Silicon wafer boat bearing mechanism for CVD (chemical vapor deposition) furnace body

By designing multiple uniform air outlets and distribution paths on the furnace cover in the silicon wafer boat support mechanism of the CVD furnace body, the problem of uneven flange inflation is solved, and the uniform supply of process gas and the improvement of process processing effect is achieved.

CN222809536UActive Publication Date: 2025-04-29WUXI PULE NEW ENERGY CO LTD
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Patent Information

Application Number
CN202421144222.6
Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
Filing Date
2024-05-24
Publication Date
2025-04-29
Estimated Expiration
2034-05-24

AI Technical Summary

Technical Problem

The existing flanges are unevenly inflated to the CVD furnace body, resulting in concentrated process gases at the edge of the furnace body and thin in the center of the furnace body, affecting the effect of subsequent process processing.

Method used

A silicon wafer boat support mechanism for CVD furnace body is designed, and multiple uniformly arranged air outlets and distribution gas paths on the furnace cover are used to ensure that the process gas enters the furnace body evenly.

Benefits of technology

Through uniform process gas supply, the process processing effect is improved, the problem of uneven gas inflation is avoided, and the stability and efficiency of subsequent processes are enhanced.

✦ Generated by Eureka AI based on patent content.

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Abstract

The utility model provides a silicon wafer boat bearing mechanism for a CVD furnace body, the silicon wafer boat bearing mechanism comprises a paddle assembly and a furnace cover, the paddle assembly is used for bearing a silicon wafer boat, a first end of the paddle assembly penetrates through the furnace cover, a distribution gas path is arranged in the furnace cover, the furnace cover further comprises a first gas inlet hole formed in the circumferential side surface or the outer side surface, and a second gas inlet hole is formed in the furnace cover. A plurality of first gas outlets are formed in the inner side face, facing the CVD furnace body, of the furnace cover, the gas distribution path is communicated with the first gas outlets, the gas supply path is in butt joint with the first gas inlets, so that process gas enters the gas distribution path through the first gas inlets and evenly flows into the CVD furnace body from the gas outlets, and the process effect is improved.
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Description

Technical Field

[0001] The present application relates to the field of photovoltaic automation production equipment, and specifically to a silicon wafer boat supporting mechanism for a CVD furnace body. Background Art

[0002] CVD furnace (full name: Chemical Vapor Deposition, Chinese: Chemical Vapor Deposition Equipment) is a coating equipment used to perform chemical vapor deposition process on silicon wafers. Before coating, a support mechanism is required to send the silicon wafer boat into the furnace body, form a seal, and then fill it with process gas.

[0003] At present, the industry usually inflates the furnace body through the flange at the entrance of the furnace body. The outer circle of the flange is provided with an air inlet, the inside of the flange is provided with a gas path, and the inner circle surface of the flange is evenly provided with multiple air outlet holes. Since the flange is annular, the air outlet holes are arranged in a ring shape. After the furnace body is inflated through the air outlet holes arranged in a ring shape on the flange, the process gas is often concentrated at the edge of the furnace body and diluted in the center of the furnace body, that is, the inflation is uneven, which is not conducive to subsequent process treatment. Utility Model Content

[0004] The purpose of this application is to solve the technical problem of uneven gas filling from the existing flange to the furnace body. This application provides a silicon wafer boat supporting mechanism for a CVD furnace body, which adopts the following technical solutions:

[0005] The purpose of this application is to achieve the following technical solutions:

[0006] A silicon wafer boat supporting mechanism for a CVD furnace body, the silicon wafer boat supporting mechanism comprises a paddle assembly and a furnace cover, wherein: the first end of the paddle assembly is penetrated through the furnace cover; a distribution gas path is arranged inside the furnace cover, the furnace cover also comprises a first air inlet hole arranged on the circumferential side surface or the outer side surface, a plurality of evenly arranged first air outlet holes are arranged on the inner side surface of the furnace cover facing the CVD furnace body, the distribution gas path is connected with the plurality of first air outlet holes, and the gas supply gas path is connected with the first air inlet holes, so that the process gas enters the distribution gas path through the first air inlet holes and flows from the plurality of first air outlet holes to the inside of the CVD furnace body.

