Splicing device and slicing machine

Abstract

The utility model discloses a wafer receiving device and a slicing machine, and the wafer receiving device comprises a box body which is used for containing a soak solution, the top of the box body is provided with a box opening for silicon wafers to go in and out, the box body is provided with a liquid discharge gap, and the liquid discharge gap is located at a position far away from the box opening; the plugging plate is used for plugging the liquid discharging gap; the driving part is used for driving the blocking plate to move towards or away from the liquid discharging notch. In the embodiment of the utility model, the soak solution can permeate into the kerfs between the silicon wafers to separate the silicon wafers, so that the cutting lines can be smoothly separated from the kerfs during material lifting, the probability that the surfaces of the silicon wafers are scratched by the cutting lines is reduced, and the quality and the yield of the silicon wafers are further improved.

Description

Technical Field

[0001] The utility model relates to the technical field of silicon rod slicing, in particular to a slicing device and a slicing machine. Background Art

[0002] At present, a slicer is usually used to slice silicon rods, and the slicer includes a cutting wire. After the cutting is completed, the material needs to be lifted, and during the lifting process, the cutting wire is separated from the cutting seam.

[0003] With the rapid development of battery technology, the thickness of silicon wafers has gradually become thinner, and the thickness of silicon rod slices has also become thinner. After the slice thickness becomes thinner, the cut silicon wafers are easy to stick together. During the process of cutting line separation, the cutting line is easy to scratch the surface of the silicon wafer, resulting in scratches on the silicon wafer and other defects, affecting the quality and yield of the silicon wafer. Utility Model Content

[0004] The utility model provides a wafer splicing device and a slicer, aiming at least to solve the technical problem in the prior art that the cutting line is easy to scratch the surface of the silicon wafer during the process of the cutting line being separated, resulting in scratches on the silicon wafer and other undesirable conditions.

[0005] In a first aspect, an embodiment of the utility model provides a splicing device, comprising:

[0006] A box body is used to contain the soaking liquid, the top of the box body is provided with a box opening for the silicon wafer to enter and exit, and the box body is provided with a liquid discharge notch, and the liquid discharge notch is located away from the box opening;

[0007] A blocking plate, used for blocking the drainage gap;

[0008] The driving member is used to drive the sealing plate to move toward or away from the drainage gap.

[0009] Optionally, the box body includes a first plate portion, the drainage gap is opened on the lower half of the first plate portion, and the drainage gap accounts for 40%-60% of the area of ​​the first plate portion.

[0010] Optionally, the blocking plate is hinged on the box body, and the driving member is used to drive the blocking plate to rotate.

[0011] Optionally, the driving member includes a telescopic rod, one end of the blocking plate is connected to the box body via a connecting member, and the other end of the blocking plate is connected to the telescopic rod.

[0012] Optionally, the sheet splicing device further comprises a spray pipe located in the box body, the spray pipe is arranged away from the box opening, one end of the spray pipe is used for passing soaking liquid, and at least one row of liquid spraying ports is provided on the spray pipe.

[0013] Optionally, the splicing device further comprises an ultrasonic vibrator group located in the box body, the ultrasonic vibrator group is arranged away from the box opening, and the ultrasonic vibrator group comprises a plurality of ultrasonic vibrators spaced apart and distributed along the length direction of the box body.

[0014] Optionally, the number of the spray pipes is at least two, and at least two of the spray pipes are spaced apart along the width direction of the box body. The box body further includes a third plate portion and a fourth plate portion extending along the length direction of the box body, wherein the two spray pipes are respectively close to the third plate portion and the fourth plate portion.

[0015] Optionally, the spray pipes and the ultrasonic vibrator groups are distributed at intervals along the width direction of the box body.

[0016] Optionally, the box body further comprises a second plate portion arranged opposite to the first plate portion, a liquid inlet pipe is arranged on a side of the second plate portion away from the first plate portion, and the liquid inlet pipe is connected to an end of the spray pipe away from the liquid discharge notch.

