FPC and display module

Abstract

The utility model discloses an FPC and a display module, and the FPC comprises a first body and a second body, and the first body and the second body are communicated through a first bending part; the first body, the second body and the first bending part are integrally formed; an NFC coil is arranged on the upper surface of the second body; the NFC coil is annularly arranged on the upper surface of the second body; the NFC coil is communicated with the first body through the first bending part. Through the design that the NFC coil is arranged on the second body and the first body, the second body and the first bending part are integrally formed, the problem of insufficient soldering caused by welding between an independent NFC and an independent FPC in the prior art is avoided.

Description

Technical Field

[0001] The utility model relates to the technical field of electronic equipment, in particular to an FPC and a display module. Background Art

[0002] With the development of the economy and the popularization of wireless payment technology, swiping bus cards or shopping through wearable devices with NFC function has become a trend in future consumption. Wearable devices with NFC function are becoming more and more popular among consumers due to their convenience in wearing, payment and novel payment methods. In the era of rapid popularization of electronic payment, wearable devices with NFC function have played an extremely important role in life.

[0003] However, the existing design usually connects the independent NFC and the independent main screen FPC through welding pads, which is cumbersome to operate and has the problem of unstable performance due to poor welding.

[0004] How to solve the above-mentioned technical problems has become a technical problem that needs to be solved urgently in the industry. Utility Model Content

[0005] In order to at least solve the above technical problems, the purpose of the utility model is to provide an FPC, which avoids the occurrence of cold welding problems caused by welding between an independent NFC and an independent FPC by arranging the NFC coil on the second body and integrating the first body, the second body and the first bending portion.

[0006] In order to achieve the above-mentioned purpose, the FPC provided by the present application includes:

[0007] A first body and a second body, wherein the first body and the second body are connected via a first bending portion;

[0008] The first body, the second body and the first bending portion are integrally formed;

[0009] An NFC coil is disposed on the upper surface of the second body;

[0010] The NFC coil is arranged in a ring shape on the upper surface of the second body;

[0011] The NFC coil is connected to the first body through the first bending portion.

[0012] Furthermore, a first body positioning hole is provided on the first body;

[0013] The second body is provided with a second body positioning hole;

[0014] When the lower surface of the first body is attached to the lower surface of the second body, the positioning hole of the first body overlaps with the positioning hole of the second body.

[0015] Furthermore, the upper surface of the first body is also provided with:

[0016] Component area: The component area is used to arrange components and ICs;

[0017] The IC is a power management IC and / or a touch control IC and / or a light sensor IC.

[0018] Furthermore, the components and IC are soldered on the component area through the SMT process.

[0019] Furthermore, a ferrite is provided on the lower surface of the second body;

[0020] The surface area of ​​the second body is greater than the surface area of ​​the first body;

[0021] When the lower surface of the first body is attached to the lower surface of the second body, the ferrite is exposed in the area of ​​the second body that is not covered by the first body.

[0022] Furthermore, the first body also includes:

[0023] An extension portion, the extension portion being connected to the first body via a second bending portion;

[0024] The extension also includes:

[0025] A third bending portion, the third bending portion is further connected to a reinforcing plate;

[0026] A BTB connector is provided on one side of the reinforcing plate facing away from the third bending portion.

[0027] Furthermore, the first body also includes: a welding portion and a binding area, and a glue-applying area is provided around the binding area.

[0028] To achieve the above object, an embodiment of the present invention further provides a display module, including the above FPC.

[0029] Furthermore, it also includes: a first glass substrate layer and a second glass substrate layer;

[0030] The size of the first glass substrate layer is greater than the size of the second glass substrate layer;

[0031] The first glass substrate layer covers the second glass substrate layer;

[0032] A first binding area is provided in an area where the first glass substrate layer is larger than the second glass substrate layer;

[0033] The first binding area is connected to the welding portion.

[0034] Furthermore, a second binding area is provided in an area where the first glass substrate layer is larger than the second glass substrate layer;

[0035] The second binding area is provided with a touch FPC.

