Semiconductor power module and power electronic equipment

Abstract

The embodiment of the utility model provides a semiconductor power module and power electronic equipment comprising the semiconductor power module, and relates to the technical field of semiconductor packaging. The semiconductor power module comprises a power chip, a packaging body and a first pin. The packaging body is used for packaging the power chip and comprises a top surface and a bottom surface which are arranged back to back in the thickness direction of the packaging body; the first pin comprises a first section and a second section which are connected, the first section extends out of one side of the packaging body and extends outwards, the second section is located on one side, deviating from the top surface, of the first section, and the second section inclines towards the packaging body from the joint of the first section and the second section. According to the technical scheme, the first pin absorbs the stress of the welding spot in a deformation mode, the possibility of cracks at the welding spot is reduced, and the semiconductor power module can stably run after being installed.

Description

Technical Field

[0001] The present application relates to the technical field of semiconductor packaging, and in particular to a semiconductor power module and a power electronic device. Background Art

[0002] Semiconductor power modules are basic components in the field of power electronics. In order to reduce manufacturing costs, semiconductor power modules mostly use small out-line packages (SOP).

[0003] With the above packaging method, the pins of the semiconductor power module will be led out from both sides of the package body and are in the shape of a seagull wing. Due to the current requirement, the size of the pins is large and thick, which makes the pins more rigid. During the temperature change process, due to the difference in thermal expansion coefficients of the pins, solder joints and printed circuit boards (PCB), stress exists at the solder joints. Since the pins are more rigid, it is difficult to absorb the stress, so there is a possibility of cracks in the solder joints, affecting the connection strength and circuit current of the semiconductor power module. If the cracks are serious, it may even cause the semiconductor power module to fail. Utility Model Content

[0004] The present application provides a semiconductor power module and a power electronic device including the semiconductor power module. The pins of the semiconductor power module can absorb stress at solder joints, thereby reducing the possibility of cracks at the solder joints.

[0005] In order to achieve the above objectives, this application adopts the following technical solutions:

[0006] In a first aspect of the present application, a semiconductor power module is provided, which includes a power chip, a package and a first pin. The package is used to package the power chip, and the package includes a top surface and a bottom surface arranged back to back in its thickness direction; the first pin includes a first section and a second section connected, the first section extends outward from one side of the package, the second section is located on the side of the first section away from the top surface, and the second section is inclined toward the package from the connection between the first section and the second section.

[0007] The second section is inclined toward the package body in the direction away from the top surface, so that the "angle" between the second section and the first section is smaller, and the second section and the first section form a structure similar to a "spring", so that at least part of the first pin has "elasticity", and when the first pin is subjected to external force, it can be stretched or compressed to achieve absorption of external stress. The semiconductor power module provided with the first pin is installed on the circuit board, and the first pin is welded to the circuit board (for example, soldering). When there is stress at the solder joint, the stress will act on the first pin. For example, when the solder expands, the distance between the first section and the second section is reduced, and the first pin is compressed; when the solder shrinks, the distance between the first section and the second section is increased, and the first pin is stretched. That is, the first pin absorbs the stress of the solder joint by deformation, reducing the possibility of cracks at the solder joint, so that the semiconductor power module can operate stably after installation.

[0008] In an optional implementation, the end of the first section facing away from the package body is integrally connected to the end of the second section, and the connection between the first section and the second section is a first bending portion of the first pin.

[0009] The first pin is integrally formed and bent, and the connection between the first section and the second section is the bending portion (first bending portion) after the first pin is bent. That is, the first pin is bent to form the first section and the second section, and the second section is bent to the side of the first section away from the top surface, and after the first pin is bent, the second section is inclined toward the package body. The first section and the second section are formed by bending the first pin, which facilitates the production and manufacturing of the first pin.

[0010] In an optional embodiment, the first pin also includes a third section, an end of the third section is integrally connected to the end of the second section facing away from the first section, the connection between the second section and the third section is the second bending position of the first pin, and the third section is bent to the side of the second section facing away from the package body, or the third section is bent to the side of the second section facing the package body.

[0011] The first pin is bent multiple times, and the third section is formed by bending. The third section plays a role in stabilizing the support of the package. When the semiconductor power module is installed later, the third section is welded to the circuit board to facilitate the installation of the semiconductor power module. In addition, when the third section is bent to the side of the second section away from the package, the third section and the second section also form a structure similar to a "spring", making more parts of the first pin "elastic". When the first pin is subjected to external force, it is easier to be stretched or compressed, so as to absorb external stress, reduce the possibility of cracks at the solder joint, and make the semiconductor power module less likely to fall after installation.

