Vibration clamp for vertical continuous copper deposition wire

Abstract

The utility model provides a vibration clamp for a vertical continuous copper deposition wire. The vibration clamp comprises a bearing transportation part, a vibration device and a clamping part, the bearing and transporting part comprises a transporting mechanism and a supporting plate, the transporting mechanism and the supporting plate are fixed in a right-angle mode, conductive brushes are arranged on the transporting mechanism and comprise the positive conductive brush and the negative conductive brush, the positive electrode of the vibrating device is electrically connected with the positive conductive brush, and the negative electrode of the vibrating device is electrically connected with the negative conductive brush. The vibration device is fixed on the supporting plate; the vibration device and the clamping part are fixed on the supporting plate, so that the clamp has a vibration function in the copper deposition process, and the problem that bubbles in the through holes of the circuit board are easy to hide in the through holes of the circuit board and are difficult to discharge due to the moment that the circuit board sinks into copper deposition liquid medicine and when the copper deposition liquid medicine is stirred in the copper deposition process is solved; and the copper deposition effect of the circuit board through hole is improved.

Description

Technical Field

[0001] The utility model relates to the field of copper deposition equipment and copper deposition tools for circuit boards, in particular to a vibration clamp for a vertical continuous copper deposition line. Background Art

[0002] During the vertical continuous copper deposition process of the circuit board, the workpiece moves perpendicular to the ground, the fixture holds the circuit board and immerses it in the copper deposition solution, and the circuit board reacts chemically with the copper deposition solution to realize the copper deposition process.

[0003] In the prior art copper plating process, a circuit board is placed in a copper plating solution cylinder. The copper plating solution is continuously stirred and circulated to generate bubbles. The bubbles are easily hidden in the through-holes of the circuit board as the solution is stirred. When some circuit boards with a large aspect ratio (ratio of thickness to hole diameter) enter the copper plating solution cylinder, bubbles are easily hidden in the through-holes. The bubbles are not easy to be discharged from the through-holes of the circuit board, resulting in the inability of the copper plating solution to perform copper plating reaction in the through-holes. The above situations will lead to the problem that copper plating cannot be performed in the through-holes of the circuit board.

[0004] Based on the above background and problems, it is necessary to provide a new type of vibration fixture for vertical continuous copper deposition line.

[0005] The fixture structure used for the vertical continuous copper deposition line of the present technical solution can be referred to the Chinese patent with publication number CN112481685A. Utility Model Content

[0006] The utility model aims to solve the problem that bubbles are easily hidden in the through holes during the current vertical continuous copper deposition process of the circuit board, and cannot be discharged, resulting in the inability to deposit copper in the through holes of the circuit board. A vibration fixture for vertical continuous copper deposition line is provided:

[0007] The vibration fixture includes a load-bearing and transporting part, a vibration device and a clamping part; the load-bearing and transporting part includes a transport mechanism and a support plate, the transport mechanism is fixed at a right angle to the support plate, a conductive brush is provided on the transport mechanism, the conductive brush includes a positive conductive brush and a negative conductive brush, the positive pole of the vibration device is electrically connected to the positive conductive brush, the negative pole of the vibration device is electrically connected to the negative conductive brush, and the vibration device is fixed to the support plate.

[0008] Preferably, the vibration device comprises a vibrator and a fixing base, and the vibrator is fixed to the support plate through the fixing base.

[0009] Preferably, the vibration device and the transportation mechanism are respectively fixed to two surfaces of the support plate.

[0010] Preferably, the vibrator is electrically connected to the conductive brush via a wire, and the wire passes through the support plate and is electrically connected to the conductive brush.

[0011] Preferably, the conductive brush is insulated and fixed on the transport mechanism, and the positive conductive brush and the negative conductive brush are fixed parallel to each other and without contact.

[0012] Preferably, the clamping portion is arranged below the supporting plate relative to the transport mechanism.

