Preheating base and chip substrate preheating system

Abstract

The embodiment of the utility model discloses a preheating base and a chip substrate preheating system. The preheating base comprises a base body and at least one boss set, the boss set is arranged on the base body and comprises a main protruding block and at least one auxiliary protruding block, and an avoiding groove is formed between the auxiliary protruding block and the main protruding block. According to the preheating base, the boss set is in direct contact with the substrate for heating, so that the substrate can be rapidly heated, the optimal welding temperature is achieved when the substrate is conveyed to a mounting platform, and meanwhile, the situation that the substrate falls off and is damaged due to the fact that the tray is demagnetized and separated due to the fact that the contact heating temperature of the tray is too high can be avoided.

Description

Technical Field

[0001] The utility model relates to the technical field of flip chips, in particular to a preheating base and a chip substrate preheating system. Background Art

[0002] With the continuous innovation of mobile phone camera technology, cameras have also developed from single-camera to multi-camera, from low-pixel to high-pixel and to periscope lenses with high-magnification optical zoom. Along with this is the increase in the difficulty of camera manufacturing process. In order to adapt to the development of the market, process manufacturers need to continuously develop production technology for high-end cameras. Flip chip welding technology is a technology that flips the chip that has been loaded with gold balls and ultrasonically welds it to a ceramic substrate. This process can make the camera thinner, more powerful, and more reliable. It is the core technology of current camera assembly. In the current flip chip welding process, the ceramic substrate needs to have an optimal welding temperature of more than 120°C. Under the combined action of force, temperature, and ultrasonic vibration, the chip is welded to the substrate to complete the welding operation.

[0003] Currently, the metal tray loaded with ceramic substrates is heated on the preheating platform, and the metal tray transfers the temperature to the ceramic substrate. During this process, the metal tray will quickly heat up to above 140°C on the preheating platform, which causes the magnetism of the metal tray to disappear, causing the upper and lower parts of the metal tray to separate, and the ceramic substrate to fall on the preheating platform, causing damage to the capacitor / IC, affecting product yield and production efficiency. At the same time, the ceramic substrate cannot be preheated to a sufficient temperature, so that the temperature of the ceramic substrate when it is transported to the installation platform is lower than the optimal welding temperature. Utility Model Content

[0004] In view of this, an embodiment of the utility model provides a preheating base and a chip substrate preheating system, so that the preheating base is directly contacted and heated with the substrate through a boss group, so that the substrate can be quickly heated up and can reach the optimal welding temperature when transferred to the mounting platform. At the same time, it can also avoid the damage to the substrate falling caused by the demagnetization and separation of the tray due to the contact heating temperature being too high, thereby improving the production yield.

[0005] In the first aspect, an embodiment of the utility model provides a preheating base, including a base body and at least one boss group, wherein the boss group is arranged on the base body, and the boss group includes a main boss block and at least one auxiliary boss block, and an avoidance groove is formed between the auxiliary boss block and the main boss block.

[0006] Preferably, the height of the main protruding block is greater than or equal to the height of the auxiliary protruding block.

[0007] Preferably, the cross-sectional shape of the main protruding block and the auxiliary protruding block comprises a rounded rectangle.

[0008] Preferably, there are two auxiliary protruding blocks, which are symmetrically arranged on both sides of the main protruding block.

[0009] Preferably, at least two positioning columns are further provided on the base body, and the positioning columns are provided on the base body near an edge position.

[0010] Preferably, the preheating base comprises a plurality of boss groups, which are evenly spaced on the base body, and a boss group in an upper row / column is located between two boss groups in a lower row / column.

[0011] In a second aspect, an embodiment of the utility model provides a chip substrate preheating system, comprising:

[0012] Preheat the base;

[0013] A tray, comprising at least one hollow slot for placing a substrate;

[0014] The boss group extends into the hollow groove and contacts the bottom surface of the substrate, a first gap is provided between the bottom surface of the tray and the top surface of the base body, and a second gap is provided between the inner wall of the hollow groove and the boss group.

[0015] Preferably, the tray comprises:

[0016] A top plate having at least one top plate groove;

[0017] The bottom plate is connected to the bottom of the top plate by magnetic adsorption. The bottom plate is provided with at least one bottom plate groove. The top plate groove and the bottom plate groove are connected in a one-to-one correspondence to form the hollow groove.

