Grinding equipment for semiconductor products

Abstract

The utility model relates to the technical field of semiconductor product processing, in particular to grinding equipment for semiconductor products, which comprises a rack, a processing module, a grinding disc arranged on the rack, a grinding transverse moving mechanism and a grinding mechanism arranged at the output end of the grinding transverse moving mechanism. The grinding mechanism comprises a mounting frame and a mounting plate arranged on the mounting frame in an up-down sliding mode, and a first lifting driving piece used for driving the mounting plate to ascend and descend is arranged on one side of the mounting frame. A jig for fixing a semiconductor product is rotatably arranged at the lower end of the mounting plate, the mounting plate is provided with a first transverse movement driving part and a swing arm, the output end of the first transverse movement driving part is connected with one side of the upper end of the swing arm, and the upper end of the jig is connected with the lower end of the swing arm. According to the grinding equipment for the semiconductor product, full-automatic grinding can be achieved through cooperation of the ELG technology and the semiconductor product, and the grinding efficiency of the semiconductor product is improved.

Description

Technical Field

[0001] The utility model relates to the technical field of semiconductor product processing, in particular to a grinding device for semiconductor products. Background Art

[0002] ELG (full name electronic lapping guide) refers to a technology that uses the measurement of semiconductor product resistance to calculate the current size of semiconductor products. In the current existing technology, semiconductor products are generally placed on a grinding disk, and the size of the semiconductor product resistance is read in real time while grinding the semiconductor product resistance, thereby grinding and processing semiconductor products of a specific size.

[0003] However, currently semiconductor products are polished manually, which has low polishing efficiency and is time-consuming and labor-intensive. Summary of the invention

[0004] In order to overcome the shortcomings and deficiencies in the prior art, the purpose of the utility model is to provide a grinding device for semiconductor products, which can realize fully automatic grinding of semiconductor products by combining ELG technology with semiconductor products to improve the grinding efficiency of semiconductor products.

[0005] The utility model is realized through the following technical solutions:

[0006] A grinding device for semiconductor products, comprising a frame and a grinding disc mounted on the frame, characterized in that it also comprises a processing module, a grinding transverse movement mechanism mounted on the frame and a grinding mechanism mounted at the output end of the grinding transverse movement mechanism; the grinding mechanism comprises a swing arm, a fixture, a first lifting drive and a first transverse movement drive both of which are connected to the processing module signal, the first lifting drive is used to drive the first transverse movement drive to move up and down, the first transverse movement drive drives the fixture to rotate through the swing arm, and the processing module is used to read the resistance value of the semiconductor product on the fixture and control the output values ​​of the first lifting drive and the first transverse movement drive according to ELG.

[0007] Among them, the grinding mechanism also includes a mounting frame and a mounting plate slidably arranged on the mounting frame up and down, the first lifting drive component is installed on one side of the mounting frame, and the output end of the first lifting drive component is connected to the mounting plate; the first transverse movement drive component is installed on the mounting plate, and the output end of the first transverse movement drive component is connected to one side of the upper end of the swing arm, and the upper end of the jig is connected to the lower end of the swing arm.

[0008] A second lifting drive member for driving the installation plate to be lifted and lowered and connected to the processing module signal is also installed on the other side of the installation frame. The second lifting drive member and the first lifting drive member are symmetrically arranged with respect to the installation plate.

[0009] Wherein, the mounting plate is also provided with a second transverse driving component connected to the processing module signal, and the output end of the second transverse driving component is connected to the other side of the upper end of the swing arm.

[0010] Wherein, the first lifting drive component and the first lateral movement drive component are both voice coil motors.

[0011] Among them, a limit plate is slidably arranged at the lower end of the mounting plate, and a jig mounting frame is rotatably arranged on the limit plate. The upper end of the jig mounting frame is connected to the lower end of the swing arm, and the jig is mounted on the jig mounting frame.

[0012] Wherein, the jig is detachably rotatably connected to the jig mounting frame.

[0013] Beneficial effects of the utility model:

[0014] The utility model discloses a grinding device for semiconductor products. The device comprises a processing module, a grinding transverse movement mechanism and a grinding mechanism. When the semiconductor product is fixed on a fixture, the grinding transverse movement mechanism drives the grinding mechanism to move to a corresponding position of a grinding disc. Then, a first lifting drive member drives a mounting plate to move downward so that the semiconductor product contacts the grinding disc to start the grinding action. At this time, the processing module controls the first lifting drive member to drive the fixture to rise and fall, or the first transverse movement drive member acts on a swing arm to drive the fixture to rotate. In combination with the ELG technology, semiconductor products of corresponding sizes can be obtained, thereby effectively improving the grinding efficiency of semiconductor products. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] The utility model is further described using the accompanying drawings, but the embodiments in the accompanying drawings do not constitute any limitation to the utility model. A person skilled in the art can obtain other drawings based on the following drawings without creative work.

