Dimming device

Abstract

This dimming device is provided with: a panel unit in which a plurality of dimming panels are laminated in a first direction, each dimming panel having a first substrate having a first terminal and a second substrate that overlaps the first substrate and has a second terminal; an external connection wire connected to at least one of the first terminal and the second terminal; and a conductive member provided at an end portion of the panel unit in a second direction intersecting the first direction, the conductive member extending in the first direction, the conductive member extending from a dimming panel located closest to one side of the panel unit in the first direction to a dimming panel located closest to the other side of the panel unit in the first direction, and the first terminal of the first substrate and the second terminal of the second substrate in each dimming panel are connected.

Description

Technical Field

[0001] The present disclosure relates to a dimming device. Background Art

[0002] The dimming device of patent document 1 includes a dimming panel. The dimming panel includes, for example, an array substrate and an opposing substrate, and a liquid crystal layer sealed between these substrates. When incident light enters the dimming panel, the transmittance of the incident light is adjusted in the dimming panel, and the adjusted transmitted light is emitted from the dimming device. In the dimming panel, the array substrate on the lower side and the opposing substrate on the upper side are stacked up and down. In addition, terminals are respectively provided on the array substrate and the opposing substrate. The wiring for external connection is respectively connected to the terminals of the array substrate and the terminals of the opposing substrate in one dimming panel. That is, two wirings for external connection are connected to each dimming panel.

[0003] Prior art literature

[0004] Patent Literature

[0005] Patent Document 1: Japanese Patent Application Publication No. 2004-333567 Utility Model Content

[0006] Technical problems to be solved by the utility model

[0007] It is desired to further reduce the number of external connection wirings such as flexible printed circuit boards used in light control devices.

[0008] The present disclosure has been made in view of the above circumstances, and an object of the present disclosure is to provide a dimming device capable of reducing the number of external connection wirings such as a flexible printed circuit board connected to a terminal of a substrate of the dimming device.

[0009] Solutions for solving technical problems

[0010] A dimming device involved in one embodiment of the present disclosure includes: a panel unit, in which multiple dimming panels are stacked in a first direction, the dimming panels have a first substrate and a second substrate, the first substrate has a first terminal, and the second substrate overlaps with the first substrate and has a second terminal; external connection wiring, connected to at least one of the first terminal and the second terminal; and a conductive component, which is provided at an end of the panel unit in a second direction intersecting the first direction and extending in the first direction, the conductive component extends from the dimming panel located on one side closest to the first direction to the dimming panel located on the other side closest to the first direction in the panel unit, and connects the first terminal of the first substrate with the second terminal of the second substrate in each of the dimming panels.

[0011] In the dimming device according to this aspect, the dimming panel may have a polygonal shape when viewed from the first direction, and the first terminal and the second terminal may include straight line portions of strips extending along sides of the polygon.

[0012] In the dimming device involved in this method, for the first substrate and the second substrate included in the dimming panel, the end of one side in the second direction of at least either one of the surface of the first substrate on the second substrate side and the surface of the second substrate on the first substrate side has a chamfered portion, and the chamfered portion increases the distance between the first substrate and the second substrate along the first direction as it moves toward the side in the second direction.

[0013] In the dimming device involved in this method, it may be that, for the first substrate and the second substrate included in the dimming panel, at least one of the surface of the first substrate on the second substrate side and the surface of the second substrate on the first substrate side has a curved surface at one end on one side in the second direction, and the curved surface is bent into a convex shape, so that the distance between the first substrate and the second substrate along the first direction increases as it moves toward one side in the second direction.

[0014] In the dimming device according to this aspect, the conductive member may include a first layer containing silver and a second layer stacked on the first layer and containing carbon.

[0015] In the dimming device according to this aspect, a side surface of an end portion of at least one of the first substrate and the second substrate provided on the second direction side may have a concavo-convex portion.

[0016] In the dimming device according to this aspect, in each of the dimming panels, the first terminal of the first substrate and the second terminal of the second substrate may be connected by a conductor, and the conductive member may be connected to the conductor.

[0017] In the dimming device involved in this method, it can also be that, for the dimming panel arranged on the side of the panel unit closest to the first direction, the second substrate is arranged on the side of the first direction relative to the first substrate, and a translucent conductive film connected to the conductive component is formed on the surface of the second substrate on the side of the first direction, and the translucent conductive film is connected to the external connection wiring.

[0018] In the dimming device involved in this method, it can also be that, for the dimming panel located on the other side closest to the first direction in the panel unit, the second substrate is arranged on one side of the first substrate in the first direction, and a transparent conductive film connected to the conductive component is formed on the surface of the first substrate on the other side in the first direction, and the transparent conductive film is connected to the external connection wiring. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] Figure 1 It is a perspective view schematically showing the light control device according to the first embodiment.

[0020] Figure 2 yes Figure 1 A cross-sectional view of a dimming device.

[0021] Figure 3 is a schematic diagram showing a wafer provided with a plurality of units.

[0022] Figure 4 It is a stack of multiple Figure 3 A cross-sectional view of a unit.

[0023] Figure 5 is from Figure 2 The top view of the array substrate in the first and second dimming panels is shown from the upper side.

[0024] Figure 6 is from Figure 2 The top view of the opposing substrates in the first and second dimming panels is shown.

[0025] Figure 7 is from Figure 2 The top views of the array substrates in the third and fourth dimming panels from the upper side are shown.

[0026] Figure 8 is from Figure 2 The top view of the opposing substrates in the first and second dimming panels is shown.

[0027] Fig. 9 This is an exploded perspective view showing a state where four dimming panels are arranged in a vertically separated manner.

[0028] Fig.10 is a schematic diagram showing the stacking Fig. 9 A perspective view of a dimming device according to a first embodiment composed of four dimming panels is shown.

[0029] Fig.11 This is a table showing the relationship between four conductive members and the conductive members connected to the electrodes of the array substrate and the counter substrate in each dimming panel.

[0030] Fig.12 1 is a schematic diagram showing a state in which the dimming panels of the panel unit according to the first comparative example are stacked.

[0031] Fig.13 1 is a schematic diagram showing a state in which one conductive member is provided in the panel unit according to the first comparative example.

[0032] Fig.14 1 is a schematic diagram showing a dimming device according to a first comparative example.

[0033] Fig.15 1 is a schematic diagram showing a dimming device according to a second comparative example.

[0034] Fig.16 It is a perspective view schematically showing a dimming device according to a second embodiment.

[0035] Fig.17 is from Fig.16 The top view of the array substrate in the first and second dimming panels is shown from the upper side.

[0036] Fig.18 is from Fig.16 The top view of the opposing substrates in the first and second dimming panels is shown.

[0037] Fig.19 is from Fig.16 The top views of the array substrates in the third and fourth dimming panels from the upper side are shown.

[0038] Fig. 20 is from Fig.16 The top views of the opposing substrates in the third and fourth dimming panels are shown from the upper side.

[0039] Fig.21 It is a perspective view schematically showing a dimming device according to a third embodiment.

[0040] Fig. 22 is from Fig.21 The top view of the array substrate in the first and second dimming panels is shown from the upper side.

