FPC (Flexible Printed Circuit) structure with aligned double-sided adhesive tape

Abstract

The utility model discloses a double-faced adhesive tape aligned FPC structure, which relates to the technical field of FPC, and comprises a circuit board body, a double-faced adhesive tape and a plurality of solid copper, the end part of the circuit board body is provided with an exposed first plating layer, one side of the circuit board body far away from the outer edge of the first plating layer is provided with a double-faced adhesive tape pasting area, and the double-faced adhesive tape is attached to the double-faced adhesive tape pasting area; the multiple pieces of solid copper are arranged on the inner side of the edge of the end, close to the first plating layer, of the double-faced adhesive tape pasting area; or the multiple pieces of solid copper are arranged on the inner side of the edge of the end, away from the first plating layer, of the double-faced adhesive tape pasting area; or the multiple pieces of solid copper are arranged on the outer side of the edge of the end, away from the first plating layer, of the double-faced adhesive tape pasting area; the multiple pieces of solid copper are located on the same horizontal line and attached to the edge line of the double-faced adhesive tape pasting area. The alignment consistency of the double-faced adhesive tape is improved, the double-faced adhesive tape is attached to the same horizontal line, and the problem that the positions of the double-faced adhesive tape are inconsistent due to large printing position tolerance when a silk-screen line serves as an alignment standard is solved.

Description

Technical Field

[0001] The utility model relates to the technical field of FPC, in particular to an FPC structure with double-sided adhesive tape alignment. Background Art

[0002] FPC (Flexible Printed Circuit Board) is a printed circuit board made of a flexible substrate with bendable and foldable properties. It is widely used in the field of display screens. One part of the coating of the FPC needs to be connected to the display screen, and the other part of the coating needs to be connected to other conductors such as the client or the transfer PCB to play a role of transfer. Since the area where the FPC is connected to the display screen is narrow, when the other part of the FPC is connected to other components, the FPC usually needs to be bent. At this time, the position where the FPC is connected to the display screen is easily pulled and torn. Therefore, double-sided tape is usually added under the coating area where the FPC is connected to the display screen to improve the stability of the connection between the FPC and the display screen and prevent the coating area from being pulled and torn.

[0003] However, the area for adding double-sided tape is limited. If the double-sided tape is too biased towards the plating area, it will affect the electrical connection of the plating area; if it is too biased towards the bending area, the remaining length of the FPC will be insufficient, resulting in the inability to electrically connect the remaining part to other components. At this time, if the double-sided tape is applied to a small area, if the double-sided tape is applied biasedly, it will cause stickiness in areas that do not need stickiness, which will not only affect the subsequent assembly of the FPC, but may also damage the components or surfaces in contact with it. Therefore, it is necessary to ensure that the double-sided tape is accurately attached. At present, silk screen lines are set in the upper and lower areas where the double-sided tape needs to be attached by printing silk screen lines to position the double-sided tape. However, the printing position tolerance of the silk screen line is large. Using it as the alignment standard for the double-sided tape will lead to inconsistencies in the position of the double-sided tape attached to each piece of FPC, which will lead to inconsistent product appearance and even affect product performance. Utility Model Content

[0004] The main purpose of the utility model is to provide an FPC structure with double-sided tape alignment, improve the alignment consistency of the double-sided tape, make the double-sided tape stick on the same horizontal line, and solve the problem of inconsistency of the double-sided tape position caused by large printing position tolerance when the silk screen line is used as the alignment standard.

[0005] To achieve the above-mentioned purpose, the utility model proposes a double-sided adhesive alignment FPC structure, comprising a circuit board body, a double-sided adhesive and a plurality of solid coppers, wherein an exposed first plating layer is provided at the end of the circuit board body, and a double-sided adhesive bonding area is provided on the side of the circuit board body away from the outer edge of the first plating layer, and the double-sided adhesive is attached to the double-sided adhesive bonding area;

[0006] The plurality of solid coppers are respectively arranged on the inner side of the edge of the double-sided adhesive bonding area close to one end of the first plating layer;

[0007] Or, a plurality of the solid coppers are respectively arranged on the inner side of the edge of the double-sided adhesive bonding area away from the first plating layer;

[0008] Or, a plurality of the solid coppers are respectively arranged on the outer side of the edge of the double-sided adhesive bonding area away from the first plating layer;

[0009] The plurality of solid coppers are located on the same horizontal line, and the plurality of solid coppers are respectively in contact with the edge lines of the double-sided adhesive bonding area.