[0016] Figure 1 It is a three-dimensional structural schematic diagram of the utility model.

[0017] Figure 2 It is a structural schematic diagram of the grinding mechanism.

[0018] Figure 3 An exploded view of part of the grinding mechanism.

[0019] Reference numerals

[0020] Frame--100, grinding disc--101, grinding transverse movement mechanism--102,

[0021] Grinding mechanism 200, mounting frame 201, mounting plate 202, first lifting drive member 203, first transverse drive member 204, swing arm 205, second lifting drive member 206, second transverse drive member 207, limit plate 208, fixture mounting frame 209, positioning column 210. DETAILED DESCRIPTION

[0022] In order to make the above-mentioned purposes, features and advantages of the utility model more obvious and easy to understand, the specific implementation methods of the utility model are described in detail below in conjunction with the accompanying drawings. In the following description, many specific details are set forth to facilitate a full understanding of the utility model. However, the utility model can be implemented in many other ways different from those described herein, and those skilled in the art can make similar improvements without violating the connotation of the utility model, so the utility model is not limited by the specific embodiments disclosed below.

[0023] In the description of the present invention, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", "clockwise", "counterclockwise", "axial", "radial", "circumferential" and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the referred device or element must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as a limitation on the present invention.

[0024] In addition, the terms "first" and "second" are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Therefore, the features defined as "first" and "second" may explicitly or implicitly include at least one of the features. In the description of the present utility model, the meaning of "plurality" is at least two, such as two, three, etc., unless otherwise clearly and specifically defined.

[0025] ELG (full name electronic lapping guide) refers to a technology that uses the measurement of semiconductor product resistance to calculate the current size of semiconductor products. In the current existing technology, semiconductor products are generally placed on a grinding disk, and the size of the semiconductor product resistance is read in real time while grinding the semiconductor product resistance, thereby grinding and processing semiconductor products of a specific size.

[0026] However, currently semiconductor products are polished manually, which has low polishing efficiency and is time-consuming and labor-intensive.

[0027] In order to solve the above problems, this embodiment discloses a grinding device for semiconductor products, the structure of which is as follows: Figures 1 to 3 As shown, the device includes a frame 100, a processing module (not shown in the figure), a grinding disc 101 installed on the frame 100, a grinding transverse movement mechanism 102, and a grinding mechanism 200 installed at the output end of the grinding transverse movement mechanism 102;

[0028] The grinding mechanism includes a swing arm 205, a fixture (not shown in the figure), a first lifting drive 203 and a first transverse drive 204, both of which are connected to the processing module signal, the first lifting drive 203 is used to drive the first transverse drive 204 to move up and down, and the first transverse drive 204 drives the fixture to rotate through the swing arm 205. The processing module is used to read the resistance value of the semiconductor product on the fixture and control the output values ​​of the first lifting drive 203 and the first transverse drive 204 according to ELG.

[0029] Preferably, the grinding mechanism also includes a mounting frame 201 and a mounting plate 202 slidably arranged on the mounting frame 201, the first lifting drive member 203 is installed on one side of the mounting frame 201, and the output end of the first lifting drive member 203 is connected to the mounting plate 202; the first transverse movement drive member 203 is installed on the mounting plate 202, the output end of the first transverse movement drive member 204 is connected to one side of the upper end of the swing arm 205, and the upper end of the fixture is connected to the lower end of the swing arm 205.

[0030] Specifically, a grinding device for semiconductor products of this embodiment is provided with a processing module, a grinding transverse movement mechanism 102 and a grinding mechanism 200. When in use, after the semiconductor product is fixed on the fixture, the grinding transverse movement mechanism 102 drives the grinding mechanism 200 to move to the corresponding position of the grinding disk 101; then the first lifting drive member 203 drives the mounting plate 202 to move downward so that the semiconductor product contacts the grinding disk 101 to start the grinding action. At this time, the processing module controls the first lifting drive member 203 to act on the mounting plate 202 to drive the fixture to rise and fall, or the first transverse movement drive member 204 acts on the swing arm 205 to drive the fixture to rotate. Combined with the ELG technology, semiconductor products of corresponding sizes can be obtained, effectively improving the grinding efficiency of semiconductor products.

[0031] Furthermore, a limit plate 208 is slidably disposed at the lower end of the mounting plate 202, and a fixture mounting frame 209 is rotatably disposed on the limit plate 208, and the fixture is mounted on the fixture mounting frame 209. Figure 2 It can be seen that the upper end of the jig mounting frame 209 is connected to the lower end of the swing arm 205 , and the limit plate 208 can limit the jig mounting frame 209 in the vertical direction when the first transverse driving member 204 acts on the swing arm 205 .

