Modular wafer processing equipment

Abstract

The utility model relates to modular wafer processing equipment, which comprises an equipment support, a plurality of baffles distributed outside the equipment support, an operation area arranged in the equipment support, a plurality of cavities distributed around the periphery of the operation area of the equipment support, a manipulator arranged in the operation area, and a bearing plate arranged in the cavity. The bearing plate divides the cavity into a machining area and a processing area from top to bottom, a machining device is arranged in the machining area, a gas-liquid processing device is arranged in the processing area, a control device is arranged on the equipment support and connected with the bus interface through a serial port connecting wire, the mechanical arm is connected into the serial port connecting wire, and the serial port connecting wire is provided with a power supply wire harness. Therefore, by adopting the configuration of the plurality of preset cavities, the modularized configuration of each processing device can be realized, and the proper processing device can be selected, matched and replaced according to the wafer manufacturing requirement, so that the whole processing equipment has better expansibility.

Description

Technical Field

[0001] The utility model relates to processing equipment, in particular to modular wafer processing equipment. Background Art

[0002] For existing wafer processing, it involves multiple processing equipment to meet the processing needs of multiple links, including loading, clamping, wet processing, cleaning, etc. At present, the equipment used for supporting processing occupies independent workstations, which will take up more space in the factory. At the same time, workers are required to participate in coordination and control between each workstation, and the cleanliness requirements during wafer processing cannot be guaranteed in real time. In addition, if the type and process of wafer processing changes, the entire processing production line needs to be rewired, and the implementation cost is high.

[0003] In view of the above-mentioned defects, the designers have actively carried out research and innovation in order to create a modular wafer processing equipment to make it more valuable for industrial use. Utility Model Content

[0004] In order to solve the above technical problems, the purpose of the utility model is to provide a modular wafer processing equipment.

[0005] The modular wafer processing equipment of the utility model includes an equipment support, and a plurality of baffles are distributed outside the equipment support, wherein: an operation area is arranged in the equipment support, the equipment support is located at the periphery of the operation area, and a plurality of chambers are distributed around it, a manipulator is arranged in the operation area, a carrying plate is arranged in the chamber, and the carrying plate divides the chamber from top to bottom into a processing area and a treatment area, a processing device is arranged in the processing area, and a gas-liquid treatment device is arranged in the treatment area, the equipment support is located at the position of the processing area, and a plurality of bus interfaces are arranged, the processing device is connected to the bus interface, the equipment support is located at the position of the treatment area, and a plurality of pipeline interfaces are arranged, the pipeline interface is connected to the gas-liquid treatment device, a control device is arranged on the equipment support, the control device is connected to the bus interface through serial port wiring, the manipulator is connected to the serial port wiring, and the serial port wiring is configured with a power supply harness.

[0006] Furthermore, in the above-mentioned modular wafer processing equipment, the robot includes a mounting base, the mounting base is connected to the equipment bracket, the robot is a multi-axis robot, and the operating radius of the robot covers each chamber.

[0007] Furthermore, in the above-mentioned modular wafer processing equipment, the processing device is modularly configured, the bottom of the processing device is connected to the carrier plate, and the back of the processing device is provided with a plurality of control interfaces and connecting pipelines, the control interface is connected to the corresponding bus interface, and the connecting pipeline is connected to the corresponding pipeline interface.

[0008] Furthermore, in the above-mentioned modular wafer processing equipment, a plurality of positioning holes are arranged on the carrier plate, mounting holes are arranged at corresponding positions on the bottom of the processing device, locking screws are arranged in the positioning holes, and the locking screws are connected to the mounting holes.

[0009] Furthermore, in the above-mentioned modular wafer processing equipment, a docking buckle is provided outside the bus interface, and a connecting sealing ring is provided on the pipeline interface.

[0010] Furthermore, in the above-mentioned modular wafer processing equipment, the processing device includes a wafer carrying device, a wafer clamping device, a wet processing device, and a wafer cleaning device.

[0011] Furthermore, in the above-mentioned modular wafer processing equipment, the gas-liquid processing device is a gas-liquid separation box.

[0012] Furthermore, in the above-mentioned modular wafer processing equipment, the control device includes an industrial computer, the industrial computer is provided with a control component, the control component includes a display and a keyboard, and the display and the keyboard are arranged on the periphery of the baffle.

