Correcting device for semiconductor processing

Abstract

The utility model discloses a correcting device for semiconductor processing, which comprises a supporting plate, a semiconductor body, pulling assemblies, sliding rails, sliding blocks, supporting claws, connecting columns, bearing discs and pulling assemblies, and is characterized in that the two sides of the two groups of pulling assemblies are attached to the sliding blocks; according to the scheme, a worker takes out a semiconductor body and places the semiconductor body above the supporting plate, the worker loosens the sliding blocks, the two sets of sliding blocks are pulled through the pulling assembly above the supporting plate, the pulling assembly pulls the two sets of sliding blocks to be close to each other, and the supporting claws installed on the upper surfaces of the sliding blocks can be attached to the semiconductor body in the approaching process of the sliding blocks; in the box lifting process of the supporting claws and the semiconductor body, due to extrusion of the outer wall of the semiconductor body, the supporting claws slide in the sliding blocks, the sliding blocks support the supporting claws through the bearing discs and the connecting columns in the sliding blocks, the supporting claws obliquely extend upwards, the diameters of the supporting claws are gradually reduced, and the stress surfaces of the supporting claws make contact with the semiconductor body; the stability of the semiconductor body on the surface of the supporting plate is improved, and the clamping effect is improved.

Description

Technical Field

[0001] The present application relates to the technical field of feces cleaning for semiconductor processing calibration, and more particularly to a calibration device for semiconductor processing. Background Art

[0002] A semiconductor is an electronic material that has electrical conductivity properties between conductors and insulators. It plays an important role in electronics and circuit design. The electrical conductivity of semiconductor materials is between conductors (such as copper or aluminum) and insulators (such as rubber or wood), which allows semiconductors to control the flow of electric current under certain conditions.

[0003] Semiconductor materials are usually composed of elements such as silicon (Si) or germanium (Ge). The atomic structure of these materials gives them a special electronic band structure. In semiconductors, electronic energy bands can be divided into valence bands and conduction bands. The valence band is the basic energy level of electrons, while the conduction band is the energy level where electrons can move freely. In insulators, the energy gap between the valence band and the conduction band is very large, and it is difficult for electrons to jump into the conduction band, so insulators do not conduct electricity. In conductors, the energy gap between the valence band and the conduction band is almost non-existent, and electrons can jump freely between the two energy levels, resulting in good electrical conductivity in conductors.

[0004] A correction device for semiconductor processing refers to a device used in the semiconductor manufacturing process to calibrate and adjust the performance and characteristics of semiconductor devices. These devices are generally used to measure and correct various parameters and characteristics of semiconductor materials and devices, such as thickness, resistivity, doping concentration and electrical properties, and these devices are used to test the electrical properties of semiconductor devices (such as transistors or integrated circuits). They help to verify the electrical characteristics and performance of the device, including parameters such as current-voltage (IV) curves, capacitance and leakage current. When the semiconductor is tested and corrected for current and voltage, the semiconductor needs to be clamped. Due to the small size and thinness of the semiconductor, the semiconductor is prone to shaking when the worker tests the current and voltage, resulting in inaccurate measurement results. Therefore, a correction device for semiconductor processing is provided by a person skilled in the art to solve the problems raised in the above-mentioned background technology. Utility Model Content

[0005] In order to solve the problems raised in the above background technology, the present application provides a correction device for semiconductor processing.

[0006] The present application provides a semiconductor processing calibration device that adopts the following technical solution:

[0007] A semiconductor processing calibration device comprises a support plate, a slide rail is fixedly connected to the top of the support plate, a slider is slidably connected to the top of the slider, two groups of sliders are provided, claws are provided on the tops of the two groups of sliders, a plurality of claws are provided, a connecting column is provided below the claws, a bearing disk is provided below the connecting column, and the bottom of the bearing disk is fixedly connected to the inner wall of the slider;

[0008] A semiconductor body, which is disposed on the slide rail, and the periphery of the semiconductor body is in contact with the plurality of claws;

[0009] A pulling assembly is arranged above the supporting plate. The pulling assembly is provided in two groups, and both sides of the two groups of pulling assemblies are in contact with the sliding block.