[0013] Preferably, the clamping portion includes a fixing plate and a clamping head.

[0014] Preferably, the chuck is a single-row chuck; the tail end of the single-row chuck faces the support plate and is fixed to the fixing plate.

[0015] Preferably, the fixing plate is a frame structure, and the clamps are double-row clamps, and the double-row clamps are correspondingly arranged on two parallel sides of the frame structure.

[0016] Preferably, the rear ends of the row of chucks in the double-row chucks close to the support plate face toward the support plate.

[0017] The utility model provides a vibrating clamp for a vertical continuous copper plating line, which fixes a vibrating device and a clamping part on a supporting plate, so that the clamp has a vibrating function during the copper plating process, thereby solving the problem that bubbles are easily hidden in the through holes of the circuit board when the circuit board is immersed in the copper plating solution and when the copper plating solution is stirred during the copper plating process, thereby making it difficult for the bubbles in the through holes of the circuit board to be discharged, thereby improving the copper plating effect of the through holes of the circuit board, and having a better copper plating effect on through-hole circuit boards with a relatively large thickness-diameter ratio. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] In order to more clearly illustrate the embodiments of the utility model or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the embodiments of the utility model. For ordinary technicians in this field, other drawings can be obtained based on the structures shown in these drawings without paying creative work.

[0019] Figure 1 This is a structural diagram of a vibration fixture for vertical continuous copper deposition wire of the utility model;

[0020] Figure 2 It is a partial structural diagram of the load-carrying and transporting part of the vibration fixture for vertical continuous copper deposition wire of the utility model;

[0021] Figure 3 This is a structural diagram of the electrical connection between the vibration fixture and the track for the vertical continuous copper deposition line of the utility model.

[0022] Description of Figure Numbers:

[0023] Label name Label name 10 Fixture 220 Fixed seat 100 Cargo Transportation Department 230 wire 110 Transport Agency 300 Clamping part 1110 Fangtong 310 Fixed plate 1120 Right angle board 320 Chuck 1130 Conductive brush 3210 Fixed row chuck 1131 Positive conductive brush 3220 Active row chuck 1132 Negative conductive brush 400 track 120 Support plate 410 Conductive copper sheet group 200 Vibration device 4110 Positive conductive copper sheet 210 Vibrator 4120 Negative conductive copper sheet

[0024] The realization of the purpose, functional features and advantages of the utility model will be further explained in conjunction with embodiments and with reference to the accompanying drawings. DETAILED DESCRIPTION

[0025] The following will be combined with the drawings in the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments of the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.

[0026] It should be noted that if the embodiments of the present invention involve directional indications (such as up, down, left, right, front, back...), the directional indications are only used to explain the relative position relationship, movement status, etc. between the components in a certain specific posture. If the specific posture changes, the directional indications will also change accordingly.

[0027] In order to better understand the above technical solution, the above technical solution is described in detail below with reference to the accompanying drawings.

[0028] See also Figure 1 and Figure 2 , Figure 1 This is a structural diagram of a vibration fixture for vertical continuous copper deposition wire of the utility model. Figure 2 This is a partial structural diagram of the load-bearing and transportation part of the vibration clamp for vertical continuous copper deposition wire of the utility model.

[0029] The vibration clamp 10 for the vertical continuous copper plating line of this embodiment includes a load-bearing and transporting part 100, a vibration device 200 and a clamping part 300; the load-bearing and transporting part 100 provides a load-bearing function for the clamp 10, and enables the clamp 10 to effectively transport structural components on the copper plating line track 1140; the clamping part 300 provides the clamp 10 with the function of clamping the circuit board.

[0030] The carrying and transporting part 100 includes a transporting mechanism 110 and a supporting plate 120 . The transporting mechanism 110 includes a conductive brush 1130 , a square tube 1110 and a right-angle plate 1120 . The conductive brush 1130 includes a positive conductive brush 1131 and a negative conductive brush 1132 . The vibration device 200 and the transporting mechanism 110 are respectively fixed on two sides of the supporting plate 120 .