[0013] Furthermore, in the above-mentioned modular wafer processing equipment, the position of the baffle located in the processing area is connected to a door assembly through a hinge, and the position of the baffle located in the processing area is provided with a cover plate.

[0014] Furthermore, in the above-mentioned modular wafer processing equipment, the bottom of the equipment bracket is provided with height adjustment feet and displacement adjustment wheels.

[0015] By means of the above solution, the utility model has at least the following advantages:

[0016] 1. By adopting several preset chamber configurations, the modular configuration of each processing device can be realized. According to the needs of wafer manufacturing, the appropriate processing device can be selected and replaced, so that the entire processing equipment has better scalability.

[0017] 2. Through a single robot, the connection between the workstations of each chamber can be achieved, which meets the integrated configuration and reduces the implementation cost.

[0018] 3. Control devices can be added to achieve manual-free coordination between processing devices, meet the needs of automated supervision, and avoid possible contamination of wafers caused by manual intrusive operations.

[0019] 4. Door assemblies and cover plates can be set to ensure that the internal environment of the chamber is isolated from the external environment as much as possible, better meeting the cleanliness requirements of wafer processing.

[0020] 5. The overall structure is simple, easy to manufacture and use.

[0021] The above description is only an overview of the technical solution of the utility model. In order to more clearly understand the technical means of the utility model and implement it according to the contents of the specification, the following is a detailed description of the preferred embodiments of the utility model in conjunction with the accompanying drawings. BRIEF DESCRIPTION OF THE DRAWINGS

[0022] Figure 1 It is a schematic diagram of the overall structure of modular wafer processing equipment.

[0023] Figure 2 It is a top view schematic diagram of the operation area and chamber distribution.

[0024] Figure 3 It is a schematic diagram of the combination process of the processing device.

[0025] Figure 4 It is a schematic diagram of the combination after the processing device is installed in place.

[0026] The meanings of the reference numerals in the drawings are as follows.

[0027] 1 Baffle 2 Operation area

[0028] 3 Chamber 4 Equipment support

[0029] 5 Carrying plate 6 Processing device

[0030] 7 Gas and liquid processing device 8 Display

[0031] 9 Keyboard 10 Door Assembly

[0032] 11 Cover 12 Height adjustment foot

[0033] 13 Displacement adjustment wheel DETAILED DESCRIPTION

[0034] The following is a further detailed description of the specific implementation of the present invention in conjunction with the accompanying drawings and examples. The following examples are used to illustrate the present invention, but are not intended to limit the scope of the present invention.

[0035] like Figures 1 to 4The modular wafer processing equipment includes an equipment support 4, and a plurality of baffles 1 are distributed outside the equipment support 4. The difference lies in that: an operation area 2 is arranged in the equipment support 4, and the equipment support 4 is located at the periphery of the operation area 2, and a plurality of chambers 3 are distributed around it, and a manipulator (not shown in the figure) is arranged in the operation area 2. In this way, the manipulator can be used to coordinate the transfer of materials such as wafers between the processing devices 6 subsequently installed in each chamber 3, so as to achieve the coordinated connection between the processing stations. At the same time, considering the modular docking use, a carrier plate 5 is arranged in the chamber 3, and the carrier plate 5 divides the chamber 3 from top to bottom into a processing area and a processing area. During the implementation period, a processing device 6 is arranged in the processing area, and a gas-liquid processing device 7 is arranged in the processing area. In this way, the participation and cooperation of each processing device 6 during wafer processing is met, and effective gas-liquid processing can be achieved, without the need to add additional gas-liquid processing equipment outside the utility model. Specifically, in order to meet the modular convenient docking, the equipment support 4 is located in the processing area, and a plurality of bus interfaces (not shown in the figure) are arranged, and the processing device 6 is connected to the bus interface. In addition, the equipment support 4 is located in the processing area and is provided with a number of pipeline interfaces (not shown in the figure), which are connected to the gas-liquid processing device 7. Considering the convenience of coordinated control of each processing device 6, a control device is provided on the equipment support 4, and the control device is connected to the bus interface through a serial port wiring, and the manipulator is connected to the serial port wiring. In this way, the cooperation between each workstation can be met, and the manipulator is used to make the transition to improve the processing efficiency. Furthermore, the serial port wiring is equipped with a power supply harness. In this way, the energy supply needs of each processing device 6 and the manipulator can be met, and the external mains power can be directly introduced.