[0010] In some embodiments, bottom columns are disposed below the support plate, and four groups of the bottom columns are symmetrically disposed, and bases are disposed below the four groups of the bottom columns.

[0011] In some embodiments, the upper surface of the support plate is provided with guide rods, and the guide rods are provided in two groups, and the two groups of sliding blocks slide along the upper surfaces of the two groups of guide rods.

[0012] In some embodiments, a limiting column is sleeved on the surface of the supporting claw, and the limiting column is installed inside the sliding block. An anti-slip strip is fixedly connected to one side of the supporting claw.

[0013] In some embodiments, the pulling assembly includes a shell fixed above the support plate, a guide column is provided inside the shell, a fixed disk is fixedly connected to the axis of the guide column, mounting disks are provided on both sides of the fixed disk, a pull rod is provided on the side where the two groups of mounting disks are away from each other, one end of the pull rod passes through the shell and is fixedly connected to the pulling disk, one side of the pulling disk is fixedly connected to the outer wall of one side of the slider, a spring is sleeved on the surface of the pull rod, and the spring is located on one side of the mounting disk and the fixed disk.

[0014] In some embodiments, a support seat is fixedly connected to the bottom of the inner wall of the shell, and the upper part of the support seat is in contact with the lower part of the guide column.

[0015] In summary, this application includes the following beneficial technical effects:

[0016] (1) A worker takes out the semiconductor body and places it on top of the support plate. The worker loosens the slider, and the two sets of sliders are pulled by the pulling assembly on the support plate. The pulling assembly pulls the two sets of sliders closer to each other. During the process of the sliders approaching, the claws installed on the upper surface will fit with the semiconductor body. During the process of lifting the semiconductor body from the box, the claws slide inside the slider due to the squeezing of the outer wall of the semiconductor body. The slider supports the claws through the internal bearing plate and the connecting column. The claws extend upward with an inclination and gradually decrease in diameter, so that the force-bearing surface of the claws contacts the semiconductor body, thereby increasing the stability of the semiconductor body on the surface of the support plate and improving the clamping effect.

[0017] (2) The outer shell protects the internal guide column, fixed plate and installation plate. The fixed plate is located in the middle of the guide column and fits the installation plates on both sides. The two sides of the guide column limit the pull rod. When the worker clamps the semiconductor body, the installation plate will slide towards each other through the elasticity of the spring. When the installation plate slides inside the guide column, the pull rod is pulled, and the pull rod pulls the pull plate to slide. The pull plate is fixed on the outer wall of the slider, so that the multiple groups of claws above the two groups of sliders are close to each other and fit with the outer wall of the semiconductor body, so that the semiconductor body is quickly clamped. The tension of the spring is not easy to cause wear on the outer wall of the semiconductor body, which affects the product quality. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] Figure 1 It is a structural schematic diagram of the overall structure in the embodiment of the present application;

[0019] Figure 2 is a schematic diagram of the structure of the semiconductor body clamping in the embodiment of the present application;

[0020] Figure 3 It is a schematic diagram of the structure of the bearing disk inside the slider in the embodiment of the present application;

[0021] Figure 4 It is a schematic diagram of the overall structure of the pulling assembly in the embodiment of the present application.

[0022] Explanation of the accompanying drawings: 1. Support plate; 11. Bottom column; 12. Base; 2. Slide rail; 3. Slider; 4. Guide rod; 5. Limit column; 6. Pull assembly; 61. Housing; 62. Support seat; 63. Guide column; 64. Fixed disk; 65. Pull rod; 66. Pull disk; 67. Spring; 68. Mounting disk; 7. Support claw; 71. Anti-slip strip; 72. Connecting column; 73. Bearing disk; 8. Semiconductor body. DETAILED DESCRIPTION

[0023] The following is combined with Figure 1-4 This application is described in further detail.