[0036] The FPC of the embodiment of the present application includes: a first body and a second body, the first body and the second body are connected through a first bending portion; the first body, the second body and the first bending portion are integrally formed; an NFC coil is provided on the upper surface of the second body; the NFC coil is arranged in a ring shape on the upper surface of the second body; the NFC coil is connected to the first body through the first bending portion. By arranging the NFC coil on the second body and the design that the first body, the second body and the first bending portion are integrally formed, the occurrence of the existing problem of cold welding caused by welding between an independent NFC and an independent FPC is avoided; no welding assembly is required, which reduces the cost compared with the existing welding process; avoids the occurrence of quality problems caused by misalignment during welding; improves product stability, thereby improving market competitiveness. BRIEF DESCRIPTION OF THE DRAWINGS

[0037] The accompanying drawings are used to provide a further understanding of the present application and constitute a part of the specification. Together with the embodiments of the present application, they are used to explain the present application and do not constitute a limitation of the present application. In the accompanying drawings:

[0038] Figure 1 is a schematic diagram of the structure when the first body and the second body of the embodiment of the present application are not attached;

[0039] Figure 2 It is a schematic diagram of the structure when the first body and the second body of the embodiment of the present application are bonded together.

[0040] Description of reference numerals:

[0041] 101-first glass substrate layer; 102-second glass substrate layer; 103-first binding area; 104-FOF binding area; 105-first body; 106-second body; 107-extension portion; 108-first bending portion; 109-second bending portion; 110-third bending portion; 111-reinforcement plate; 112-glue dispensing area; 113-binding area; 114-first body positioning hole; 115-second body positioning hole; 116-component area; 117-NFC coil; 118-touch FPC. DETAILED DESCRIPTION

[0042] The embodiments of the present application will be described in more detail below with reference to the accompanying drawings. Although certain embodiments of the present application are shown in the accompanying drawings, it should be understood that the present application can be implemented in various forms and should not be construed as being limited to the embodiments described herein. Instead, these embodiments are provided to provide a more thorough and complete understanding of the present application. It should be understood that the drawings and embodiments of the present application are only for exemplary purposes and are not intended to limit the scope of protection of the present application.

[0043] It should be understood that the various steps described in the method implementation of the present application can be performed in different orders and / or performed in parallel. In addition, the method implementation may include additional steps and / or omit the steps shown. The scope of the present application is not limited in this respect.

[0044] The term "including" and its variations used herein are open inclusions, i.e., "including but not limited to". The term "based on" means "based at least in part on". The term "one embodiment" means "at least one embodiment"; the term "another embodiment" means "at least one additional embodiment"; the term "some embodiments" means "at least some embodiments". The relevant definitions of other terms will be given in the following description.

[0045] It should be noted that the modifications of "one" and "plurality" mentioned in this application are illustrative rather than restrictive, and those skilled in the art should understand that unless otherwise clearly indicated in the context, it should be understood as "one or more". "Plurality" should be understood as two or more.

[0046] The present invention provides an FPC, including:

[0047] A first body and a second body, wherein the first body and the second body are connected via a first bending portion;

[0048] The first body, the second body and the first bending portion are integrally formed;

[0049] An NFC coil is disposed on the upper surface of the second body;

[0050] The NFC coil is arranged in a ring shape on the upper surface of the second body;

[0051] The NFC coil is connected to the first body through the first bending portion.

[0052] Example 1

[0053] Figure 1 is a schematic diagram of the structure of the first body and the second body of the embodiment of the present application when they are not attached. Figure 2 This is a schematic diagram of the structure when the first body and the second body of the embodiment of the present application are attached. Figure 1-2 , the FPC of the embodiment of the present application is described in detail.

[0054] In some exemplary embodiments, FPC (Flexible Printed Circuit) is a highly reliable and excellently flexible printed circuit board made of polyimide or polyester film as a substrate.

[0055] In some exemplary embodiments, the FPC has the characteristics of high wiring density, light weight, thin thickness, and good bendability.

[0056] The FPC of the embodiment of the present application includes: a first body 105 and a second body 106 .

[0057] In some exemplary embodiments, the first body 105 and the second body 106 are connected via the first bending portion 108 , and the connection therebetween is an electrical connection.

[0058] In some exemplary embodiments, the first body 105 and the second body 106 may be designed to have multiple routing layers as required.

[0059] In some exemplary embodiments, the first body 105 , the second body 106 , and the first bending portion 108 are integrally formed.

[0060] In some exemplary embodiments, an NFC coil 117 is disposed on the upper surface of the second body 106 , or it can be understood that the second body 106 is a module with an NFC function.

[0061] In some exemplary embodiments, the NFC coil 117 is disposed in a ring shape on the upper surface of the second body 106 .

[0062] In some exemplary embodiments, the NFC coil 117 is connected to the first body 105 through the first bend 108; it can be understood that the wiring connected to the NFC coil 117 and the outside enters the first body 105 through the first bend 108, and is finally connected to the main board together with the wiring on the first body 105.

[0063] In some exemplary embodiments, NFC (Near Field Communication).