[0041] Fig.23 is from Fig.21 The top view of the opposing substrates in the first and second dimming panels is shown.

[0042] Fig.24 is from Fig.21 The top views of the array substrates in the third and fourth dimming panels from the upper side are shown.

[0043] Fig.25 is from Fig.21 The top views of the opposing substrates in the third and fourth dimming panels are shown from the upper side.

[0044] Fig.26 It is a schematic cross-sectional view showing a dimming device according to a first modification.

[0045] Fig. 27 It is a schematic cross-sectional view showing a dimming device according to a second modification.

[0046] Fig.28 It is a schematic cross-sectional view showing a dimming device according to a third modification.

[0047] Fig.29 It is a schematic cross-sectional view showing a dimming device according to a fourth modification.

[0048] Fig.30 1 is a schematic cross-sectional view showing a dimming panel in which an array substrate and a counter substrate are connected by vias in a dimming device according to a fifth modification.

[0049] Fig.31 Is to show the stacking Fig.30 Schematic diagram of a panel unit composed of a dimming panel.

[0050] Fig.32 is Fig.31 A schematic diagram of a panel unit having a conductive component on the side thereof.

[0051] Fig.33 It is a schematic cross-sectional view showing a dimming device according to a sixth modification.

[0052] Fig.34 It is a schematic cross-sectional view showing a dimming device according to a seventh modification.

[0053] Fig.35 It is a schematic cross-sectional view showing a dimming device according to an eighth modification.

[0054] Fig.36 It is shown Fig.35 Schematic top view of a dimming device.

[0055] Fig.37 It is a top view of the array substrate in the dimming device involved in the ninth variation.

[0056] Fig.38 yes Fig.37 A cross-sectional view of line XXXVIII-XXXVIII. DETAILED DESCRIPTION

[0057] The mode (embodiment) for implementing the present disclosure is described in detail with reference to the accompanying drawings. The present disclosure is not limited to the contents described in the following embodiments. In addition, the constituent elements described below include elements that can be easily thought of by those skilled in the art, and substantially the same elements. Furthermore, the constituent elements described below can be appropriately combined.

[0058] In addition, the disclosure is only an example, and for those skilled in the art, appropriate changes that can be easily thought of while maintaining the subject matter of the disclosure are of course included in the scope of the present disclosure. In addition, in order to make the description clearer, the drawings sometimes schematically show the width, thickness, shape, etc. of each part compared to the actual method, but this is only an example and does not limit the interpretation of the present disclosure. In addition, in this specification and each figure, the same figure mark is sometimes used for the same elements as those described previously with respect to the figures that have appeared, and the detailed description is appropriately omitted. In addition, in the following description, the array substrate is also referred to as the first substrate or the lower substrate. The opposing substrate is also referred to as the second substrate or the upper substrate.

[0059] [First embodiment]

[0060] Figure 1 It is a perspective view schematically showing the light control device according to the first embodiment. Figure 2 yes Figure 1 A cross-sectional view of a dimming device. Figure 3 is a schematic diagram showing a wafer provided with a plurality of units. Figure 4 Is a stack of multiple Figure 3 A cross-sectional view of a unit.

[0061] In addition, in the XYZ coordinates shown in the figure, the X direction is the front-to-back direction, and the X1 side is opposite to the X2 side. The X1 side is also called the front side, and the X2 side is also called the back side. The Y direction is the left-to-right direction, and the Y1 side is opposite to the Y2 side. The Y1 side is also called the left side, and the Y2 side is also called the right side. The Z direction is the up-and-down direction (stacking direction). The Z1 side is opposite to the Z2 side. The Z1 side is also called the upper side, and the Z2 side is also called the lower side. In addition, the Z direction is also called the first direction, and the X direction and the Y direction are also called the second direction. For example, one side in the first direction is the Z1 side in the Z direction, and the other side in the first direction is the Z2 side in the Z direction.

[0062] like Figure 1 as well as Figure 2 As shown, the dimming device 100 according to the first embodiment includes a panel unit 110, a conductive member 500, and a flexible printed circuit (FPC: FLEXIBLE PRINTED CIRCUITS) 400 as an example of external connection wiring. The external connection wiring 400 is not limited to the flexible printed circuit, and may be a conductive wire.

[0063] like Figure 2 As shown, in this embodiment, the panel unit 110 is formed by stacking a plurality of (four in this embodiment) dimming panels 1 in the Z direction (first direction). The dimming panel 1 is a square in this embodiment, but the utility model is not limited thereto, and also includes polygons such as pentagons.

[0064] Specifically, if Figure 2 As shown, four dimming panels 1 are stacked in sequence from the upper side to form dimming panels 1A, 1B, 1C, and 1D. Each dimming panel 1 includes an array substrate 2 arranged on the lower side, an opposing substrate 3 arranged on the upper side, a seal 600 provided between the array substrate 2 and the opposing substrate 3, a liquid crystal layer 4 filled inside the seal 600, and a terminal 200. In addition, the inside of the seal 600 is an effective area. In addition, when observed from the Z direction, the array substrate 2 and the opposing substrate 3 have the same size. Moreover, for example, the wiring (flexible printed substrate) 400 for external connection is electrically connected to the terminal 200 of the array substrate 2 in the dimming panel 1D located at the lowermost side.

[0065] In addition, on the side of the panel unit 110, the conductive member 500 extends in the up-down direction (see the Fig.10 ). The conductive member 500 may be made of, for example, silver (Ag) or carbon (C). The conductive member 500 is formed by, for example, applying a paste containing a conductive material to the array substrate 2 and curing the paste.

[0066] Next, a procedure for manufacturing the panel unit 110 by cutting the stacked wafers into individual pieces up and down will be briefly described.

[0067] like Figure 3 As shown in FIG. 4 , a sealing member 600 and a liquid crystal layer 4 are arranged on the wafer 45 at a fixed interval. The dotted line shows the dividing line 47. In this way, a plurality of liquid crystal units are manufactured on the wafer 45. Next, as shown in FIG. Figure 4 As shown in FIG. 1 , the wafer 45 having the liquid crystal unit is bonded and stacked up and down using a light-transmitting adhesive 720 (such as OCR). Figure 4 The individual pieces are cut along the dividing lines 47 by a wire saw, a dicing device, etc. Thus, the panel unit 110 is completed.

[0068] Next, wirings and terminals of the array substrate 2 and the counter substrate 3 constituting the panel unit 110 will be described in detail. Figure 5 is from Figure 2 The top view of the array substrate in the first and second dimming panels is shown from the upper side. Figure 6 is from Figure 2 The top view of the opposing substrates in the first and second dimming panels is shown. Figure 7is from Figure 2 The top views of the array substrates in the third and fourth dimming panels from the upper side are shown. Figure 8 is from Figure 2 The top view of the opposing substrates in the first and second dimming panels is shown. Fig. 9 This is an exploded perspective view showing a state where four dimming panels are arranged in a vertically separated manner. Fig.10 is a schematic diagram showing a stacked Fig. 9 The four dimming panels shown are perspective views of a dimming device according to a first embodiment. Fig.11 This is a table showing the relationship between four conductive members and the conductive members connected to the electrodes of the array substrate and the counter substrate in each dimming panel.