[0012] In an optional implementation, the first bending portion has a first bending surface facing the package body, the second bending portion has a second bending surface facing away from the package body, and the second bending surface is closer to the package body than the first bending surface.

[0013] The second bending surface is closer to the package body than the first bending surface, which means that the first pin is bent more (the second section is tilted more), and the "angle" between the first section and the second section becomes smaller. In addition, in the example where the third section is bent to the side of the second section away from the package body, the second section is tilted more, which can also reduce the "angle" between the second section and the third section. In this way, the "elasticity" of the first pin can be increased, making it easier to stretch and compress, and making the first pin more capable of absorbing stress.

[0014] In an optional implementation, the third section is bent to a side of the second section away from the package body, and an end of the third section away from the second section is located on a side of the first bending portion away from the package body.

[0015] The third section is bent to the side of the second section away from the package body, so that a structure similar to a "spring" is formed between the first section and the second section, and between the second section and the third section. The first pin has greater "elasticity" and is more easily stretched or compressed when the first pin is subjected to external force, thereby absorbing external stress. The third section extends outward for a longer distance (the third section is longer), which extends the welding part during soldering, making the connection between the third section and the circuit board more firm and stable.

[0016] In an optional implementation, the third section has a mounting surface facing away from the top surface, and the mounting surface protrudes to a side of the bottom surface facing away from the top surface.

[0017] The mounting surface protrudes below the bottom surface. When the semiconductor power module is mounted on the circuit board, the mounting surface of the third section will first contact the circuit board to play a supporting role. The above design facilitates welding between the third section and the circuit board, reducing the possibility of insufficient welding between the first pin and the circuit board.

[0018] In an optional embodiment, the semiconductor power module also includes a second pin, the package body has a first side surface and a second side surface back to back in a first direction, the first direction is perpendicular to the thickness direction of the package body, the first pin extends from the first side surface, the second pin extends from the second side surface, the size of the first pin in the second direction is greater than or smaller than the size of the second pin in the second direction, and the second direction is perpendicular to the first direction and the thickness direction of the package body.

[0019] The first pin and the second pin have different widths, so that the first pin and the second pin have different current carrying capacities. The first pin and the second pin with different widths are respectively arranged on both sides of the package body, so that the two pins can adapt to different current carrying requirements. In addition, the narrower one of the first pin and the second pin can be arranged in multiple numbers. For example, the width of the second pin is smaller than the width of the first pin, and the area occupied by a single second pin is smaller. In this way, more second pins can be extended from the second side surface.

[0020] In an optional embodiment, the second pin includes a connected fourth section and a fifth section, the fourth section extends from the second side and extends outward, the fifth section is located on the side of the fourth section away from the top surface, and the fifth section is inclined toward the package body from the connection between the fourth section and the fifth section.

[0021] The fifth section is inclined toward the package body in the direction away from the top surface, so that the "angle" between the fifth section and the fourth section is smaller, and the fifth section and the fourth section form a structure similar to a "spring", so that at least part of the second pin has "elasticity", and when the second pin is subjected to external force, it can be stretched or compressed, so that the second pin absorbs external stress. The possibility of cracks at the solder joint is reduced, so that the semiconductor power module can operate stably after installation.

[0022] In an optional embodiment, the second pin also includes a sixth segment, one end of the fifth segment is integrally connected to the end of the fourth segment facing away from the package body, and the other end is integrally connected to the end of the sixth segment, and the sixth segment is bent to the side of the fifth segment facing away from the package body, or the sixth segment is bent to the side of the fifth segment facing the package body.

[0023] The second pin is bent to form the fourth, fifth and sixth sections. The sixth section plays a role in stabilizing the support of the package. When the semiconductor power module is installed later, the sixth section can be welded to the circuit board. In addition, when the sixth section is bent to the side of the fifth section away from the package, the fifth and sixth sections also form a structure similar to a "spring", making more parts of the second pin "elastic". When the second pin is subjected to external force, it is easier to be stretched or compressed, thereby absorbing external stress. Both the first pin and the second pin are "elastic", which further reduces the possibility of cracks at each solder joint.

[0024] A second aspect of the present application provides a power electronic device, which includes a circuit board and the above-mentioned semiconductor power module, wherein the bottom surface faces the circuit board, and the first pin is connected to the circuit board.