[0017] Optionally, a fixing plate is provided on the second plate portion, the fixing plate protrudes from a side of the second plate portion away from the first plate portion, a through hole is formed on the fixing plate, and an end of the liquid inlet pipe away from the spray pipe passes through the through hole.

[0018] In a second aspect, an embodiment of the utility model provides a slicer, comprising a cutting line, at least two main rollers and a slice splicing device as described in any one of the above;

[0019] The cutting line is wound around at least two of the main rollers, the splicing device is located between the at least two main rollers, and the splicing device comprises a box body, the top of the box body is provided with a box opening for silicon wafers to enter and exit, and the box opening faces the cutting line.

[0020] In the embodiment of the utility model, during the cutting process, the cut part of the silicon rod gradually enters the box body and is soaked by the soaking liquid contained in the box body. After the cutting is completed, the soaking liquid penetrates into the slits between the silicon wafers, so that each silicon wafer is separated, so that the cutting line can smoothly detach from the slit when lifting the material, avoiding the cutting line from contacting the silicon wafer during the detachment process, reducing the probability of the cutting line scratching the surface of the silicon wafer, thereby improving the quality and yield of the silicon wafer. In addition, through the setting of the driving part, the position of the blocking plate can be automatically adjusted so that the blocking plate blocks the drainage gap or exposes the drainage gap.

[0021] In addition, during the cutting process, when the blocking plate contacts the drainage notch away from the box mouth, it can ensure that the soaking liquid in the box body has a certain amount of accumulation. Under the action of the spraying port on the spray pipe, the soaking liquid slightly moves the silicon wafers, separates each silicon wafer, and promotes the discharge of chips. In addition, during the cutting process, when the driving part is closed and the blocking plate contacts the drainage notch away from the box mouth, after the amount of soaking liquid in the box body reaches a preset value, the blocking plate will be pushed open under the action of the soaking liquid, and automatically discharge to discharge the soaking liquid, thereby avoiding the soaking liquid from accumulating in the box body for a long time; compared with the blocking plate that matches the entire opening, the blocking plate that matches the drainage notch that accounts for 40%-60% of the area on the first plate portion is easier to be pushed open. In addition, when storing liquid, since the drainage gap accounts for 40%-60% of the area on the first plate portion, compared with the entire first plate portion being fully open, the amount of leakage during liquid storage is reduced and the liquid storage speed is increased, so that the immersion liquid can quickly fill the box body to achieve complete immersion of the silicon wafer, so that the cutting line can smoothly detach from the cutting seam when lifting the material.

[0022] In addition, the soaking liquid is poured in from one end and sprayed out from the spray port on the bottom spray pipe, forming a liquid surge, which slightly moves the silicon wafers, separates the silicon wafers from each other, and makes the slits vertical. When lifting the material, the cutting line can easily break away from the slit without scratching the surface of the silicon wafer. In addition, the soaking liquid is poured in from one end and discharged from the other end, which helps to remove the impurity particles contained in the soaking liquid and prevent the wire jump during the cutting process.

[0023] The above description is only an overview of the technical solution of the utility model. In order to more clearly understand the technical means of the utility model, it can be implemented in accordance with the contents of the specification. In order to make the above and other purposes, features and advantages of the utility model more obvious and easy to understand, the specific implementation methods of the utility model are listed below. BRIEF DESCRIPTION OF THE DRAWINGS

[0024] Figure 1 A schematic structural diagram of a splicing device provided in an embodiment of the utility model;

[0025] Figure 2 A three-dimensional structure diagram of another splicing device provided in an embodiment of the utility model Figure 1 ;

[0026] Figure 3 A three-dimensional structure diagram of another splicing device provided in an embodiment of the utility model Figure 2 ;

[0027] Figure 4 A schematic top view of another splicing device provided in an embodiment of the utility model;

[0028] Figure 5for Figure 4 Schematic cross-sectional view of AA in the figure;

[0029] Figure 6 A schematic side view of another splicing device provided in an embodiment of the utility model;

[0030] Figure 7 A schematic structural diagram of another splicing device provided in an embodiment of the utility model.