[0007] The supporting mechanism of the present application can form a closed environment with the furnace body after the silicon wafer boat is sent into the furnace body, and then the gas supply line supplies gas into the furnace body through multiple evenly arranged gas outlets on the furnace cover. Compared with the traditional flange gas supply, the supporting mechanism provided by the present application can supply gas more evenly due to the evenly arranged gas outlets on the furnace cover, thereby improving the process treatment effect.

[0008] Optionally, the silicon wafer boat supporting mechanism further includes a first connecting plate, the paddle assembly includes a first paddle and a second paddle, the first paddle and the second paddle are parallel to each other to jointly support the silicon wafer boat, and the first connecting plate is used to fix the second ends of the first paddle and the second paddle.

[0009] The paddle assembly can be a single paddle or a pair of paddles, and can be flexibly arranged according to actual conditions. The double paddles and the first connecting plate are arranged to effectively improve the stability of the double-paddle silicon wafer boat.

[0010] Optionally, the furnace cover includes a furnace cover body and a cover plate, an inner side surface of the furnace cover body is provided with an air path groove, the cover plate is configured to form a distribution air path after sealingly docking with the air path groove, and a plurality of first air outlet holes are evenly arranged on the cover plate.

[0011] The cover plate and the gas path groove are arranged to cooperate to form a distribution gas path, which is not only easy to produce and process, but also convenient for later maintenance.

[0012] Optionally, a sealing strip is provided between the cover plate and the gas path groove.

[0013] By arranging a sealing strip between the cover plate and the gas path groove, the air tightness between the cover plate and the gas path groove is further improved, and the process gas is prevented from overflowing from the edge of the cover plate.

[0014] Optionally, a flange is provided at the entrance of the CVD furnace body, a second air inlet hole is provided on the circumferential outer side surface of the flange, a second air outlet hole is provided on the inner circle of the flange, an annular air path arranged circumferentially is provided inside the flange, the annular air path connects the second air inlet hole and the second air outlet hole, the furnace cover also includes a first air inlet hole arranged on the circumferential side surface, and the flange is configured so that when the furnace cover is docked with the CVD furnace body, the gas supply path supplies gas to the first air inlet hole of the furnace cover through the annular air path of the flange.

[0015] By providing a flange for docking, it is convenient to supply process gas to the furnace cover that has been docked to the furnace body. At the same time, this setting can also be used to transform and upgrade existing equipment to achieve the technical effect of uniform gas supply at a lower cost.

[0016] Optionally, the silicon wafer boat supporting mechanism also includes a second connecting plate and at least one elastic bellows, the first end of the paddle assembly is passed through the second connecting plate and fixedly connected to the second connecting plate, at least one elastic bellows is sleeved on the paddle assembly, and the first end of at least one elastic bellows is fixedly connected to the second connecting plate, and the second end of at least one elastic bellows is fixedly connected to the furnace cover.

[0017] The furnace cover is installed by using the second connecting plate and the elastic bellows, so that the furnace cover can be moved within a certain range, thereby avoiding damage caused by rigid collision when the furnace cover is connected to the furnace body.

[0018] Optionally, the silicon wafer boat supporting mechanism also includes at least one flow equalizing plate located on the first paddle and the second paddle, the flow equalizing plate is evenly provided with a plurality of first through holes, the first paddle and the second paddle are penetrated by at least one flow equalizing plate, and at least one flow equalizing plate is located on the inner side of the furnace cover, and at least one flow equalizing plate is used to evenly distribute the process gas leaving the gas outlet.

[0019] By providing at least one flow equalizing plate, the process gas leaving the first gas outlet can be further homogenized, thereby improving the uniformity of the process gas in the furnace body.

[0020] Optionally, the silicon wafer boat supporting mechanism includes at least two current balancing plates, and through holes of two adjacent current balancing plates are arranged in a staggered manner.

[0021] By providing at least two flow equalizing plates with through holes arranged in staggered positions, the uniformity of the process gas in the furnace body is further improved.

[0022] Optionally, the outer diameter of at least one flow balancing plate is the same as the inner diameter of the CVD furnace body.

[0023] By setting the outer diameter of the flow equalizing plate to be basically consistent with the inner diameter of the furnace body, the process gas cannot pass between the outer edge of the flow equalizing plate and the inner wall of the furnace body, ensuring that the process gas must be processed by the flow equalizing plate before entering the furnace body.