[0032] In this embodiment, the grinding disc 101 can be one of a coarse grinding disc, a fine grinding disc or a polishing disc, that is, the equipment of this embodiment can be equipped with multiple units at the same time to perform different grinding processes; and the jig and the jig mounting frame 209 are detachably connected to each other, and the jig can be quickly positioned by the two positioning columns 210 on the jig mounting frame 209, and the jig can be locked on the jig mounting frame 209 by screws, so that the jig can be quickly disassembled and assembled, which is convenient for switching semiconductor products on the jig on different process equipment.

[0033] Furthermore, the other side of the mounting frame 201 is also provided with a second lifting drive member 206 for driving the mounting plate 202 to rise and fall and connected to the processing module signal. The second lifting drive member 206 and the first lifting drive member 203 are symmetrically arranged with respect to the mounting plate 202; the mounting plate 202 is also provided with a second transverse movement drive member 207 connected to the processing module signal, and the output end of the second transverse movement drive member 207 is connected to the other side of the upper end of the swing arm 205.

[0034] On the basis of the first lifting drive 203 and the first transverse drive 204, a second lifting drive 206 and a second transverse drive 207 are added, the output directions of the first lifting drive 203 and the second lifting drive 206 are in phase and parallel, and the output directions of the first transverse drive 204 and the second transverse drive 207 are opposite and parallel, so as to improve the stability of the driving fixture when lifting or rotating. Preferably, the first lifting drive 203, the first transverse drive 204, the second lifting drive 206 and the second transverse drive 207 are all voice coil motors, and can also be replaced by other drive components, which will not be repeated here.

[0035] It should be noted that the grinding transverse movement mechanism 102 of the present embodiment is preferably a servo system; in addition, the semiconductor product mounted on the fixture in the present embodiment is also connected to the processing module signal, and the processing module detects the current resistance of the semiconductor product at any time; and the structure and principle of the processing module in the present embodiment, as well as how the processing module uses ELG technology to process and calculate the size of the semiconductor product, belong to the prior art and will not be repeated here.

[0036] Finally, it should be noted that the above embodiments are only used to illustrate the technical solution of the utility model, rather than to limit the protection scope of the utility model. Although the utility model has been described in detail with reference to the preferred embodiments, ordinary technicians in this field should understand that the technical solution of the utility model can be modified or replaced by equivalents without departing from the essence and scope of the technical solution of the utility model.

Claims

1. A grinding device for semiconductor products, comprising a frame and a grinding disc mounted on the frame, characterized in that: It also includes a processing module, a grinding transverse movement mechanism installed on the frame, and a grinding mechanism installed at the output end of the grinding transverse movement mechanism; The grinding mechanism includes a swing arm, a jig, a first lifting drive and a first transverse drive, both of which are connected to the processing module signal, the first lifting drive is used to drive the first transverse drive to move up and down, the first transverse drive drives the jig to rotate through the swing arm, and the processing module is used to read the resistance value of the semiconductor product on the jig and control the output values ​​of the first lifting drive and the first transverse drive according to the ELG.

2. A grinding device for semiconductor products according to claim 1, characterized in that: The grinding mechanism further includes a mounting frame and a mounting plate slidably disposed on the mounting frame, the first lifting drive member is mounted on one side of the mounting frame, and an output end of the first lifting drive member is connected to the mounting plate; The first transverse driving member is installed on the mounting plate, the output end of the first transverse driving member is connected to one side of the upper end of the swing arm, and the upper end of the fixture is connected to the lower end of the swing arm.

3. A grinding device for semiconductor products according to claim 2, characterized in that: A second lifting drive member for driving the mounting plate to move up and down and connected to the processing module signal is also installed on the other side of the mounting frame. The second lifting drive member and the first lifting drive member are symmetrically arranged with respect to the mounting plate.

4. A grinding device for semiconductor products according to claim 2, characterized in that: The mounting plate is also provided with a second transverse driving member connected to the processing module signal, and the output end of the second transverse driving member is connected to the other side of the upper end of the swing arm.

5. A grinding device for semiconductor products according to claim 2, characterized in that: A limit plate is slidably arranged at the lower end of the mounting plate, and a jig mounting frame is rotatably arranged on the limit plate. The upper end of the jig mounting frame is connected to the lower end of the swing arm, and the jig is mounted on the jig mounting frame.

6. A grinding device for semiconductor products according to claim 5, characterized in that: The jig is detachably rotatably connected to the jig mounting frame.

7. The grinding device for semiconductor products according to claim 1, characterized in that: The first lifting drive component and the first lateral movement drive component are both voice coil motors.

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