[0031] Reference numerals:

[0032] 1-box body, 11-first plate portion, 111-liquid discharge notch, 12-second plate portion, 13-box opening, 14-bottom plate, 2-sealing plate, 4-connecting piece, 5-spray pipe, 51-liquid spray outlet, 6-ultrasonic vibrator group, 61-ultrasonic vibrator, 7-liquid inlet pipe, 8-fixing plate, 9-elbow, 10-driving piece. DETAILED DESCRIPTION

[0033] The exemplary embodiments of the present invention will be described in more detail below with reference to the accompanying drawings. Although the exemplary embodiments of the present invention are shown in the accompanying drawings, it should be understood that the present invention can be implemented in various forms and should not be limited by the embodiments described herein. On the contrary, these embodiments are provided to enable a more thorough understanding of the present invention and to fully convey the scope of the present invention to those skilled in the art.

[0034] With the rapid development of battery technology, the thickness of silicon wafers has gradually become thinner, and the thickness of silicon rod slices has also become thinner. For example, for M10-sized silicon rods, the thickness of mass-produced slices has switched from 150μm to 130μm, and subsequent market demand is still exploring a thickness of 120μm. After the slice thickness becomes thinner, the cut silicon wafers are easy to stick together. During the process of the cutting line detaching, the cutting line is easy to scratch the surface of the silicon wafer, resulting in scratches on the silicon wafer and other undesirable conditions, affecting the quality and yield of the silicon wafer. In order to solve the above problems, the embodiment of the utility model provides a wafer splicing device and a slicer.

[0035] First, refer to Figure 1 and Figure 2 The utility model discloses a wafer splicing device, comprising: a box body 1 for containing soaking liquid, the box body 1 is actually called a waste box, which can receive silicon wafer cutting waste, the top of the box body 1 has a box opening 13 for silicon wafers to enter and exit, and a drainage gap 111 is opened on the box body 1, and the drainage gap 111 is located away from the box opening 13; a blocking plate 2 is used to block the drainage gap 111; a driving member 10 is used to drive the blocking plate 2 to move toward or away from the drainage gap 111.

[0036] Specifically, the splicing device is applied to a slicer, which includes at least two main rollers, the cutting line is wound around at least two main rollers (the main rollers and the cutting line are not shown), and the splicing device is located between at least two main rollers. The soaking liquid can be a cutting liquid or water, and the soaking liquid is preferably a cutting liquid, which has cooling, dispersing and lubricating effects. The cuttings and soaking liquid in the box body 1 can be discharged through the drainage notch 111.

[0037] The size of the blocking plate 2 is greater than or equal to the size of the drainage gap 111. Figure 1 and Figure 2 , the blocking plate 2 can be connected to the box body 1. The blocking plate 2 can also have no connection with the box body 1. The blocking plate 2 blocks the drainage gap 111 when it is in contact with the box body 1. When the blocking plate 2 blocks the drainage gap 111, the drainage gap 111 is closed. At this time, the soaking liquid in the box body 1 will gradually fill up. After the box body 1 is filled with the soaking liquid, the silicon wafers after cutting can be soaked, so that the silicon wafers are separated from each other due to the presence of the soaking liquid, so that the cutting line can smoothly detach from the cutting seam when lifting the material. When the blocking plate 2 does not block the drainage gap 111, the drainage gap 111 is opened, and the soaking liquid in the box body 1 is discharged through the drainage gap 111. The driving member 10 can be used to drive the blocking plate 2 to rotate. The driving member 10 can also be used to drive the blocking plate 2 to move.

[0038] The slicer also includes a silicon rod fixing part (not shown) for fixing the silicon rod. During the silicon rod cutting process, the height of the main roller and the cutting line can remain unchanged, the position of the splicing device can be fixed, and the silicon rod fixing part can drive the silicon rod to move up and down to realize the cutting of the silicon rod by the cutting line.