[0024] Optionally, the silicon wafer boat supporting mechanism also includes a linear module, a servo motor and a mounting plate, the mounting plate is fixedly arranged on the driving end of the linear module, and the first fixed block, the second fixed block, the third fixed block and the fourth fixed block are arranged in an array on the upward side or the one side of the mounting plate, and a second through hole is arranged at the center of each fixed block, the first end of the first paddle is sequentially extended into the second through holes of the first fixed block and the second fixed block, and the first end of the second paddle is sequentially extended into the second through holes of the third fixed block and the fourth fixed block, and the servo motor is configured to drive the mounting plate to move through the linear module to drive the first paddle and the second paddle to extend into or be pulled out of the CVD furnace body.

[0025] By setting up 4 fixing blocks, linear modules and servo motors, it is convenient to install the double propellers. At the same time, the fixing blocks have a simple structure and are easy to maintain.

[0026] Optionally, the silicon wafer boat supporting mechanism also includes a rotating seat and two suspension rods. The first fixed block and the third fixed block are rotatably mounted on the downward side of the mounting plate through the rotating seat, and the second fixed block and the fourth fixed block are fixedly mounted on the lower ends of the suspension rods. The suspension rods pass through the mounting plate in the vertical direction and are fixedly connected to the mounting plate in a height-adjustable manner.

[0027] The fixing block is arranged to be connected to the mounting plate via a swivel seat or a boom, and the horizontal positions of the two propellers can be adjusted respectively by adjusting the position of the boom on the mounting plate. BRIEF DESCRIPTION OF THE DRAWINGS

[0028] Figure 1 A schematic diagram of the structure of the silicon wafer boat supporting mechanism provided in an embodiment of the present application at a first viewing angle;

[0029] Figure 2 A schematic diagram of the structure of a furnace cover provided in an embodiment of the present application at a second viewing angle, wherein (a) is a furnace cover with a cover plate installed on the inner side, and (b) is a furnace cover without a cover plate installed on the inner side;

[0030] Figure 3 A schematic diagram of the structure of a CVD furnace provided in an embodiment of the present application from a third viewing angle;

[0031] Figure 4 A schematic structural diagram of a CVD furnace provided in an embodiment of the present application and equipped with a first paddle and a second paddle at a fourth viewing angle;

[0032] Figure 5 A schematic structural diagram of the ends of the first paddle and the second paddle provided in an embodiment of the present application at a fifth viewing angle;

[0033] Figure 6 A schematic diagram of a structure in which a first paddle and a second paddle provided in an embodiment of the present application are installed on a linear module through a mounting plate at a sixth viewing angle;

[0034] Figure 7 A schematic structural diagram of the first paddle and the second paddle provided in an embodiment of the present application installed on a mounting plate at a seventh viewing angle.

[0035] Figures 1 to 7 The following reference numerals are included:

[0036] 1- Wafer boat supporting mechanism;

[0037] 11-first paddle; 111-first end of the first paddle; 112-second end of the first paddle;

[0038] 12-second paddle; 121-first end of second paddle; 122-second end of second paddle;

[0039] 13-furnace cover; 131-first air outlet; 132-furnace cover body; 133-cover plate; 134-gas path groove;

[0040] 14-first connecting plate; 15-second connecting plate; 16-elastic bellows;

[0041] 17-current balancing plate; 171-first through hole;

[0042] 18-Linear module; 19-Servo motor;

[0043] 20-mounting plate; 201-first fixing block; 202-second fixing block; 203-third fixing block; 204-fourth fixing block;

[0044] 21- rotating seat; 22- hanging rod;

[0045] 2- Silicon wafer boat;

[0046] 3-CVD furnace body; 31-flange. DETAILED DESCRIPTION

[0047] The following will be combined with the drawings in the embodiments of the present disclosure to clearly and completely describe the technical solutions in the embodiments of the present disclosure. Obviously, the described embodiments are part of the embodiments of the present disclosure, rather than all of the embodiments. Based on the embodiments in the present disclosure, all other embodiments obtained by those skilled in the art without creative work are within the scope of protection of the present disclosure.

[0048] Existing CVD furnaces usually charge process gas into the furnace body through a flange set at the entrance of the furnace body. However, since the flange is annular, the process gas charging is often uneven, which is not conducive to subsequent process treatment. The process gas referred to in this application is a gas that may be used in a CVD furnace, such as nitrogen, silane gas, etc.