[0018] Preferably, the horizontal cross-sectional area of ​​the top plate groove is larger than the horizontal cross-sectional area of ​​the bottom plate groove, and the shape of the top plate groove and the shape of the bottom plate groove form a relative step shape in the vertical cross-section.

[0019] Preferably, the height of the boss group is greater than the thickness of the bottom plate, and the horizontal cross-sectional area of ​​the bottom plate groove is greater than the horizontal cross-sectional area of ​​the boss group.

[0020] The embodiment of the utility model provides a preheating base and a chip substrate preheating system, wherein the preheating base includes a base body and at least one boss group, wherein the boss group is arranged on the base body, and includes a main boss block and at least one auxiliary boss block, wherein an avoidance groove is formed between the auxiliary boss block and the main boss block. The preheating base is heated by direct contact between the boss group and the substrate, so that the substrate can be heated quickly and can reach the optimal welding temperature when it is transferred to the mounting platform. At the same time, the use of a heating method in which the boss group is in direct contact with the substrate can also avoid the damage to the substrate caused by the loss of magnetism and separation of the tray due to excessive contact heating temperature, thereby improving the production yield. BRIEF DESCRIPTION OF THE DRAWINGS

[0021] The above and other purposes, features and advantages of the present invention will become more apparent through the following description of the embodiments of the present invention with reference to the accompanying drawings, in which:

[0022] Figure 1 It is a three-dimensional diagram of the base body and the boss assembly of one embodiment of the utility model;

[0023] Figure 2 This is a top view of a preheating base according to an embodiment of the utility model;

[0024] Figure 3 It is a side view of the base body and the boss assembly of one embodiment of the utility model;

[0025] Figure 4 This is a front view of a preheating base according to an embodiment of the utility model;

[0026] Figure 5 It is a top view of a boss assembly of an embodiment of the utility model;

[0027] Figure 6 It is a projection cross-sectional view of the positional relationship of a substrate, a tray, and a boss assembly in one embodiment of the utility model;

[0028] Figure 7 It is a projection cross-sectional view of the positional relationship between a tray and a boss assembly in one embodiment of the utility model;

[0029] Figure 8 is a cross-sectional view of a tray of an embodiment of the utility model;

[0030] Fig. 9 It is a three-dimensional cross-sectional view of the positional relationship between a tray and a boss assembly in one embodiment of the utility model;

[0031] Fig.10 This is a temperature curve diagram of a substrate and a tray when a preheating base is used for heating in one embodiment of the utility model;

[0032] Fig.11 It is a temperature curve diagram of the substrate and the tray when the preheating platform is used for heating in the prior art.

[0033] Description of reference numerals:

[0034] 100-preheating base; 110-base body; 120-boss group; 121-main protrusion block; 122-auxiliary protrusion block; 123-avoidance groove; 130-positioning column; 200-tray; 210-top plate; 220-bottom plate; 230-hollow groove; 231-top plate groove; 232-bottom plate groove; 300-base plate; 310-through groove. DETAILED DESCRIPTION

[0035] The present application is described below based on embodiments, but the present application is not limited to these embodiments. In the detailed description of the present application below, some specific details are described in detail. It is possible for those skilled in the art to fully understand the present application without the description of these details. In order to avoid confusing the essence of the present application, known methods, processes, flows, components and circuits are not described in detail.

[0036] In addition, persons of ordinary skill in the art will appreciate that the drawings provided herein are for illustration purposes and are not necessarily drawn to scale.

[0037] Unless otherwise clearly defined and specified, the terms "installed", "connected", "connected", "fixed" and the like should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium; it can be the internal connection of two elements or the interaction relationship between two elements, unless otherwise clearly defined. For ordinary technicians in this field, the specific meanings of the above terms in this application can be understood according to specific circumstances.

[0038] For ease of explanation, spatially relative terms such as "inside", "outside", "below", "below", "lower", "above", "upper", etc. are used herein to describe the relationship of one element or feature illustrated in the figures to another element or feature. It will be understood that spatially relative terms may be intended to include different orientations of the device in use or operation other than the orientation depicted in the figures. For example, if the device in the figure is turned over, an element described as being "below" or "below" other elements or features will then be positioned as being "above" the other elements or features. Thus, the example term "below" can include both the orientations of above and below. The device may be oriented in other ways (rotated 90 degrees or in other orientations), and the spatially relative descriptors used herein should be interpreted accordingly.

