Auxiliary installation tool for semiconductor equipment

Abstract

The utility model provides an auxiliary installation tool for semiconductor equipment, and belongs to the field of semiconductors. The auxiliary installation tool comprises a lifting device. And the bearing device is connected to the lifting device, and the bearing device is used for bearing the connecting assembly. Wherein the lifting device ascends and descends in the longitudinal direction to drive the bearing device to position the connecting assembly in the longitudinal direction, so that the connecting assembly and the reaction cavity are installed. Through the arrangement of the lifting device and the bearing device, the lifting device ascends and descends in the longitudinal direction to drive the bearing device to position the connecting assembly in the longitudinal direction, so that the connecting assembly and the reaction cavity are installed. Therefore, the pumping pipeline at the bottom of the valve can be prevented from easily loosening and falling. And meanwhile, the isolating valve and the throttling valve can be accurately positioned when being connected with the pumping pipeline, so that the mounting efficiency is improved, and the maintenance efficiency of semiconductor equipment is also improved. And the sealing failure risk of the pumping pipeline is reduced.

Description

Technical Field

[0001] The utility model relates to the technical field of semiconductors, in particular to an auxiliary installation tool for semiconductor equipment. Background Art

[0002] In semiconductor equipment, such as etching machines and ion implantation machines, they are used for wafer manufacturing. These semiconductor devices all have a reaction chamber and a gas delivery component that delivers gas to the reaction chamber. The gas delivery component is mainly used for the delivery of special process gases in semiconductor equipment, and is a transmission pipeline connecting the gas source to the reaction chamber. The gas used in the wafer processing process has the characteristics of high purity, strong corrosiveness, flammability, explosion and toxicity, so there are high requirements for the sealing, cleanliness and corrosion resistance of the pipeline.

[0003] The delivery assembly includes isolation valves, throttle valves, pumping pipelines and other parts. The isolation valve and throttle valve are connected to the reaction chamber at the top and the pumping pipeline at the bottom through screws. Therefore, when maintaining the isolation valve and throttle valve, the fixing screws need to be disassembled to remove the valve body. However, when the fixing screws are removed, the pumping pipeline at the bottom of the valve is easy to loosen and fall, and it is difficult to re-position the isolation valve and throttle valve when reconnecting the pumping pipeline, which reduces the efficiency of installation and easily causes the pumping pipeline seal to leak.

[0004] It should be noted that the information disclosed in the background technology section of the utility model is only intended to deepen the understanding of the general background technology of the utility model, and should not be regarded as an admission or suggestion in any form that the information constitutes prior art already known to those skilled in the art. Utility Model Content

[0005] The utility model aims to provide an auxiliary installation tool for semiconductor equipment to solve the technical problem of difficult positioning of valves of gas pipelines in semiconductor equipment during installation.

[0006] In order to solve the above technical problems, the utility model provides an auxiliary installation tool for semiconductor equipment, wherein the semiconductor equipment at least comprises a reaction chamber and a connection component, wherein the connection component is used to supply gas to flow to the reaction chamber, and the auxiliary installation tool for semiconductor equipment comprises:

[0007] Lifting device;

[0008] A supporting device connected to the lifting device, the supporting device being used to support the connecting assembly;

[0009] The lifting device is lifted and lowered in the longitudinal direction, driving the supporting device to position the connecting component in the longitudinal direction, so as to install the connecting component and the reaction chamber.

[0010] Preferably, the lifting device is a jack.

[0011] Preferably, the lifting device is a hydraulic lifting device.

[0012] Preferably, the supporting device comprises:

[0013] A connecting end connected to the lifting device;

[0014] A supporting portion, used for supporting the connecting assembly;

[0015] The limiting portion is arranged on the supporting portion and is used for limiting the connection assembly.

[0016] Preferably, the connecting end is fixedly connected to the supporting portion.

[0017] Preferably, two limiting portions are provided and are symmetrically distributed along the width direction of the supporting portion.

[0018] Preferably, the connection assembly includes a pumping pipeline, and the spacing between the two limiting portions along the width direction of the support portion is equal to the diameter of the pumping pipeline.

[0019] Preferably, a height of the limiting portion along the longitudinal direction is greater than or equal to a diameter of the pumping pipeline.

[0020] Preferably, the lifting device is detachably connected to the supporting device.

[0021] Preferably, the lifting device is welded to the supporting device.

