Cleaning device for semiconductor packaging products

Abstract

A cleaning device for semiconductor packaging products comprises a main body frame, a cleaning cavity, a container, a water washing device, a controller, a rotating device and a vibrating device, the vibrating device is arranged at the bottom of the cleaning cavity, the rotating device is used for rotating the container containing the semiconductor packaging products, the products in the container are evenly sprayed, and the uniformity of cleaning is improved; the container and the loading platform of the rotating mechanism are installed in a matched mode through a positioning groove and a positioning protrusion, stable installation of the container is achieved, and the container is prevented from moving in the cleaning cavity; the vibration device is installed below the rotating device, used for supporting the rotating device and comprises a base, supporting legs and a second motor, the elastic supporting legs with the buffering function are installed at the bottom of the base, and the base is driven by the second motor through a crankshaft connecting rod mechanism so as to drive the base to vibrate. By means of the arrangement of the vibration device, products in the container are separated in a vibration mode, accumulation and bonding of the products are prevented, the cleaning efficiency is improved, and the products are buffered and protected.

Description

Technical Field

[0001] The utility model relates to the technical field of semiconductor packaging, in particular to a cleaning device for semiconductor packaging products. Background Art

[0002] In the semiconductor field, miniaturization and high performance have become important trends in the development of electronic components. As an advanced packaging technology, leadless packaging, such as DFN / QFN, provides higher efficiency, smaller size and better performance for the design of modern electronic products, so it is more and more widely used. DFN / QFN has a high degree of integration, with dozens or tens of thousands of pieces integrated in a frame. After packaging, PKG cutting is required to separate the products into single pieces. The PKG cutting process requires glue to be used for bonding, and there is a certain probability that residual glue will adhere to the surface of the product. After using solvent to remove the residual glue, it is necessary to perform multiple cleanings to remove the residues on the surface of the product.

[0003] Currently, the cleaning devices commonly used for semiconductor packaging products generally only have a single spray function. However, in actual applications, since semiconductor packaging products are stacked or piled together during cleaning, single spray cleaning will cause uneven and incomplete cleaning, affecting product performance and reducing product quality. Utility Model Content

[0004] In order to solve the above technical problems, the utility model provides a cleaning device for semiconductor packaging products, which is provided with a rotating mechanism for allowing the product to evenly receive water cleaning during the cleaning process; it is also provided with a vibration device to prevent the semiconductor packaging products from stacking and sticking during the cleaning process, thereby improving the product cleaning effect.

[0005] The technical solution adopted by the utility model is: a cleaning device for semiconductor packaging products, comprising

[0006] Main frame,

[0007] A cleaning chamber is arranged on the upper part of the main frame, the cleaning chamber has a space for placing semiconductor package products, a drainage port and a particle collecting device are arranged at the bottom of the cleaning chamber, and a cover is arranged at the top;

[0008] The container is used to hold the semiconductor packaged product and can be placed in the cleaning chamber. The bottom of the container is provided with a positioning protrusion and a water leakage hole;

[0009] A water washing device, comprising a nozzle, a booster pump and a control box, wherein the booster pump is connected to the control box by a water pipe, and the control box is connected to the nozzle by a water pipe;

[0010] The controller is connected to the booster pump and the control box, and is characterized in that it also includes

[0011] The rotating device is arranged at the bottom of the cleaning chamber, and includes a loading platform. The top surface of the loading platform is provided with a positioning groove, and the positioning groove is engaged with the positioning protrusion arranged at the bottom of the container; the loading platform is provided with a first water collecting trough, and the lower end of the first water collecting trough is connected to the first drain pipe. A rotating shaft is installed at the bottom center of the loading platform, and the rotating shaft is connected to the first motor through transmission.

[0012] Furthermore, at least one first water collecting trough is provided, and the bottom surface of at least one first water collecting trough is provided as a slope structure, and the first drain pipe is installed at the lower end of the first water collecting trough having the slope structure.

[0013] Further, when the first water collecting trough overlaps with the positioning groove, the first water collecting trough is located below the positioning groove, and the width of the first water collecting trough is smaller than the width of the positioning groove.