[0039] Unless the context clearly requires otherwise, the words "include", "comprising" and similar words throughout the application should be interpreted as including rather than exclusive or exhaustive; that is, the meaning is "including but not limited to".

[0040] In the description of this application, it should be understood that the terms "first", "second", etc. are only used for descriptive purposes and cannot be understood as indicating or implying relative importance. In addition, in the description of this application, unless otherwise specified, the meaning of "plurality" is two or more.

[0041] During the flip chip welding process, the substrate 300 needs to be preheated so that the substrate 300 has an optimal welding temperature of more than 120°C when it is transferred to the mounting platform, so that the chip is welded to the substrate 300 under the combined action of force, temperature and ultrasonic vibration. The substrate 300 is usually a ceramic substrate.

[0042] Reference Figure 1-Figure 3 The preheating base 100 of the utility model embodiment includes a base body 110 and at least one boss group 120. The boss group 120 is arranged on the base body 110, and is used to contact and heat the substrate 300, so as to preheat the substrate 300 and enable it to be at an optimal welding temperature when it is transferred to the mounting platform. The boss group 120 can be integrally formed with the base body 110, and in other embodiments, it can also be connected by bolts, snaps, etc. The boss group 120 includes a main protrusion block 121 and at least one auxiliary protrusion block 122, and an avoidance groove 123 is formed between the auxiliary protrusion block 122 and the main protrusion block 121. Since a capacitor element is arranged on the surface of the substrate 300, the capacitor element will be damaged by direct heat, so it is necessary to avoid the capacitor element at the bottom of the substrate 300 through the avoidance groove 123. The position and shape of the avoidance groove 123 are adapted to the position and shape of the capacitor element, and the position and shape of the auxiliary protrusion block 122 are set according to the position and shape of the avoidance groove 123 formed by the auxiliary protrusion block 122 and the main protrusion block 121 .

[0043] In some embodiments, the height of the main protrusion block 121 is greater than or equal to the height of the auxiliary protrusion block 122. The auxiliary protrusion block 122 can be adjusted in height according to the shape of the substrate 300, and cooperates with the main protrusion block 121 to provide auxiliary support and heating for the substrate 300. At this time, the upper surface of the main protrusion block 121 is still in contact with the substrate 300 and heats the substrate 300, which does not affect the preheating process.

[0044] In some embodiments, the cross-sectional shape of the main protrusion block 121 and the auxiliary protrusion block 122 includes a rounded rectangle. The cross-sectional shape of the main protrusion block 121 and the auxiliary protrusion block 122 can also be changed according to the shape of the substrate, for example, the cross-sectional shape is set to a circular, oval, rectangular or irregular shape such as an "L" shape, etc., to cooperate with the heating of the substrate 300 and the avoidance of the capacitor element.

[0045] The number of the auxiliary protrusion block 122 can be one, two, three, etc. The auxiliary protrusion block 122 is arranged outside the main protrusion block 121 to support and heat the substrate in cooperation with the main protrusion block 121. Figure 5 There are two auxiliary protrusion blocks 122, which are symmetrically arranged on both sides of the main protrusion block 121. At this time, two symmetrical avoidance grooves 123 are formed between the two auxiliary protrusion blocks 122 and the main protrusion block 121, so as to achieve heating of the substrate 300 provided with corresponding symmetrical capacitor elements.

[0046] In some embodiments, reference Figure 4 , at least two positioning posts 130 are also provided on the base body 110, and the positioning posts 130 are arranged near the edge position of the base body 110 for positioning the tray 200. The tray 200 is provided with hollow grooves 230 having the same number as the boss group 120. After the positioning posts 130 have positioned the tray 200, the positions of the hollow grooves 230 and the boss group 120 can correspond one to one. When the substrate 300 is placed in the hollow grooves 230, the lower surface of the substrate 300 can contact the boss group 120, and there is a gap between the lower surface of the tray 200 and the inner wall of the hollow grooves 230 and the base body 110 and the boss group 120. At this time, the position of the capacitor element on the substrate 300 corresponds to the position of the avoidance groove 123, so as to achieve heating of the substrate 300 without damaging the capacitor element.