[0049] like Figure 1 As shown, an embodiment of the present application provides a silicon wafer boat supporting mechanism for a CVD furnace body, including a paddle assembly and a furnace cover, wherein the first end of the paddle assembly is inserted through the furnace cover. A distribution gas path is also provided inside the furnace cover, and a first air inlet hole connected to the distribution gas path is provided on one of the circumferential side surface and the outer side surface of the furnace cover, and a first air outlet hole connected to the distribution gas path is provided on the inner side surface of the furnace cover, and the gas supply path is connected to the first air inlet hole, so that the process gas leaves from the gas supply path and enters the first air inlet hole, then flows along the distribution gas path and leaves from the first air outlet hole to enter the CVD furnace body.

[0050] The "gas supply circuit" mentioned in this application refers to the gas source mechanism for supplying process gas, which may include a gas storage tank and common gas circuit components, such as gas pipes, valves, manifold blocks, etc. In addition, the "inner side of the furnace cover" mentioned in this application refers to the side of the furnace cover facing the CVD furnace body, and correspondingly, the outer side of the furnace cover refers to the side of the furnace cover facing away from the CVD furnace body.

[0051] Optionally, the paddle assembly may include a single paddle, or may include a first paddle and a second paddle arranged parallel to each other. If a double-paddle design is adopted, a first connecting plate is also required. The first connecting plate is fixedly mounted on the second ends of the first paddle and the second paddle to fix the second ends of the first paddle and the second paddle to prevent the two paddles from deforming or misaligning, which is not conducive to carrying the silicon wafer boat. The following text will use the paddle assembly including double paddles as an example for explanation, and the same applies to the case of a single paddle.

[0052] The present application sets a plurality of first gas outlet holes on the inner side surface of the furnace cover, so that the process gas enters evenly from the furnace body end, prevents uneven gas injection of the process gas, and improves the subsequent process treatment effect.

[0053] Furthermore, if Figure 2 As shown, the furnace cover includes a furnace cover body and a cover plate, and a gas path groove is provided on the inner side of the furnace cover body. When the cover plate is placed on the gas path groove, the two are closed to form a distribution gas path. At this time, a plurality of first gas outlet holes are evenly arranged on the cover plate, and the plurality of first gas outlet holes are located in the extension path of the gas path groove, so that the process gas can move along the gas path groove and leave from the plurality of first gas outlet holes and enter the CVD furnace body.

[0054] Such an arrangement is convenient for the production and processing of the furnace cover, as well as the installation and maintenance of the furnace cover.

[0055] It should be noted that Figure 2 (b) only shows the general direction of the air path groove, and does not show how the air path groove is connected to the second air inlet hole. Those skilled in the art can make adaptive settings according to actual conditions to connect the air path groove and the second air inlet hole to achieve air intake through the air path groove.

[0056] Furthermore, a sealing strip is provided between the cover plate and the gas path groove, and the sealing strip can be made of a strip-shaped material formed of high-temperature resistant rubber or other high-temperature resistant elastic material, or can be directly formed by using high-temperature resistant glue between the cover plate and the gas path groove. This arrangement can prevent the process gas in the gas path groove from overflowing from the edge of the cover plate, and avoid the process gas from flowing from one branch of the gas path groove to another branch path as expected, resulting in uneven gas discharge from multiple gas outlets.

[0057] Optionally, refer to Figure 3-4 A flange is also provided at the entrance of the CVD furnace body, a second air inlet is provided on the annular outer side surface of the flange, a second air outlet is provided on the annular inner side surface of the flange, an annular gas path is provided inside the flange, the second air inlet is connected with the second air outlet through the annular gas path, and the gas supply path injects process gas into the second air inlet, and the process gas leaves from the second air outlet after passing through the annular gas path and enters the first air inlet of the furnace cover.

[0058] By using the flange to supply air to the furnace cover, existing equipment can be easily upgraded and modified. The existing equipment can improve the problem of uneven air intake at the end by simply replacing the furnace door.