[0069] As mentioned above, refer to Fig. 9 The four dimming panels are stacked in order from the top to form a dimming panel 1A, a dimming panel 1B, a dimming panel 1C and a dimming panel 1D.

[0070] like Figure 5 As shown, the array substrate 2 of the dimming panel 1A and the dimming panel 1B includes first terminals 210, 220, 230, 240 and a liquid crystal driving electrode 250. In addition, the array substrate 2 is a square when viewed from above, and has a first side 21, a second side 22, a third side 23 and a fourth side 24. The first side 21 is located on the X1 side. The second side 22 is located on the X2 side. The third side 23 is located on the Y1 side. The fourth side 24 is located on the Y2 side.

[0071] The first terminal 210 has straight portions 213 and 215. The straight portions 213 and 215 are wide strips. The straight portion 213 extends from the end 211 to the end 212. The straight portion 213 extends along the first side 21. The straight portion 215 extends from the end 212 to the end 214. The end 214 is connected to the wiring 251. A liquid crystal drive electrode 250 is provided in the center of the array substrate 2, and the wiring 251 is electrically connected to the liquid crystal drive electrode 250. The wiring 251 extends in the Y direction. A plurality of liquid crystal drive electrodes 250 are provided, each extending in the X direction.

[0072] The first terminal 220 has straight portions 223 and 225. The straight portions 223 and 225 are wide strips. The straight portion 223 extends from the end 221 to the end 222. The straight portion 223 extends along the second side 22. The straight portion 225 extends from the end 222 to the end 224. The end 224 is connected to the wiring 252. The wiring 252 is connected to the liquid crystal drive electrode 250. The wiring 252 extends in the Y direction.

[0073] The first terminal 230 has a straight portion 233 . The straight portion 233 is a wide strip-shaped body. The straight portion 233 extends from the end 231 to the end 232 . The straight portion 233 extends along the third side 23 .

[0074] The first terminal 240 has a straight portion 243 . The straight portion 243 is a wide strip-shaped body. The straight portion 243 extends from the end 241 to the end 242 . The straight portion 243 extends along the fourth side 24 .

[0075] like Figure 6 As shown, the counter substrate 3 of the dimming panel 1A and the dimming panel 1B includes second terminals 310, 320, 330, 340 and a liquid crystal drive electrode 350. In addition, the counter substrate 3 is a square in a plan view, and has a first side 31, a second side 32, a third side 33 and a fourth side 34. The first side 31 is located on the X1 side. The second side 32 is located on the X2 side. The third side 33 is located on the Y1 side. The fourth side 34 is located on the Y2 side.

[0076] The second terminal 310 has a straight portion 313 . The straight portion 313 is a wide strip-shaped body. The straight portion 313 extends from the end 311 to the end 312 . The straight portion 313 extends along the first side 31 .

[0077] The second terminal 320 has a straight portion 323 . The straight portion 323 is a wide strip-shaped body. The straight portion 323 extends from the end 321 to the end 322 . The straight portion 323 extends along the second side 32 .

[0078] The second terminal 330 has straight portions 333 and 335. The straight portions 333 and 335 are wide strips. The straight portion 333 extends from the end 331 to the end 332. The straight portion 333 extends along the third side 33. The straight portion 335 extends from the end 332 to the end 334. The end 334 is connected to the wiring 351. A liquid crystal drive electrode 350 is provided in the center of the opposing substrate 3, and the wiring 351 is electrically connected to the liquid crystal drive electrode 350. The wiring 351 extends in the X direction. A plurality of liquid crystal drive electrodes 350 are provided, each extending in the Y direction.

[0079] The second terminal 340 has straight portions 343 and 345. The straight portions 343 and 345 are wide strips. The straight portion 343 extends from the end 341 to the end 342. The straight portion 343 extends along the fourth side 34. The straight portion 345 extends from the end 342 to the end 344. The end 344 is connected to the wiring 352. The wiring 352 is electrically connected to the liquid crystal drive electrode 350. The wiring 352 extends in the X direction.

[0080] Next, the dimming panels 1C and 1D are described. The dimming panels 1C and 1D are obtained by rotating the dimming panels 1A and 1B 90 degrees in the clockwise direction (right-hand direction). Therefore, the positions of the wiring, terminals, and electrodes of the array substrate 2 and the counter substrate 3 included in the dimming panels 1C and 1D are also obtained by rotating the wiring, terminals, and electrodes of the array substrate 2 and the counter substrate 3 included in the dimming panels 1A and 1B 90 degrees in the clockwise direction (right-hand direction).

[0081] Then, if Fig. 9 As shown in FIG. 1 , the dimming panels 1A, 1B, 1C, and 1D are stacked up and down to form a panel unit 110. Fig.10 As shown, a conductive component 500 is provided on the side of the panel unit 110. Specifically, four conductive components 510, 520, 530, and 540 are provided on the side of each side of the panel unit 110. Specifically, for example, a paste containing a conductive material such as silver or carbon is applied to the side of the panel unit 110 and then cured to form the conductive component 500. The paste is applied in a manner electrically connected to the terminal 200 of the array substrate 2 and the terminal 200 of the opposing substrate 3 in the dimming panel 1. Therefore, the terminal 200 of the array substrate 2 and the terminal 200 of the opposing substrate 3 in one dimming panel 1 are electrically connected via the conductive component 500. As described above, a conductive component 500 electrically connects the terminals 200 of the array substrate 2 and the terminals 200 of the opposing substrate 3 in the dimming panel 1D, the terminals 200 of the array substrate 2 and the terminals 200 of the opposing substrate 3 in the dimming panel 1C, the terminals 200 of the array substrate 2 and the terminals 200 of the opposing substrate 3 in the dimming panel 1B, and the terminals 200 of the array substrate 2 and the terminals 200 of the opposing substrate 3 in the dimming panel 1A.

[0082] Here, it is explained Fig.11 For example, the 210 (510) recorded in the column of the array substrate in the dimming panel 1A means Figure 5 The first terminal 210 is connected to the conductive component 510. Figure 5 As shown, the first terminal 210 is located on the X1 side. Fig.10 As shown, the conductive component 510 is also located on the X1 side. Therefore, the conductive component 510 disposed on the X1 side is electrically connected to the first terminal 210.

[0083] In addition, the 340 (520) written in the column of the counter substrate in the dimming panel 1D means Figure 8 The second terminal 340 is connected to the conductive component 520. Figure 8 As shown, the second terminal 340 is located on the X2 side. Fig.10As shown, the conductive member 520 is also located on the X2 side. Therefore, the conductive members 520 disposed on the X2 side are electrically connected to the second terminal 340. In the dimming device 100 according to the present embodiment, the liquid crystal cell for p-wave polarization and the liquid crystal cell for s-wave polarization are stacked and combined.

[0084] Next, a first comparative example will be described. Fig.12 1 is a schematic diagram showing a state in which the dimming panels of the panel unit according to the first comparative example are stacked. Fig.13 1 is a schematic diagram showing a state in which one conductive member is provided in the panel unit according to the first comparative example. Fig.14 1 is a schematic diagram showing a dimming device according to a first comparative example.