[0025] The first pin is welded to the circuit board. The first pin has "elasticity". When stress exists at the solder joint, the stress will act on the first pin. When the first pin is subjected to external force, it can be stretched or compressed to absorb the external stress. The possibility of cracks at the solder joint is reduced, so that the semiconductor power module can operate stably after installation, and the power electronic equipment can operate stably and normally.

[0026] In addition, the power electronic device provided in the present application includes the above-mentioned semiconductor power module, so the power electronic device provided in the present application and the semiconductor power module of the above-mentioned technical solution can solve the same technical problems and have the same technical effects. BRIEF DESCRIPTION OF THE DRAWINGS

[0027] Figure 1 A schematic diagram of a partial structure of a power electronic device provided in an embodiment of the present application;

[0028] Figure 2 It is a schematic diagram of the structure of pins in the related art;

[0029] Figure 3 is a schematic diagram of a crack at a solder joint in the related art;

[0030] Figure 4 A schematic diagram of a semiconductor power module provided in an embodiment of the present application;

[0031] Figure 5 A top view of a semiconductor power module provided in an embodiment of the present application;

[0032] Figure 6 A schematic diagram of the structure of a first pin provided in an embodiment of the present application;

[0033] Figure 7 A schematic diagram of the structure of another first pin provided in an embodiment of the present application;

[0034] Figure 8 A schematic diagram of the structure of another first pin provided in an embodiment of the present application;

[0035] Fig. 9 A side view of a semiconductor power module provided in an embodiment of the present application.

[0036] Reference numerals:

[0037] 100-Power electronic equipment;

[0038] 110-circuit board;

[0039] 120-Semiconductor power module;

[0040] 1-package body; 10-power chip; 11-top surface; 12-bottom surface; 13-first side surface; 14-second side surface;

[0041] 2-pin;

[0042] 3-first pin; 31-first section; 32-second section; 33-third section; 331-mounting surface; 34-first bending part; 341-first bending surface; 35-second bending part; 351-second bending surface;

[0043] 4- second pin; 41- fourth section; 42- fifth section; 43- sixth section. DETAILED DESCRIPTION

[0044] The technical solutions in the embodiments of the present application will be described below in conjunction with the drawings in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, rather than all of the embodiments.

[0045] In the present application, unless otherwise clearly specified and limited, the directions or positional relationships indicated by the terms "upper" and "lower" may be defined, including but not limited to, the directions relative to the schematic placement of the components in the drawings, wherein these directional terms may be relative concepts, which are used for relative description and clarification, and may change accordingly according to the changes in the placement of the components in the drawings, and shall not be understood as limitations on the present application.

[0046] In this application, the terms "first", "second", etc. are used only for descriptive purposes to distinguish one element from another element, and should not be understood as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Therefore, a feature defined as "first", "second", etc. may explicitly or implicitly include one or more of the features.

[0047] In the present application, unless otherwise clearly specified or limited, "plurality" means two or more.

[0048] In this application, unless otherwise clearly specified and limited, the terms "installed", "connected", and "connected" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium, or it can be the internal communication of two components. For ordinary technicians in this field, the specific meanings of the above terms in this application can be understood according to specific circumstances.

[0049] In addition, in this application, the words "exemplary" or "for example" are used to indicate examples, illustrations or explanations. Any embodiment or design described as "exemplary" or "for example" in this application should not be interpreted as being more preferred or more advantageous than other embodiments or designs. Specifically, the use of words such as "exemplary" or "for example" is intended to present related concepts in a specific way.

[0050] In the drawings of the embodiments of the present application, solid structures such as components and assemblies are represented by guide lines; hollow structures such as openings, holes, spaces, and cavities are represented by guide lines with arrows.

[0051] The embodiment of the present application provides a power electronic device 100, which can be any suitable device. For example, the power electronic device 100 can be an on-board charger (OBC), also known as an on-board charger, which refers to a charger fixed on an electric vehicle and has the ability to safely and automatically charge the power battery of the electric vehicle. For another example, the power electronic device 100 can also be a communication power supply, an inverter, etc., and the present application does not make specific restrictions on this.

[0052] Figure 1 The schematic diagram of the partial structure of the power electronic device 100 is shown as an example. Figure 1 The exemplary power electronic device 100 includes a circuit board 110 and a semiconductor power module 120. The circuit board 110 may be a printed circuit board (PCB), and the semiconductor power module 120 is disposed on the circuit board 110. Other structures on the circuit board 110 are hidden in the drawings. The power electronic device 100 may also include a housing (not shown in the drawings) for protecting the internal structure, and the circuit board 110 and the semiconductor power module 120 are both disposed in the housing.

