Semiconductor device for multi-block photosensitive signal processing

Abstract

The utility model relates to the technical field of application of intelligent detection systems, and discloses a semiconductor device for multi-block photosensitive signal processing, which comprises a mounting plate, a positioning mechanism is arranged at the top of the mounting plate, and a detection mechanism is arranged at the bottom of the positioning mechanism. According to the semiconductor device for multi-block photosensitive signal processing, the copper foil circuit board can be positioned through the arranged positioning mechanism, the phenomenon that the copper foil circuit board shakes in the shell is avoided, the copper foil circuit board is protected, the detection mechanism is arranged, a traditional sensor structure is optimized and integrated, and the detection accuracy is improved. The number of sensing elements needed by a finished circuit is reduced, the sensing precision and density are improved, entity contact is not needed any more, optical signals are transmitted to a PD signal receiving tube and then converted into analog level signals through an IC processor, and a better detection system is achieved.

Description

Technical Field

[0001] The utility model relates to the technical field of application of intelligent detection systems, in particular to a semiconductor device for multi-block photosensitive signal processing. Background Art

[0002] Semiconductor devices are electronic devices with conductivity between good conductors and insulators. They use the special electrical properties of semiconductor materials to complete specific functions. They can be used to generate, control, receive, transform, amplify signals and perform energy conversion. The semiconductor materials of semiconductor devices are silicon, germanium or gallium arsenide, and they can be used as rectifiers, oscillators, light emitters, amplifiers, photometers and other equipment. In order to distinguish them from integrated circuits, they are sometimes called discrete devices. The basic structure of most two-terminal devices (i.e. crystal diodes) is a PN junction.

[0003] Currently existing semiconductor devices have the following two main defects:

[0004] 1. Currently, when placing a semiconductor device inside a housing, since the housing does not have a positioning structure, the semiconductor device is prone to shaking inside the housing, thereby causing damage to the semiconductor device, which is not conducive to protecting the semiconductor device.

[0005] 2. Currently, the photoelectric sensor chip in the semiconductor device only integrates a single block of photoelectric sensors, which results in the device not having multiple channels to output different photoelectric signals, and cannot obtain the brightness change of ambient light and the degree of shading at different positions, which is defective. Utility Model Content

[0006] The purpose of the utility model is to provide a semiconductor device for processing multi-block light-sensing signals to solve the problems raised in the above-mentioned background technology.

[0007] To achieve the above-mentioned purpose, the utility model provides the following technical solution: a semiconductor device for multi-block photosensitive signal processing, comprising a mounting plate, a positioning mechanism is arranged on the top of the mounting plate, and a detection mechanism is arranged on the bottom of the positioning mechanism.

[0008] The positioning mechanism includes a shell, which is fixedly connected to the top of the mounting plate, a positioning column is provided on the top of the shell, a positioning plate is fixedly connected to the top of the positioning column, connecting plates are fixedly connected on both sides of the positioning plate, a support rod is slidably connected in the connecting plate, a support column is fixedly connected to the bottom of the support rod, the support column is fixedly connected to the top of the mounting plate, and springs are sleeved on both sides of the surface of the support rod.

[0009] Preferably, a support frame is fixedly connected to the top of the support rod, and the support frame is fixedly connected to the top of the mounting plate. The support frame is provided to support and fix the support rod.

[0010] Preferably, the number of the positioning posts is four, and the springs are arranged at the top and the bottom of the connecting plate. The copper foil circuit board can be positioned by the arranged positioning posts.

[0011] Preferably, the detection mechanism includes a copper foil circuit board, which is arranged in the shell, and the copper foil circuit board (surface is electrically connected with a photosensitive integrated chip, and the chip has a plurality of blocks of photosensitive receiving areas built in, which respectively generate different signals corresponding to different areas for comparison.

[0012] Preferably, a plurality of photosensitive areas are arranged on the surface of the copper foil circuit board, and an ultra-thin epoxy resin colloid is coated on the surface of the copper foil circuit board. The epoxy resin colloid is small and thin, so the conversion efficiency of transmitting and receiving photoelectric signals can be maximized.

[0013] Preferably, both sides of the copper foil circuit board are electrically connected with copper foil circuit board pins, and the surface of the copper foil circuit board pins is coated with impedance green oil to promote impedance matching. In high-frequency circuits, the green oil will have a loss effect on the signal on the microstrip line, but not covering the green oil will cause the copper foil to oxidize and the impedance to change, resulting in impedance mismatch, so the green oil will touch the pins to promote impedance matching.