[0059] Optionally, refer to Figure 5 As shown, the silicon wafer boat supporting mechanism also includes a second connecting plate and an elastic bellows. The second connecting plate is fixedly mounted on the first end of the first paddle and the second paddle to prevent the two paddles from being misaligned and to keep the two paddles parallel. There are two elastic bellows, and the first end of the first paddle and the second paddle passes through an elastic bellows respectively. One end of the two elastic bellows is fixedly connected to the outer side of the furnace cover, and the other ends of the two elastic bellows are fixedly connected to the second connecting plate, so that the furnace cover is fixed to the two paddles through the elastic bellows and the second connecting plate, so as to prevent the furnace cover from being rigidly impacted due to the failure to accurately align the flange when the two paddles carry the silicon wafer boat into the CVD furnace body, thereby causing structural damage.

[0060] Optionally, continue to refer to Figure 5 As shown, the wafer boat supporting mechanism also includes at least one flow equalizing plate fixedly mounted on the first paddle and the second paddle, and a plurality of through holes of the same size are evenly arranged on the flow equalizing plate. After the process gas leaves the first gas outlet of the furnace cover, it will be further evenly distributed by the flow equalizing plate, thereby further improving the problem of uneven air intake at the end.

[0061] Furthermore, the silicon wafer boat supporting mechanism includes at least two flow equalizing plates, which are evenly arranged along the first paddle and the second paddle at a fixed distance, and the through holes of two adjacent flow equalizing plates are staggered to prevent the process gas from flowing in a straight line, further improving the effect of uniform gas.

[0062] Furthermore, the outer diameter of the flow equalizing plate is substantially consistent with the inner diameter of the CVD furnace body, which can avoid or at least reduce the process gas from directly entering the furnace body along the inner side of the CVD furnace body without passing through the through holes of the flow equalizing plate.

[0063] Alternatively, if Figure 6-7 The silicon wafer boat supporting mechanism also includes a linear module, a servo motor, and a mounting plate. The mounting plate is fixedly mounted on the driving end of the linear module. The upward or downward side of the mounting plate is also arrayed with a first fixed block, a second fixed block, a third fixed block, and a fourth fixed block. A second through hole is arranged at the center of each fixed block. The first end of the first paddle extends into the second through holes of the first fixed block and the second fixed block in sequence, and the first end of the second paddle extends into the second through holes of the third fixed block and the fourth fixed block in sequence. The servo motor is configured to drive the mounting plate to move through the linear module to drive the first paddle and the second paddle to extend into or be pulled out of the CVD furnace body.

[0064] Further, continue as Figure 7As shown, the wafer boat supporting mechanism also includes two rotating seats and two suspension rods, and the rotating seats and the suspension rods are both mounted on the mounting plate. More specifically, the first fixed block and the third fixed block are rotatably mounted on the lower side of the mounting plate through a rotating seat, and the second fixed block and the fourth fixed block are fixedly mounted on the lower end of a suspension rod, respectively. The suspension rod passes through the mounting plate in the vertical direction and is fixedly connected to the fixed plate in an adjustable height. It can be seen that through the setting of the rotating seat and the suspension rod, the inclination of each paddle can be adjusted quickly and conveniently, for example, it can be set to a horizontal or other required angle.

[0065] The present application is described in sufficient detail above with certain particularity. It should be understood by those skilled in the art that the description in the embodiments is merely exemplary, and all changes made without departing from the true spirit and scope of the present application should fall within the scope of protection of the present application. The scope of protection claimed in the present application is defined by the claims, rather than by the above description in the embodiments.

Claims

1. A silicon wafer boat supporting mechanism for a CVD furnace, characterized in that: The silicon wafer boat supporting mechanism includes a paddle assembly and a furnace cover, wherein: the paddle assembly is used to carry the silicon wafer boat, and the first end of the paddle assembly is penetrated through the furnace cover; a distribution gas circuit is arranged inside the furnace cover, and the furnace cover also includes a first air inlet hole arranged on the circumferential side or the outer side; the inner side of the furnace cover facing the CVD furnace body is provided with a plurality of evenly arranged first air outlet holes, the distribution gas circuit is connected with the plurality of first air outlet holes, and the gas supply gas circuit is connected with the first air inlet holes, so that the process gas enters the distribution gas circuit through the first air inlet hole, and flows from the plurality of first air outlet holes to the inside of the CVD furnace body.

