Wafer parameter searching and centering device

Abstract

The utility model provides a wafer parameter searching and centering device, which is used in the technical field of semiconductor manufacturing and comprises a rack, a base, a carrying table, a centering mechanism, a parameter searching mechanism and a moving mechanism. The carrying platform and the parameter searching mechanism are respectively connected with the rack; the centering mechanism is arranged on the base through the moving mechanism; the moving mechanism comprises a transverse moving mechanism, a lifting mechanism and a rotating mechanism which are connected in sequence; a wafer placing groove of the carrying table is provided with a hole and a notch, and the centering mechanism penetrates through the hole; the parameter searching mechanism comprises a parameter searching sensor, a support and a driving device. Signals of the parameter searching mechanism are emitted to the notch and can move in the notch. And the centering mechanism and / or the wafer placing groove are / is provided with a vacuum adsorption mechanism. The wafer centering device is reasonable in structural arrangement, enables the centering mechanism to be aligned with the center of a wafer through the transverse moving mechanism, the lifting mechanism and the rotating mechanism, drives the fixed wafer to move to rectify deviation, is simple and convenient to operate, accurate in positioning and high in alignment efficiency, and can be flexibly suitable for various working scenes needing to center the wafer.

Description

Technical Field

[0001] The utility model belongs to the technical field of semiconductor manufacturing, and particularly relates to a wafer parameter finding and centering device. Background Art

[0002] A chip is a silicon wafer used in the production of silicon semiconductor integrated circuits. Because of its round shape, it is also called a wafer. Various circuit component structures can be processed on the silicon wafer to become an integrated circuit product with specific electrical functions. The production of integrated circuits has very strict requirements on equipment, raw materials and production environment, so the wafer production process requires high cleanliness, high stability and high reliability. In order to improve production efficiency, an automated wafer transfer system has been used on the production line (such as 8-inch and 12-inch wafer equipment) to replace manual wafer transfer. The wafer transfer system refers to the conveying equipment used by integrated circuit production factories to classify wafers in a high-cleanliness environment. The wafer transfer system uses a robot to perform pick-up and delivery operations on the wafers. The robot itself does not have a positioning function. In order to meet the pick-up and delivery accuracy requirements, the wafer needs to be positioned to ensure that it is aligned with the center of the wafer before the pick-up and delivery operation is performed. The prior art often places the wafer on a positioning platform, and moves the wafer to the alignment center by adjusting the position of the positioning platform. This method has a relatively complex mechanical structure and requires positioning through movement in multiple directions. It is greatly affected by the stability of the mechanical structure, the operation is cumbersome, and the positioning accuracy is low. At the same time, the robot can only place or drag the wafer from below, which is not convenient for use under some special application requirements. Utility Model Content

[0003] In order to solve the above technical problems, the utility model provides a wafer parameter finding and centering device, which can quickly complete the positioning and deviation correction of the wafer center, is easy to operate, and has high alignment accuracy.

[0004] The technical solution adopted by the utility model is:

[0005] A chip reference and centering device comprises a frame and a base, and also comprises a carrier, a centering mechanism, a reference mechanism and a moving mechanism; the carrier and the reference mechanism are respectively connected to the frame; the centering mechanism is arranged on the base through the moving mechanism, and the moving mechanism drives the centering mechanism to move in the horizontal and vertical directions and rotate around the axis of the centering mechanism; the chip placement groove of the carrier is provided with a hole, and the structure of the hole can accommodate the centering mechanism to pass through and move in the hole; the center of the chip placement groove of the carrier coincides with the axis of the centering mechanism when it is in the initial position; the chip placement groove is provided with a notch, and the signal of the reference mechanism is emitted to the notch and can cause the signal to move in the notch.

[0006] Furthermore, the centering mechanism and / or the wafer placement groove is provided with a vacuum adsorption mechanism for adsorbing the wafer.

[0007] Furthermore, the center of the hole coincides with the center of the wafer placement groove.

[0008] Furthermore, the notch extends from the hole to the outside of the wafer placement groove.