[0014] Furthermore, the first motor is connected to a controller.

[0015] Furthermore, it also includes a vibration device, which is installed below the rotating device and is used to support the rotating device. It includes a base, legs and a second motor. The bottom of the base is equipped with legs, and the base is driven by the second motor through a crankshaft connecting rod mechanism to drive the base to vibrate.

[0016] Furthermore, the crankshaft connecting rod mechanism includes a connecting rod and an eccentric connecting rod, the base is hinged to the first end of the connecting rod, and the second end of the connecting rod passes through the main frame and is hinged to the power output shaft of the second motor through the eccentric connecting rod.

[0017] Furthermore, a second annular water collecting trough is provided on the base, the second water collecting trough is arranged corresponding to the first drain pipe, the bottom end of the first drain pipe is located in the second water collecting trough, and the second water collecting trough is provided with at least one second drain pipe.

[0018] Furthermore, the supporting legs include a main supporting leg fixedly connected to the main frame, and a secondary supporting leg fixedly connected to the base, and a spring is connected between the main supporting leg and the secondary supporting leg, and the spring plays a role of buffering and shock absorption.

[0019] Furthermore, the second motor is connected to a controller.

[0020] Furthermore, the nozzle is provided with a metal snake pipe joint, which can conveniently adjust the spraying direction.

[0021] Furthermore, a guide structure is provided between the base and the main frame, and the guide structure includes a slider fixedly connected to the base, and a guide groove fixedly connected to the inner wall of the cleaning chamber, and the slider is connected to the guide groove in a sliding fit.

[0022] Furthermore, the crankshaft connecting rod mechanism can also be set to the following structure, which includes a crankshaft connecting rod, both ends of which are rotatably connected to the main frame through bearings, one end of which passes through the main frame and is connected to the power output shaft of the second motor, and the bent portion of the crankshaft connecting rod is connected to the base through a hinge.

[0023] The beneficial effects of the utility model are: 1) the container containing the semiconductor packaged product can be rotated by utilizing the rotating mechanism, so that the product inside is sprayed evenly, thereby improving the uniformity of cleaning;

[0024] 2) The container and the loading platform of the rotating mechanism are installed in coordination with the positioning groove and the positioning protrusion to achieve stable installation of the container and prevent it from moving in the cleaning chamber;

[0025] 3) Use the vibration device to separate the products in the container, prevent accumulation and adhesion between products, improve the cleaning efficiency, and make the products clean more thoroughly;

[0026] 4) The spring setting of the vibration device plays a certain buffering role, preventing the semiconductor package product from being damaged due to excessive force during the vibration process, and plays a buffering and protective role for the product;

[0027] 5) The guide structure of the vibration device can play a role in radial limiting its base, restricting it to move up and down only in the axial direction, thereby improving the stability of the equipment. BRIEF DESCRIPTION OF THE DRAWINGS

[0028] Figure 1 The utility model is a schematic diagram of the overall structure of a cleaning device for semiconductor packaging products;

[0029] Figure 2 It is a front view schematic diagram of a cleaning device for semiconductor packaging products according to Embodiment 1;

[0030] Figure 3 for Figure 2 Schematic diagram of AA structure;

[0031] Figure 4 It is a right side schematic diagram of a cleaning device for semiconductor package products according to Embodiment 1;

[0032] Figure 5 for Figure 4 Schematic diagram of BB structure;

[0033] Figure 6 The figure is a bottom-up structural diagram of the container;

[0034] Figure 7 It is a schematic diagram of the top view of the rotating device;

[0035] Figure 8is a cross-sectional schematic diagram of a rotating device;

[0036] Fig. 9 is a front view schematic diagram of a cleaning device for semiconductor packaging products according to Embodiment 2;

[0037] Fig.10 for Fig. 9 A'-A' structure schematic diagram;

[0038] Fig.11 It is a right side schematic diagram of a cleaning device for semiconductor package products according to Embodiment 2;

[0039] Fig.12 for Fig.11 Schematic diagram of the B'-B' structure;

[0040] Fig.13 for Fig.12 Enlarged view of point C;

[0041] Fig.14 for Fig.12 The enlarged view of point D;

[0042] Fig.15 is a schematic top view of a vibration device of Example 2;

[0043] Fig.16 is a schematic diagram of a cleaning device for semiconductor packaging products according to Example 3;

[0044] Fig.17 for Fig.16 Schematic top view of .