2. A silicon wafer boat supporting mechanism for a CVD furnace as claimed in claim 1, characterized in that: The silicon wafer boat supporting mechanism also includes a first connecting plate, and the paddle assembly includes a first paddle and a second paddle. The first paddle and the second paddle are parallel to each other to jointly support the silicon wafer boat, and the first connecting plate is used to fix the second ends of the first paddle and the second paddle.

3. The silicon wafer boat supporting mechanism for a CVD furnace according to claim 1, characterized in that: The furnace cover comprises a furnace cover body and a cover plate. An air path groove is provided on the inner side of the furnace cover body. The cover plate is configured to form the distribution air path after being sealed and docked with the air path groove. A plurality of the first air outlet holes are evenly arranged on the cover plate.

4. A silicon wafer boat supporting mechanism for a CVD furnace as claimed in claim 3, characterized in that: A sealing strip is arranged between the cover plate and the gas path groove.

5. The silicon wafer boat supporting mechanism for a CVD furnace according to claim 1, characterized in that: A flange is provided at the entrance of the CVD furnace body, a second air inlet hole is provided on the circumferential outer side surface of the flange, a second air outlet hole is provided on the inner circle of the flange, an annular air path arranged circumferentially is provided inside the flange, the annular air path connects the second air inlet hole and the second air outlet hole, the furnace cover also includes a first air inlet hole arranged on the circumferential side surface, and the flange is configured so that when the furnace cover is docked with the CVD furnace body, the gas supply path supplies gas to the first air inlet hole of the furnace cover through the annular air path of the flange.

6. The silicon wafer boat supporting mechanism for a CVD furnace according to claim 1, characterized in that: The silicon wafer boat supporting mechanism also includes a second connecting plate and at least one elastic bellows. The first end of the paddle assembly is passed through the second connecting plate and fixedly connected to the second connecting plate. The at least one elastic bellows is sleeved on the paddle assembly, and the first end of the at least one elastic bellows is fixedly connected to the second connecting plate. The second end of the at least one elastic bellows is fixedly connected to the furnace cover.

7. The silicon wafer boat supporting mechanism for a CVD furnace according to claim 2, characterized in that: The silicon wafer boat supporting mechanism also includes at least one flow equalizing plate located on the first paddle and the second paddle, the flow equalizing plate is evenly provided with a plurality of first through holes, the first paddle and the second paddle are penetrated by the at least one flow equalizing plate, and the at least one flow equalizing plate is located on the inner side of the furnace cover, and the at least one flow equalizing plate is used to evenly distribute the process gas leaving from the first gas outlet.

8. The silicon wafer boat supporting mechanism for a CVD furnace according to claim 7, characterized in that: The silicon wafer boat supporting mechanism comprises at least two current equalizing plates, and the first through holes of two adjacent current equalizing plates are arranged in a staggered manner.

9. The silicon wafer boat supporting mechanism for a CVD furnace according to claim 7, characterized in that: The outer diameter of the at least one flow balancing plate is the same as the inner diameter of the CVD furnace body.

10. The silicon wafer boat supporting mechanism for a CVD furnace according to claim 2, characterized in that: The silicon wafer boat supporting mechanism also includes a linear module, a servo motor and a mounting plate. The mounting plate is fixedly arranged on the driving end of the linear module. The first fixed block, the second fixed block, the third fixed block and the fourth fixed block are arranged in an array on the upper side or the one side of the mounting plate. A second through hole is arranged at the center of each fixed block. The first end of the first paddle extends into the second through holes of the first fixed block and the second fixed block in sequence, and the first end of the second paddle extends into the second through holes of the third fixed block and the fourth fixed block in sequence. The servo motor is configured to drive the mounting plate to move through the linear module to drive the first paddle and the second paddle to extend into or be pulled out of the CVD furnace body.

11. A silicon wafer boat supporting mechanism for a CVD furnace as claimed in claim 10, characterized in that: The silicon wafer boat supporting mechanism also includes two rotating seats and two suspension rods. The first fixed block and the third fixed block are rotatably mounted on the downward side of the mounting plate through the rotating seats, and the second fixed block and the fourth fixed block are fixedly mounted on the lower ends of the suspension rods, respectively. The suspension rods pass through the mounting plate in a vertical direction and are fixedly connected to the mounting plate in a height-adjustable manner.

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