[0085] like Figure 12 to Figure 14 As shown, in the dimming device 100A and the panel unit 110A involved in the first comparative example, the counter substrate 3 is arranged offset in the Y direction relative to the array substrate 2. Specifically, the counter substrate 3 is offset to the Y1 side relative to the array substrate 2. In addition, the counter substrate 3 is arranged on the upper side of the terminal 200 of the array substrate 2 in a non-opposite manner. The array substrate 2 is arranged on the lower side of the terminal 300 of the counter substrate 3 in a non-opposite manner. The following briefly describes the manufacturing sequence of the dimming device 100A involved in the first comparative example.

[0086] First, if Fig.12 As shown in FIG. 1 , the dimming panel 10 including the array substrate 2, the counter substrate 3, the seal 600 and the liquid crystal layer 4 is stacked up and down. When the dimming panel 10 on the upper side and the dimming panel 10 on the lower side are bonded, a light-transmitting adhesive 720 such as OCA is used as an optical adhesive sheet. Fig.13 As shown, the panel unit 110A is manufactured. Fig.13 As shown, in the panel unit 110A, dimming panels 10A, 10B, 10C, and 10D are stacked in order from the upper side.

[0087] Then, if Fig.13 As shown in FIG. 1 , a conductive component 510 is provided on one side (Y2 side) of the side portion of the panel unit 110A. The conductive component 510 connects the terminals 200 of the array substrate 2 in each dimming panel 10 up and down. Fig.14 As shown, a conductive component 520 is provided on the other side (Y1 side) of the side portion of the panel unit 110A. The conductive component 520 connects the terminals 300 of the opposing substrates 3 in each dimming panel 10 up and down. In addition, the external connection wiring 400 is connected to the terminal 200 of the array substrate 2 in the dimming panel 10 located at the bottom, for example.

[0088] Next, a second comparative example will be described. Fig.151 is a schematic diagram showing a dimming device according to a second comparative example.

[0089] like Fig.15 As shown, in the dimming device 100F and the panel unit 110F according to the second comparative example, the conductive components 510 and 520 are connected to the terminals 200 of the array substrate 2 and are not connected to the counter substrate 3. In addition, the terminals 200 of the array substrate 2 are connected vertically through the conductive components 510, and are connected to the external connection wiring 400 through the terminals 200 of the dimming panel 10D. The dimming device 100F according to the second comparative example is briefly described below.

[0090] like Fig.15 As shown, the dimming panels 10 are stacked up and down to form a panel unit 110F. The dimming panel 10 includes an array substrate 2, an opposing substrate 3, a seal 600, and a liquid crystal layer 4. The array substrate 2 is larger than the opposing substrate 3. Specifically, the array substrate 2 is formed to be larger than the opposing substrate 3 in the X direction and the Y direction, and when viewed from the Z1 side, the terminals 200 provided on each side of the array substrate 2 are exposed from the opposing substrate 3. No terminals are provided on the opposing substrate 3. In the panel unit 110F, the dimming panels 10A, 10B, 10C, and 10D are stacked in sequence from the upper side.

[0091] A conductive component 510 is provided on one side (Y2 side) of the side portion of the panel unit 110F. The conductive component 510 connects the terminals 200 of the array substrate 2 in each dimming panel 10 vertically. In addition, a conductive component 520 is provided on the other side (Y1 side) of the side portion of the panel unit 110F. The conductive component 520 connects the terminals 200 of the array substrate 2 in each dimming panel 10 vertically. In addition, the external connection wiring (flexible printed circuit board) 400 is connected to the terminals 200 of the array substrate 2 in the dimming panel 10D located at the bottom, for example.

[0092] As described above, the dimming device 100 of the first embodiment includes: a panel unit 110, in which multiple dimming panels 1A, 1B, 1C, and 1 are stacked in the up and down direction (first direction, Z direction), and the dimming panels 1A, 1B, 1C, and 1 have an array substrate 2 (first substrate) and an opposing substrate 3, the array substrate 2 (first substrate) has first terminals 210, 220, 230, and 240, and the opposing substrate 3 has second terminals 310, 330, 330, and 340; an external connection wiring (flexible printed circuit board) 400, which is connected to the first terminal or the second terminal; and a conductive component 500, which is arranged on the side of the panel unit 110 (the end in the second direction) and extends in the up and down direction. The conductive component 500 extends from the dimming panel 1A located at the uppermost side (one side in the first direction) of the panel unit 110 to the dimming panel 1D located at the lowermost side (the other side in the first direction), and connects the first terminal of the array substrate 2 and the second terminal of the opposing substrate 3 in each dimming panel.

[0093] As described above, in Patent Document 1, since the terminals of the array substrate and the terminals of the counter substrate in one dimming panel are each connected to one external connection wiring 400, the number of external connection wirings 400 used in the entire dimming device increases. Specifically, in Patent Document 1, eight external connection wirings 400 are required.

[0094] However, in this embodiment and the first comparative example and the second comparative example, Fig.11 As described in the table, for example, external connection wiring 400 such as a flexible printed circuit board may be connected to a total of four locations, namely, the first terminals 210 and 220 of the array substrate 2 of the dimming panel 1D and the second terminals 330 and 340 of the counter substrate 3 of the dimming panel 1D.

[0095] That is, in the case of a dimming device having four stacked dimming panels, eight external connection wirings 400 are required in Patent Document 1, but in the present embodiment and the first and second comparative examples, four external connection wirings 400 are sufficient, and the number of external connection wirings 400 can be suppressed. In addition, since one of the four external connection wirings 400 can be arranged on each side of the rectangular dimming device 100, the connection operation of the external connection wirings 400 becomes easier than when the four external connection wirings 400 are concentrated on one side.

[0096] The dimming panels 1, 1A, 1B, 1C, 1D have a polygonal shape when viewed from the top and bottom, and the first terminals 210, 220, 230, 240 and the second terminals 310, 320, 330, 340 are strips extending along the sides of the polygon. Thus, since wide terminals are arranged along the edges of the dimming panels 1, 1A, 1B, 1C, 1D, it is easy to connect the terminals to the external connection wiring 400 such as a flexible printed substrate.

[0097] In addition, in the first comparative example and the second comparative example, when viewed from the Z1 side, the terminal 200 of the array substrate 2 is exposed from the opposing substrate 3, so the connection between the external connection wiring (flexible printed substrate) 400 and the terminal 200 is easier than in the first embodiment. However, in the conductive components 510 and 520 involved in the first comparative example and the second comparative example, the Z direction distance between the connecting portion of the conductive components 510 and 520 and the substrate is larger than in the first embodiment. For example, in the first comparative example, Fig.13 As shown, the conductive component 510 is connected to the array substrate 2 of the dimming panel 10A, the array substrate 2 of the dimming panel 10B, the dimming panel 10C, and the array substrate 2 of the dimming panel 10D, but is not connected to the counter substrate 3. That is, the distance between the connecting parts of the conductive component 510 and the substrate in the Z direction is equal to the thickness of one dimming panel 10. Therefore, in the first comparative example and the second comparative example, it is difficult to control the application of the conductive paste of the conductive components 510 and 520.