[0039] During the cutting process, the cut part of the silicon rod gradually enters the box body 1 and is soaked in the soaking liquid contained in the box body 1. After the cutting is completed, the soaking liquid penetrates into the slits between the silicon wafers, so that the silicon wafers are separated, so that the cutting line can smoothly detach from the slits when lifting the material, avoiding the cutting line from contacting the silicon wafer during the detachment process, reducing the probability of the cutting line scratching the surface of the silicon wafer, thereby improving the quality and yield of the silicon wafer.

[0040] The box body 1 includes a first plate portion 11 , and a liquid discharge notch 111 is provided on the lower half of the first plate portion 11 . The area of ​​the liquid discharge notch 111 on the first plate portion 11 accounts for 40%-60%.

[0041] The first plate portion 11 is specifically located on one side of the box body 1 along the length direction thereof. The length direction of the box body 1 can be referred to as Figure 1 and Figure 2The drainage notch 111 is in the direction indicated by the arrow B. The area ratio of the drainage notch 111 on the first plate portion 11 can be 40%, 42%, 45%, 50%, 55%, 60%, etc. The area ratio of the drainage notch 111 on the first plate portion 11 is preferably 50%. The drainage notch 111 is preferably located in the lower half of the first plate portion 11.

[0042] Specifically, the drainage notch 111 is located in the lower half of the first plate portion 11. During the cutting process, when the blocking plate 2 contacts the drainage notch 111 located in the lower half of the first plate portion 11, it can ensure that the soaking liquid in the box body 1 has a certain amount of accumulation. Under the gushing action of the liquid spraying port 51 on the spray pipe 5, the soaking liquid slightly moves the silicon wafers, separates each silicon wafer, and promotes the discharge of chips. In addition, during the cutting process, when the driving member 10 is closed and the blocking plate 2 contacts the drainage notch 111 located in the lower half of the first plate portion 11, after the amount of liquid accumulated in the soaking liquid in the box body 1 reaches a preset value, the blocking plate 2 will be pushed open under the action of the soaking liquid, and automatically discharge to discharge the soaking liquid, thereby avoiding the soaking liquid from accumulating in the box body 1 for a long time; compared with the blocking plate 2 matched with the entire opening, the blocking plate 2 matched with the drainage notch 111 located in the lower half of the first plate portion 11 is easier to be pushed open. In addition, when storing liquid, since the drainage notch 111 is located in the lower half of the first plate portion 11, compared with the entire first plate portion 11 being fully open, the amount of liquid leakage during liquid storage is reduced and the liquid storage speed is increased, so that the immersion liquid can quickly fill the box body 1 to achieve complete immersion of the silicon wafer, so that the cutting line can smoothly detach from the cutting seam when lifting the material.

[0043] In one embodiment, referring to Figure 1 , Figure 2 and Figure 6 The blocking plate 2 is hinged on the box body 1, and the driving member 10 is used to drive the blocking plate 2 to rotate.

[0044] In a specific embodiment, the driving member 10 can be a cylinder, an oil cylinder, an electric push rod, etc. The driving member 10 includes a driving source and a telescopic rod connected to the driving source. One end of the blocking plate 2 is connected to the box body 1 through a connecting member 4, and the other end of the blocking plate 2 is connected to the telescopic rod. The connecting member 4 can be a hinged member such as a hinge.

[0045] The slicer also includes a frame, a cabin and a guide groove (not shown above), the guide groove is installed on the frame, and the driving member 10 can be installed on the guide groove. The guide groove is used to guide the soaking liquid discharged from the drainage gap 111. The guide groove is specifically used to guide the soaking liquid discharged from the drainage gap 111 to the recovery liquid port on the cabin. The guide groove includes a connected main body section and a guide section, the main body section in the guide groove is located on one side of at least two main rollers along the length direction, and is located on one side of the box body 1 along the length direction, and the drainage gap 111 on the box body 1 is close to the main body section in the guide groove. The guide section in the guide groove is located below the drainage gap 111, and the guide section is preferably perpendicular to the main section. The guide section is used to guide the soaking liquid discharged from the drainage gap 111 to the main section. The driving source in the driving member 10 is installed on the guide groove, and the telescopic rod in the driving member 10 is connected to the blocking plate 2.