[0010] Optionally, a plurality of the solid copper spacers are arranged in the double-sided tape pasting area.

[0011] Optionally, the solid copper is in the shape of a strip.

[0012] Optionally, the circuit board body comprises a base film, a first conductor layer, a first covering film and the first plating layer, the first conductor layer is provided on the surface of the base film, the first plating layer and the first covering film are provided on the surface of the first conductor layer, the first plating layer is provided at an end of the first conductor layer, the first covering film is located on one side of the first plating layer, and the first covering film exposes the first plating layer to the outside;

[0013] The double-sided tape is arranged on the surface of the first covering film, and the double-sided tape is arranged close to the first coating layer.

[0014] Optionally, the circuit board body further comprises a second conductor layer, a third conductor layer, a second covering film, a third covering film and a fourth covering film, the second conductor layer and the third conductor layer are arranged at intervals on a side of the base film away from the first conductor layer, and the second conductor layer is arranged close to one end of the first plating layer;

[0015] A second covering film is disposed at an end of the substrate film facing away from the first conductor layer, and the second covering film is disposed close to one end of the first plating layer;

[0016] A third cover film is provided on the surface of the second conductor layer, and a fourth cover film is provided on the surface of the third conductor layer.

[0017] Optionally, the circuit board body further includes a first electromagnetic interference film and a second electromagnetic interference film, the first electromagnetic interference film is provided on the surface of the first covering film, and the first electromagnetic interference film is located on a side of the double-sided adhesive away from the first coating;

[0018] The second electromagnetic interference film is disposed on the surface of the third covering film.

[0019] Optionally, the circuit board body further comprises a conductive film and a first reinforcing plate, the conductive film is disposed on the surface of the fourth cover film, and the first reinforcing plate is disposed on the surface of the conductive film;

[0020] The conductive film and the first reinforcing plate have the same area.

[0021] Optionally, a bending area and a connecting area are provided at one end of the circuit board body away from the first coating, and one end of the bending area away from the first coating is connected to the connecting area;

[0022] The circuit board body further comprises an adhesive layer, a second reinforcement plate and a second plating layer, wherein in the connection area, the first conductor layer is disposed on the surface of the base film, the first covering film is disposed on the surface of the first conductor layer, the adhesive layer is disposed on the surface of the first covering film, and the second reinforcement plate is disposed on the surface of the adhesive layer;

[0023] In the bending area, a third conductor layer is provided on a side of the base film away from the first conductor layer, and a fourth covering film is provided on a surface of the third conductor layer, and the third conductor layer and the fourth covering film extend to the connection area;

[0024] In the connection area, the second plating layer is provided on the surface of the third conductor layer, the second plating layer is provided at the end of the third conductor layer, the fourth covering film is located on one side of the second plating layer, and the fourth covering film exposes the second plating layer.

[0025] Optionally, the bending area is L-shaped.

[0026] Optionally, a silk-screen line is provided on the surface of the second reinforcement plate.

[0027] Compared with the prior art, the embodiments of the present invention have the following beneficial effects:

[0028] The utility model sets multiple solid coppers as the alignment marks of the double-sided adhesive tape. The multiple solid coppers have high recognition and can play the role of double-sided adhesive tape alignment. The double-sided adhesive tape can be attached to the double-sided adhesive tape pasting area according to the multiple solid coppers, thereby ensuring that the upper and lower edges of the double-sided adhesive tape can be accurately aligned during the pasting process, greatly reducing the misalignment of the double-sided adhesive tape, improving the alignment consistency of the double-sided adhesive tape, and making the double-sided adhesive tape pasted on the same horizontal line, further improving the product quality, reducing the difficulty of production operation, and improving production efficiency. In the utility model, solid copper is used to replace the original silk screen line. At this time, two silk screen lines are reduced in the FPC structure. The original silk screen line area can be used as the pasting area of ​​the double-sided adhesive tape, making the pasted double-sided adhesive tape area larger, further improving the connection stability between the utility model and the display screen glass, and avoiding the situation of pulling and tearing in the utility model. In the utility model, multiple solid coppers are retained in the subsequent process, and finally used as reference standards in the finished product inspection process to judge whether the finished product meets the standard, ensure the accuracy and reliability of the finished product inspection structure, and can also further improve production efficiency and control product quality. In addition, the utility model reduces the printing silk screen line process, thereby reducing production costs, and solves the problem that the current use of silk screen lines as alignment standards has a large printing position tolerance, resulting in inconsistency in the position of double-sided adhesive tape. BRIEF DESCRIPTION OF THE DRAWINGS

[0029] Figure 1 This is a front view of an embodiment of an FPC structure with double-sided adhesive tape aligned according to the utility model (without double-sided adhesive tape);

[0030] Figure 2 This is a front view of another embodiment of an FPC structure with double-sided adhesive tape aligned according to the utility model (double-sided adhesive tape is not attached);

[0031] Figure 3 It is a front view of another embodiment of the FPC structure with double-sided adhesive tape alignment of the utility model (without double-sided adhesive tape);

[0032] Figure 4 This is a front view of an embodiment of an FPC structure with double-sided adhesive tape alignment according to the utility model (double-sided adhesive tape has been pasted);

[0033] Figure 5 This is a rear view of an embodiment of an FPC structure with double-sided adhesive tape alignment according to the utility model (double-sided adhesive tape has been pasted);

[0034] Figure 6 for Figure 4 Sectional view of section AA;

[0035] Figure 7 for Figure 4 Cross-sectional view of section BB.

[0036] Wherein: 1. circuit board body; 101. first plating layer; 102. base film; 103. first conductor layer; 104. first covering film; 105. second conductor layer; 106. third conductor layer; 107. second covering film; 108. third covering film; 109. fourth covering film; 110. first electromagnetic interference film; 111. second electromagnetic interference film; 112. conductive film; 113. first reinforcing plate; 1a. bending area; 1b. connection area; 114. adhesive layer; 115. second reinforcing plate; 116. second plating layer; 117. silk screen line; 2. double-sided tape; 3. solid copper; 4. double-sided tape pasting area. DETAILED DESCRIPTION

[0037] The following will be combined with the drawings in the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments of the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.

[0038] It should be noted that all directional indications in the embodiments of the present invention (such as up, down, left, right, front, back...) are only used to explain the relative position relationship, movement status, etc. between the components under a certain specific posture (as shown in the accompanying drawings). If the specific posture changes, the directional indication will also change accordingly.

[0039] In the present invention, unless otherwise clearly specified and limited, the terms "connection", "fixation", etc. should be understood in a broad sense. For example, "fixation" can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium, it can be the internal connection of two elements or the interaction relationship between two elements, unless otherwise clearly defined. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0040] In addition, in the present utility model, descriptions such as "first", "second", etc. are only used for descriptive purposes and cannot be understood as indicating or implying their relative importance or implicitly indicating the number of technical features indicated. Therefore, the features defined as "first" and "second" may explicitly or implicitly include at least one of the features. In addition, the meaning of "and / or" appearing in the full text is to include three parallel solutions. Taking "A and / or B as an example", it includes solution A, or solution B, or solutions that satisfy both A and B. In addition, the technical solutions between the various embodiments can be combined with each other, but it must be based on the ability of ordinary technicians in this field to implement. When the combination of technical solutions is contradictory or cannot be implemented, it should be deemed that such combination of technical solutions does not exist and is not within the scope of protection required by the present utility model.

[0041] The utility model provides an FPC structure with double-sided adhesive alignment.