[0024] The present application discloses a semiconductor processing calibration device. Figure 1-4 A semiconductor processing correction device comprises a support plate 1, a semiconductor body 8 and a pulling assembly 6, a slide rail 2 is fixedly connected to the top of the support plate 1, a slider 3 is slidably connected to the top of the slide rail 2, two groups of sliders 3 are provided, claws 7 are provided on the top of the two groups of sliders 3, a plurality of claws 7 are provided, a connecting column 72 is provided below the claws 7, a bearing disk 73 is provided below the connecting column 72, and the bottom of the bearing disk 73 is fixedly connected to the inner wall of the slider 3, the semiconductor body 8 is provided on the slide rail 2, and the surrounding of the semiconductor body 8 is in contact with the plurality of claws 7, and the pulling assembly 6 is provided above the support plate 1, and two groups of the pulling assembly 6 are provided, and both sides of the two groups of pulling assemblies 6 are in contact with the slider 3;

[0025] In this way, during the implementation process, when the worker needs to clamp the semiconductor body 8, the worker places the support plate 1 on the surface of the workbench, the support plate 1 is placed horizontally, and then the worker slides the slider 3, the slider 3 slides on the surface of the slide rail 2 and the guide rod 4, and bosses are provided on both sides of the surface of the slide rail 2, and the bosses are embedded in the inside of the slider 3, so that the sliding stability of the slider 3 along the surface of the slide rail 2 is improved, and the two sets of guide rods 4 limit the two sides of the slider 3, so as to increase the sliding stability of the slider 3 on the surface of the slide rail 2;

[0026] The worker takes out the semiconductor body 8 and places it on the top of the support plate 1. The worker loosens the slider 3. The two groups of sliders 3 are pulled by the pulling component 6 above the support plate 1. The pulling component 6 pulls the two groups of sliders 3 closer to each other. During the approach of the sliders 3, the claws 7 installed on the upper surface will fit with the semiconductor body 8. During the process of lifting the claw 7 with the semiconductor body 8, due to the extrusion of the outer wall of the semiconductor body 8, the claw 7 slides inside the slider 3. The slider 3 supports the claw 7 through the internal bearing disk 73 and the connecting column 72. The claw 7 extends upward at an angle with a gradually decreasing diameter, so that the force-bearing surface of the claw 7 contacts with the semiconductor body 8, thereby increasing the stability of the semiconductor body 8 on the surface of the support plate 1 and improving the clamping effect.

[0027] Among them, a bottom column 11 is arranged under the support plate 1, and four groups of bottom columns 11 are symmetrically arranged. A base 12 is arranged under the four groups of bottom columns 11. The bottom column 11 is used between the base 12 and the support plate 1. The bottom of the base 12 is a suction cup. When the worker places the support plate 1 on a horizontal table, the worker presses the base 12 downward, and the air at the connection between the base 12 and the table is discharged, so that the base 12 is adsorbed above the table, which can increase the connection stability between the table and the support plate 1.

[0028] Preferably, a guide rod 4 is provided on the upper surface of the support plate 1, and two groups of guide rods 4 are provided. The two groups of sliders 3 slide along the upper surfaces of the two groups of guide rods 4. The guide rods 4 are semi-arc-shaped and installed inside the support plate 1. The upper surfaces of the guide rods 4 are fitted with the sliders 3. When the sliders 3 slide, both sides of the sliders 3 will slide along the outer walls of the guide rods 4 to improve stability.

[0029] Specifically, a limit column 5 is sleeved on the surface of the claw 7, and the limit column 5 is installed inside the slider 3. An anti-skid strip 71 is fixedly connected to one side of the claw 7. The limit column 5 is threadedly inserted into the inside of the slider 3 to facilitate the installation of the limit column 5. The inside of the limit column 5 will fit with the claw 7, so that the rotation stability of the claw 7 inside the slider 3 is improved. The anti-skid strip 71 is installed horizontally. The anti-skid strip 71 is made of rubber insulating material and can isolate the electrical transmission between the anti-skid strip 71 and the claw 7. The anti-skid strip 71 increases the surface friction of the claw 7 and improves the clamping stability of the semiconductor body (8).