[0098] In contrast, in the first embodiment, the array substrate 2 where the terminal 200 is located is opposite to the counter substrate 3, and the conductive components 510 and 520 are connected to the array substrate 2 and the counter substrate 3 of all the dimming panels 10. That is, the distance in the Z direction between the connecting portions of the conductive components 510 and 520 and the substrates becomes the distance in the Z direction between the array substrate 2 and the counter substrate 3. Therefore, in the first embodiment, the side surface of the panel unit 110, which is the coating surface of the conductive paste, is flattened compared to the first comparative example and the second comparative example, so that the control when the conductive paste of the conductive components 510 and 520 is coated becomes easy.

[0099] Furthermore, in the first comparative example and the second comparative example, since the array substrate 2 and the counter substrate 3 are different in size and have a region where one substrate does not overlap with the other substrate in the Z direction, as described above Figure 3 as well as Figure 4 As described above, it is impossible to cut a wafer having a plurality of array substrates 2 and a counter substrate 3 in a stacked state, which may lead to a decrease in the manufacturing efficiency of the dimming device and an increase in the manufacturing cost.

[0100] In contrast, the first embodiment has advantages not found in the first comparative example and the second comparative example in that the ease of applying the conductive paste of the conductive components 510 and 520 is improved, and the manufacturing efficiency can be improved by cutting the array substrate 2 and the counter substrate 3 together on the stacked wafer. In addition, in the first embodiment, the array substrate 2 and the counter substrate 3 overlap in the Z direction without misalignment in the Y direction and the X direction, so the frame of the panel unit 110 is narrowed, which also contributes to the miniaturization and narrow frame of the dimming device 100.

[0101] [Second Embodiment]

[0102] Next, a second embodiment will be described. Fig.16 It is a perspective view schematically showing a dimming device according to a second embodiment. Fig.17 is from Fig.16 The top view of the array substrate in the first and second dimming panels is shown from the upper side. Fig.18 is from Fig.16 The top view of the opposing substrates in the first and second dimming panels is shown. Fig.19 is from Fig.16 The top views of the array substrates in the third and fourth dimming panels from the upper side are shown. Fig. 20 is from Fig.16 The top views of the opposing substrates in the third and fourth dimming panels are shown from the upper side.

[0103] First, the wiring and terminals of the array substrate and the counter substrate constituting the panel unit 110 are described in detail. Fig.17 As shown, the array substrate 2A of the dimming panel 1A and the dimming panel 1B includes first terminals 210A, 220A, 230A, 240A and liquid crystal driving electrodes 250. The first side 21 is located on the X1 side. The second side 22 is located on the X2 side. The third side 23 is located on the Y1 side. The fourth side 24 is located on the Y2 side.

[0104] The first terminal 210A has straight portions 216A, 217A, 218A, and 219A. The straight portion 216A extends from the end 211A to the end 212A. The straight portion 217A extends from the end 212A to the end 213A. The straight portion 218A extends from the end 213A to the end 214A. The straight portion 219A extends from the end 214A to the end 215A. The end 215A is connected to the wiring 251. The straight portion 216A extends along the second side 22. The straight portion 217A extends along the fourth side 24. The straight portion 218A extends along the first side 21.

[0105] The first terminal 220A has a straight portion 223A. The straight portion 223A extends from the end 221A to the end 222A in the X direction. The end 222A is connected to the wiring 252 .

[0106] The first terminal 230A extends from the end 231A to the end 232A. The first terminal 240A extends from the end 241A to the end 242A. The first terminal 230A is arranged at a position closer to the X2 side than the first terminal 240A. The first terminal 230A and the first terminal 240A are arranged on the third side 23. Fig.18 As shown, the counter substrate 3A of the dimming panel 1A and the dimming panel 1B includes second terminals 310A, 320A, 330A, and 340A and liquid crystal driving electrodes 350 .

[0107] The second terminal 310A extends from the end 311A ​​to the end 312A. The second terminal 320A extends from the end 321A to the end 322A. The second terminal 310A is arranged on the Y2 side relative to the second terminal 320A. The second terminal 310A and the second terminal 320A are provided on the second side 32 .

[0108] The second terminal 330A is provided on the third side 33. The second terminal 340A has straight portions 346A, 347A, 348A, and 349A. The straight portion 346A extends from the end 341A to the end 342A. The straight portion 346A extends along the third side 33. The straight portion 347A extends from the end 342A to the end 343A. The straight portion 347A extends along the first side 31. The straight portion 348A extends from the end 343A to the end 344A. The straight portion 347A extends along the fourth side 34. The straight portion 349A extends from the end 344A to the end 345A. The end 345A is connected to the wiring 352.

[0109] Next, the dimming panels 1C and 1D are described. When viewed from above, the terminals, wirings, and liquid crystal drive electrodes of the array substrates in the dimming panels 1C and 1D are located in the same position as the terminals, wirings, and liquid crystal drive electrodes of the opposing substrates in the dimming panels 1A and 1B. Fig.19 The array substrate and Fig.18 The positions of the terminals, wirings and liquid crystal drive electrodes are the same as those of the opposing substrates shown in FIG. Fig. 20 The counter substrate and Fig.17 The positions of the terminals, wirings and liquid crystal driving electrodes of the array substrate shown are the same.

[0110] like Fig.19As shown, the array substrate 2B of the dimming panel 1C and the dimming panel 1D includes first terminals 210A, 220A, 230A, 240A and liquid crystal driving electrodes 250. The first side 21 is located on the X1 side. The second side 22 is located on the X2 side. The third side 23 is located on the Y1 side. The fourth side 24 is located on the Y2 side.

[0111] The first terminal 210A has straight portions 216A, 217A, 218A, and 219A. The straight portion 216A extends along the third side 23. The straight portion 217A extends along the first side 21. The straight portion 218A extends along the fourth side 24. The first terminal 210A is connected to the wiring 251.

[0112] The first terminal 220A has a straight portion 223A. The straight portion 223A is provided on the third side 23. The straight portion 223A is connected to the wiring 252.

[0113] The first terminal 230A and the first terminal 240A are provided on the second side 22. The first terminal 230A is arranged on the Y2 side relative to the first terminal 240A.

[0114] like Fig. 20 As shown, the counter substrate 3B of the dimming panel 1C and the dimming panel 1D includes second terminals 310A, 320A, 330A, and 340A and liquid crystal driving electrodes 350 .

[0115] The second terminals 310A and 320A are provided on the third side 33. The second terminal 310A is located closer to the X1 side than the second terminal 320A.

[0116] The second terminal 330A is disposed on the second side 32 .

[0117] The second terminal 340A has straight portions 346A, 347A, 348A, and 349A. The straight portion 346A extends along the second side 32. The straight portion 347A extends along the fourth side 34. The straight portion 348A extends along the first side 31. An end 345A of the straight portion 349A is connected to the wiring 352.

[0118] As described above, according to the second embodiment, in the case of a dimming device in which four dimming panels are stacked, in Patent Document 1, eight external connection wirings 400 are required, but in the present embodiment, the number of external connection wirings 400 is only four, and similarly to the first embodiment, the number of external connection wirings 400 can be suppressed.

[0119] Furthermore, since the straight portion 217A of the first terminal 210A and the straight portion 347A of the second terminal 340A extend over the entire area of ​​the side, the range for connecting the external connection wiring 400 is extended.