[0042] In the embodiment of the present utility model, Figures 1 to 3 As shown, a double-sided adhesive FPC structure comprises a circuit board body 1, a double-sided adhesive 2 and a plurality of solid coppers 3, an exposed first plating layer 101 is provided at the end of the circuit board body 1, a double-sided adhesive bonding area 4 is provided on the side of the circuit board body 1 away from the outer edge of the first plating layer 101, and the double-sided adhesive 2 is attached to the double-sided adhesive bonding area 4;

[0043] like Figure 1 As shown, a plurality of solid coppers 3 are respectively arranged on the inner side of the edge of the double-sided adhesive bonding area 4 close to one end of the first plating layer 101;

[0044] like Figure 2 As shown, or, a plurality of solid coppers 3 are respectively arranged on the inner side of the edge of the double-sided adhesive bonding area 4 away from the first plating layer 101;

[0045] like Figure 3 As shown, or, a plurality of solid coppers 3 are respectively arranged on the outer side of the edge of the double-sided adhesive bonding area 4 away from one end of the first plating layer 101;

[0046] The plurality of solid coppers 3 are located on the same horizontal line, and the plurality of solid coppers 3 are respectively in contact with the edge lines of the double-sided adhesive bonding area 4 .

[0047] The utility model sets a plurality of solid coppers 3 as the alignment marks of the double-sided adhesive tape 2. The plurality of solid coppers 3 have a high degree of recognition and can play the role of the alignment of the double-sided adhesive tape 2. The double-sided adhesive tape 2 can be attached to the double-sided adhesive adhesive area 4 according to the plurality of solid coppers 3, thereby ensuring that the upper and lower edges of the double-sided adhesive tape 2 can be accurately aligned during the pasting process, greatly reducing the misalignment of the double-sided adhesive tape 2, improving the alignment consistency of the double-sided adhesive tape 2, making the double-sided adhesive tape 2 attached to the same horizontal line, further improving the product quality, reducing the difficulty of production operation, and improving production efficiency. In the utility model, the solid copper 3 is used to replace the original silk screen line, and two silk screen lines are reduced in the FPC structure. The area of ​​the original printed silk screen line can be used as the pasting area of ​​the double-sided adhesive tape 2, so that the pasting area of ​​the double-sided adhesive tape 2 becomes larger, further improving the connection stability between the utility model and the component, and avoiding the pulling and tearing of the utility model. The plurality of solid coppers 3 of the utility model are retained in the subsequent process, and finally used as a reference standard in the finished product detection process to judge whether the finished product meets the standard, ensure the accuracy and reliability of the finished product detection structure, and can also further improve production efficiency and control product quality. In addition, the utility model reduces the printing silk screen line process, thereby reducing production costs. The utility model solves the problem that the current use of silk screen lines as alignment standards has a large printing position tolerance, resulting in inconsistency in the position of double-sided adhesive tape.

[0048] To further illustrate, when multiple solid coppers 3 are respectively arranged on the inner side of the edge of the double-sided tape pasting area 4 close to the first coating 101, the double-sided tape 2 is aligned with reference to the upper edges of the multiple solid coppers 3; multiple solid coppers 3 are respectively arranged on the inner side of the edge of the double-sided tape pasting area 4 away from the first coating 101, and the double-sided tape 2 is aligned with reference to the lower edges of the multiple solid coppers 3; multiple solid coppers 3 are respectively arranged on the outer side of the edge of the double-sided tape pasting area 4 away from the first coating 101, and the double-sided tape 2 is aligned with reference to the upper edges of the multiple solid coppers 3.

[0049] See also Figures 1 to 3 In one embodiment of the present application, a plurality of solid coppers 3 are arranged at intervals in the double-sided adhesive bonding area 4 .

[0050] The solid copper 3 interval setting can not only meet the production needs, but also optimize the process flow and reduce unnecessary adjustments and correction processes. In addition, the solid copper 3 interval setting can reduce the etching time, thereby reducing production costs. In actual production, the position and quantity of the solid copper 3 can be flexibly adjusted to meet different application requirements.

[0051] See also Figures 1 to 3 In one embodiment of the present application, the solid copper 3 is in the shape of a strip.

[0052] A strip of solid copper 3 is set as a positioning standard. The strip of solid copper 3 has a certain width and length, so that it is easier to be identified and positioned during the production process, which further helps to align the upper and lower edges of the double-sided tape 2 during the bonding process, so that the double-sided tape 2 remains on the same horizontal line, greatly improving product quality.