[0009] Furthermore, the reference-seeking mechanism includes a reference-seeking sensor, a bracket and a driving device, wherein the transmitting end and the receiving end of the reference-seeking sensor are relatively arranged on the bracket, so that the transmitting end is higher than the upper end surface of the notch and the receiving end is lower than the upper end surface of the notch; the driving device drives the bracket to move.

[0010] Furthermore, the moving mechanism includes a transverse movement mechanism, a lifting mechanism and a rotating mechanism which are connected in sequence, the transverse movement mechanism is arranged on the base, the rotating mechanism is connected to the centering mechanism, and the rotation center of the rotating mechanism coincides with the axis of the centering mechanism.

[0011] Furthermore, the transverse movement mechanism includes a transverse movement drive assembly, a slide bar and a slider, and the transverse movement drive assembly and the slider are both installed on the base; the transverse movement drive assembly is connected to the slide bar, and the slider is connected to the slide bar; when the transverse movement drive assembly is running, it drives the slider to move along the slide bar.

[0012] Furthermore, the lifting mechanism includes a mobile platform, a telescopic device and a lifting block connected in sequence, the mobile platform is arranged on the top of the slider, and the telescopic device is vertically arranged on the mobile platform; when the telescopic device is running, it drives the lifting block to rise or fall.

[0013] Furthermore, the rotating mechanism includes a rotating drive component, a rotating shaft and a rotating sleeve; the rotating sleeve is arranged on the top of the lifting block, and the rotating shaft is arranged inside the rotating sleeve and connected to the rotating drive component; when the rotating drive component is running, it drives the rotating shaft to rotate; the upper part of the rotating shaft is connected to the centering mechanism.

[0014] Furthermore, it also includes a control system, which controls the operation of the reference-seeking mechanism and receives measurement data of the reference-seeking mechanism, and controls the operation of the vacuum adsorption mechanism, the transverse movement mechanism, the lifting mechanism and the rotating mechanism through analysis and calculation.

[0015] The advantages and positive effects of the utility model are as follows: the structure of the chip parameter finding and centering device is reasonably arranged, and the centering mechanism is aligned with the center of the chip by arranging a transverse movement mechanism, a lifting mechanism and a rotating mechanism, so as to drive the chip to move for deviation correction, and the operation is simple, the positioning is precise, the alignment efficiency is high, and it can be flexibly applied to various work scenarios that require centering of the chip. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] Figure 1 It is a front view of a specific embodiment of the utility model;

[0017] Figure 2 It is a side view of a specific embodiment of the utility model;

[0018] Figure 3 It is a top view of a specific embodiment of the utility model.

[0019] In the figure:

[0020] 1. Frame 2. Base 3. Carrier

[0021] 301, wafer placement groove 302, hole 303, adsorption hole

[0022] 304, gap 4, centering mechanism 5, reference-seeking mechanism

[0023] 501, bracket 5011, transmitting end 5012, receiving end

[0024] 502, driving device 6, moving mechanism 601, transverse movement mechanism

[0025] 6011, transverse drive assembly 6012, slide bar 6013, slide block

[0026] 602, lifting mechanism 6021, mobile platform 6022, telescopic device

[0027] 6023, lifting block 603, rotating mechanism 6031, rotating drive assembly

[0028] 6032, rotating shaft 6033, rotating sleeve 7, wafer positioning axis DETAILED DESCRIPTION

[0029] The embodiments of the present utility model are described below in conjunction with the accompanying drawings.

[0030] In the description of the embodiments of the present utility model, it should be understood that the orientation or positional relationship indicated by the terms "top", "bottom", etc. is based on the orientation or positional relationship shown in the accompanying drawings, and is only for the convenience of describing the present utility model and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on the present utility model. In the description of the present utility model, it should be noted that, unless otherwise clearly specified and limited, the terms "set" and "connect" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be directly connected, or indirectly connected through an intermediate medium, or it can be a connection between the two elements. For those of ordinary skill in the art, the specific meanings of the above terms in the present utility model can be understood by specific circumstances.