[0022] Compared with the prior art, the auxiliary installation tool of the utility model has the following advantages:

[0023] The utility model uses a lifting device. A supporting device is connected to the lifting device, and the supporting device is used to support the connecting component. Among them, the lifting device is lifted and lowered in the longitudinal direction, driving the supporting device to position the connecting component in the longitudinal direction, so as to install the connecting component with the reaction chamber. Therefore, the auxiliary installation tool provided by the utility model, through the provided lifting device and supporting device, the lifting device is lifted and lowered in the longitudinal direction, driving the supporting device to position the connecting component in the longitudinal direction, so as to install the connecting component with the reaction chamber. Thereby, the pumping pipeline at the bottom of the valve can be prevented from being easily loosened and falling. At the same time, the isolation valve and the throttle valve can be accurately positioned when connected to the pumping pipeline, which improves the efficiency of installation and also improves the efficiency of maintenance of semiconductor equipment. Reduce the risk of pumping pipeline sealing failure. BRIEF DESCRIPTION OF THE DRAWINGS

[0024] Figure 1 It is a schematic diagram of a part of the structure of a semiconductor device in one embodiment of the utility model;

[0025] Figure 2 It is a schematic diagram of the main structure of the auxiliary installation tool provided in one embodiment of the utility model;

[0026] Figure 3 It is a structural schematic diagram of the auxiliary installation tool provided in one embodiment of the utility model in a use state;

[0027] In the figure,

[0028] 100-semiconductor equipment; 110-pumping pipeline;

[0029] 120-Isolation valve; 130-Throttle valve;

[0030] 140-port; 200-auxiliary installation tools;

[0031] 210-lifting device; 220-supporting device;

[0032] 221-connecting end; 222-supporting portion;

[0033] 223-Limiting part. DETAILED DESCRIPTION

[0034] In order to make the purpose, advantages and features of the utility model clearer, the auxiliary installation tool of the semiconductor device proposed by the utility model is further described in detail below in combination with the drawings and specific embodiments. It should be noted that the drawings are all in a very simplified form and use non-precise proportions, which are only used to conveniently and clearly assist in explaining the purpose of the embodiment of the utility model. It should be understood that the drawings in the specification do not necessarily show the specific structure of the utility model in proportion, and the illustrative features used to illustrate certain principles of the utility model in the drawings in the specification will also adopt a slightly simplified drawing method. The specific design features of the utility model disclosed herein include, for example, specific dimensions, directions, positions and shapes, which will be determined in part by the specific environment to be applied and used. And, in the embodiments described below, sometimes the same figure mark is used in common between different drawings to represent the same part or a part with the same function, and its repeated description is omitted. In this specification, similar numbers and letters are used to represent similar items, so once an item is defined in one drawing, it does not need to be further discussed in subsequent drawings.

[0035] In addition, the terms "first" and "second" are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Therefore, the features defined as "first" and "second" may explicitly or implicitly include at least one of the features. In the description of the present utility model, the meaning of "plurality" is at least two, such as two, three, etc., unless otherwise clearly and specifically defined.

[0036] In the description of this specification, the description with reference to the terms "one embodiment", "some embodiments", "example", "specific example", or "some examples" etc. means that the specific features, structures, materials or characteristics described in conjunction with the embodiment or example are included in at least one embodiment or example of the utility model. In this specification, the schematic representations of the above terms do not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials or characteristics described may be combined in any one or more embodiments or examples in a suitable manner. In addition, those skilled in the art may combine and combine the different embodiments or examples described in this specification and the features of the different embodiments or examples, without contradiction.

[0037] It should be noted that in the following embodiments, the term "longitudinal" refers to Figures 1 to 3 The direction indicated by arrow b in the figure. The direction indicated by arrow b is the direction of telescopic movement of the lifting device. The term "lateral" means Figure 2 That is, in this embodiment, the horizontal direction refers to the direction in which the length of the support portion 222 is located in the front view of the auxiliary installation tool 200. Figure 3 The direction indicated by the middle arrow d is the direction of the width of the support portion 222 .

[0038] Please refer to Figures 1 to 3 A specific embodiment of a semiconductor device auxiliary installation tool disclosed herein is used to assist in the installation of semiconductor devices. However, it should be understood that the semiconductor device auxiliary installation tool in this embodiment is used to assist in the installation of semiconductor devices, but is not limited to being used only in semiconductor devices.

[0039] It should be noted that the semiconductor device 100 described in this article is a semiconductor device 100 having a reaction chamber, such as a photolithography machine, an ion implantation machine, and the like.