[0064] In some exemplary embodiments, when the first body 105 has a plurality of wiring layers, the plurality of wiring layers are insulated from adjacent wiring layers by using a substrate layer.

[0065] In some exemplary embodiments, the first body 105 , the second body 106 , and the first bending portion 108 may all be designed by mesh copper.

[0066] In some exemplary embodiments, a first body positioning hole 114 is defined in the first body 105 .

[0067] In some exemplary embodiments, a second body positioning hole 115 is defined in the second body 106 .

[0068] In some exemplary embodiments, a lower surface of the first body 105 is in contact with a lower surface of the second body 106 .

[0069] In some exemplary embodiments, when the lower surface of the first body 105 is bonded to the lower surface of the second body 106, the first body positioning hole 114 overlaps with the second body positioning hole 115; when the first body 105 and the second body 106 are bonded, a positioning column can be used to assist the operation of aligning the first body positioning hole 114 with the second body positioning hole 115.

[0070] In some exemplary embodiments, the number of the first body positioning hole 114 on the first body 105 may be one or more.

[0071] In some exemplary embodiments, the number of the second body positioning hole 115 on the second body 106 may be one or more.

[0072] In some exemplary embodiments, the first body positioning holes 114 on the first body 105 correspond one-to-one to the second body positioning holes 115 on the second body 106 .

[0073] In some exemplary embodiments, the upper surface of the first body 105 is further provided with a component region 116 .

[0074] In some exemplary embodiments, the component area 116 is used to arrange components and ICs.

[0075] In some exemplary embodiments, the IC is a power management IC and / or a touch control IC and / or a light sensing IC.

[0076] In some exemplary embodiments, components and ICs are soldered on the component area 116 by SMT process.

[0077] In some exemplary embodiments, the components include capacitors and / or resistors and / or diodes.

[0078] In some exemplary embodiments, the capacitor plays a role of voltage stabilization or filtering.

[0079] In some exemplary embodiments, the resistor plays a role of pull-up or electrostatic protection.

[0080] In some exemplary embodiments, the diode plays a role in electrostatic protection or preventing voltage backflow.

[0081] In some exemplary embodiments, ferrite is further disposed on the lower surface of the second body 106 .

[0082] In some exemplary embodiments, the surface area of ​​the second body 106 is greater than the surface area of ​​the first body 105 .

[0083] In some exemplary embodiments, when the lower surface of the first body 105 is attached to the lower surface of the second body 106 , ferrite is exposed in an area of ​​the second body 106 that is not covered by the first body 105 .

[0084] In some exemplary embodiments, the first body 105 further includes an extension portion 107 .

[0085] In some exemplary embodiments, the extension portion 107 is connected to the first body 105 via the second bending portion 109 .

[0086] In some exemplary embodiments, the first body 105 may be fitted with the extension portion 107 via the second bending portion 109 .

[0087] In some exemplary embodiments, the extension portion 107 further includes a third bending portion 110 .

[0088] In some exemplary embodiments, the first bending portion 108 , the second bending portion 109 , and the third bending portion 110 are all provided with a routing layer.

[0089] In some exemplary embodiments, the third bent portion 110 is further connected to a reinforcing plate 111 .

[0090] In some exemplary embodiments, the reinforcement plate 111 includes a reinforcement steel plate, PI reinforcement, or FR4 reinforcement.

[0091] In some exemplary embodiments, a BTB connector is provided on a side of the reinforcement plate facing away from the third bending portion.

[0092] In some exemplary embodiments, the first body 105 further includes a welding portion and a binding area 113 .

[0093] In some exemplary embodiments, a glue point area 112 is further provided around the binding area 113 .

[0094] In some exemplary embodiments, for example, the welding portion is in the edge area of ​​the first body 105 , a binding area 113 is provided on the side of the welding portion close to the central area of ​​the first body 105 , a gap is provided between the binding area 113 and the welding portion, and the glue dispensing area 112 surrounds the binding area 113 .

[0095] In some exemplary embodiments, the bonding area 113 is used to bond the COF IC.

[0096] In some exemplary embodiments, a FOF binding area 104 is provided on one side of the glue dispensing area 112 close to the central area of ​​the first body 105 .

[0097] In some exemplary embodiments, FOF (fpconfilm) bonding is a COF and FPC bonding process, and electrical connection is achieved through anisotropic conductive adhesive film.

[0098] In some exemplary embodiments, anisotropic conductive film (ACF, anisotropic conductive film) is used.

[0099] In some exemplary embodiments, the NFC coil 117 is disposed on the second body 106, and the first body 105, the second body 106, and the first bent portion 108 are integrally formed, thereby avoiding the risk of cold solder joints caused by welding between an independent NFC and an independent FPC. At the same time, the cost is reduced, and no assembly is required, thereby saving the welding steps and avoiding quality problems caused by misalignment.