[0031] like Figure 1-Figure 3 As shown, in a specific embodiment, the utility model proposes a chip reference finding and centering device, which includes a frame 1 and a base 2, a carrier 3, a centering mechanism 4, a reference finding mechanism 5 and a moving mechanism 6; the carrier 3 and the reference finding mechanism 5 are respectively connected to the frame 1; the centering mechanism 4 is arranged on the base through the moving mechanism 6, and the moving mechanism 6 drives the centering mechanism 4 to move in the horizontal and vertical directions and rotate around the axis of the centering mechanism 4; the chip placement groove 301 of the carrier 3 is provided with a hole 302, and the structure of the hole 302 can accommodate the centering mechanism 4 to pass through and move in the hole 302; the center of the chip placement groove 301 of the carrier 3 coincides with the axis of the centering mechanism 4 when it is in the initial position; the chip placement groove 301 is provided with a notch 304, and the signal of the reference finding mechanism 5 is emitted in the direction of the notch 304 and moves in the notch 304.

[0032] In this embodiment, the frame 1 is also provided with a manipulator, and the manipulator pick-up and delivery position parameters are set according to the installation position of the carrier 3, so that the chip positioning axis 7 coincides with the center of the chip placement groove 301; then the initial position of the centering mechanism 4 is set, so that the axis of the centering mechanism 4 is aligned with the center of the chip placement groove 301; when in use, the manipulator places the chip in the chip placement groove 301, and drives the centering mechanism 4 to rise through the moving mechanism 6, so that the chip is separated from the carrier 3; the moving mechanism 6 is operated to rotate and drive the centering mechanism 4 to rotate around its axis, thereby driving the chip to rotate; the reference seeking mechanism 5 is operated to send a signal, so that the signal emitted by the reference seeking mechanism 5 moves in the gap 304, thereby determining the chip edge; determine the offset between the center of the chip and the center of the chip placement slot 301 by calculation, adjust the moving mechanism 6, make the centering mechanism 4 descend, and the chip returns to the chip placement slot 301; operate the moving mechanism 6 according to the offset, drive the centering mechanism 4 to move, and align the axis of the centering mechanism 4 with the center of the chip; adjust the moving mechanism 6, make the centering mechanism 4 rise and lift the chip again, and drive the chip to move, so that the center of the chip is aligned with the center of the chip placement slot 301; adjust the moving mechanism 6, make the centering mechanism 4 descend, and the chip returns to the center of the chip placement slot 301 again, that is, complete the precise positioning and position adjustment of the chip, and finally realize the robot hand to accurately carry the chip to the set position.

[0033] Specifically, the present application proposes a chip reference finding and centering device for reference finding and centering of round wafers, and the specifications of the round wafers include but are not limited to 4 inches, 6 inches and 8 inches; in a specific embodiment, the carrier 3 is set to be circular, and the outline of the chip placement groove 301 is circular or partially circular, and the size of the chip placement groove 301 is larger than the common round wafer size in the prior art, and the center of the chip placement groove 301 coincides with the center of the carrier 3; the size of the hole 302 is larger than the size of the cross-section of the centering mechanism 4, which is convenient for the centering mechanism 4 to pass through the hole to lift the chip and drive the chip to move; the size of the hole 302 is smaller than the size of the chip placement groove 301 and the chip to be referenced and centered, so that the chip can fall into the chip placement groove 301 when the centering mechanism 4 descends.

[0034] Furthermore, in order to prevent the wafer from shifting during the process of rising and falling, resulting in inaccurate positioning, the centering mechanism 4 and / or the wafer placement groove 301 are provided with a vacuum adsorption mechanism for adsorbing the wafer. When the centering mechanism 4 is provided with a vacuum adsorption mechanism, the vacuum adsorption mechanism of the centering mechanism 4 is turned on when the centering mechanism 4 rises, adsorbs the wafer to fix it to the centering mechanism 4, and rises, rotates and falls with the centering mechanism 4. When the centering mechanism 4 falls to be flush with the upper surface of the stage 3, the vacuum adsorption mechanism is closed to separate the wafer from the centering mechanism 4. When the wafer placement groove 301 is provided with a vacuum adsorption mechanism, the vacuum adsorption mechanism of the wafer placement groove 301 is turned on when the wafer contacts the wafer placement groove 301, and the vacuum adsorption mechanism of the wafer placement groove 301 is closed after the centering mechanism 4 rises and contacts the wafer.