[0031] In this embodiment, the vibration device 200 is located on the front side of the support plate 120, the transportation mechanism 110 is arranged on the back side of the support plate 120, the transportation mechanism 110 and the support plate 120 are fixed at right angles, the square tube 1110 cooperates to fix the transportation mechanism 110 and the support plate 120, and the support plate 120 is vertically fixed to the bottom surface of the square tube 1110.

[0032] The positive pole of the vibrator 210 is connected to the positive conductive brush 1131, and the negative pole of the vibrator 210 is connected to the negative conductive brush 1132; in this embodiment, the wire 230 of the vibrator 210 passes through the support plate 120 and passes through the square tube 1110 from the back of the support plate 120. The wire 230 is divided into two strands, namely the positive wire and the negative wire. The positive wire is connected to the positive conductive brush 1131, and the negative wire is connected to the negative conductive brush 1132.

[0033] The vibration device 200 includes a vibrator 210 and a fixing base 220. The vibrator 210 is fixed to the support plate 120 through the fixing base 220. The vibrator 210 can generate vibration when the clamp 10 is running. By fixing the vibrator 210 on the support plate 120, the vibration generated by the vibrator 210 can be transmitted to the clamping part 300. The clamping part 300 is arranged below the support plate 120 relative to the transportation mechanism 110, so that when the vibrator 210 vibrates on the support plate 120, it drives the clamping part 300 to vibrate, and then drives the circuit board to be copper-plated. When the clamping part 300 clamps the circuit board and sinks it into the copper-plating solution, the bubbles in the through hole of the circuit board are vibrated and discharged.

[0034] Please continue reading Figure 1 .

[0035] The clamping portion 300 includes a fixing plate 310 and a clamp 320 . The fixing plate 310 is fixed to the bottom position of the vertical supporting surface of the supporting plate 120 . A single row of clamps are evenly distributed and fixedly installed on the fixing plate 310 . The tail ends of the single row of clamps face the supporting plate 120 and are fixed to the fixing plate 310 .

[0036] In this embodiment, the single-row chuck is suitable for copper plating processing of rigid circuit boards. The chuck 320 holds the circuit board and sinks it into the copper plating solution. The vibrator 210 drives the clamping part 300 to vibrate to discharge the bubbles in the through holes in the circuit board.

[0037] In one embodiment, the fixed plate 310 is a frame structure, and when the clamped circuit board is a flexible board, the clamp 320 is a double-row clamp 320A, and the double-row clamps are correspondingly arranged on two parallel sides of the frame structure; the double-row clamps have a row of clamps close to the support plate 120 with their tail ends facing the support plate 120.

[0038] During the copper plating process, the copper plating solution will circulate and roll in the solution cylinder. For the processing of flexible boards or rigid-flexible boards, since the boards are flexible, if a single-row chuck is used to clamp only one side, the lower end of the board will float with the rolling solution, causing the board to be scrapped or the cylinder to be damaged. Therefore, double-row chucks are required to clamp the upper and lower ends to ensure the stability of the flexible board or rigid-flexible board in the copper plating cylinder.

[0039] In the present embodiment, the two parallel sides of the frame structure without the double-row chucks installed are retractable structures, which can be set as a main frame structure and a sub-frame structure both of which are U-shaped structures, wherein the opening directions of the two U-shapes are opposite, and a sliding clamping and fixing mechanism is set on the double arms of the U-shape, so that the U-shaped sub-frame structure is retractable and positionable on the U-shaped main frame structure; as another optional method, it can be set as a main frame structure and a sub-fixed plate of a U-shaped structure, and the double-row chucks 320A include a fixed row of chucks 3210 close to one end of the support plate 120 and a movable row of chucks 3220 at the other end, and the movable row of chucks 3220 are sleeve-type, slidable and positionable and fixed on the U-shaped double arms of the main frame structure.