[0046] In addition, the driving source of the driving member 10 can be installed on other fixed structures, but it is best to install it on the guide groove, which can achieve convenience and efficiency in operation.

[0047] When the driving member 10 is working, the telescopic rod can be extended toward or away from the box body 1. When the telescopic rod is extended toward the box body 1, the telescopic rod pushes the blocking plate 2 to rotate toward the drainage gap 111, so that the blocking plate 2 blocks the drainage gap 111. When the telescopic rod is retracted away from the box body 1, the telescopic rod pulls the blocking plate 2, so that the blocking plate 2 rotates away from the drainage gap 111, so that the drainage gap 111 is exposed.

[0048] When the driving member 10 is working and the telescopic rod is extended, it will push the sealing plate 2 to rotate toward the drainage gap 111 until the sealing plate 2 is in contact with the box body 1. Then the driving member 10 presses the sealing plate 2 tightly to keep the sealing plate 2 in contact with the box body 1 to block the drainage gap 111. When the driving member 10 is closed and the amount of liquid stored in the box body 1 reaches a preset value, the sealing plate 2 is pushed open by the soaking liquid and automatically drains to discharge the soaking liquid, thereby preventing the soaking liquid from accumulating in the box body 1 for a long time. The preset value can be set according to actual needs, such as the preset value can be 0.01m 3 -0.02m 3 The default value is preferably 0.019m 3 The drainage notch 111 is located in the lower half of the first plate portion 11 , which reduces the size of the blocking plate 2 compared to the first plate portion 11 being fully open, so that the blocking plate 2 is easier to be pushed open under the action of the soaking liquid, and has high sensitivity.

[0049] When liquid needs to be stored in the box body 1, the driving member 10 works and presses the sealing plate 2, and the sealing plate 2 blocks the drainage gap 111. At this time, the amount of soaking liquid entering is much greater than the amount leaking from the joint between the sealing plate 2 and the box body 1, so that the box body 1 is quickly filled with soaking liquid. When liquid does not need to be stored in the box body 1, the driving member 10 is closed, and when the amount of soaking liquid in the box body 1 reaches a preset value, the sealing plate 2 will be pushed open to automatically drain. At this time, the soaking liquid in the box body 1 will never be full to prevent jumper.

[0050] In another specific embodiment, the blocking plate 2 is connected to the box body 1 via a rotating shaft, and the driving member 10 is connected to the rotating shaft. The driving member 10 is used to drive the rotating shaft to rotate, thereby driving the blocking plate 2 to rotate.

[0051] In one embodiment, referring to Figure 7 The driving member 10 is connected to the sealing plate 2 , and is used to drive the sealing plate 2 to move toward or away from the drainage gap 111 .

[0052] In this embodiment, the blocking plate 2 is not connected to the box body 1. The driving member 10 can be a small cylinder, and the slicer also includes a cabin, and the driving member 10 can be installed on the cabin. When the driving member 10 is working, it will drive the blocking plate 2 to move toward the drainage gap 111 until the blocking plate 2 fits with the box body 1 and blocks the drainage gap 111. The driving member 10 will also drive the blocking plate 2 to move away from the drainage gap 111. At this time, the drainage gap 111 is opened and can be discharged.

[0053] Reference Figure 1 , Figure 4 and Figure 5 The sheet splicing device provided in the embodiment of the utility model further comprises a spray pipe 5 located in the box body 1, the spray pipe 5 is arranged away from the box opening 13, one end of the spray pipe 5 is used for passing the soaking liquid, and at least one row of liquid spraying ports 51 is opened on the spray pipe 5.