[0047] In some embodiments, reference Figure 2 The preheating base 100 includes a plurality of boss groups 120, which are evenly spaced on the base body 110, and the boss groups 120 in the upper row / column are located between the two boss groups 120 in the lower row / column. The spaced arrangement of the boss groups 120 can effectively utilize the space of the preheating base 100. Since the number of boss groups 120 in a row / column, the intervals between the boss groups 120, and the positions of the hollow grooves 230 on the tray 200 correspond one to one, the position arrangement of the boss groups 120 can also be expressed as a rectangular array or other arrangement methods according to actual conditions.

[0048] Reference Figure 6-Figure 8 The chip substrate preheating system of the embodiment of the utility model includes a preheating base 100 and a tray 200, and the tray 200 includes at least one hollow groove 230 for placing the substrate 300. The position of the hollow groove 230 corresponds one-to-one to the position of the boss group 120. Among them, the boss group 120 extends into the hollow groove 230 and contacts the bottom surface of the substrate 300, and the height of the boss group 120 is greater than the thickness of the bottom plate 220, so that there is a first gap between the bottom surface of the tray 200 and the top surface of the base body 110. The horizontal cross-sectional area of ​​the bottom plate groove 232 is greater than the horizontal cross-sectional area of ​​the boss group 120, so that there is a second gap between the inner wall of the hollow groove 230 and the side wall of the boss group 120. Refer to Fig. 9 , the first gap is connected to the second gap, that is, the preheating base 100 does not contact the tray 200, and the boss group 120 directly heats the substrate 300. In other words, the first gap and the second gap can prevent the heat from being directly transferred to the tray 200 during the preheating process, causing the tray 200 to lose magnetism due to high temperature deformation and separation from top to bottom, causing the substrate 300 to fall and damage the substrate 300.

[0049] Fig.10This is a temperature curve diagram of a substrate and a tray when a preheating base is used for heating in one embodiment of the utility model; Fig.11 It is a temperature curve diagram of the substrate and the tray when the preheating platform is used for heating in the prior art.

[0050] refer to Fig.10 When the preheating base 100 of the utility model is used for heating, the temperature of the tray 200 is significantly lower than the temperature of the substrate 300 during the preheating and the process of sending the substrate 300 to the mounting platform. When the substrate 300 is heated to the highest preheating temperature, the highest temperature of the tray 200 is only about 52°C, and during the entire heating process, the temperature of the tray 200 does not exceed 100°C. Under this temperature condition, the tray 200 will not deform or lose magnetism. At the same time, when the substrate 300 is transferred to the mounting platform, the substrate 300 can reach the optimal welding temperature of about 120°C.

[0051] refer to Fig.11 When the preheating base 100 in the prior art is used for heating, the temperature of the tray 200 is always higher than the temperature of the substrate 300 during the entire preheating and soldering process of the substrate 300 on the mounting platform. When the substrate 300 is heated to the highest preheating temperature, the highest preheating temperature does not exceed 100°C, and the temperature of the tray 200 has reached about 120°C at this time, which can neither make the substrate 300 at the optimal soldering temperature when it is transferred to the mounting platform, nor can the tray 200 be deformed and demagnetized due to the high temperature, resulting in the separation of the upper and lower parts of the tray 200, and the substrate 300 falling and being damaged.

[0052] In some embodiments, the tray 200 includes a top plate 210 and a bottom plate 220, and the bottom plate 220 is connected to the bottom of the top plate 210 by magnetic adsorption. The top plate 210 and the bottom plate 220 are used to hold and clamp the substrate 300, and are used to transport the substrate 300. The top plate 210 is provided with at least one top plate groove 231, and the bottom plate 220 is provided with at least one bottom plate groove 232. The top plate groove 231 and the bottom plate groove 232 are connected to form a hollow groove 230 in a one-to-one correspondence. The hollow groove 230 is used to place the substrate 300, and by limiting the position of the substrate 300, the substrate 300 is prevented from being tilted and damaged due to position movement.