[0035] In this embodiment, the centering mechanism 4 and the chip placement groove 301 are both provided with a vacuum adsorption mechanism. When the chip contacts the chip placement groove 301, the vacuum adsorption mechanism of the chip placement groove 301 is turned on; when the centering mechanism 4 rises and contacts the chip, the vacuum adsorption mechanism of the chip placement groove 301 is closed, and the vacuum adsorption mechanism of the centering mechanism 4 is turned on; when the centering mechanism 4 descends until the chip contacts the chip placement groove 301, the vacuum adsorption mechanism of the centering mechanism 4 is closed, and the vacuum adsorption mechanism of the chip placement groove 301 is turned on, thereby completing the handover of the chip.

[0036] Specifically, the centering mechanism 4 and the upper end surface of the chip placement groove 301 are provided with adsorption holes 303, and the adsorption holes 303 are connected to the vacuum generator through a vacuum suction pipe; the centering mechanism 4 and the chip placement groove 301 can be connected to different vacuum generators respectively, and can also be connected to the same vacuum generator respectively; the vacuum generator and the vacuum suction pipe are existing technologies and can be obtained by purchase, and will not be described in detail here.

[0037] In order to ensure that the centering mechanism 4 has a balanced moving distance in different directions when the hole 302 moves, the center of the hole 302 coincides with the center of the chip placement groove 301, that is, the rotation axis of the centering mechanism 4 coincides with the center of the hole 302. When the chip deviates in different directions, it can be adjusted by the centering mechanism 4.

[0038] Because the chip is placed in the chip placement slot 301, the reference-seeking mechanism 5 sends a signal in the direction of the notch 304. When the chip does not block the signal sent by the reference-seeking mechanism 5, the signal passes through the notch 304 and is received; when the chip blocks the signal sent by the reference-seeking mechanism 5, the edge position of the chip can be determined; when the chip specifications are different or placed at different positions in the chip placement slot 301, the signal should have a sufficient detection range to realize the detection function of the reference-seeking mechanism 5; preferably, the notch 304 extends from the hole 302 to the outside of the chip placement slot 301, so that the detection range of the signal can cover the entire radial range of the chip placement slot 301, and effectively identify all chip edge positions within the range.

[0039] In this embodiment, the reference-seeking mechanism 5 includes a reference-seeking sensor, a bracket 501 and a driving device 502. The transmitting end 5011 and the receiving end 5012 of the reference-seeking sensor are relatively arranged on the bracket 501, so that the transmitting end 5011 is higher than the upper end surface of the notch 304, and the receiving end 5012 is lower than the upper end surface of the notch 304; the driving device 502 drives the bracket 501 to move along the notch 304. Specifically, the driving device 502 is arranged on the frame 1, and its output end is connected to the bracket 501, driving the bracket 501 to move toward the center of the chip placement groove 301 or away from the center of the chip placement groove 301, so as to realize the movement of the signal emitted by the reference sensor in the notch 304; the bracket 501 is provided with a relative upper support rod and a lower support rod, one end of the upper support rod and the lower support rod are connected by a vertical rod, and the other end extends toward the direction close to the chip placement groove 301, the transmitting end 5011 of the reference sensor is arranged at the extended end of the upper support rod, and the receiving end 5012 is arranged at the extended end of the lower support rod; the upper support rod is arranged above the upper end surface of the notch 304, and the lower support rod is arranged below the upper end surface of the notch 304. Specifically, the receiving end 5012 of the lower support rod can be located in the notch 304 or below the notch 304. When in use, the transmitting end 5011 and the receiving end 5012 are respectively located above and below the chip, realizing the function of the reference sensor to detect the chip.