[0045] In the figure, 1-main frame, 2-cleaning chamber, 21-drain port, 22-particle collecting device, 23-third drain pipe, 24-cover body, 3-container, 31-positioning protrusion, 32-leakage hole, 4-water washing device, 41-spray nozzle, 42-boosting pump, 43-control box, 5-controller, 6-rotating device, 61-loading platform, 62-positioning groove, 63-first water collecting tank, 64-first drain pipe, 65-rotating shaft, 66-first motor, 7-vibrating device, 71-base, 711-second water collecting tank, 712-second drain pipe, 72-leg, 721-main leg, 722-auxiliary leg, 723-spring, 73-second motor, 74-connecting rod, 75-eccentric connecting rod, 76-guide structure, 761-slider, 762-guide groove, 77-crank connecting rod. DETAILED DESCRIPTION Example

[0046] like Figure 1-8 As shown, a cleaning device for semiconductor packaging products includes a main frame 1, a cleaning chamber 2, a container 3, a water washing device 4, a controller 5 and a rotating device 6.

[0047] Among them, the cleaning chamber 2 is arranged at the upper part of the main frame 1, and has a space for placing semiconductor packaging products. A drain port 21 and a particle collection device 22 are provided at the bottom of the cleaning chamber 2, and a cover body 24 is provided at the top; the drain port discharges the cleaned water by installing a third drain pipe 23.

[0048] The particle collecting device 22 is arranged at the bottom end of the drain outlet 21, and is detachably connected to the drain outlet. Particles such as copper scraps and resin are deposited in this collector and need to be cleaned regularly to avoid pipe blockage and reduce the intensity of waste liquid treatment.

[0049] The container 3 is used to contain the semiconductor packaged product and can be placed in the cleaning chamber 2. The bottom surface of the container 3 is provided with a positioning protrusion 31. The bottom surface of the container 3 is provided with a water leakage hole 32 at least.

[0050] The water washing device 4 comprises a nozzle 41, a booster pump 42 and a control box 43. The booster pump 42 and the control box 43 are arranged in a main frame. The booster pump 42 is connected to the control box 43 by a water pipe 44, and the control box 43 is connected to the nozzle 41 by a water pipe. The nozzle is provided with a metal snake pipe joint, which can conveniently adjust the spray direction according to the cleaning requirements. The booster pump 42 and the control box 43 are connected to the controller 5. When the cleaning button of the controller 5 is turned on, pure water flows to the control box 43 after passing through the booster pump 42. The control box 43 can control the cleaning time and cleaning temperature, and then spray out from the nozzle 41.

[0051] The rotating device 6 is arranged at the bottom of the cleaning chamber 2, and includes a loading platform 61. The top surface of the loading platform 61 is provided with a positioning groove 62, and the positioning groove 62 is a cross-shaped structure, which is engaged with the positioning protrusion 31 arranged at the bottom of the container 3; the loading platform 61 is provided with a first water collecting trough 63, and the lower end of the first water collecting trough 63 is connected to a first drain pipe 64. A rotating shaft 65 is installed at the bottom center of the loading platform 61, and the rotating shaft 65 is connected to the first motor 66 for driving the loading platform 61 to drive the container 3 to rotate.

[0052] At least one first water collecting trough 63 is provided, and its longitudinal section is a shape with a high middle and low ends, and a bottom surface forming a slope structure. The first drainage pipe 64 is installed at the lower end of the first water collecting trough 63 .

[0053] When multiple first water collecting tanks 63 are provided, the bottom surface of at least one of the first water collecting tanks 63 is provided with the above-mentioned slope structure, and the first drainage pipe 64 is installed at the lower end of the first water collecting tank 63 having the slope structure.