[0100] Example 2

[0101] Embodiment 2 is a display module.

[0102] Figure 1 is a schematic diagram of the structure of the first body and the second body of the embodiment of the present application when they are not attached. Figure 2 This is a schematic diagram of the structure when the first body and the second body of the embodiment of the present application are attached. Figure 1-2 , the display module of the embodiment of the present application is described in detail.

[0103] In some exemplary implementations, the display module of the embodiments of the present application includes the FPC of the above embodiments.

[0104] In some exemplary embodiments, the display module of the embodiment of the present application includes: a first glass substrate layer 101 and a second glass substrate layer 102 .

[0105] In some exemplary embodiments, the size of the first glass substrate layer 101 is greater than the size of the second glass substrate layer 102 .

[0106] In some exemplary embodiments, the first glass substrate layer 101 covers the second glass substrate layer 102 .

[0107] In some exemplary embodiments, a first binding region 103 is provided in a region where the first glass substrate layer 101 is larger than the second glass substrate layer 102 .

[0108] In some exemplary embodiments, the first bonding region 103 is connected to a welding portion.

[0109] In some exemplary embodiments, a second binding region is further provided in a region where the first glass substrate layer 101 is larger than the second glass substrate layer 102 .

[0110] In some exemplary embodiments, a touch FPC 118 is disposed in the second binding area.

[0111] Example 3

[0112] Embodiment 3 is an electronic device including the FPC of the above embodiment.

[0113] In some exemplary embodiments, a display device is installed on the electronic device of the embodiment of the present application, and the display device adopts the display module of the above embodiment.

[0114] In some exemplary embodiments, the electronic device of the embodiments of the present application includes a smart wearable device (eg, a smart watch, a smart bracelet, etc.).

[0115] Although the implementation methods disclosed in the utility model are as above, the content is only an implementation method adopted to facilitate the understanding of the utility model, and is not used to limit the utility model. Any technician in the field to which the utility model belongs can make any modifications and changes in the form and details of implementation without departing from the spirit and scope disclosed in the utility model, but the scope of patent protection of the utility model shall still be based on the scope defined in the attached claims.

Claims

1. An FPC, characterized in that: include: A first body and a second body, wherein the first body and the second body are connected via a first bending portion; The first body, the second body and the first bending portion are integrally formed; An NFC coil is provided on the upper surface of the second body; The NFC coil is arranged in a ring shape on the upper surface of the second body; The NFC coil is connected to the first body through the first bending portion.

2. The FPC according to claim 1, characterized in that: The first body is provided with a first body positioning hole; The second body is provided with a second body positioning hole; When the lower surface of the first body is in contact with the lower surface of the second body, the first body positioning hole and the second body positioning hole overlap.

3. The FPC according to claim 2, characterized in that: The upper surface of the first body is also provided with: A component area, wherein the component area is used to arrange components and ICs; The IC is a power management IC and / or a touch control IC and / or a light sensing IC.

4. The FPC according to claim 3, characterized in that: The components and IC are soldered on the component area through SMT process.

5. The FPC according to claim 4, characterized in that: The lower surface of the second body is also provided with ferrite; The surface area of ​​the second body is greater than the surface area of ​​the first body; When the lower surface of the first body is attached to the lower surface of the second body, the ferrite is exposed in an area of ​​the second body that is not covered by the first body.

6. The FPC according to claim 5, characterized in that: The first body also includes: an extension portion, wherein the extension portion is connected to the first body via a second bending portion; The extension portion also includes: A third bending portion, wherein the third bending portion is further connected to a reinforcing plate; A BTB connector is provided on a side of the reinforcing plate facing away from the third bending portion.

7. The FPC according to claim 6, characterized in that: The first body further comprises: a welding portion and a binding area, and a glue point area is provided around the binding area.

8. A display module, characterized in that: The FPC comprises the FPC described in any one of claims 1 to 7.

9. The display module according to claim 8, characterized in that: Also includes: a first glass substrate layer and a second glass substrate layer; The size of the first glass substrate layer is greater than the size of the second glass substrate layer; The first glass substrate layer covers the second glass substrate layer; A first binding area is provided in an area where the first glass substrate layer is larger than the second glass substrate layer; The first binding area is connected to the welding portion.

10. The display module according to claim 9, characterized in that: A second binding area is further provided in an area where the first glass substrate layer is larger than the second glass substrate layer; The second binding area is provided with a touch FPC.

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