[0040] Specifically, the moving mechanism 6 includes a transverse mechanism 601, a lifting mechanism 602 and a rotating mechanism 603 which are connected in sequence. The transverse mechanism 601 is arranged on the base 2, the rotating mechanism 603 is connected to the centering mechanism 4, and the rotation center of the rotating mechanism 603 coincides with the axis of the centering mechanism 4; specifically, the transverse mechanism 601 is arranged above the base 2, and the lifting mechanism 602 is arranged on the upper part of the transverse mechanism 601. When the transverse mechanism 601 is in operation, it drives the lifting mechanism 602 to move in the horizontal direction; the rotating mechanism 603 is arranged on the upper part of the lifting mechanism 602. When the lifting mechanism 602 is in operation, it drives the rotating mechanism 603 to move in the vertical direction; the centering mechanism 4 is arranged on the upper part of the rotating mechanism 603. When the rotating mechanism 603 rotates, it drives the centering mechanism 4 to rotate along its axis.

[0041] Specifically, the transverse movement mechanism 601 includes a transverse movement drive component 6011, a slide bar 6012 and a slider 6013. The transverse movement drive component 6011 and the slide bar 6012 are both installed on the base 2; the transverse movement drive component 6011 is connected to the slide bar 6012, and the slider 6013 is connected to the slide bar 6012; when the transverse movement drive component 6011 is running, it drives the slider 6013 to move along the slide bar 6012.

[0042] Specifically, the lifting mechanism 602 includes a mobile platform 6021, a telescopic device 6022 and a lifting block 6023 connected in sequence, the mobile platform 6021 is arranged on the top of the slider 6013, and the telescopic device 6022 is vertically arranged on the mobile platform 6021; when the telescopic device 6022 is running, it drives the lifting block 6023 to rise or fall.

[0043] Specifically, the rotating mechanism 603 includes a rotating drive component 6031, a rotating shaft 6032 and a rotating sleeve 6033; the rotating sleeve 6033 is arranged on the top of the lifting block 6023, and the rotating shaft 6032 is arranged inside the rotating sleeve 6033 and is connected to the rotating drive component 6031; when the rotating drive component 6031 is running, it drives the rotating shaft 6032 to rotate; the upper part of the rotating shaft 6032 is connected to the centering mechanism 4, and the axis of the rotating shaft 6032 coincides with the rotation axis of the centering mechanism 4.

[0044] In this embodiment, the transverse drive assembly 6011, the telescopic device 6022, and the rotation drive assembly 6031 can all adopt cylinders, electric cylinders or hydraulic cylinders and their supporting equipment, which will not be elaborated here.

[0045] Furthermore, the chip reference and centering device of the present application also includes a control system, which controls the operation of the reference-seeking mechanism 5 and receives measurement data of the reference-seeking mechanism 5, and controls the operation of the vacuum adsorption mechanism, the transverse movement mechanism 601, the lifting mechanism 602 and the rotating mechanism 603 through analysis and calculation.

[0046] In this embodiment, the chip is placed on the carrier 3 from above by the robot. In order to facilitate the robot to grab, the carrier 3 is provided with a grabbing groove, which is connected to the chip placement groove 301 and is staggered with the notch 304; preferably, one or more grabbing grooves can be provided, and their number and position are set according to the structure of the robot. In this embodiment, a grabbing groove is provided, and the position of the grabbing groove is arranged on both sides of the hole 302 relative to the notch 304, so as to facilitate the robot to grab the chip from two directions; in some special application requirements, the chip can be placed and taken manually by clamping or sucking with a clamping tool, which is more flexible to use.

[0047] The technical content of this application is further illustrated by specific embodiments below.

[0048] Example 1

[0049] like Figure 1-Figure 3 As shown, this embodiment provides a wafer reference finding and centering device, including a frame 1 and a base 2, a carrier 3, a centering mechanism 4, a reference finding mechanism 5, a moving mechanism 6 and a control system.

[0050] The above components are described in detail below.