[0040] The double-row chucks with a retractable structure can be adjusted according to the layout size of the circuit board to form a double-row chuck distance that can clamp circuit boards of different widths, meet the clamping requirements of circuit boards of different sizes, improve the clamping stability, and cooperate with the vibrator 210 to vibrate and improve the uniformity of copper deposition.

[0041] See also Figure 3 , Figure 3 This is a structural diagram of the electrical connection between the vibration fixture and the track for the vertical continuous copper deposition line of the utility model.

[0042] When the fixture 10 of this embodiment is used, the conductive brush 1130 is transported in contact on the electroplating line track 400 with conductive function. A conductive copper sheet group 410 is provided on the surface of the track 400. The conductive copper sheet group 410 and the positive conductive copper sheet 4110 and the negative conductive copper sheet 4120 corresponding to the positive conductive brush 1131 and the negative conductive brush 1132 are respectively connected to the positive electrode and the negative electrode of the power supply that provide current, so that the power supply provides current to the conductive copper sheet group 410, the conductive copper sheet group 410 provides current to the conductive brush 1130, and the conductive brush 1130 provides current to the vibrator 210 through the wire 230, and the vibrator 210 realizes vibration.

[0043] The above description is only a preferred embodiment of the utility model, and does not limit the patent scope of the embodiment of the utility model. All equivalent structural changes made by using the description and drawings of the embodiment of the utility model under the utility model concept, or directly / indirectly used in other related technical fields are included in the patent protection scope of the embodiment of the utility model.

Claims

1. A vibration fixture for vertical continuous copper deposition line, characterized in that: The vibration fixture comprises a load-bearing and transporting portion, a vibration device and a clamping portion; The load-bearing transport part includes a transport mechanism and a support plate. The transport mechanism is fixed at right angles to the support plate. The transport mechanism is provided with a conductive brush, and the conductive brush includes a positive conductive brush and a negative conductive brush. The positive electrode of the vibration device is electrically connected to the positive conductive brush, and the negative electrode of the vibration device is electrically connected to the negative conductive brush. The vibration device is fixed on the support plate.

2. A vibration fixture for vertical continuous copper deposition line as claimed in claim 1, characterized in that: The vibration device comprises a vibrator and a fixing seat, and the vibrator is fixed on the supporting plate through the fixing seat.

3. A vibration fixture for vertical continuous copper deposition line as claimed in claim 1, characterized in that: The vibration device and the transportation mechanism are respectively fixed on two surfaces of the support plate.

4. A vibration fixture for vertical continuous copper deposition line as claimed in claim 2, characterized in that: The vibrator is electrically connected to the conductive brush via a wire, and the wire passes through the support plate and is electrically connected to the conductive brush.

5. A vibration fixture for vertical continuous copper deposition line as claimed in claim 1, characterized in that: The conductive brush is insulated and fixed on the transport mechanism, and the positive conductive brush and the negative conductive brush are fixed parallel to each other and without contact.

6. A vibration fixture for vertical continuous copper deposition line as claimed in claim 1, characterized in that: The clamping portion is arranged below the supporting plate relative to the transport mechanism.

7. A vibration fixture for vertical continuous copper deposition line as claimed in claim 6, characterized in that: The clamping part includes a fixing plate and a clamping head.

8. A vibration fixture for vertical continuous copper deposition line as claimed in claim 7, characterized in that: The chuck is a single-row chuck; the tail end of the single-row chuck faces the support plate and is fixed on the fixing plate.

9. A vibration fixture for vertical continuous copper deposition line as claimed in claim 7, characterized in that: The fixing plate is a frame structure, and the clamps are double-row clamps, which are correspondingly arranged on two parallel sides of the frame structure.

10. A vibration fixture for vertical continuous copper deposition line as claimed in claim 9, characterized in that: The rear ends of a row of the double-row chucks close to the support plate face toward the support plate.

Images