[0036] In combination with a preferred embodiment of the utility model, the manipulator includes a mounting base, the mounting base is connected to the equipment bracket 4, the manipulator is a multi-axis manipulator, and the operating radius of the manipulator covers each chamber 3. In this way, it can be ensured that the manipulator can achieve lossless and orderly transportation of materials and meet the docking of various stations during wafer processing. At the same time, no manual intervention is required to avoid the possibility of external intrusion and contamination of the wafer. At the same time, a single manipulator can achieve coverage, which improves processing efficiency while reducing implementation costs.

[0037] Further, the processing device 6 is modularly configured. In this way, it has a unified appearance and can be assembled in accordance with the reserved space of the chamber 3. At the same time, the installation position of each processing device 6 can be adjusted according to the needs of the actual processing procedure, so that the manipulator can coordinate the feeding. In order to meet the requirements of stable placement, the bottom of the processing device 6 is connected to the carrier plate 5. In addition, in order to achieve a standardized pipeline layout, a fast and stable docking can be achieved after the processing device 6 is placed. The back of the processing device 6 is provided with a number of control interfaces and connecting pipelines, the control interface is connected to the corresponding bus interface, and the connecting pipeline is connected to the corresponding pipeline interface. Considering the stability of the combination, a number of positioning holes are provided on the carrier plate 5, and a mounting hole is provided at the corresponding position of the bottom of the processing device 6. A locking screw is provided in the positioning hole, and the locking screw is connected to the mounting hole. In this way, after the processing device 6 is placed in place and the pipeline connection is completed, it can be effectively locked to avoid unnecessary displacement. Furthermore, considering the stability of the pipeline connection, a docking buckle is provided outside the bus interface, and a connecting sealing ring is provided on the pipeline interface.

[0038] In view of the actual implementation, the processing device 6 used includes a wafer carrying device, a wafer clamping device, a wet processing device, and a wafer cleaning device. In this way, the needs of conventional wafer processing can be met. Of course, other devices can be selected to form the processing device 6 according to actual processing needs. For the current processing device 6, a unified outer frame and wiring port can be customized to give it a better modular configuration effect. Taking into account the expansion of subsequent functions, the commercially available devices suitable for wafer processing can be subjected to corresponding modular transformation so that they can be docked with the chamber 3 and its preset bus interface and pipeline interface, which will not be repeated here. At the same time, in order to meet the gas-liquid supply and processing needs during wafer processing, the gas-liquid processing device 7 used is a gas and liquid separation box.

[0039] Further, the control device includes an industrial computer, and a control component is provided on the industrial computer. In this way, the coordinated operation of each processing device 6 during wafer processing can be met, and different program control can be achieved according to different wafer processing requirements. At the same time, the control component includes a display 8 and a keyboard 9, and the display 8 and the keyboard 9 are arranged on the periphery of the baffle 1. Therefore, it is convenient for users to realize control and debugging, and the working status of each processing device 6 can be viewed more intuitively.

[0040] During implementation, the baffle 1 is located in the processing area and is connected to a door assembly 10 through a hinge. This can meet the dust-proof setting during daily processing without affecting the feeding and taking of materials. At the same time, a cover plate 11 can be provided at the position of the baffle 1 in the processing area. In this way, the whole has better integration. In addition, considering the convenience of leveling the equipment in the factory area, a height adjustment foot 12 is provided at the bottom of the equipment bracket 4. Furthermore, considering the convenience of transportation layout, a displacement adjustment wheel 13 is also provided at the bottom of the equipment bracket 4, which can be conveniently moved under the premise that the height adjustment foot 12 is folded.

[0041] The working principle of the utility model is as follows:

[0042] According to the current wafer processing step requirements, the user selects a suitable processing device 6 that has been modularly arranged, such as a wafer clamping device, a wet processing device 6, a wafer cleaning device, etc., and installs them in the corresponding chamber 3. After installation, the operating radius and operation of the manipulator are adjusted to ensure that it can smoothly connect with the station feeding and taking requirements formed by the wafer clamping device, the wet processing device 6, and the wafer cleaning device.

[0043] Afterwards, the operating parameters of the wafer clamping device, the wet processing device 6, and the wafer cleaning device can be coordinated through the control device.