[0051] The carrier 3 is connected to the frame 1 and is a circular platform arranged in the horizontal direction, wherein a circular wafer placement groove 301 is arranged in the middle thereof, a hole 302 is arranged in the middle of the wafer placement groove 301, and the centers of the carrier 3, the wafer placement groove 301 and the hole 302 coincide; the wafer placement groove 301 is provided with a notch 304, which extends from the hole 302 to the edge of the carrier 3 and is fan-shaped as a whole; the upper end surface of the wafer placement groove 301 is provided with an adsorption hole 303, and the adsorption hole 303 is connected to the vacuum generator through a vacuum suction pipe. In this embodiment, the size of the wafer placement groove 301 is larger than the size of an 8-inch round wafer. Because this device is used in a specific working condition, the inventor of this application found that the wafer offset is small under this working condition, so the size of the hole 302 is small, which is sufficient to meet its use requirements while avoiding environmental corrosion of the internal components of the carrier 3 caused by the opening being too large.

[0052] The reference-seeking mechanism 5 includes a reference-seeking sensor, a bracket 501 and a driving device 502. The driving device 502 is arranged on the frame 1, and its output end is connected to the bracket 501, driving the bracket 501 to move toward the center of the chip placement groove 301 or away from the center of the chip placement groove 301; the bracket 501 is provided with a relative upper support rod and a lower support rod, one end of the upper support rod and the lower support rod are connected by a vertical rod, and the other end extends toward the direction close to the chip placement groove 301, the transmitting end 5011 of the reference-seeking sensor is arranged at the extended end of the upper support rod, and the receiving end 5012 is arranged at the extended end of the lower support rod; the upper support rod is arranged above the upper end surface of the notch 304, and the lower support rod is arranged below the upper end surface of the notch 304. When the driving device 502 is running, it drives the bracket 501 to move along the notch 304, that is, along the radial direction of the carrier 3.

[0053] The moving mechanism 6 includes a transverse mechanism 601, a lifting mechanism 602 and a rotating mechanism 603 which are connected in sequence. The transverse mechanism 601 includes a transverse driving assembly 6011, a slide bar 6012 and a slider 6013. The transverse driving assembly 6011 and the slide bar 6012 are both installed on the base 2. The transverse driving assembly 6011 is connected to the slide bar 6012, and the slider 6013 is connected to the slide bar 6012. When the transverse driving assembly 6011 is running, the slider 6013 is driven to move along the slide bar 6012. The lifting mechanism 602 includes a moving platform 6021, a telescopic device 6022 and a lifting block 6023 which are connected in sequence. The moving platform 6021 is arranged on the slider. 6013, the telescopic device 6022 is vertically arranged on the mobile platform 6021; when the telescopic device 6022 is in operation, it drives the lifting block 6023 to rise or fall; the rotating mechanism 603 includes a rotating drive component 6031, a rotating shaft 6032 and a rotating sleeve 6033; the rotating sleeve 6033 is arranged on the top of the lifting block 6023, and the rotating shaft 6032 is arranged inside the rotating sleeve 6033 and is connected to the rotating drive component 6031; when the rotating drive component 6031 is in operation, it drives the rotating shaft 6032 to rotate; the upper part of the rotating shaft 6032 is connected to the centering mechanism 4, and the axis of the rotating shaft 6032 coincides with the rotation axis of the centering mechanism 4.

[0054] In this embodiment, the transverse drive component 6011 adopts a cylinder and its supporting equipment, and the telescopic device 6022 adopts a hydraulic cylinder and its supporting equipment; the rotation drive component 6031 can adopt an electric cylinder and its supporting equipment, all of which are purchased and used as a set.

[0055] The centering mechanism 4 is a circular shaft, and its initial position axis coincides with the center of the wafer placement groove 301. When the moving mechanism 6 is operated to raise the centering mechanism 4, the centering mechanism 4 passes through the hole 302, and an adsorption hole 303 is provided on its upper end surface. The adsorption hole 303 is connected to the vacuum generator through a vacuum suction pipe.