[0053] In some embodiments, the horizontal cross-sectional area of ​​the top plate groove 231 is greater than the horizontal cross-sectional area of ​​the bottom plate groove 232, and the shape of the top plate groove 231 and the shape of the bottom plate groove 232 form a relative stepped shape in the vertical cross-section. At this time, the edge of the lower surface of the substrate 300 contacts the upper surface of the bottom plate groove 232, and the side of the substrate 300 contacts the inner wall of the top plate groove 231, which supports the substrate 300 and forms a limit. Since a stepped through groove 310 is provided in the center of the substrate 300 to accommodate the chip, the contact area between the substrate 300 and the top surface of the boss group 120 becomes smaller. Therefore, by limiting the substrate 300 through the bottom plate groove 232 and the top plate groove 231, it is possible to prevent the substrate 300 from being skewed or offset on the boss group 120, resulting in reduced heating efficiency and damage to the substrate 300, which affects the product yield.

[0054] In the embodiment of the utility model, the preheating base 100 includes a base body 110 and at least one boss group 120, the boss group 120 includes a main protrusion block 121 and at least one auxiliary protrusion block 122, and an avoidance groove 123 is formed between the auxiliary protrusion block 122 and the main protrusion block 121. The preheating base 100 is directly contacted and heated with the substrate 300 through the boss group 120, so that the substrate 300 can be quickly heated and can reach the optimal welding temperature when it is transferred to the mounting platform, while avoiding the problem of the substrate 300 falling and being damaged due to the demagnetization and separation of the tray 200 caused by the contact heating temperature being too high, and effectively improving the production yield.

[0055] The above description is only a preferred embodiment of the present application and is not intended to limit the present application. For those skilled in the art, the present application may have various modifications and variations. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present application shall be included in the protection scope of the present application.

Claims

1. A preheating base, characterized in that: The preheating base (100) comprises a base body (110) and at least one boss group (120), wherein the boss group (120) is arranged on the base body (110), and the boss group (120) comprises a main protrusion block (121) and at least one auxiliary protrusion block (122), wherein an avoidance groove (123) is formed between the auxiliary protrusion block (122) and the main protrusion block (121).

2. The preheating base according to claim 1, characterized in that: The height of the main protruding block (121) is greater than or equal to the height of the auxiliary protruding block (122).

3. The preheating base according to claim 1, characterized in that: The cross-sectional shapes of the main protruding block (121) and the auxiliary protruding block (122) include rounded rectangles.

4. The preheating base according to claim 1, characterized in that: The auxiliary protruding blocks (122) are two in number and are symmetrically arranged on both sides of the main protruding block (121).

5. The preheating base according to claim 1, characterized in that: At least two positioning columns (130) are also arranged on the base body (110), and the positioning columns (130) are arranged on the base body (110) near the edge.

6. The preheating base according to claim 1, characterized in that: The preheating base (100) comprises a plurality of boss groups (120) which are evenly spaced and arranged on the base body (110), and the boss groups (120) in an upper row / column are located between two boss groups (120) in a lower row / column.

7. A chip substrate preheating system, characterized in that: The chip substrate preheating system comprises: The preheating base (100) according to any one of claims 1 to 6; A tray (200) comprising at least one hollow groove (230) for placing a substrate (300); The boss group (120) extends into the hollow groove (230) and contacts the bottom surface of the substrate (300), a first gap is provided between the bottom surface of the tray (200) and the top surface of the base body (110), and a second gap is provided between the inner wall of the hollow groove (230) and the boss group (120).

8. The chip substrate preheating system according to claim 7, characterized in that: The tray (200) comprises: The top plate (210) is provided with at least one top plate groove (231); The bottom plate (220) is connected to the bottom of the top plate (210) by magnetic adsorption, and the bottom plate (220) is provided with at least one bottom plate groove (232), and the top plate groove (231) and the bottom plate groove (232) are connected in a one-to-one correspondence to form the hollow groove (230).

9. The chip substrate preheating system according to claim 8, characterized in that: The horizontal cross-sectional area of ​​the top plate groove (231) is greater than the horizontal cross-sectional area of ​​the bottom plate groove (232), and the shape of the top plate groove (231) and the shape of the bottom plate groove (232) form a relative stepped shape in the vertical cross-section.

10. The chip substrate preheating system according to claim 8, characterized in that: The height of the boss group (120) is greater than the thickness of the bottom plate (220), and the horizontal cross-sectional area of ​​the bottom plate groove (232) is greater than the horizontal cross-sectional area of ​​the boss group.

Images