[0053] The present application embodiment provides a semiconductor power module 120, referring to Figure 1 The semiconductor power module 120 includes a power chip 10 (the dotted box indicated by the label "10" exemplarily shows the power chip), a package body 1 and a plurality of pins 2. The package body 1 is used to package the power chip 10, that is, the power chip 10 is arranged in the package body 1, the plurality of pins 2 are electrically connected to the power chip 10, and the plurality of pins 2 extend from the package body 1. When the semiconductor power module 120 is installed, the plurality of pins 2 need to be welded to the circuit board 110, for example, by soldering.

[0054] Among them, the power chip 10 is a basic component in the field of power electronics. It can be one of a diode, a silicon carbide (SiC) tube, a metal-oxide semiconductor field-effect transistor (Metal-Oxide-Semiconductor Field-Effect Transistor, MOSFET), a gallium nitride (GaN) tube, a thyristor, an insulated gate bipolar transistor (Insulated gate bipolar transistor, IGBT), etc. This application does not make any specific restrictions on this.

[0055] In order to improve the manufacturability (Design For Manufacturing, DFM) and reduce the manufacturing cost, the power chip 10 evolves from a traditional package (eg, TO247 plug-in package) to a surface mount small out-line package (SOP).

[0056] In some examples, due to the current requirements of the semiconductor power module 120, some pins 2 are larger and thicker, for example, some pins 2 are wider than 1 mm and thicker than 0.5 mm, which makes the rigidity of such pins 2 greater. In the related art, the part of the pin 2 extending out of the package 1 is in a "gull wing shape", see Figure 2 , Figure 2 The structure of the pin 2 in the related art is shown as an example. During the temperature change, there are differences in the thermal expansion coefficients of the pin 2, the solder joint and the circuit board 110, and stress exists at the solder joint. With the pin 2 structure of the related art, since the pin 2 has a large rigidity, it is difficult to absorb the above stress, and the solder joint will become a stress concentration point, so there is a possibility of cracks in the solder joint.

[0057] Reference Figure 3 , Figure 3 The example shows the situation where cracks appear at the solder joint of pin 2. A large number of cracks at the solder joint will affect the connection strength between the semiconductor power module 120 and the circuit board 110, and will also affect the flow of the circuit. When the cracks are serious, they may even penetrate the solder joint, causing the semiconductor power module 120 to fail and the power electronic device 100 to be unable to operate normally.

[0058] The semiconductor power module 120 of the present application can solve the above problems. Figure 4 , Figure 4A semiconductor power module 120 provided by the present application is shown as an example, and the package body 1 includes a top surface 11 and a bottom surface 12 arranged back to back in the thickness direction thereof. When the semiconductor power module 120 is installed, the thickness direction of the package body 1 may be perpendicular to the surface of the circuit board 110, the bottom surface 12 faces the circuit board 110, and the top surface 11 faces away from the circuit board 110. The structure of the package body 1 may be designed as required, and the package body 1 may be a structure such as a plastic shell, a block-shaped structure, or other irregular structures, and the present application does not impose any specific restrictions on this.

[0059] Reference Figure 4 The package body 1 has a first side surface 13 and a second side surface 14 which are back-to-back in a first direction, and the first direction is perpendicular to the thickness direction of the package body 1, that is, the first side surface 13 and the second side surface 14 are respectively walls on both sides of the package body 1. Part (one or more) of the leads 2 extend from the first side surface 13, and part (one or more) of the leads 2 extend from the second side surface 14.

[0060] For example, refer to Figure 4 The plurality of pins 2 include a first pin 3 and a second pin 4. The first pin 3 extends from the first side surface 13, and the second pin 4 extends from the second side surface 14. The size of the first pin 3 and the size of the second pin 4 may be the same or different. Figure 4 The example shows a case where the first pin 3 and the second pin 4 have different sizes. In this example, the size of the first pin 3 in the second direction is larger than the size of the second pin 4 in the second direction, and the second direction is perpendicular to the first direction and the thickness direction of the package body 1 (the first direction, the second direction and the thickness direction of the package body 1 are perpendicular to each other), that is, the first pin 3 is wider than the second pin 4.