[0040] The core idea of ​​the present invention is to provide an auxiliary installation tool for semiconductor equipment, which can prevent the pumping pipeline 110 at the bottom of the valve from loosening and falling. At the same time, the isolation valve 120 and the throttle valve 130 can be accurately positioned when connected to the pumping pipeline 110, so as to improve the efficiency of installation and the efficiency of maintenance of the semiconductor equipment 100. It can also reduce the risk of sealing failure of the pumping pipeline 110.

[0041] In order to realize the above idea, the utility model provides an auxiliary installation tool for semiconductor equipment. Figures 1 to 3A specific embodiment of an auxiliary installation tool for semiconductor equipment is disclosed. The semiconductor equipment at least includes a reaction chamber (not shown in the figure) and a connection component, and the connection component is used to allow gas to flow to the reaction chamber. The auxiliary installation tool 100 of the semiconductor equipment includes a lifting device 210. A supporting device 220 is connected to the lifting device 210, and the supporting device 220 is used to support the connection component. The lifting device 210 is longitudinally (i.e., Figure 2 The supporting device 220 is lifted and lowered in the direction of the arrow b in the middle, driving the supporting device 220 to position the connecting component in the longitudinal direction, so as to install the connecting component with the reaction chamber.

[0042] Among them, Figure 1 As shown, the semiconductor device 100 at least includes a reaction chamber (not shown in the figure) and a connecting component, and the connecting component is used to supply gas to the reaction chamber. The connecting component includes a pumping pipeline 110, an isolation valve 120, a throttle valve 130 and a port 140. The port 140 is connected to the reaction chamber. The pumping pipeline 110 transports the gas from the pumping pipeline 110 to the reaction chamber through the port 140 by a pump. It should be noted that the connecting component not only includes the pumping pipeline 110, the isolation valve 120, the throttle valve 130 and the port 140 listed above, but also includes components such as a reduction tube, a flow meter, and a pressure gauge. The lifting device 210 is arranged in the longitudinal direction (i.e., Figure 2 The supporting device 220 is lifted and lowered in the direction of the arrow b in the middle, driving the supporting device 220 to position the pumping pipeline 110 in the longitudinal direction, so as to install the pumping pipeline 110, the isolation valve 120, the throttle valve 130 and the reaction chamber. Since the reaction chamber and the connecting assembly are prior art, those skilled in the art are already familiar with their specific structures and principles, which will not be described in detail here.

[0043] In traditional semiconductor equipment maintenance, the valve bodies of the isolation valve 120 and the throttle valve 130 are usually removed by disassembling the fixing screws. However, when the fixing screws are removed, the pumping pipeline 110 at the bottom of the valve is easily loosened and falls, making it difficult to locate, which not only reduces the efficiency of semiconductor equipment installation and maintenance. At the same time, it is also easy to cause the seal of the pumping pipeline 110 to leak during installation, increasing the risk of seal failure of the pumping pipeline 110.

[0044] However, the auxiliary installation tool 100 for semiconductor equipment disclosed in this embodiment is provided with a lifting device 210 and a supporting device 220. The lifting device 210 is lifted and lowered in the longitudinal direction, driving the supporting device 220 to position the pumping wire 110 in the longitudinal direction, so as to install the pumping pipeline 110, the isolation valve 120, the throttle valve 130 and the reaction chamber. This can prevent the pumping pipeline 110 at the bottom of the valve from being easily loosened and falling. At the same time, the isolation valve 120 and the throttle valve 130 can be accurately positioned when connected to the pumping pipeline 110, which improves the efficiency of installation and the efficiency of semiconductor equipment maintenance. The risk of sealing failure of the pumping pipeline 110 is reduced.

[0045] For example, Figure 2 As shown, the lifting device 210 can be a jack or a hydraulic lifting device, as long as it can achieve telescopic lifting movement along the longitudinal direction.

[0046] Exemplarily, the supporting device 220 includes: a connecting end 221 connected to the lifting device 210; a supporting portion 222 for supporting the connecting assembly; and a limiting portion 223 disposed on the supporting portion 222 for limiting the connecting assembly.