[0054] Specifically, the box body 1 further includes a bottom plate 14 arranged opposite to the box opening 13, and the spray pipe 5 is located close to the bottom plate 14. The number of the spray pipes 5 can be set according to actual needs, such as one, two, three, four, etc. The end of the spray pipe 5 away from the liquid discharge notch 111 is used to pass the soaking liquid, and the liquid spray port 51 is used to spray the soaking liquid.

[0055] Each row of liquid spraying ports 51 includes a plurality of liquid spraying ports 51 spaced apart along the length direction of the box body 1. The soaking liquid sprayed from the liquid spraying ports 51 eventually falls back into the box body 1. The spray pipe 5 is preferably provided with a plurality of rows of liquid spraying ports, and at least one row of liquid spraying ports 51 faces the box opening 13. The shape of the liquid spraying ports 51 can be set according to actual needs, such as being round, square, etc.

[0056] After the soaking liquid is sprayed out from the liquid spray port 51 on the bottom spray pipe 5, liquid surge is formed, which has a slight pushing effect on the silicon wafers, so that the silicon wafers are always separated from each other and the cut seams are vertical, so that the cutting line can be smoothly separated from the cut seams when lifting the material.

[0057] Reference Figure 1 , Figure 4 and Figure 5 The splicing device provided in the embodiment of the utility model further includes an ultrasonic vibrator group 6 located in the box body 1 . The ultrasonic vibrator group 6 is arranged away from the box opening 13 . The ultrasonic vibrator group 6 includes a plurality of ultrasonic vibrators 61 spaced apart and distributed along the length direction of the box body 1 .

[0058] Specifically, the ultrasonic vibrator group 6 is arranged on the bottom plate 14. The number of ultrasonic vibrator groups 6 can be set according to actual needs, such as being set to one, two, etc. The ultrasonic vibrator 61 is used to output vibration. After the box body 1 is filled with liquid, the ultrasonic vibrator group 6 outputs vibration, generates cavitation, cleans the cutting line in the slit, thereby removing the chips on the surface of the cutting line, achieving the effect of chip removal, and enhancing the cutting force of the cutting line; not only that, through the joint synergistic effect of the ultrasonic vibrator and the liquid storage of the splicing device, the liquid can be more fully penetrated into the slit between the silicon wafers, so that each silicon wafer is separated.

[0059] Reference Figure 4 There are at least two spray pipes 5, and at least two spray pipes 5 are spaced apart along the width direction of the box body 1. The box body 1 also includes a third plate portion and a fourth plate portion extending along the length direction of the box body 1, wherein the two spray pipes 5 are respectively close to the third plate portion and the fourth plate portion.

[0060] Specifically, the third plate portion and the fourth plate portion are located between the first plate portion 11 and the second plate portion 12. The first plate portion 11, the second plate portion 12, the third plate portion, the fourth plate portion and the bottom plate 14 enclose the box body 1. When the two spray pipes 5 are respectively close to the third plate portion and the fourth plate portion, the liquid surge formed can move the silicon wafer from both sides.

[0061] At least two spray pipes 5 can also be arranged in a serpentine distribution, which can be understood as multiple spray pipes are arranged in an S-shape or a zigzag shape. The at least two spray pipes arranged in a serpentine distribution have a larger distribution area at the bottom of the box body, thereby providing a larger liquid surge area and improving the stirring effect on the silicon wafer.

[0062] Reference Figure 4 When the number of the spray pipes 5 is two, one of the spray pipes 5 is close to the third plate portion, and the other spray pipe 5 is close to the fourth plate portion.

[0063] When the number of spray pipes 5 is three, one spray pipe 5 is located at the intersection of the third plate portion and the bottom plate 14, another spray pipe 5 is located at the intersection of the fourth plate portion and the bottom plate 14, and the last spray pipe 5 is located between the two spray pipes 5 on both sides, preferably located in the middle position of the box body 1 along its width direction.