[0061] Figure 5 1 is a schematic diagram of a semiconductor power module 120 viewed from above along the thickness direction of the package body 1, which exemplarily shows a situation where the first pin 3 is wider than the second pin 4. In other examples, the first pin 3 may be narrower than the second pin 4.

[0062] The first pin 3 and the second pin 4 have different widths, so that the first pin 3 and the second pin 4 have different current carrying capacities. The first pin 3 and the second pin 4 with different widths are respectively arranged on both sides of the package body 1 to meet different current carrying requirements. In addition, the narrower one of the first pin 3 and the second pin 4 can be arranged in multiple numbers. For example, the width of the second pin 4 is smaller than the width of the first pin 3, and the area occupied by the second pin 4 is smaller, so that more second pins 4 can be extended from the second side surface 14.

[0063] In other examples, the size of the first pin 3 and the size of the second pin 4 may be the same.

[0064] In addition, the number of pins 2 extending from the first side surface 13 and the number of pins 2 extending from the second side surface 14 may be the same or different, and the present application does not impose any specific limitation on this.

[0065] For the structure of the first pin 3, refer to Figure 6 , Figure 6 The structure of a first pin 3 is shown as an example. The first pin 3 includes a first section 31 and a second section 32 connected to each other. The first section 31 extends outward from one side (first side surface 13) of the package body 1. The second section 32 is located on the side of the first section 31 away from the top surface 11. The second section 32 is inclined toward the package body 1 from the connection between the first section 31 and the second section 32, that is, the second section 32 is inclined toward the package body 1 in the direction from the top surface 11 to the bottom surface 12. The "angle" between the second section 32 and the first section 31 is small, and the second section 32 and the first section 31 form a structure similar to a "spring", so that at least part of the first pin 3 has "elasticity".

[0066] The smaller "angle" mentioned above can be understood as that, compared with the prior art, the second section 32 of the present application is inclined toward the package body 1 (in the prior art, it is inclined toward the side away from the package body 1). In this way, the first pin 3 can be regarded as a "spring" with "elasticity". When the first pin 3 is subjected to external force, it can be stretched or compressed to absorb the external stress.

[0067] For example, after the first pin 3 is soldered to the circuit board 110, when stress exists at the solder joint, the stress will act on the first pin 3. When the solder expands, the distance between the first section 31 and the second section 32 is reduced, and the first pin 3 is compressed; when the solder shrinks, the distance between the first section 31 and the second section 32 is increased, and the first pin 3 is stretched. The first pin 3 absorbs the stress at the solder joint by deformation, which reduces the stress of the solder joint in the temperature cycle scenario (for example, it can be reduced by 46%), improves the temperature cycle durability of the product, reduces the possibility of cracks at the solder joint, and reduces the possibility of the package 1 falling off the circuit board 110, so that the semiconductor power module 120 can operate stably after installation.

[0068] The second section 32 is inclined toward the package body 1 in the direction from the top surface 11 to the bottom surface 12. It can be understood that the end of the second section 32 away from the first section 31 is closer to the package body 1 than the end of the first section 31 away from the package body 1. That is, when looking down at the semiconductor power module 120 (see FIG. Figure 5 ), there is an overlapping portion between the first section 31 and the second section 32. For example, when viewed from above, the first section 31 can completely cover the second section 32; for another example, when viewed from above, only the first section 31 and the connection between the first section 31 and the second section 32 can be seen.

[0069] In order to facilitate production, the first pin 3 can be integrally formed and bent, that is, referring to Figure 6 The end of the first section 31 facing away from the package body 1 is integrally connected to the end of the second section 32, and the connection between the first section 31 and the second section 32 is the first bending portion 34 of the first pin 3. That is, the first pin 3 is bent to form the first section 31 and the second section 32, and the second section 32 is bent to the side of the first section 31 facing away from the top surface 11. After the first pin 3 is bent, the second section 32 is inclined toward the package body 1.

[0070] The first bending portion 34 is one of the bending portions of the first lead 3 after being bent, and may include the end of the first section 31 away from the package body 1 and the end of the second section 32. That is, the first section 31 is used to connect the end of the second section 32, and the second section 32 is used to connect the end of the first section 31, and the two are connected as one body to form the first bending portion 34 together.

[0071] Reference Figure 6 The first pin 3 may further include a third section 33, which may be formed by bending the first pin 3 multiple times, an end of the third section 33 is integrally connected to an end of the second section 32 away from the first section 31, and a connection between the second section 32 and the third section 33 is a second bending portion 35 of the first pin 3. In an example, the third section 33 may be bent to a side of the second section 32 away from the package body 1.