[0047] Specifically, refer to Figure 2 and Figure 3 As shown, the connection end 221 can be configured as a rod-shaped structure or a plate-shaped structure. There is no specific requirement for the specific shape of the connection end 221. The connection end 221 can be detachably connected to the lifting device 210, for example, the connection end 221 can be fixedly connected to the lifting device 210 by bolts to achieve a detachable connection between the lifting device 210 and the supporting device 220. The connection end 221 can also be welded to the lifting device 210 to achieve a fixed connection between the lifting device 210 and the supporting device 220. In order to improve the support strength of the connection end 221, the connection end 221 adopts a strong and tough material, such as Teflon, to improve the support durability of the connection end 221.

[0048] The support portion 222 can be constructed as a plate-like structure. The support portion 222 is fixedly connected to the connection end 221, which can be welded, fixedly connected by screws, or connected by interference fit. Here, there is no specific requirement for the connection method between the connection end 221 and the support portion 222, as long as the connection end 221 and the support portion 222 can be fixedly connected. In order to improve the support strength of the support portion 222, the support portion 222 adopts a strong and tough material, such as Teflon, to improve the durability of the support portion 222. The sum of the heights of the connection end 221 and the support portion 222 in the longitudinal direction is determined by measuring the height between the telescopic end of the lifting device 210 and the pumping pipeline 110 on site.

[0049] The limiting portion 223 can be configured as a plate-shaped structure, a cylindrical structure, or the like. In this embodiment, the limiting portion 223 is preferably a plate-shaped structure. A plurality of limiting portions 223 can be provided. Preferably, two limiting portions 223 are provided, and are symmetrically distributed along the width direction of the support portion 222. This is to achieve positioning and fixing of the pumping wire 110.

[0050] Furthermore, in order to improve the stability of the positioning and fixing of the pumping pipeline 110, the two limiting portions 223 are arranged along the width direction of the supporting portion 222 (ie, Figure 2 The distance between the two ends of the stopper 223 (in the direction indicated by the arrow c) is equal to the diameter of the pumping pipeline 110. In order to further improve the stability of the pumping pipeline 110 and prevent the pumping pipeline 110 from shaking, the height of the stopper 223 along the longitudinal direction is greater than or equal to the diameter of the pumping pipeline 110.

[0051] In summary, the above embodiments provide detailed descriptions of different configurations of auxiliary installation tools for semiconductor equipment. Of course, the above description is only a description of the preferred embodiments of the utility model, and is not any limitation on the scope of the utility model. The utility model includes but is not limited to the configurations listed in the above implementations. Those skilled in the art can draw inferences based on the contents of the above embodiments. Any changes and modifications made by ordinary technicians in the field of the utility model based on the above disclosures shall fall within the scope of protection of the claims.

Claims

1. An auxiliary installation tool for semiconductor equipment, the semiconductor equipment at least comprising a reaction chamber and a connection component, the connection component is used for supplying gas to flow to the reaction chamber, characterized in that: The auxiliary installation tools for the semiconductor equipment include: Lifting device; A supporting device connected to the lifting device, the supporting device being used to support the connecting assembly; The lifting device is lifted and lowered in the longitudinal direction, driving the supporting device to position the connecting component in the longitudinal direction, so as to install the connecting component and the reaction chamber.

2. The auxiliary mounting tool for semiconductor devices according to claim 1, characterized in that: The lifting device is a jack.

3. The auxiliary mounting tool for semiconductor devices according to claim 1, characterized in that: The lifting device is a hydraulic lifting device.

4. The auxiliary mounting tool for semiconductor devices according to claim 1, characterized in that: The supporting device comprises: A connecting end connected to the lifting device; A supporting portion, used for supporting the connecting assembly; The limiting portion is arranged on the supporting portion and is used for limiting the connection assembly.

5. The auxiliary mounting tool for semiconductor devices according to claim 4, characterized in that: The connecting end is fixedly connected to the supporting portion.

6. The auxiliary mounting tool for semiconductor devices according to claim 4, characterized in that: The limiting parts are provided with two and are symmetrically distributed along the width direction of the supporting part.

7. The auxiliary mounting tool for semiconductor devices according to claim 4, characterized in that: The connecting assembly includes a pumping pipeline, and the spacing between the two limiting parts along the width direction of the supporting part is equal to the diameter of the pumping pipeline.

8. The auxiliary mounting tool for semiconductor devices according to claim 7, characterized in that: The height of the limiting portion along the longitudinal direction is greater than or equal to the diameter of the pumping pipeline.

9. The auxiliary mounting tool for semiconductor devices according to claim 1, characterized in that: The lifting device is detachably connected to the supporting device.

10. The semiconductor device mounting auxiliary tool according to claim 1, characterized in that: The lifting device is welded to the supporting device.

Images