[0064] The spray pipes 5 and the ultrasonic vibrator groups 6 are distributed at intervals along the width direction of the box body 1 .

[0065] Reference Figure 4 When the number of the spray pipes 5 is two and the number of the ultrasonic vibrator group 6 is one, the ultrasonic vibrator group 6 is located between the two spray pipes 5 .

[0066] When the number of the ultrasonic vibrator groups 6 is two and the number of the spray pipes 5 is three, each ultrasonic vibrator group 6 is located between two spray pipes 5 .

[0067] Reference Figure 1 , Figure 4 and Figure 5 The box body 1 also includes a second plate portion 12 arranged opposite to the first plate portion 11. A liquid inlet pipe 7 is arranged on a side of the second plate portion 12 away from the first plate portion 11. The liquid inlet pipe 7 is connected to an end of the spray pipe 5 away from the discharge notch 111.

[0068] Specifically, the liquid inlet pipe 7 is vertically arranged, and one end of the liquid inlet pipe 7 close to the spray pipe 5 is connected with an elbow 9 to change the flow direction of the soaking liquid to the horizontal direction. The elbow 9 penetrates the second plate portion 12 to extend into the box body 1, and the elbow 9 is connected to the spray pipe 5.

[0069] The number of the liquid inlet pipes 7 is greater than or equal to one and less than or equal to the number of the spray pipes 5. Figure 4 and Figure 5 When the number of the liquid inlet pipes 7 is equal to the number of the spray pipes 5 , each liquid inlet pipe 7 is connected to the spray pipe 5 through an elbow 9 .

[0070] When the number of the liquid inlet pipe 7 is one and the number of the spray pipes 5 is multiple, the elbow 9 is connected to the multiple spray pipes 5 in the box body 1 through a joint, and the joint is located in the box body 1. When the number of the spray pipes 5 is three, the joint is specifically a four-way joint, and the elbow 9 is connected to the three spray pipes 5 through the four-way joint. The four-way joint specifically includes a main inlet and three diversion ports, and the flow directions of the soaking liquid flowing at the three diversion ports are parallel.

[0071] In the embodiment of the utility model, the soaking liquid is poured into the box body 1 from one side and discharged from the other side of the box body 1, which is conducive to removing the foreign particles contained in the soaking liquid, thereby preventing the wire mesh from jumping during the cutting process.

[0072] Reference Figure 1In one embodiment, a fixing plate 8 is provided on the second plate portion 12 , and the fixing plate 8 protrudes from the side of the second plate portion 12 away from the first plate portion 11 . A through hole is provided on the fixing plate 8 , and one end of the liquid inlet pipe 7 away from the spray pipe 5 passes through the through hole.

[0073] Specifically, the fixing plate 8 is used to support and fix the box body 1. When only one liquid inlet pipe 7 is provided, the liquid inlet pipe 7 passes through directly below the fixing plate 8, so that the liquid inlet pipe 7 can be hidden in the space below the fixing plate 8, thereby ensuring aesthetics.

[0074] Reference Figure 3 A fixing plate 8 may also be provided on the first plate portion 11 , and the fixing plate 8 protrudes from a side of the first plate portion 11 away from the second plate portion 12 .

[0075] Reference Figure 3 and Figure 4 In one embodiment, when a plurality of liquid inlet pipes 7 are provided, the liquid inlet pipes 7 do not pass through the fixed plate 8, that is, no through hole is provided on the fixed plate 8.

[0076] On the second aspect, an embodiment of the utility model further discloses a slicer, comprising a cutting line, at least two main rollers and any one of the above-mentioned splicing devices, wherein the cutting line is wound around at least two main rollers, the splicing device is located between at least two main rollers, and the splicing device comprises a box body 1, and the top of the box body 1 has a box opening 13 for silicon wafers to enter and exit, and the box opening faces the cutting line.