[0014] Compared with the prior art, the present invention provides a semiconductor device for multi-block photosensitive signal processing, which has the following beneficial effects:

[0015] 1. The multi-block photosensitive signal processing semiconductor device can position the copper foil circuit board through the provided positioning mechanism, thereby preventing the copper foil circuit board from shaking inside the housing and protecting the copper foil circuit board.

[0016] 2. The multi-block photosensitive signal processing semiconductor device, through the setting of the detection mechanism, optimizes and integrates the traditional sensor structure, reduces the number of sensing elements required in the finished circuit, improves the sensing accuracy and density, and no longer requires physical contact. The light signal is transmitted to the PD signal receiving tube and then converted into an analog level signal IC processor, achieving a better detection system. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] In order to more clearly illustrate the technical solutions in the embodiments of the present invention, the following briefly introduces the drawings required for use in the description of the embodiments. Obviously, the drawings described below are only some embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on these drawings without creative labor:

[0018] Figure 1 It is a schematic diagram of the overall structure of the utility model;

[0019] Figure 2 This is a schematic diagram of the positioning mechanism of the utility model;

[0020] Figure 3 This is a front view schematic diagram of the detection mechanism of the utility model;

[0021] Figure 4 This is a schematic diagram of the front structure of the detection mechanism of the utility model;

[0022] Figure 5 This is a schematic diagram of the back side of the detection mechanism of the utility model;

[0023] Figure 6 It is a side view schematic diagram of the detection mechanism of the utility model;

[0024] Figure 7 It is a side structural diagram of the detection mechanism of the utility model.

[0025] In the figure: 1. Mounting plate; 2. Positioning mechanism; 21. Support frame; 22. Connecting plate; 23. Spring; 24. Shell; 25. Positioning plate; 26. Support rod; 27. Support column; 28. Positioning column; 3. Detection mechanism; 31. Copper foil circuit board; 32. Photosensitive integrated chip; 33. Multi-block photosensitive area; 34. Ultra-thin epoxy resin colloid; 35. Copper foil circuit board pin; 36. Impedance green oil. DETAILED DESCRIPTION

[0026] The following will be combined with the drawings in the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.

[0027] The utility model provides a technical solution:

[0028] Embodiment 1:

[0029] Combination Figure 1 to Figure 2 A semiconductor device for multi-block photosensitive signal processing includes a mounting plate 1, a positioning mechanism 2 is arranged on the top of the mounting plate 1, and a detection mechanism 3 is arranged on the bottom of the positioning mechanism 2.

[0030] The positioning mechanism 2 includes a shell 24, which is fixedly connected to the top of the mounting plate 1. A positioning column 28 is provided on the top of the shell 24. A positioning plate 25 is fixedly connected to the top of the positioning column 28. Connecting plates 22 are fixedly connected on both sides of the positioning plate 25. A support rod 26 is slidably connected inside the connecting plate 22. A support column 27 is fixedly connected to the bottom of the support rod 26. The support column 27 is fixedly connected to the top of the mounting plate 1. Springs 23 are sleeved on both sides of the surface of the support rod 26.

[0031] Furthermore, a support frame 21 is fixedly connected to the top of the support rod 26 , and the support frame 21 is fixedly connected to the top of the mounting plate 1 . The support frame 21 is provided to support and fix the support rod 26 .

[0032] Furthermore, the number of the positioning posts is four, and the springs 23 are all arranged at the top and the bottom of the connecting plate 22. The copper foil circuit board 31 can be positioned by the positioning posts 28.

[0033] Embodiment 2:

[0034] See also Figure 3-7 On the basis of the first embodiment, the detection mechanism 3 further comprises a copper foil circuit board 31, the copper foil circuit board 31 is arranged in the shell 24, and the surface of the copper foil circuit board 31 is electrically connected to a photosensitive integrated chip 32, and the chip has a built-in integrated photosensitive receiving area of ​​multiple blocks, which generates different signals corresponding to different areas for comparison.

[0035] Furthermore, a plurality of photosensitive areas 33 are arranged on the surface of the copper foil circuit board 31. The surface of the copper foil circuit board 31 is coated with an ultra-thin epoxy resin colloid 34. The epoxy resin colloid is small and thin, so the conversion efficiency of transmitting and receiving photoelectric signals can be maximized.