[0072] It can be understood that the second bending portion 35 is another bending portion after the first pin 3 is bent multiple times, and it may include the end of the second section 32 away from the first section 31 and the end of the third section 33. That is, the second section 32 is used to connect the end of the third section 33, and the third section 33 is used to connect the end of the second section 32, and the two are connected as a whole to form the second bending portion 35. For example, when the first pin 3 is bent twice, the two bending portions of the first pin 3 are the first bending portion 34 and the second bending portion 35 respectively.

[0073] The third section 33 plays a role in stably supporting the package body 1. When the semiconductor power module 120 is installed later, the third section 33 is welded to the circuit board 110 to facilitate the installation of the semiconductor power module 120. In addition, when the third section 33 is bent to the side of the second section 32 away from the package body 1, the third section 33 and the second section 32 also form a structure similar to a "spring".

[0074] That is, a structure similar to a "spring" (a multi-stage or multi-layer spring) is formed between the first section 31 and the second section 32, and between the second section 32 and the third section 33, so that more parts of the first pin 3 have "elasticity". The first pin 3 has greater "elasticity", and is more easily stretched or compressed when the first pin 3 is subjected to external force, thereby realizing the first pin 3's absorption of external stress, reducing the possibility of cracks at the solder joint, and making the installed semiconductor power module 120 less likely to fall and more stable.

[0075] In order to facilitate connection with the circuit board 110, the length of the third section 33 can be longer, for example, the end of the third section 33 away from the second section 32 extends to the side of the first bending portion 34 away from the package body 1, that is, the distance between the end of the third section 33 away from the second section 32 and the package body 1 is farther than the distance between the first bending portion 34 and the package body 1. The third section 33 extends outward for a longer distance, and has a longer welding position during soldering, so that the connection between the third section 33 and the circuit board 110 can be more firmly and stably made.

[0076] In addition, since the second section 32 is tilted toward the package body 1, when looking down at the semiconductor power module 120 (see Figure 5 ), there are overlapping parts between the first section 31, the second section 32 and the third section 33.

[0077] In one example, referring to Figure 6 , the first pin 3 may be a pin similar to a "Z" shape. In this example, the extension direction of the first section 31 is parallel to the extension direction of the third section 33, the second section 32 extends obliquely between the first section 31 and the third section 33, the angle between the first section 31 and the second section 32 is an acute angle, and the angle between the second section 32 and the third section 33 is an acute angle.

[0078] In another example, referring to Figure 7 , Figure 7 Another structure of the first pin 3 is shown as an example. The first pin 3 of the example can be an "S"-shaped pin. In this example, the second section 32 is the middle part of the two bending parts of the first pin 3 (the first bending part 34 and the second bending part 35), and the second section 32 is inclined toward the package body 1 in the direction from the top surface 11 to the bottom surface 12.

[0079] In order to enhance the ability of the first pin 3 to absorb stress, the bending degree of the first pin 3 can be relatively large. Figure 6The first bending part 34 has a first bending surface 341 facing the package body 1, and the second bending part 35 has a second bending surface 351 facing away from the package body 1. The second bending surface 351 is closer to the package body 1 than the first bending surface 341, that is, the second section 32 is more inclined (inclined by a larger amplitude), so that the "angle" between the first section 31 and the second section 32 becomes smaller, and the "angle" between the second section 32 and the third section 33 can also be smaller. In this way, the bending degree of the first pin 3 is greater, so that the "elasticity" of the first pin 3 is increased, and it is easy to stretch and compress.

[0080] In other examples, the bending degree of the first pin 3 may also be smaller. Figure 7 , the first bending surface 341 is closer to the package body 1 than the second bending surface 351 , and the inclination amplitude of the second section 32 is smaller.

[0081] Among them, the structure of the first bending surface 341 and the second bending surface 351 is related to the bending degree and bending shape of the first pin 3. For example, the first bending surface 341 and the second bending surface 351 can both be arc surfaces or both be angled surfaces. This application does not make any specific restrictions on this.

[0082] In the present application, the forming method of the first pin 3 includes but is not limited to stamping, mold bending, etc. In other examples, the first section 31, the second section 32 and the third section 33 can also be interconnected by welding. The present application does not limit the forming method of the first pin 3.