[0120] [Third Embodiment]

[0121] Next, a third embodiment will be described. Fig.21 It is a perspective view schematically showing a dimming device according to a third embodiment. Fig. 22 is from Fig.21 The top view of the array substrate in the first and second dimming panels is shown from the upper side. Fig.23 is from Fig.21 The top view of the opposing substrates in the first and second dimming panels is shown. Fig.24 is from Fig.21 The top views of the array substrates in the third and fourth dimming panels from the upper side are shown. Fig.25 is from Fig.21 The top views of the opposing substrates in the third and fourth dimming panels are shown from the upper side.

[0122] First, the wiring and terminals of the array substrate and the counter substrate constituting the panel unit 110 in the dimming device 100C according to the third embodiment are described in detail. In the third embodiment, in all dimming panels, four terminals are arranged on the same second side. The following is a specific description.

[0123] like Fig. 22 As shown, the array substrate 2C of the dimming panel 1A and the dimming panel 1B includes first terminals 210C, 220C, 230C, 240C and liquid crystal driving electrodes 250. The first side 21 is located on the X1 side. The second side 22 is located on the X2 side. The third side 23 is located on the Y1 side. The fourth side 24 is located on the Y2 side.

[0124] The first terminal 210C is provided on the second side 32. The end 211C of the first terminal 210C is connected to the wiring 252. The first terminal 220C has straight portions 222C, 223C, 224C, and 225C. The straight portion 222C extends from the second side 22 to the end 226C. The straight portion 223C extends from the end 226C to the end 227C. The straight portion 224C extends from the end 227C to the end 228C. The straight portion 225C extends from the end 228C to the end 229C. The end 229C is connected to the wiring 251.

[0125] The first terminal 230C is provided on the second side 22. The first terminal 230C is located closer to the Y2 side than the first terminal 210C.

[0126] The first terminal 240C is provided on the second side 22. The first terminal 240C is located on the Y1 side relative to the straight portion 222C.

[0127] On the second side 22 of the array substrate 2C, the first terminal 230C, the first terminal 210C, the straight portion 222C of the first terminal 220C, and the first terminal 240C are arranged in order from the Y2 side toward the Y1 side.

[0128] like Fig.23 As shown, the counter substrate 3C of the dimming panel 1A and the dimming panel 1B includes second terminals 310C, 320C, 330C, and 340C and liquid crystal driving electrodes 350 .

[0129] The second terminal 310C and the second terminal 320C are provided on the second side 32. The second terminal 310C is arranged on the Y2 side relative to the second terminal 320C.

[0130] The second terminal 330C includes straight portions 332C, 333C, and 334C. The straight portion 332C extends along the second side 32. The straight portion 333C extends along the fourth side 34. The straight portion 334C includes an end 331C, and the end 331C is connected to the wiring 352.

[0131] The second terminal 340C includes straight portions 342C, 343C, and 344C. The straight portion 342C extends along the second side 32. The straight portion 343C extends along the third side 33. The straight portion 344C includes an end 341C, and the end 341C is connected to the wiring 351.

[0132] Next, the dimming panels 1C and 1D are described. When viewed from above, the terminals, wirings, and liquid crystal drive electrodes of the array substrates in the dimming panels 1C and 1D are located in the same position as the terminals, wirings, and liquid crystal drive electrodes of the opposing substrates in the dimming panels 1A and 1B. Fig.24 The array substrate and Fig.23 The positions of the terminals, wirings and liquid crystal drive electrodes are the same as those of the opposing substrates shown in FIG. Fig.25 The counter substrate and Fig. 22 The positions of the terminals, wirings and liquid crystal driving electrodes of the array substrate shown are the same.

[0133] like Fig.24 As shown, the array substrate 2D of the dimming panel 1C and the dimming panel 1D includes first terminals 210D, 220D, 230D, 240D and liquid crystal driving electrodes 250. The first side 21 is located on the X1 side. The second side 22 is located on the X2 side. The third side 23 is located on the Y1 side. The fourth side 24 is located on the Y2 side.

[0134] The first terminal 210D has straight portions 212D, 213D, and 214D. The straight portion 212D extends along the second side 22. The straight portion 213D extends along the fourth side 24. The straight portion 214D has an end 211D, and the end 211D is connected to the wiring 251.

[0135] The first terminal 220D includes straight portions 222D, 223D, and 224D. The straight portion 222D extends along the second side 22. The straight portion 223D extends along the third side 23. The straight portion 224D includes an end 221D, and the end 221D is connected to the wiring 252.

[0136] The first terminals 230D and 240D are provided on the second side 22. The first terminal 230D is located closer to the Y2 side than the first terminal 240D.

[0137] like Fig.25 As shown, the counter substrate 3D of the dimming panel 1C and the dimming panel 1D includes second terminals 310D, 320D, 330D, and 340D and liquid crystal driving electrodes 350 .

[0138] The second terminal 310D and the second terminal 320D are provided on the second side 32. The second terminal 310D is located closer to the Y2 side than the second terminal 320D.

[0139] The second terminal 330D is provided on the second side 32 . The second terminal 330D is connected to the wiring 352 .

[0140] The second terminal 340D has straight portions 342D, 343D, 344D, and 345D. The straight portion 342D is provided on the second side 32. The straight portion 343D extends from the top of the straight portion 342D to the Y1 side. The straight portion 344D extends along the third side 33. The straight portion 345D extends along the Y direction, and the end portion 341D is connected to the wiring 351.

[0141] As described above, according to the third embodiment, the number of external connection wirings 400 such as a flexible printed circuit board can be reduced, as in the first and second embodiments. In particular, in the third embodiment, since all terminals are arranged on one side, four external connection wirings 400 are led out in the same direction, and the external connector connected to the external connection wirings 400 can be set to one.

[0142] [First Modification]

[0143] Next, a first modification example will be described. Fig.26 It is a schematic cross-sectional view showing a dimming device according to a first modification.

[0144] like Fig.26As shown, in the first variant, a chamfered portion 25E is provided at the end of the array substrate 2E. The chamfered portion 25E is provided at the corner of the surface 20a and the side surface 20c. The chamfered portion 25E is shown as an inclined surface in the cross section, for example. The inclined surface is inclined downward as it approaches the conductive component 500. That is, the chamfered portion 25E is formed in a shape in which the upper and lower distances between the array substrate 2E and the opposing substrate 3 increase as they move toward the Y1 side. The chamfered portion 25E is, for example, a plane connecting the end 251E of the surface (upper surface) 20a of the array substrate 2E and the end 252E of the side surface 20c of the array substrate 2E.

[0145] As described above, in the first variant, the chamfered portion 25E has a distance in the up and down direction (distance in the Z direction) that increases toward the Y1 side. Therefore, when, for example, a conductive paste is applied to form the conductive component 500, the paste flows in from the chamfered portion 25E, and the forming operation of the conductive component 500 is facilitated.

[0146] [Second Modification]

[0147] Next, a second modification example will be described. Fig. 27 It is a schematic cross-sectional view showing a dimming device according to a second modification.