[0054] When a plurality of first water collecting grooves 63 are provided, they are evenly distributed or crisscrossed along the circumference of the loading platform 61 , and the first water collecting grooves 63 and the positioning grooves 62 are spaced apart as much as possible.

[0055] When the first water collecting groove 63 overlaps with the positioning groove 62 , the first water collecting groove is located below the positioning groove 62 , and the width of the first water collecting groove 63 is smaller than the width of the positioning groove 62 .

[0056] The first motor 66 can be connected to the controller 5 to control the rotation speed or working time of the motor to meet the cleaning requirements.

[0057] When using this embodiment, the semiconductor packaged product is placed in the container, and the positioning protrusion of the container 3 is clamped with the positioning groove 62 provided on the loading platform 61 of the rotating device, so that the container 3 can be stably installed in the cleaning chamber. The cover of the cleaning chamber 2 is closed, the button on the controller 5 is turned on, the cleaning time and water temperature, as well as the rotation speed of the rotating device are set, and the water flows through the nozzle to clean the product in the container at the set temperature and time, and the product is evenly and thoroughly cleaned during the rotation process. Example

[0058] like Figure 9-15 As shown, on the basis of Example 1, a vibration device 7 is further provided. The vibration device 7 is installed below the rotating device 6 and is used to support the rotating device 6. It includes a base 71, a leg 72 and a second motor 73. The bottom of the base 71 is equipped with a leg 72, which is connected to the cleaning chamber 2 by the leg 72; the base 71 is driven by the second motor through a crankshaft connecting rod mechanism to drive the base to vibrate.

[0059] In this embodiment, the crankshaft connecting rod mechanism includes a connecting rod 71 and an eccentric connecting rod 75. The base 71 is hinged to the first end of the connecting rod 74. The second end of the connecting rod 74 passes through the main frame 1 and is hinged to the power output shaft of the second motor 73 through the eccentric connecting rod 75.

[0060] A second annular water collecting trough 711 is provided on the base 71 . The second water collecting trough 711 is provided corresponding to the first drain pipe 64 . The bottom end of the first drain pipe 64 is located in the second water collecting trough 711 . The second water collecting trough 711 is provided with at least one second drain pipe 712 .

[0061] In this embodiment, the second water collecting tank 711 can also be set to be inclined to one side. In this case, the second drain pipe 712 can be set as one and installed at a lower position on the bottom surface of the second water collecting tank 711.

[0062] The legs 72 include a main leg 721 fixedly connected to the main frame 1 and a secondary leg 722 fixedly connected to the base 71 . A spring 723 is connected between the main leg 721 and the secondary leg 722 , and the spring 723 plays a role in buffering and shock absorption.

[0063] The second motor 73 may be connected to the controller 5 to control the vibration frequency or amplitude of the vibration device 7 .

[0064] In this embodiment, based on the embodiment 1, the vibration frequency of the vibration device is set by the controller 5, and the vibration amplitude can be set by adjusting the length of the eccentric connecting rod 75. While the rotating device rotates, the vibration device shakes and vibrates the products in the container at a certain frequency, prompting them to separate, so that the water flow can clean each product, thereby improving the cleaning efficiency. Example

[0065] like Figure 16-17 As shown, on the basis of Example 2, a guide structure 76 is provided around the base 71 and between the main frame 1 , so that the base 71 can move up and down along the cleaning chamber 2 .

[0066] In this embodiment, the crankshaft connecting rod mechanism in Embodiment 1 is replaced by a crankshaft connecting rod 77, both ends of which are rotatably connected to the main frame 1 through bearings, one end of which passes through the main frame to connect to the power output shaft of the second motor 73, and the bent portion of the crankshaft connecting rod 73 is connected to the base 71 through a hinge.

[0067] The guide structure 76 includes a guide groove 762 provided on the outer periphery of the base 71 and a slider 761 fixedly connected to the inner wall of the cleaning chamber 2 . The slider 761 is connected to the guide groove 762 in a sliding manner.

