump, both of which are installed on the top of the cleaning bin, the bottom end of the output end of the electric telescopic rod passes through the top of the cleaning bin and is fixedly connected to the air storage bin, the interior of the air storage bin is a hollow structure, an air inlet is opened on the top, and a plurality of air blowing pipes are installed at the bottom of the air storage bin, the air blowing pipes are connected to the inner cavity of the air storage bin, an air guide pipe is installed on the high-pressure air pump, and the end of the air guide pipe passes through the pipe hole and is connected to the air inlet on the top of the air storage bin.

2. A chip production cleaning device according to claim 1, characterized in that: The number of the air blowing pipes is the same as the recovery holes, and the center of each air blowing pipe corresponds to the center of each recovery hole one by one.

3. A chip production cleaning device according to claim 1, characterized in that: A layer of anti-skid pad is arranged on the inner wall surface of each positioning block, and the surface of the anti-skid pad is engraved with herringbone anti-skid patterns.

4. A chip production cleaning device according to claim 1, characterized in that: A baffle is fixedly connected to the top of the cleaning table. The baffle is a rectangular frame structure and is located at the edge of the cleaning table.

5. A chip production cleaning device according to claim 1, characterized in that: A plurality of positioning holes are provided on the surface of the support plate, and a plurality of positioning rods are fixedly connected to both sides of the bottom of the cleaning table. The number of the positioning rods is the same as that of the positioning holes, the diameters are equal, and the center of each positioning rod corresponds one-to-one to the center of each positioning hole.

6. A chip production cleaning device according to claim 1, characterized in that: The bottom of the support plate is fixedly connected with a support block, and the support block is a triangular block structure, one side of which is fixedly connected to the inner wall of the cleaning chamber.

7. A chip production cleaning device according to claim 1, characterized in that: Blocks are fixedly connected to both sides of the bottom of the recovery tank, and a pair of slots are opened at the bottom of the inner cavity of the cleaning chamber. The slots and blocks are both rectangular, with correspondingly equal widths, and the center of each slot corresponds to the center of each block.

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