[0036] Furthermore, both sides of the copper foil circuit board 31 are electrically connected to copper foil circuit board pins 35, and the surface of the copper foil circuit board pins 35 is coated with impedance green oil 36 to achieve impedance matching. In high-frequency circuits, green oil will have a loss effect on the signal on the microstrip line, but not covering the green oil will cause the copper sheet to oxidize and the impedance to change, resulting in impedance mismatch, so the green oil will cause impedance matching.

[0037] The epoxy resin colloid is small and thin, so it can maximize the transmission and conversion efficiency of receiving photoelectric signals. The width of the epoxy colloid is 3.0mm~7.0mm, the thickness is 0.65mm, and the length can be cut according to the actual product size, such as the finished product size of 3.0*3.5*1.1mm, or 3.7*4.8*1.1mm, or 5.0*5.0*1.8mm.

[0038] In actual operation, when the copper foil circuit board 31 needs to be placed, the positioning plate 25 can be pulled upwards, and the connecting plate 22 slides upwards on the surface of the supporting rod 26. Then, the copper foil circuit board 31 is placed inside the housing 24. Under the elastic force of the spring 23, the positioning plate 25 can be driven to move downwards. At this time, the positioning column 28 can contact the copper foil circuit board 31, and the copper foil circuit board 31 can be positioned to avoid the copper foil circuit board 31 from shaking inside the housing 24, thereby protecting the copper foil circuit board 31.

[0039] This device can be applied to semiconductor devices (including LEDs and photoelectric receiving semiconductors). Users use solder paste to solder the lead pins to achieve electrical connection between the external PCB circuit board and the device. Photons are received under constant voltage drive to generate level signals. Since the chip has built-in integrated photosensitive receiving areas of multiple blocks, different signals corresponding to different areas are generated for comparison, so more accurate application data can be obtained.

[0040] It should be noted that, in this article, relational terms such as first and second, etc. are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Moreover, the terms "include", "comprise" or any other variants thereof are intended to cover non-exclusive inclusion, so that a process, method, article or device including a series of elements includes not only those elements, but also other elements not explicitly listed, or also includes elements inherent to such process, method, article or device. In the absence of further restrictions, the elements defined by the statement "comprise a ..." do not exclude the presence of other identical elements in the process, method, article or device including the elements.

Claims

1. A semiconductor device for multi-block photosensitive signal processing, comprising a mounting board (1), characterized in that: A positioning mechanism (2) is arranged on the top of the mounting plate (1), and a detection mechanism (3) is arranged on the bottom of the positioning mechanism (2); The positioning mechanism (2) comprises a shell (24), the shell (24) is fixedly connected to the top of the mounting plate (1), a positioning column (28) is arranged on the top of the shell (24), a positioning plate (25) is fixedly connected to the top of the positioning column (28), both sides of the positioning plate (25) are fixedly connected to connecting plates (22), a support rod (26) is slidably connected inside the connecting plate (22), a support column (27) is fixedly connected to the bottom of the support rod (26), the support column (27) is fixedly connected to the top of the mounting plate (1), and springs (23) are sleeved on both sides of the surface of the support rod (26).

2. The semiconductor device for multi-block photosensitive signal processing according to claim 1, characterized in that: The top of the support rod (26) is fixedly connected to a support frame (21), and the support frame (21) is fixedly connected to the top of the mounting plate (1).

3. The semiconductor device for multi-block photosensitive signal processing according to claim 1, characterized in that: The number of the positioning columns (28) is four, and the springs (23) are both arranged at the top and the bottom of the connecting plate (22).

4. The semiconductor device for multi-block photosensitive signal processing according to claim 1, characterized in that: The detection mechanism (3) comprises a copper foil circuit board (31), the copper foil circuit board (31) is arranged in a housing (24), and a photosensitive integrated chip (32) is electrically connected to the surface of the copper foil circuit board (31).

5. The semiconductor device for multi-block photosensitive signal processing according to claim 4, characterized in that: The surface of the copper foil circuit board (31) is provided with a plurality of photosensitive areas (33), and the surface of the copper foil circuit board (31) is coated with an ultra-thin epoxy resin colloid (34).

6. The semiconductor device for multi-block photosensitive signal processing according to claim 5, characterized in that: Both sides of the copper foil circuit board (31) are electrically connected to copper foil circuit board pins (35), and the surfaces of the copper foil circuit board pins (35) are coated with impedance green oil (36).

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