[0148] like Fig. 27 As shown, in the second modified example, a curved portion 25F is provided at the end of the array substrate 2F. The curved portion 25F is provided at the corner of the surface 20a and the side surface 20c. The curved portion 25F is formed in a shape in which the vertical distance between the array substrate 2E and the opposing substrate 3 increases toward the Y1 side. The curved portion 25F is curved in a convex shape toward the opposing substrate 3.

[0149] As described above, in the second modification, since the curved surface portion 25F is convexly curved, when, for example, conductive paste is applied to form the conductive member 500 , the paste flows in from the curved surface portion 25F, and thus the forming operation of the conductive member 500 is easy.

[0150] [Third Modification]

[0151] Next, a third modification example will be described. Fig.28 It is a schematic cross-sectional view showing a dimming device according to a third modification.

[0152] like Fig.28As shown, in the third variant, the conductive component is set to a two-layer structure. That is, the conductive component 500 described in the embodiment is a one-layer structure, but the conductive component 550 involved in the third variant is a two-layer structure in which the second layer 552 is formed on the first layer 551. Specifically, as the first layer 551, a slurry with a lower viscosity is applied, and as the second layer 552, a slurry with a higher viscosity is applied on the first layer 551, and then the slurry is cured to form the conductive component 550. In addition, as the slurry with a lower viscosity, for example, a silver (Ag) slurry is preferred, and as the slurry with a higher viscosity, for example, a carbon (C) slurry is preferred.

[0153] As described above, in the third modification, the conductive member 500 includes the first layer 551 containing silver and the second layer 552 stacked on the first layer 551 and containing carbon.

[0154] The conductive component 500 is formed, for example, by coating with a paste containing a conductive material and drying it. Here, a low-viscosity paste has a higher shrinkage rate than a high-viscosity paste. If a high-viscosity paste is applied to the first layer, and then a high-viscosity paste is applied to the second layer, and the paste is dried as a whole, cracks are likely to occur in the second layer. Therefore, it is preferred to apply a silver paste with a lower viscosity to the first layer, and then apply a carbon paste with a higher viscosity than silver to the second layer, thereby forming the conductive component 500.

[0155] [Fourth Modification]

[0156] Next, a fourth modification example will be described. Fig.29 It is a schematic cross-sectional view showing a dimming device according to a fourth modification.

[0157] like Fig.29 As shown, in the fourth variation, a concave-convex portion 25G is provided on the side surface 20c of the array substrate 2G. In other words, the concave-convex portion 25G is also a groove. That is, on the side surface 20c of the array substrate 2G, convex portions and concave portions are alternately arranged in the up-down direction.

[0158] As described above, in the fourth modification, the concavo-convex portion 25G is provided on the side surface 20c of the array substrate 2G. When the conductive component 500 is formed by, for example, applying a paste containing a conductive material and drying it, the paste enters the groove of the concavo-convex portion 25G and solidifies. Therefore, the conductive component 500 is more firmly fixed to the array substrate 2G.

[0159] [Fifth Modification]

[0160] Next, a fifth modification example will be described. Fig.30 1 is a schematic cross-sectional view showing a dimming panel in which an array substrate and a counter substrate are connected by vias in a dimming device according to a fifth modification. Fig.31 It is shown that the stacked Fig.30 Schematic diagram of a panel unit of a dimming panel. Fig.32 is Fig.31 A schematic diagram of a panel unit having a conductive component on the side thereof.

[0161] In the fifth modification, the array substrate 2 and the counter substrate 3 are electrically connected vertically by the vias 43, and the conductive member 560 is electrically connected to the vias 43. This will be described in detail below.

[0162] First, if Fig.30 As shown, an electrode 41 is formed on the surface 20a of the array substrate 2. The electrode 41 extends in the entire Y direction, for example, and is connected to the liquid crystal drive electrode 250. In addition, an electrode 40 is formed on the end of the surface 3a and the back surface 3b of the counter substrate 3. Fig.31 As shown, a via 43 extending in the up-down direction is provided to connect the electrode 40 and the electrode 41 .

[0163] Moreover, if Fig.32 As shown, a conductive member 560 is provided on the side of the panel unit 110. The conductive member 560 has a plurality of protrusions 561 protruding laterally (in the Y direction) at intervals in the upper and lower directions. The top ends of the protrusions 561 are electrically connected to the via 43.

[0164] As described above, in the fifth variation, the first terminal 210 of the array substrate 2 and the second terminal 310 of the counter substrate 3 are connected by the conductive body 43, and the conductive component 500 is connected to the conductive body 43. The first terminal 210 of the array substrate 2 and the second terminal 310 of the counter substrate 3 are connected by the conductive body 43 and the conductive component 500, so the conductivity becomes higher.

[0165] [Sixth Modification]

[0166] Next, a sixth modification example will be described. Fig.33 It is a schematic cross-sectional view showing a dimming device according to a sixth modification.

[0167] In the sixth modification, an ITO film connected to the conductive member 500 is provided in the panel unit 110, and external connection wiring 400 such as a flexible printed circuit board is connected to the ITO film.

[0168] like Fig.33As shown, in the dimming device 100D, an ITO film 44 is provided on the upper surface (back surface 30b) of the counter substrate 3 disposed on the uppermost side of the panel unit 110. The ITO film 44 is formed over substantially the entire Y direction. An external connection wiring 400 is connected to the end portion on the Y1 side of the ITO film 44. The ITO film 44 is an example of a light-transmitting conductive film.

[0169] As described above, in the sixth modification, the ITO film 44 connected to the conductive member 500 is formed on the upper surface of the counter substrate 3. The ITO film 44 is connected to the wiring 400 for external connection.

[0170] In the above-described embodiment and the modified example, the external connection wiring 400 is connected to the terminal 200. However, in this modified example, the external connection wiring 400 is connected to the terminal 200 via the conductive member 500 and the ITO film 44, so that the external connection wiring 400 can be connected to a portion without a terminal such as the upper surface of the counter substrate 3.

[0171] [Seventh Modification]

[0172] Next, a seventh modification example will be described. Fig.34 It is a schematic cross-sectional view showing a dimming device according to a seventh modification.

[0173] In the seventh modification, an ITO film 44 is formed on the counter substrate 3 disposed at the uppermost side of the panel unit 110, and an external connection wiring 400 such as a flexible printed substrate is connected to the ITO film 44. In contrast, in the seventh modification, an ITO film 44 is formed on the array substrate 2 disposed at the lowermost side of the panel unit 110, and an external connection wiring 400 is connected to the ITO film 44. This will be described in detail below.

[0174] like Fig.34 As shown, in the dimming device 100E, an ITO film 44 is provided on the lower surface (back surface 20b) of the array substrate 2 disposed at the lowermost side of the panel unit 110. The ITO film 44 is formed over substantially the entire Y direction. An external connection wiring 400 is connected below the end of the ITO film 44 on the Y1 side.

[0175] As described above, in the seventh modification, the ITO film 44 connected to the conductive member 500 is formed on the lower surface 2 b (the surface on the other side in the first direction) of the array substrate 2 , and the ITO film 44 is connected to the external connection wiring 400 .