[0053] See also Figures 4 to 7 In one embodiment of the present application, the circuit board body 1 includes a base film 102, a first conductor layer 103, a first cover film 104 and a first plating layer 101. The first conductor layer 103 is provided on the surface of the base film 102, and the first plating layer 101 and the first cover film 104 are provided on the surface of the first conductor layer 103. The first plating layer 101 is provided at the end of the first conductor layer 103, and the first cover film 104 is located on one side of the first plating layer 101, and the first cover film 104 makes the first plating layer 101 exposed to the outside;

[0054] The double-sided tape 2 is disposed on the surface of the first covering film 104 , and the double-sided tape 2 is disposed close to the first coating layer 101 .

[0055] The base film 102, as the base material layer of the FPC, is usually made of a flexible insulating material, which can provide basic support and insulation for the FPC. The first conductor layer 103 is arranged on the surface of the base film 102 to provide the FPC with conductive properties, so that the FPC can transmit current and signals. The first coating layer 101 and the first covering film 104 are arranged on the surface of the first conductor layer 103. Preferably, the first coating layer 101 is electrically connected to the display screen glass to ensure smooth transmission of current and signals. The first covering film 104 can protect the first conductor layer 103, prevent the first conductor layer 103 from being eroded and damaged by the external environment, and at the same time increase the flexibility and reliability of the FPC.

[0056] See also Figures 4 to 7 In one embodiment of the present application, the circuit board body 1 further includes a second conductor layer 105, a third conductor layer 106, a second cover film 107, a third cover film 108 and a fourth cover film 109. The second conductor layer 105 and the third conductor layer 106 are arranged at intervals on one side of the base film 102 away from the first conductor layer 103, and the second conductor layer 105 is arranged close to one end of the first plating layer 101;

[0057] A second covering film 107 is provided at the end of the substrate film 102 facing away from the first conductor layer 103 , and the second covering film 107 is provided close to one end of the first plating layer 101 ;

[0058] A third cover film 108 is provided on the surface of the second conductor layer 105 , and a fourth cover film 109 is provided on the surface of the third conductor layer 106 .

[0059] The second conductor layer 105 and the third conductor layer 106 are arranged on the side of the base film 102 facing away from the first conductor layer 103, which can further improve the conductive performance of the FPC; the third covering film 108 and the fourth covering film 109 protect the second conductor layer 105 and the third conductor layer 106 respectively, so that the second conductor layer 105 and the third conductor layer 106 are prevented from being corroded and damaged by the external environment; the second covering film 107 is arranged at one end close to the first plating layer 101, which can protect the end of the base film 102 close to the first plating layer 101, which helps to improve the service life of the utility model.

[0060] Preferably, the base film 102, the first covering film 104, the second covering film 107, the third covering film 108 and the fourth covering film 109 are all polyimide films, wherein the thickness of the base film 102 is 25 μm, and the thickness of the first covering film 104, the second covering film 107, the third covering film 108 and the fourth covering film 109 are all 12.5 μm; preferably, the first conductor layer 103, the second conductor layer 105 and the third conductor layer 106 are all glue-free ED copper, and the thickness is 12 μm; preferably, the double-sided tape 2 is 3M9077 double-sided tape, which can be used for bonding flexible circuit boards, and has good heat shock resistance and excellent bonding performance for plastics and plastic gaskets.

[0061] See also Figures 4 to 6 In one embodiment of the present application, the circuit board body 1 further includes a first electromagnetic interference film 110 and a second electromagnetic interference film 111. The first electromagnetic interference film 110 is provided on the surface of the first covering film 104, and the first electromagnetic interference film 110 is located on the side of the double-sided adhesive 2 away from the first coating layer 101;

[0062] A second EMI film 111 is disposed on the surface of the third cover film 108 .

[0063] The first electromagnetic interference film 110 and the second electromagnetic interference film 111 form shielding layers on the surfaces of the first covering film 104 and the third covering film 108 respectively, which can effectively block the propagation of electromagnetic waves, prevent the invasion of external electromagnetic interference, and prevent interference from the inside to the outside, which helps to achieve high-quality high-frequency signal transmission and can also meet the FPC bending characteristics and assembly workability requirements.