[0068] Under the constraint of the guide structure 76, the base 71 is driven by the second motor to move up and down along the inner wall of the cleaning chamber to achieve up and down vibration of the product in the container. Combined with the rotation cleaning method of Example 1, the cleaning effect of the semiconductor packaging product is improved.

Claims

1. A cleaning device for semiconductor packaging products, comprising: Main frame, A cleaning chamber is arranged on the upper part of the main frame, the cleaning chamber has a space for placing the semiconductor packaged product, a drainage port and a particle collecting device are arranged at the bottom of the cleaning chamber, and a cover is arranged at the top; A container, used to hold the semiconductor packaged product, which can be placed in the cleaning chamber, and a positioning protrusion and a water leakage hole are provided at the bottom of the container; A water washing device, comprising a nozzle, a booster pump and a control box, wherein the booster pump is connected to the control box by a water pipe, and the control box is connected to the nozzle by the water pipe; A controller connected to the booster pump and the control box, characterized in that it also includes A rotating device is arranged at the bottom of the cleaning chamber, and includes a loading platform. A positioning groove is provided on the top surface of the loading platform, and the positioning groove is engaged with the positioning protrusion arranged at the bottom of the container; the loading platform is provided with a first water collecting trough, and the lower end of the first water collecting trough is connected to a first drain pipe. A rotating shaft is installed at the bottom center of the loading platform, and the rotating shaft is connected to the first motor through transmission.

2. A cleaning device for semiconductor packaging products according to claim 1, characterized in that: At least one first water collecting trough is provided, and the bottom surface of at least one first water collecting trough is provided with a slope structure, and the first drain pipe is installed at the lower end of the first water collecting trough with the slope structure.

3. A cleaning device for semiconductor packaging products according to claim 2, characterized in that: When the first water collecting groove overlaps with the positioning groove, the first water collecting groove is located below the positioning groove, and the width of the first water collecting groove is smaller than the width of the positioning groove.

4. A cleaning device for semiconductor packaging products according to claim 1, characterized in that: It also includes a vibration device, which is installed below the rotating device and is used to support the rotating device. The vibration device includes a base, legs and a second motor. The bottom of the base is equipped with legs, and the base is driven by the second motor through a crankshaft connecting rod mechanism to drive the base to vibrate.

5. A cleaning device for semiconductor packaging products according to claim 4, characterized in that: The crankshaft connecting rod mechanism includes a connecting rod and an eccentric connecting rod. The base is hinged to the first end of the connecting rod. The second end of the connecting rod passes through the main frame and is hinged to the power output shaft of the second motor through the eccentric connecting rod.

6. A cleaning device for semiconductor packaging products according to claim 5, characterized in that: The base is provided with a second annular water collecting trough, the second water collecting trough is arranged corresponding to the first drain pipe, the bottom end of the first drain pipe is located in the second water collecting trough, and the second water collecting trough is provided with at least one second drain pipe.

7. A cleaning device for semiconductor packaging products according to claim 5, characterized in that: The supporting legs include a main supporting leg fixedly connected to the main frame, and a secondary supporting leg fixedly connected to the base. A spring is connected between the main supporting leg and the secondary supporting leg, and the spring plays a role of buffering and shock absorption.

8. A cleaning device for semiconductor packaging products according to claim 4, characterized in that: A guide structure is provided between the base and the main frame. The guide structure comprises a slider fixedly connected to the base and a guide groove fixedly connected to the inner wall of the cleaning chamber. The slider is connected to the guide groove in a sliding manner.

9. A cleaning device for semiconductor packaging products according to claim 8, characterized in that: The crankshaft connecting rod mechanism includes a crankshaft connecting rod, both ends of which are rotatably connected to the main frame through bearings, one end of which passes through the main frame and is connected to the power output shaft of the second motor, and the bent portion of the crankshaft connecting rod is connected to the base through a hinge.

10. A cleaning device for semiconductor packaging products according to claim 4, characterized in that: The first motor and the second motor are connected to the controller.

11. A cleaning device for semiconductor packaging products according to claim 1, characterized in that: The spray head is provided with a metal snake pipe joint, which can conveniently adjust the spray direction.

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