[0083] In other examples, the third section 33 is bent to the side of the second section 32 facing the package body 1. Figure 8 , Figure 8 Another structure of the first pin 3 is shown as an example, the third section 33 can be bent to the bottom of the package body 1. In this example, there is a gap between the third section 33 and the bottom of the package body 1, so that when the first pin 3 is stretched or compressed, the third section 33 can move up and down to absorb the stress. For another example, the third section 33 is bent only toward one side of the package body 1, but is still located on the side of the package body 1 and does not extend to the bottom of the package body 1.

[0084] In order to facilitate the later welding of the third section 33 with the circuit board 110, refer to Fig. 9 , Fig. 9The side view of the semiconductor power module 120 is shown as an example, and the third section 33 has a mounting surface 331 facing away from the top surface 11, and the mounting surface 331 protrudes to the side of the bottom surface 12 facing away from the top surface 11. That is, the mounting surface 331 is closer to the circuit board 110 than the bottom surface 12 of the package body 1, and the mounting surface 331 protrudes below the bottom surface 12. When the semiconductor power module 120 is installed on the circuit board 110, the mounting surface 331 of the third section 33 will first contact the circuit board 110, play a supporting role, and also facilitate the welding of the third section 33 and the circuit board 110, reducing the possibility of insufficient welding between the first pin 3 and the circuit board 110.

[0085] For the structure of the second pin 4, refer to Fig. 9 The second pin 4 includes a fourth section 41 and a fifth section 42 that are connected to each other. The fourth section 41 extends outward from the second side surface 14, and the fifth section 42 is located on the side of the fourth section 41 that is away from the top surface 11. The fifth section 42 is inclined toward the package body 1 from the connection between the fourth section 41 and the fifth section 42, that is, the fifth section 42 is inclined toward the package body 1 in the direction from the top surface 11 to the bottom surface 12, so that the "angle" between the fifth section 42 and the fourth section 41 is smaller, and the fifth section 42 and the fourth section 41 form a structure similar to a "spring".

[0086] In this way, at least part of the second pin 4 is "elastic", and when the second pin 4 is subjected to external force, it can be stretched or compressed, thereby absorbing the external stress of the second pin 4. The possibility of cracks in the solder joints at the second pin 4 is reduced, so that the semiconductor power module 120 can operate stably after installation.

[0087] The second pin 4 can be bent multiple times and form a fourth section 41, a fifth section 42 and a sixth section 43 by bending. One end of the fifth section 42 is integrally connected to the end of the fourth section 41 away from the package body 1, and the other end is integrally connected to the end of the sixth section 43. The sixth section 43 plays a role in stably supporting the package body 1. When the semiconductor power module 120 is installed later, the sixth section 43 can be welded to the circuit board 110.

[0088] In one example, the sixth section 43 is bent to the side of the fifth section 42 away from the package body 1, that is, the second pin 4 can also be bent into a pin with a structure similar to a "Z" shape or an "S" shape. A structure similar to a "spring" is formed between the fourth section 41 and the fifth section 42, and between the fifth section 42 and the sixth section 43, so that more positions of the second pin 4 have "elasticity", and when the second pin 4 is subjected to external force, it is easier to be stretched or compressed, thereby absorbing the external stress.

[0089] In the above example, both the first pin 3 and the second pin 4 are “elastic”, which further reduces the possibility of cracks occurring at the solder joints of each pin 2 .

[0090] The bending degree of the second pin 4 can be greater, for example, the fifth section 42 is more inclined (inclined with a greater amplitude), so that the "angle" between the fourth section 41 and the fifth section 42 becomes smaller, and the "angle" between the fifth section 42 and the sixth section 43 becomes smaller. In this way, the bending degree of the second pin 4 is greater, so that the "elasticity" of the second pin 4 is increased, and it is easy to stretch and compress. In other examples, the bending degree of the second pin 4 can also be smaller, and in this example, the inclination amplitude of the fifth section 42 can be smaller.

[0091] In some examples, the length of the sixth segment 43 may be longer, and more parts of the sixth segment 43 may be welded to the circuit board 110 , so that the connection between the sixth segment 43 and the circuit board 110 is more firm and stable.

[0092] In addition, the bottom of the sixth section 43 can protrude to the side of the bottom surface 12 of the package body 1 away from the top surface 11. When the semiconductor power module 120 is installed on the circuit board 110, the third section 33 and the sixth section 43 first contact the circuit board 110, thereby supporting the package body 1 and facilitating the first pin 3 and the second pin 4 to be respectively soldered to the circuit board 110.