[0064] Preferably, the first electromagnetic interference film 110 and the second electromagnetic interference film 111 are both of model PC6000. The PC6000 series electromagnetic interference films are suitable for electromagnetic wave shielding of high-step-difference rigid-flex boards or multi-layer FPCs. This series of electromagnetic interference films has excellent chemical resistance, shielding properties and bending properties.

[0065] See also Figure 6 to Figure 7In one embodiment of the present application, the circuit board body 1 further includes a conductive film 112 and a first reinforcing plate 113, the surface of the fourth cover film 109 is provided with the conductive film 112, and the surface of the conductive film 112 is provided with the first reinforcing plate 113;

[0066] The conductive film 112 and the first reinforcing plate 113 have the same area.

[0067] The use of the conductive film 112 ensures the stability and reliability of signal transmission, and can also provide additional protection for the circuit; the first reinforcing plate 113 can enhance the mechanical strength of the FPC part structure, provide a more solid support for the FPC, and prevent it from being damaged due to bending or pressure during assembly and operation. The first reinforcing plate 113 with the same area is set on the surface of the conductive film 112, and the two can be completely fitted, providing better structural support, further enhancing the overall strength of the FPC, and preventing excessive stress from being generated when bending or twisting. The first reinforcing plate 113 can also provide support and protection for the conductive film 112, thereby improving electrical performance.

[0068] Preferably, the conductive film 112 is CBF 800-60D, and its thickness is 60 μm.

[0069] Preferably, the first reinforcing plate 113 is made of polyimide, which can be used to enhance the rigidity, stability and electrical performance of the local area of ​​the FPC; preferably, the thickness of the first reinforcing plate 113 is 0.30±0.05 mm. Optionally, the first reinforcing plate 113 is a steel sheet.

[0070] Specifically, the side of the first reinforcing plate 113 facing away from the conductive film 112 is covered with another layer of double-sided adhesive, which further facilitates the utility model to be electrically connected with other components after being bent, and can provide stable structural support for the electrical connection to prevent the electrical connection from being affected by external forces. Optionally, the double-sided adhesive layer covering the first reinforcing plate 113 has the same area as the conductive film 112 and the first reinforcing plate 113.

[0071] See also Figures 1 to 5 In one embodiment of the present application, a bending area 1a and a connecting area 1b are provided at one end of the circuit board body 1 away from the first coating layer 101, and the end of the bending area 1a away from the first coating layer 101 is connected to the connecting area 1b;

[0072] The circuit board body 1 further includes an adhesive layer 114, a second reinforcement plate 115 and a second plating layer 116. In the connection area 1b, the surface of the base film 102 is provided with a first conductor layer 103, the surface of the first conductor layer 103 is provided with a first cover film 104, the surface of the first cover film 104 is provided with an adhesive layer 114, and the surface of the adhesive layer 114 is provided with a second reinforcement plate 115;

[0073] In the bending area 1a, a third conductor layer 106 is provided on a side of the base film 102 away from the first conductor layer 103, and a fourth cover film 109 is provided on the surface of the third conductor layer 106. The third conductor layer 106 and the fourth cover film 109 extend to the connection area 1b;

[0074] In the connection area 1b, the surface of the third conductor layer 106 is provided with a second plating layer 116, which is disposed at the end of the third conductor layer 106, and the fourth covering film 109 is located on one side of the second plating layer 116, and the fourth covering film 109 exposes the second plating layer 116.

[0075] In practical applications, due to space limitations or assembly requirements, the FPC needs to be bent to adapt to a specific shape or structure. The setting of the bending area 1a enables the present invention to be bent as required to meet assembly requirements, thereby improving the performance of the present invention.

[0076] The connection area 1b is the area where the utility model is connected to other conductors. In the connection area 1b, the surface of the first cover film 104 is connected to the second reinforcement plate 115 through the adhesive layer 114. The second reinforcement plate 115 can significantly enhance the mechanical strength of the connection area 1b, so that it can withstand greater external stress and impact force, provide additional protection for this part, and thus facilitate the normal operation of the utility model. The second plating layer 116 is electrically connected to other components to improve the conductivity of the connection area 1b.