[0077] Since the slicer includes the above-mentioned slice splicing device, it also has the beneficial effects of the above-mentioned slice splicing device, which will not be described in detail here.

[0078] The slicer also includes a liquid supply device, which includes a liquid supply tank and a liquid supply pipe. The liquid supply tank is used to contain cutting liquid, and the liquid inlet pipe 7 is connected to the liquid supply tank through the liquid supply pipe.

[0079] The slicer also comprises a cutting line and two main rollers which are distributed at intervals, the cutting line is wound around the two main rollers, and a slice splicing device is located between the two main rollers.

[0080] It should be noted that, in this article, the terms "include", "comprises" or any other variations thereof are intended to cover non-exclusive inclusion, so that a process, method, article or device including a series of elements includes not only those elements, but also other elements not explicitly listed, or also includes elements inherent to such process, method, article or device. In the absence of further restrictions, an element defined by the sentence "comprises a ..." does not exclude the existence of other identical elements in the process, method, article or device including the element.

[0081] The embodiments of the utility model are described above in conjunction with the accompanying drawings, but the utility model is not limited to the above-mentioned specific implementation methods. The above-mentioned specific implementation methods are merely illustrative and not restrictive. Under the enlightenment of the utility model, ordinary technicians in this field can also make many forms without departing from the scope of protection of the utility model and the claims, which all fall within the protection of the utility model.

Claims

1. A splicing device, characterized in that: include: A box body is used to contain the soaking liquid, the top of the box body is provided with a box opening for the silicon wafer to enter and exit, and the box body is provided with a liquid discharge notch, and the liquid discharge notch is located away from the box opening; A blocking plate, used for blocking the drainage gap; The driving member is used to drive the sealing plate to move toward or away from the drainage gap.

2. The sheet splicing device according to claim 1, characterized in that: The box body includes a first plate portion, the drainage notch is opened on the lower half of the first plate portion, and the drainage notch accounts for 40%-60% of the area of ​​the first plate portion.

3. The splicing device according to claim 1, characterized in that: The driving member comprises a telescopic rod, one end of the blocking plate is connected to the box body, and the other end of the blocking plate is connected to the telescopic rod.

4. The splicing device according to claim 2, characterized in that: The sheet splicing device further comprises a spray pipe located in the box body, the spray pipe is arranged away from the box opening, one end of the spray pipe is used for introducing soaking liquid, and at least one row of liquid spraying ports is provided on the spray pipe.

5. The sheet splicing device according to claim 4, characterized in that: The splicing device further comprises an ultrasonic vibrator group located in the box body, the ultrasonic vibrator group is arranged away from the box opening, and the ultrasonic vibrator group comprises a plurality of ultrasonic vibrators spaced and distributed along the length direction of the box body.

6. The sheet splicing device according to claim 4, characterized in that: The number of the spray pipes is at least two, and the at least two spray pipes are spaced apart and distributed along the width direction of the box body.

7. The splicing device according to claim 5, characterized in that: The spray pipes and the ultrasonic vibrator groups are distributed at intervals along the width direction of the box body.

8. The splicing device according to claim 4, characterized in that: The box body also includes a second plate portion arranged opposite to the first plate portion, a liquid inlet pipe is arranged on a side of the second plate portion away from the first plate portion, and the liquid inlet pipe is connected to an end of the spray pipe away from the liquid discharge notch.

9. The splicing device according to claim 8, characterized in that: A fixing plate is disposed on the second plate portion, the fixing plate protrudes from a side of the second plate portion away from the first plate portion, a through hole is formed on the fixing plate, and an end of the liquid inlet pipe away from the spray pipe passes through the through hole.

10. A slicer, characterized in that: It comprises a cutting line, at least two main rollers and a splicing device according to any one of claims 1 to 9; The cutting line is wound around at least two of the main rollers, the splicing device is located between the at least two main rollers, and the splicing device comprises a box body, the top of the box body is provided with a box opening for silicon wafers to enter and exit, and the box opening faces the cutting line.

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