[0030] More specifically, the pulling assembly 6 includes a shell 61 fixed on the support plate 1, a guide column 63 is arranged inside the shell 61, a fixed plate 64 is fixedly connected to the axis of the guide column 63, mounting plates 68 are arranged on both sides of the fixed plate 64, a pull rod 65 is arranged on the side away from each other of the two sets of mounting plates 68, one end of the pull rod 65 passes through the shell 61 and is fixedly connected to a pull plate 66, one side of the pull plate 66 is fixedly connected to the outer wall of one side of the slider 3, a spring 67 is sleeved on the surface of the pull rod 65, and the spring 67 is located on one side of the mounting plate 68 and the fixed plate 64;

[0031] The outer shell 61 protects the internal guide column 63, the fixed disk 64 and the installation disk 68. The fixed disk 64 is located in the middle of the guide column 63 and fits the installation disks 68 on both sides. The two sides of the guide column 63 limit the pull rod 65. When the worker clamps the semiconductor body 8, the installation disk 68 will slide to the side close to each other through the elasticity of the spring 67. When the installation disk 68 is located inside the guide column 63 and slides, the pull rod 65 is pulled, and the pull rod 65 pulls the pull disk 66 to slide. The pull disk 66 is fixed on the outer wall of the slider 3, so that the multiple groups of claws 7 above the two groups of sliders 3 are close to each other and fit with the outer wall of the semiconductor body 8, so as to quickly clamp the semiconductor body 8. The tension of the spring 67 is not easy to cause wear to the outer wall of the semiconductor body 8, which affects the product quality.

[0032] Furthermore, during the implementation process, a support seat 62 is fixedly connected to the bottom of the inner wall of the outer shell 61, and the upper part of the support seat 62 is fitted with the lower part of the guide column 63. The outer shell 61 is composed of hollow shells on both sides that are hinged and rotated. A fixing bolt is installed at the bottom of the outer shell 61 to facilitate fixing the outer shell 61 to the top of the support plate 1. The outside of the outer shell 61 is fixed and sealed by bolts, and the inside of the outer shell 61 supports the bottom of the guide column 63 through the support seat 62. The support seat 62 is detachably connected to the upper guide column 63, which is convenient for the later replacement of the guide column 63 and increases the use efficiency.

[0033] The implementation principle of the semiconductor processing correction device of the embodiment of the present application is as follows: when the worker needs to clamp the semiconductor body 8, the worker places the support plate 1 on the surface of the workbench, the support plate 1 is placed horizontally, and then the worker slides the slider 3, the slider 3 slides on the surface of the slide rail 2 and the guide rod 4, the surface of the slide rail 2 is provided with bosses on both sides, the bosses are embedded in the inside of the slider 3, so that the sliding stability of the slider 3 along the surface of the slide rail 2 is improved, the two groups of guide rods 4 limit the two sides of the slider 3, and increase the sliding stability of the slider 3 on the surface of the slide rail 2, the worker takes out the semiconductor body 8 and places it on the top of the support plate 1, and the worker releases the slider 3 The two groups of sliders 3 are pulled by the pulling assembly 6 above the support plate 1. The pulling assembly 6 pulls the two groups of sliders 3 closer to each other. During the approach of the sliders 3, the claws 7 installed on the upper surface will fit with the semiconductor body 8. During the lifting process of the claws 7 and the semiconductor body 8, due to the extrusion of the outer wall of the semiconductor body 8, the claws 7 slide inside the slider 3. The slider 3 supports the claws 7 through the internal bearing plate 73 and the connecting column 72. The claws 7 extend upward at an angle and the diameter gradually decreases, so that the force-bearing surface of the claws 7 contacts with the semiconductor body 8, thereby increasing the stability of the semiconductor body 8 on the surface of the support plate 1 and improving the clamping effect.