[0077] Preferably, the second reinforcing plate 115 is made of SUS 304 electroplated nickel, and its thickness is 0.20±0.05 mm. Optionally, the second reinforcing plate 115 is a steel sheet.

[0078] See also Figures 1 to 5 In one embodiment of the present application, the bending area 1a is L-shaped.

[0079] The bending area 1a is L-shaped, which further facilitates the bending of the utility model and electrical connection with other components, so that the utility model can be more flexibly applied to complex installation environments.

[0080] See also Figure 7 In one embodiment of the present application, a silk screen line 117 is provided on the surface of the second reinforcing plate 115 .

[0081] The silk-screen line 117 can clearly mark the key position of the second reinforcing plate 115 . The silk-screen line 117 can also be used as an identification mark of the machine on the automated production line, thereby improving the level of production automation and further ensuring the correct assembly and maintenance of the FPC.

[0082] Preferably, the first coating 101 is connected to the display glass, and the second coating 116 is connected to the adapter PCB. In actual production, after the double-sided adhesive 2 is aligned, the first coating 101 is first electrically connected to the glass, and then the release film of the double-sided adhesive 2 is torn off. Then the FPC is statically bent 180 degrees for the first time at the first covering film 104 area between the double-sided adhesive 2 and the first electromagnetic interference film 110, and then statically bent 180 degrees for the second time at the bending area 1a to electrically connect the second coating 116 to the adapter PCB.

[0083] To further illustrate, the tolerance of the width of the solid copper 3 is 0.03 mm to 0.05 mm.

[0084] The tolerance of the width of the actual copper 3 is 0.03mm~0.05mm, which can ensure that the deviation between the actual fitting position and the designed position of the double-sided tape 2 is within the sum of the tolerance of the width of the actual copper 3 (0.03mm~0.05mm) and the width of the actual copper 3, and further make the double-sided tape 2 fit on the same horizontal line, meeting the FPC's need for high-precision fitting of the double-sided tape 2.

[0085] Specifically, the first conductor layer 103 is copper in a grid shape.

[0086] Specifically, the first conductor layer 103 is a copper grid at a 45° angle. Compared with grids in other directions or shapes, the copper grid at a 45° angle has a higher visual contrast with the solid copper 3, further improving the recognition of the solid copper 3, making the solid copper 3 not easily identified as other structures, and effectively improving production efficiency.

[0087] Specifically, when the first conductor layer 103 is copper, the plurality of solid coppers 3 and the first conductor layer 103 are formed by synchronous etching.

[0088] The above are only preferred embodiments of the present invention, and do not limit the patent scope of the present invention. All equivalent structural changes made by using the contents of the present invention specification and drawings under the inventive concept of the present invention, or directly / indirectly applied in other related technical fields are included in the patent protection scope of the present invention.

Claims

1. A double-sided adhesive FPC structure, characterized in that: It comprises a circuit board body (1), a double-sided adhesive tape (2) and a plurality of solid coppers (3); the end of the circuit board body (1) is provided with an exposed first plating layer (101); the circuit board body (1) is provided with a double-sided adhesive tape adhesive area (4) on a side away from the outer edge of the first plating layer (101); the double-sided adhesive tape (2) is attached to the double-sided adhesive tape adhesive area (4); The plurality of solid coppers (3) are respectively arranged on the inner side of the edge of the double-sided adhesive bonding area (4) close to one end of the first plating layer (101); Or, the plurality of solid coppers (3) are respectively arranged on the inner side of the edge of the double-sided adhesive bonding area (4) away from the first plating layer (101); Or, the plurality of solid coppers (3) are respectively arranged on the outer side of the edge of one end of the double-sided adhesive bonding area (4) away from the first plating layer (101); The plurality of solid coppers (3) are located on the same horizontal line, and the plurality of solid coppers (3) are respectively in contact with the edge lines of the double-sided adhesive bonding area (4).