[0093] In another example, the sixth section 43 is bent to the side of the fifth section 42 facing the package body 1. For example, the sixth section 43 can be bent to the bottom of the package body 1; for another example, the sixth section 43 is only bent toward one side of the package body 1, but is still located on the side of the package body 1 and does not extend to the bottom of the package body 1.

[0094] The forming method of the second pin 4 includes but is not limited to stamping, mold bending, etc. In other examples, the fourth section 41, the fifth section 42 and the sixth section 43 can also be interconnected by welding. The present application does not limit the forming method of the second pin 4.

[0095] In some other examples, the plurality of pins 2 may include a plurality of first pins 3 and a plurality of second pins 4. The plurality of first pins 3 extend from the first side surface 13 and are arranged at intervals along the second direction; the plurality of second pins 4 extend from the second side surface 14 and are arranged at intervals along the second direction.

[0096] In some other examples, among the plurality of pins 2 , other pins 2 except the first pin 3 and the second pin 4 may also adopt the structure of the first pin 3 or the structure of the second pin 4 .

[0097] It should be noted that the first pin 3 or the second pin 4 of the present application can also be used in other semiconductor packaging methods.

[0098] The above is only a specific implementation of the present application, but the protection scope of the present application is not limited thereto. Any person skilled in the art who is familiar with the present technical field can easily think of changes or substitutions within the technical scope disclosed in the present application, which should be included in the protection scope of the present application. Therefore, the protection scope of the present application should be based on the protection scope of the claims.

Claims

1. A semiconductor power module, characterized in that: include: Power chip; A package body, the package body is used to package the power chip, the package body comprises a top surface and a bottom surface arranged back to back in the thickness direction of the package body; A first pin, the first pin includes a first section and a second section that are connected, the first section protrudes from one side of the package body and extends outward, the second section is located on a side of the first section away from the top surface, and the second section is inclined toward the package body from the connection between the first section and the second section.

2. The semiconductor power module according to claim 1, characterized in that: The end of the first section facing away from the package body is integrally connected to the end of the second section, and the connection between the first section and the second section is a first bending portion of the first pin.

3. The semiconductor power module according to claim 2, characterized in that: The first pin further includes a third section, an end of the third section is integrally connected to an end of the second section away from the first section, and a connection between the second section and the third section is a second bending portion of the first pin. The third section is bent to a side of the second section facing away from the package body, or the third section is bent to a side of the second section facing the package body.

4. The semiconductor power module according to claim 3, characterized in that: The first bending portion has a first bending surface facing the package body, and the second bending portion has a second bending surface facing away from the package body. The second bending surface is closer to the package body than the first bending surface.

5. The semiconductor power module according to claim 3 or 4, characterized in that: The third section is bent to a side of the second section away from the package body, and an end of the third section away from the second section is located at a side of the first bending portion away from the package body.

6. The semiconductor power module according to claim 3 or 4, characterized in that: The third section has a mounting surface facing away from the top surface, and the mounting surface protrudes to a side of the bottom surface facing away from the top surface.

7. The semiconductor power module according to any one of claims 1 to 4, characterized in that: The semiconductor power module further includes a second pin, the package body has a first side surface and a second side surface back to back in a first direction, the first direction is perpendicular to a thickness direction of the package body, the first pin extends from the first side surface, and the second pin extends from the second side surface. A dimension of the first pin in a second direction is larger than or smaller than a dimension of the second pin in the second direction, and the second direction is perpendicular to the first direction and a thickness direction of the package body.

8. The semiconductor power module according to claim 7, characterized in that: The second pin includes a fourth section and a fifth section that are connected, the fourth section extends outward from the second side surface, the fifth section is located on the side of the fourth section away from the top surface, and the fifth section is inclined toward the package body from the connection between the fourth section and the fifth section.

9. The semiconductor power module according to claim 8, characterized in that: The second lead further includes a sixth segment, one end of the fifth segment is integrally connected to the end of the fourth segment away from the package body, and the other end is integrally connected to the end of the sixth segment, The sixth section is bent to a side of the fifth section facing away from the package body, or the sixth section is bent to a side of the fifth section facing the package body.

10. A power electronic device, characterized in that: The invention comprises a circuit board and the semiconductor power module according to any one of claims 1 to 9, wherein the bottom surface faces the circuit board, and the first pin is connected to the circuit board.

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