[0056] The reference-seeking mechanism 5, vacuum adsorption mechanism, transverse movement mechanism 601, lifting mechanism 602 and rotating mechanism 603 are all connected to the control system. The control system controls the operation of the reference-seeking mechanism 5 and receives the measurement data of the reference-seeking mechanism 5, and controls the operation of the vacuum adsorption mechanism, transverse movement mechanism 601, lifting mechanism 602 and rotating mechanism 603 through analysis and calculation.

[0057] In this embodiment, the method of using the above-mentioned wafer centering device to perform centering on the wafer is as follows:

[0058] The grabbing parameters of the manipulator of the preset rack 1 are such that the axis center of the wafer positioning axis 7 coincides with the center of the wafer placement slot 301; the manipulator places the wafer in the wafer placement slot 301, at which time the centering mechanism 4 is in the initial position, and its axis center coincides with the center of the wafer placement slot 301; the lifting mechanism 602 is operated to drive the centering mechanism 4 to rise, and at the same time, the controller starts the vacuum adsorption mechanism of the centering mechanism 4, the centering mechanism 4 contacts the wafer and adsorbs the wafer and lifts it synchronously, so that the wafer is separated from the carrier 3; the rotating mechanism 603 is operated to rotate, driving the centering mechanism 4 to rotate around its axis center, thereby driving the wafer to rotate; the reference-seeking mechanism 5 is operated to send a signal, so that the signal emitted by the reference-seeking mechanism 5 moves in the notch 304, detects the edge position of the wafer, and transmits the measurement data to the control system, and the control system determines the offset between the center of the wafer and the center of the wafer placement slot 301 by calculation; the control system operates the lifting mechanism 602 to descend, so that the centering mechanism 4 drives the wafer to descend, and when the wafer contacts the wafer placement slot 301, the control system closes the centering mechanism 4. The control system operates the transverse movement mechanism 601 and the rotation mechanism 603 to make the rotation axis of the centering mechanism 4 coincide with the center of the wafer, and then operates the lifting mechanism 602 to make the centering mechanism 4 rise, and turns on the vacuum suction mechanism of the centering mechanism 4, the centering mechanism 4 drives the wafer to rise again, and then operates the rotation mechanism 603 to rotate and drive the centering mechanism 4 to rotate around its axis, thereby driving the wafer to rotate, and operates the reference-seeking mechanism 5 to send a signal to detect the edge position of the wafer to determine whether the center of the wafer is aligned with the center of the wafer placement slot 301; if it is determined to be aligned after detection, the control system operates the lifting mechanism 602 to descend, so that the centering mechanism 4 drives the wafer to descend, and when the wafer contacts the wafer placement slot 301, the control system turns off the vacuum suction mechanism of the centering mechanism 4, and turns on the vacuum suction mechanism of the wafer placement slot 301, completing the wafer handover, realizing the precise positioning and position adjustment of the wafer, and finally realizing the robot hand accurately transporting the wafer to the set position.

[0059] Among them, the control system determines the offset between the center of the chip and the center of the chip placement slot 301 by calculation. The principle is: according to the polar coordinate data of the chip edge collected by the reference-seeking mechanism 5, the arc part data is screened according to the change characteristics of the measured radius, an equation model is established, and the least squares method is used to fit the equation expression of the circle, so as to calculate the eccentricity Δr of the true center of the chip and the axial position of the centering mechanism 4 in the radial direction, that is, the eccentricity of the true center of the chip and the chip positioning axis 7 in the radial direction; at the same time, the phase angle α with the axial direction of the movement of the transverse movement mechanism 601 is measured.

[0060] Among them, the control system operates the transverse movement mechanism 601 and the rotation mechanism 603 to make the rotation axis of the centering mechanism 4 coincide with the center of the chip, specifically: the control system controls the rotation mechanism 603 to rotate in the opposite direction of the angle α, so that the axial direction of the movement of the transverse movement mechanism 601 coincides with the radial direction of the chip, and then controls the transverse movement mechanism 601 to move a distance of Δr along its axial direction, so that the rotation axis of the centering mechanism 4 coincides with the center of the chip, thereby achieving the purpose of aligning the centering mechanism 4.