2. The FPC structure with double-sided adhesive alignment according to claim 1, characterized in that: A plurality of the solid coppers (3) are arranged at intervals in the double-sided adhesive bonding area (4).

3. The FPC structure with double-sided adhesive alignment according to claim 1, characterized in that: The solid copper (3) is in the shape of a strip.

4. The FPC structure with double-sided adhesive alignment according to claim 1, characterized in that: The circuit board body (1) comprises a base film (102), a first conductor layer (103), a first covering film (104) and the first plating layer (101); the first conductor layer (103) is provided on the surface of the base film (102); the first plating layer (101) and the first covering film (104) are provided on the surface of the first conductor layer (103); the first plating layer (101) is provided at an end of the first conductor layer (103); the first covering film (104) is located on one side of the first plating layer (101); and the first covering film (104) exposes the first plating layer (101) to the outside; The double-sided adhesive tape (2) is arranged on the surface of the first covering film (104), and the double-sided adhesive tape (2) is arranged close to the first coating layer (101).

5. The FPC structure with double-sided adhesive alignment according to claim 4, characterized in that: The circuit board body (1) further comprises a second conductor layer (105), a third conductor layer (106), a second covering film (107), a third covering film (108) and a fourth covering film (109); the second conductor layer (105) and the third conductor layer (106) are arranged at intervals on a side of the base film (102) away from the first conductor layer (103); the second conductor layer (105) is arranged close to one end of the first plating layer (101); A second covering film (107) is provided at the end of the substrate film (102) facing away from the first conductor layer (103), and the second covering film (107) is provided close to one end of the first plating layer (101); A third covering film (108) is provided on the surface of the second conductor layer (105), and a fourth covering film (109) is provided on the surface of the third conductor layer (106).

6. The FPC structure with double-sided adhesive alignment according to claim 5, characterized in that: The circuit board body (1) further comprises a first electromagnetic interference film (110) and a second electromagnetic interference film (111); the first electromagnetic interference film (110) is provided on the surface of the first covering film (104), and the first electromagnetic interference film (110) is located on a side of the double-sided adhesive tape (2) away from the first coating layer (101); The second electromagnetic interference film (111) is provided on the surface of the third covering film (108).

7. The FPC structure with double-sided adhesive alignment according to claim 5, characterized in that: The circuit board body (1) further comprises a conductive film (112) and a first reinforcing plate (113); the conductive film (112) is provided on the surface of the fourth covering film (109), and the first reinforcing plate (113) is provided on the surface of the conductive film (112); The conductive film (112) and the first reinforcing plate (113) have the same area.

8. The FPC structure with double-sided adhesive alignment according to claim 5, characterized in that: A bending area (1a) and a connection area (1b) are provided at one end of the circuit board body (1) away from the first coating layer (101); and the end of the bending area (1a) away from the first coating layer (101) is connected to the connection area (1b); The circuit board body (1) further comprises an adhesive layer (114), a second reinforcing plate (115) and a second plating layer (116); in the connection area (1b), the surface of the base film (102) is provided with the first conductor layer (103), the surface of the first conductor layer (103) is provided with the first covering film (104), the surface of the first covering film (104) is provided with the adhesive layer (114), and the surface of the adhesive layer (114) is provided with the second reinforcing plate (115); In the bending area (1a), a third conductor layer (106) is provided on a side of the base film (102) facing away from the first conductor layer (103), a fourth covering film (109) is provided on the surface of the third conductor layer (106), and the third conductor layer (106) and the fourth covering film (109) extend to the connection area (1b); In the connection area (1b), the surface of the third conductor layer (106) is provided with the second plating layer (116), the second plating layer (116) is arranged at the end of the third conductor layer (106), the fourth covering film (109) is located on one side of the second plating layer (116), and the fourth covering film (109) exposes the second plating layer (116) to the outside.

9. The FPC structure with double-sided adhesive alignment according to claim 8, characterized in that: The bending area (1a) is in an L-shape.

10. The FPC structure with double-sided adhesive alignment according to claim 8, characterized in that: A silk screen line (117) is provided on the surface of the second reinforcing plate (115).

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