[0034] In the description of the present application, it should be noted that the terms "upper", "lower", etc. indicate orientations or positional relationships based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present application and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on the present application. Unless otherwise clearly specified and limited, the terms "installed", "connected", and "connected" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection, or it can be an indirect connection through an intermediate medium, or it can be a connection between the two elements. For those of ordinary skill in the art, the specific meanings of the above terms in the present application can be understood according to the specific circumstances.

[0035] It should be noted that, in this application, relational terms such as "first" and "second" are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Moreover, the terms "include", "comprise" or any other variants thereof are intended to cover non-exclusive inclusion, so that a process, method, article or device including a series of elements includes not only those elements, but also other elements not explicitly listed, or also includes elements inherent to such process, method, article or device. In the absence of further restrictions, the elements defined by the sentence "comprise a ..." do not exclude the presence of other identical elements in the process, method, article or device including the elements.

[0036] The above description is only a specific implementation of the present application, so that those skilled in the art can understand or implement the present application. Various modifications to these embodiments will be apparent to those skilled in the art, and the general principles defined herein can be implemented in other embodiments without departing from the spirit or scope of the present application. Therefore, the present application will not be limited to the embodiments shown herein, but will conform to the widest range consistent with the principles and novel features applied for herein.

Claims

1. A semiconductor processing calibration device, characterized in that: include: A support plate (1), wherein a slide rail (2) is fixedly connected to the upper part of the support plate (1), a slider (3) is slidably connected to the upper part of the slider (2), two groups of the sliders (3) are provided, and claws (7) are provided on the upper parts of the two groups of sliders (3), and a plurality of claws (7) are provided, a connecting column (72) is provided below the claws (7), a bearing plate (73) is provided below the connecting column (72), and the lower part of the bearing plate (73) is fixedly connected to the inner wall of the slider (3); A semiconductor body (8) is arranged on the slide rail (2), and the periphery of the semiconductor body (8) is in contact with the plurality of supporting claws (7); A pulling assembly (6) is arranged above the support plate (1), and two groups of the pulling assembly (6) are provided, and both sides of the two groups of the pulling assembly (6) are in contact with the sliding block (3).

2. A semiconductor processing calibration device according to claim 1, characterized in that: A bottom column (11) is arranged below the support plate (1), and four groups of the bottom columns (11) are symmetrically arranged, and a base (12) is arranged below each of the four groups of the bottom columns (11).

3. A semiconductor processing calibration device according to claim 1, characterized in that: The upper surface of the support plate (1) is provided with guide rods (4), and the guide rods (4) are provided in two groups. The two groups of sliding blocks (3) slide along the upper surfaces of the two groups of guide rods (4).

4. A semiconductor processing calibration device according to claim 1, characterized in that: A limiting column (5) is sleeved on the surface of the supporting claw (7), and the limiting column (5) is installed inside the sliding block (3). An anti-slip strip (71) is fixedly connected to one side of the supporting claw (7).

5. A semiconductor processing calibration device according to claim 1, characterized in that: The pulling assembly (6) comprises a shell (61) fixed on the top of the support plate (1), a guide column (63) is arranged inside the shell (61), a fixed disk (64) is fixedly connected to the axis of the guide column (63), mounting disks (68) are arranged on both sides of the fixed disk (64), a pull rod (65) is arranged on the side away from each other of the two groups of mounting disks (68), one end of the pull rod (65) passes through the shell (61) and is fixedly connected to a pull disk (66), one side of the pull disk (66) is fixedly connected to the outer wall of one side of the slider (3), and a spring (67) is sleeved on the surface of the pull rod (65), and the spring (67) is located on the side of the mounting disk (68) away from the fixed disk (64).

6. A semiconductor processing calibration device according to claim 5, characterized in that: A support seat (62) is fixedly connected to the bottom of the inner wall of the outer shell (61), and the upper part of the support seat (62) is in contact with the lower part of the guide column (63).

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