[0061] Among them, the reference-seeking mechanism 5 sends a signal to detect the edge position of the chip and determine whether the center of the chip is aligned with the center of the chip placement slot 301. The specific judgment method is: when the chip edge signal detected by the reference-seeking mechanism 5 is a continuous signal, it means that the chip is currently rotating around its center; when the chip edge signal detected by the reference-seeking mechanism 5 is a discontinuous jumping signal, it means that the chip is currently not rotating around its center, that is, the alignment is not completed.

[0062] The above is a detailed description of the embodiments of the utility model, but the contents are only preferred embodiments of the utility model and cannot be considered to limit the scope of implementation of the utility model. All equivalent changes and improvements made within the scope of application of the utility model should still fall within the scope of the patent coverage of the utility model.

Claims

1. A wafer centering device, comprising a frame and a base, characterized in that; It also includes a carrier, a centering mechanism, a reference-seeking mechanism and a moving mechanism; the carrier and the reference-seeking mechanism are respectively connected to the frame; the centering mechanism is arranged on the base through the moving mechanism, and the moving mechanism drives the centering mechanism to move in the horizontal and vertical directions and rotate around the axis of the centering mechanism; the chip placement groove of the carrier is provided with a hole, and the structure of the hole can accommodate the centering mechanism to pass through and move in the hole; the center of the chip placement groove of the carrier coincides with the axis of the centering mechanism when it is in the initial position; the chip placement groove is provided with a notch, and the signal of the reference-seeking mechanism is emitted to the notch and can make the signal move in the notch.

2. The wafer centering device according to claim 1, characterized in that: The centering mechanism and / or the wafer placement groove are provided with a vacuum adsorption mechanism for adsorbing the wafer.

3. The wafer centering device according to claim 2, characterized in that: The center of the hole coincides with the center of the wafer placement groove.

4. The wafer centering device according to claim 3, characterized in that: The notch extends from the hole to the outside of the wafer placement groove.

5. The wafer centering device according to any one of claims 2 to 4, characterized in that: The reference-seeking mechanism includes a reference-seeking sensor, a bracket and a driving device. The transmitting end and the receiving end of the reference-seeking sensor are relatively arranged on the bracket, so that the transmitting end is higher than the upper end surface of the notch, and the receiving end is lower than the upper end surface of the notch; the driving device drives the bracket to move.

6. The wafer centering device according to claim 5, characterized in that: The moving mechanism comprises a transverse movement mechanism, a lifting mechanism and a rotating mechanism which are connected in sequence. The transverse movement mechanism is arranged on the base. The rotating mechanism is connected to the centering mechanism. The rotation center of the rotating mechanism coincides with the axis center of the centering mechanism.

7. The wafer centering device according to claim 6, characterized in that: The transverse movement mechanism includes a transverse movement driving assembly, a sliding bar and a sliding block, wherein the transverse movement driving assembly and the sliding block are both installed on the base; the transverse movement driving assembly is connected to the sliding bar, and the sliding block is connected to the sliding bar; when the transverse movement driving assembly is running, the sliding block is driven to move along the sliding bar.

8. The wafer centering device according to claim 7, characterized in that: The lifting mechanism comprises a mobile platform, a telescopic device and a lifting block which are connected in sequence. The mobile platform is arranged on the top of the slider, and the telescopic device is vertically arranged on the mobile platform. When the telescopic device is in operation, it drives the lifting block to rise or fall.

9. The wafer centering device according to claim 8, characterized in that: The rotating mechanism includes a rotating drive component, a rotating shaft and a rotating sleeve; the rotating sleeve is arranged on the top of the lifting block, and the rotating shaft is arranged inside the rotating sleeve and connected to the rotating drive component; when the rotating drive component is running, the rotating shaft is driven to rotate; the upper part of the rotating shaft is connected to the centering mechanism.

10. The wafer centering device according to claim 6, characterized in that: It also includes a control system, which controls the operation of the reference-seeking mechanism and receives measurement data of the reference-seeking mechanism, and controls the operation of the vacuum adsorption mechanism, the transverse movement mechanism, the lifting mechanism and the rotating mechanism through analysis and calculation.

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