[0176] In the above-mentioned embodiment and the modified example, the external connection wiring 400 is connected to the terminal 200. However, in this modified example, the external connection wiring 400 is connected to the terminal 200 via the conductive component 500 and the ITO film 44, so the external connection wiring 400 can be connected to a portion without a terminal such as the lower surface 2b of the array substrate 2.

[0177] [Eighth Modification]

[0178] Fig.35 It is a schematic cross-sectional view showing a dimming device according to an eighth modification. Fig.36 It is shown Fig.35 Schematic top view of a dimming device.

[0179] In the sixth modification, an ITO film 44 is formed on the uppermost counter substrate 3 disposed on the panel unit 110, and an external connection wiring 400 such as a flexible printed circuit board is connected to the ITO film 44. In contrast, in the eighth modification, a metal wiring 46 is provided on the uppermost counter substrate 3 disposed on the panel unit 110, and the external connection wiring 400 is connected to the metal wiring 46. This will be described in detail below.

[0180] like Fig.35 As shown, in the dimming device 100G, a metal wiring 46 is provided on the upper surface (back surface 30b) of the counter substrate 3 disposed on the uppermost side of the panel unit 110. The metal wiring 46 is opaque. Fig.36 As shown, the inside of the sealing member 600 is an effective area. The metal wiring 46 is provided so as to surround the outside of the sealing member 600. The four conductive members 500 are connected to the wirings 400 for external connection, respectively.

[0181] As described above, in the eighth variant, a metal wiring 46 is provided on the upper surface (back side 30b) of the opposing substrate 3, and the metal wiring 46 is connected to the external connection wiring 400, so that the external connection wiring 400 can be connected also in a portion of the upper surface of the opposing substrate 3 where there is no terminal.

[0182] [Ninth Modification Example]

[0183] Next, a ninth modification example will be described. Fig.37 It is a top view of the array substrate in the dimming device involved in the ninth variation. Fig.38 yes Fig.37 A cross-sectional view of line XXXVIII-XXXVIII.

[0184] like Fig.37 as well as Fig.38As shown, in the ninth variation, for a plurality of terminals (first terminals 210C, 220C, 230C, 240C) of the array substrate 2, a partition wall portion 602, 603, 604 of a seal 600 is provided between adjacent terminals in the Y direction. The seal 600 has an annular portion 601 and partition walls 602, 603, 604. The liquid crystal layer 4 is filled on the inner peripheral side of the annular portion 601. The partition walls 602, 603, 604 extend from the annular portion 601 toward the X2 side. The partition wall portion 602 is located between the first terminals 240C and 220C. The partition wall portion 603 is located between the first terminals 220C and 210C. The partition wall portion 604 is located between the first terminals 210C and 230C.

[0185] As described above, in the ninth modification, the partition walls 602 , 603 , and 604 are provided between the terminals 210C, 220C, 230C, and 240C, and thus short circuits between adjacent terminals can be suppressed.

[0186] Description of Reference Numerals

[0187] 1. 1A, 1B, 1C, 1D, dimming panel; 2. 2A, 2B, 2C, 2D, 2E, 2F, 2G, array substrate (first substrate, lower substrate); 3. A, 3B, 3C, 3D, opposing substrate (second substrate, upper substrate); 4. liquid crystal layer; 10. A, 10B, 10C, 10D, dimming panel; 20a, surface; 20b, back; 20c, side; 21, first side; 22, second side; 23, third side; 2 4, fourth side; 25E, chamfered portion; 25F, curved portion; 25G, concave-convex portion; 31, first side; 32, second side; 33, third side; 34, fourth side; 40, 41, electrodes; 43, conductor; 44, ITO film (translucent conductive film); 46, metal wiring; 100, 100A, 100C, 100D, 100E, 100F, 100G, dimming device; 110, 110A, 110F, panel unit; 200, terminal; 210, 210A, 210C, 210D, 220, 220A, 220C, 220D, 230, 230A, 230C, 230D, 240, 240A, 240C, first terminal; 250, liquid crystal drive electrode; 300, terminal; 310, 310A, 310C, 310D, 320, 320A, 320C, 320D, 330, 330A, 330C, 330 D, 340, 340A, 340C, 340D, second terminal; 350, liquid crystal drive electrode; 400, wiring for external connection (flexible printed circuit board); 500, 510, 520, 530, 540, 550, 560, conductive component; 551, first layer; 552, second layer; 561, protrusion; 600, sealing member; 601, annular portion; 602, 603, 604, partition wall portion; 720, light-transmitting adhesive.

Claims

1. A dimming device, comprising: A panel unit, wherein a plurality of dimming panels are stacked in a first direction, wherein the dimming panels have a first substrate and a second substrate, wherein the first substrate has a first terminal, and the second substrate overlaps with the first substrate and has a second terminal; an external connection wiring connected to at least one of the first terminal and the second terminal; as well as a conductive member provided at an end portion of the panel unit in a second direction intersecting the first direction and extending in the first direction, The conductive component extends from the dimming panel located on one side of the panel unit closest to the first direction to the dimming panel located on the other side closest to the first direction, And the conductive component connects the first terminal of the first substrate and the second terminal of the second substrate in each of the dimming panels.

2. The dimming device according to claim 1, characterized in that: The dimming panel has a polygonal shape when viewed from the first direction, The first terminal and the second terminal include a straight portion of a strip-shaped body extending along the side of the polygon.

3. The dimming device according to claim 1, characterized in that: With respect to the first substrate and the second substrate included in the dimming panel, At least one of a surface of the first substrate on the second substrate side and a surface of the second substrate on the first substrate side has a chamfered portion at one end in the second direction. The chamfered portion increases the distance between the first substrate and the second substrate along the first direction toward one side in the second direction.

4. The dimming device according to claim 1, characterized in that: With respect to the first substrate and the second substrate included in the dimming panel, At least one of a surface of the first substrate on the second substrate side and a surface of the second substrate on the first substrate side has a curved surface at one end in the second direction. The curved surface portion is curved in a convex shape, and a distance between the first substrate and the second substrate along the first direction increases toward one side in the second direction.

5. The dimming device according to claim 1, characterized in that: The conductive member has a first layer including silver and a second layer stacked on the first layer and including carbon.

6. The dimming device according to claim 1, characterized in that: A side surface of an end portion of at least one of the first substrate and the second substrate provided on the second direction side has a concavo-convex portion.

7. The dimming device according to claim 1, characterized in that: In each of the dimming panels, The first terminal of the first substrate and the second terminal of the second substrate are connected by a via, and the conductive member is connected to the via.

8. The dimming device according to any one of claims 1 to 7, characterized in that: For the dimming panel disposed on the side of the panel unit closest to the first direction, The second substrate is arranged on one side of the first substrate in the first direction, A light-transmitting conductive film connected to the conductive component is formed on one surface of the second substrate in the first direction. The light-transmitting conductive film is connected to the external connection wiring.

9. The dimming device according to any one of claims 1 to 7, characterized in that: For the dimming panel located closest to the other side in the first direction in the panel unit, The second substrate is arranged on one side of the first substrate in the first direction, A light-transmitting conductive film connected to the conductive component is formed on the other side of the first substrate in the first direction. The light-transmitting conductive film is connected to the external connection wiring.

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