[0044] It can be seen from the above text description and the accompanying drawings that the following advantages are achieved after adopting the utility model:

[0045] 1. By adopting several preset chamber configurations, the modular configuration of each processing device can be realized. According to the needs of wafer manufacturing, the appropriate processing device can be selected and replaced, so that the entire processing equipment has better scalability.

[0046] 2. Through a single robot, the connection between the workstations of each chamber can be achieved, which meets the integrated configuration and reduces the implementation cost.

[0047] 3. Control devices can be added to achieve manual-free coordination between processing devices, meet the needs of automated supervision, and avoid possible contamination of wafers caused by manual intrusive operations.

[0048] 4. Door assemblies and cover plates can be set to ensure that the internal environment of the chamber is isolated from the external environment as much as possible, better meeting the cleanliness requirements of wafer processing.

[0049] 5. The overall structure is simple, easy to manufacture and use.

[0050] In addition, the indicated orientations or positional relationships described in the present invention are based on the orientations or positional relationships shown in the accompanying drawings and are only for the convenience of describing the present invention and simplifying the description. They do not indicate or imply that the device or structure referred to must have a specific orientation or be operated with a specific orientation structure. Therefore, they cannot be understood as a limitation on the present invention.

[0051] The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention. It should be pointed out that a person skilled in the art can make several improvements and modifications without departing from the technical principle of the present invention, and these improvements and modifications should also be regarded as within the protection scope of the present invention.

Claims

1. A modular wafer processing device, comprising an equipment support, wherein a plurality of baffles are distributed outside the equipment support, characterized in that: An operating area is provided in the equipment bracket, and the equipment bracket is located at the periphery of the operating area, and is surrounded by a plurality of chambers. A manipulator is provided in the operating area, and a carrying plate is provided in the chamber, and the carrying plate divides the chamber into a processing area and a treatment area from top to bottom. A processing device is provided in the processing area, and a gas-liquid treatment device is provided in the treatment area. The equipment bracket is located at the processing area, and is provided with a plurality of bus interfaces, and the processing device is connected to the bus interface. The equipment bracket is located at the treatment area, and is provided with a plurality of pipeline interfaces, and the pipeline interface is connected to the gas-liquid treatment device. A control device is provided on the equipment bracket, and the control device is connected to the bus interface via serial port wiring. The manipulator is connected to the serial port wiring, and the serial port wiring is configured with a power supply harness.

2. The modular wafer processing equipment according to claim 1, characterized in that: The manipulator includes a mounting base, the mounting base is connected to the equipment bracket, the manipulator is a multi-axis manipulator, and the operating radius of the manipulator covers each chamber.

3. The modular wafer processing equipment according to claim 1, characterized in that: The processing device is modularly configured, the bottom of the processing device is connected to the carrier plate, and the back of the processing device is provided with a plurality of control interfaces and connecting pipelines, the control interface is connected to the corresponding bus interface, and the connecting pipeline is connected to the corresponding pipeline interface.

4. The modular wafer processing equipment according to claim 1, characterized in that: The carrying plate is provided with a plurality of positioning holes, and a mounting hole is provided at a corresponding position of the bottom of the processing device. A locking screw is provided in the positioning hole, and the locking screw is connected to the mounting hole.

5. The modular wafer processing equipment according to claim 1, characterized in that: The bus interface is provided with a docking buckle outside, and the pipeline interface is provided with a connecting sealing ring.

6. The modular wafer processing equipment according to claim 1, characterized in that: The processing device includes a wafer carrying device, a wafer clamping device, a wet processing device, and a wafer cleaning device.

7. The modular wafer processing equipment according to claim 1, characterized in that: The gas-liquid processing device is a gas-liquid separation box.

8. The modular wafer processing equipment according to claim 1, characterized in that: The control device includes an industrial computer, and a control component is arranged on the industrial computer. The control component includes a display and a keyboard, and the display and the keyboard are arranged on the periphery of the baffle.

9. The modular wafer processing equipment according to claim 1, characterized in that: The position of the baffle plate located in the processing area is connected to a door assembly via a hinge, and the position of the baffle plate located in the processing area is provided with a cover plate.

10. The modular wafer processing equipment according to claim 1, characterized in that: The bottom of the equipment bracket is provided with a height adjustment foot and a displacement adjustment wheel.

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