Preparation device of nano tin-silver-copper soldering paste
By designing the preparation device of nano-tin silver copper solder paste, using components such as rotary rods, hydraulic rods and sub-screen mesh, the problem of nano-tin silver copper solder paste being prone to impurities and clumps during the preparation of the mixture is solved, achieving uniform and delicate paste and improving welding performance.
Patent Information
- Application Number
- CN202421623763.7
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-07-10
- Publication Date
- 2025-05-02
- Estimated Expiration
- 2034-07-10
AI Technical Summary
The existing nanotin silver copper solder paste is prone to impurities and particle clumps when preparing the mixture, which affects the uniformity and use of the paste.
A preparation device for nanotin silver copper solder paste is designed, including a preparation tank and adjustment component, which drives the bottom bracket to flip through a rotary rod, controls the lifting and lowering of the auxiliary plate, filters the paste through a screen mesh, and provides adjustment space to ensure that the paste is uniform and delicate.
Through the design of this device, it is possible to effectively filter out the miscellaneous material in the paste, promote filtration and pressurization treatment, and obtain a more uniform and delicate nanotin silver copper solder paste, which improves the quality and use effect of the paste.
Smart Images
Figure CN222818199U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to the technical field of solder paste preparation, in particular to a device for preparing nano tin-silver-copper solder paste. Background Art
[0002] Nano-tin-silver-copper solder paste is a material used for electronic soldering, which is composed of nano-scale tin, silver and copper particles. It has good electrical conductivity, thermal conductivity and welding performance, and is often used in the packaging and assembly of electronic components. Nano-tin-silver-copper solder paste needs to be prepared in a preparation device using various materials for subsequent use.
[0003] However, when the existing nano-tin-silver-copper solder paste is mixed and prepared, impurities and particle agglomerates are easily generated, which affects the uniformity and usage of the paste.
[0004] Therefore, in view of this, the existing structure and defects are studied and improved, and a preparation device of nano-tin-silver-copper solder paste is provided. Utility Model Content
[0005] The utility model aims to provide a device for preparing nano-tin-silver-copper solder paste to solve the problems raised in the above-mentioned background technology.
[0006] To achieve the above-mentioned purpose, the utility model provides the following technical solutions: a device for preparing nano tin-silver-copper solder paste, comprising a preparation tank and an adjusting component, the lower end of the preparation tank is connected to a screening tank, and a sub-screen is installed inside the screening tank, the adjusting component used for filtering the paste and removing blocks is arranged on both sides of the bottom support plate, and the adjusting component comprises an adjusting hole, a rotating rod, an adjusting groove, a hydraulic rod 1 and an auxiliary plate, the top end of the adjusting hole is provided with a rotating rod, and the lower end of the adjusting hole is connected with an adjusting groove, the lower end of the adjusting hole is installed with a hydraulic rod 1, and the output end of the hydraulic rod 1 is installed with an auxiliary plate.
[0007] Furthermore, the interiors of the preparation tank and the screening tank are connected, and a bottom support plate is provided at the upper end of the interior of the screening tank.
[0008] Furthermore, the adjustment hole and the adjustment slot are an integrated structure, and the size of the auxiliary plate matches the size of the adjustment hole.
[0009] Furthermore, an external support frame is installed on the outside of the screening tank, and two groups of the external support frames are symmetrically arranged about the vertical center axis of the screening tank.
[0010] Furthermore, a mounting plate is installed on the outside of the preparation tank, and an auxiliary component for assisting movement is provided on the upper end of the mounting plate.
[0011] Furthermore, the auxiliary component includes a hydraulic rod 2 and a connecting plate, and the connecting plate is installed at the output end of the hydraulic rod 2.
[0012] Furthermore, the auxiliary component also includes a top cover and a stirring rod. The top cover is installed on the side of the connecting plate, and the stirring rod is installed in the middle of the top cover through a motor.
[0013] Furthermore, the hydraulic rods and the connecting plates are symmetrically arranged in two groups about the vertical center axis of the top cover, and the top cover and the stirring rods are vertically distributed.
[0014] The utility model provides a preparation device of nano-tin-silver-copper solder paste, which has the following beneficial effects:
[0015] 1. The utility model drives the bottom support plate to turn over by the motor at the end of the rotating rod, so that the paste after preliminary mixing is turned over and faces downward, and the hydraulic rod controls the lifting and lowering movement of the auxiliary plate through telescopic movement, so that the bottom support plate and the paste move downward. When moving downward, the auxiliary plate also blocks the adjustment hole to prevent overflow, and the sub-screen plays a role in filtering the paste moving downward. At this time, the downward movement of the bottom support plate can also play a role in pressurizing and promoting filtration, thereby obtaining a more uniform and delicate nano-tin-silver-copper solder paste, and the adjustment groove provides adjustment space for the auxiliary plate.
[0016] 2. The utility model uses the bottom support plate to temporarily seal the bottom of the preparation tank. The hydraulic rod 2 controls the lifting and lowering of the top cover by telescoping, and can drive the lifting and lowering of the stirring rod, providing space for the bottom support plate to turn over and rotate. The stirring rod is driven by a motor to mix the raw materials for preparing the nano-tin-silver-copper solder paste in the preparation tank. BRIEF DESCRIPTION OF THE DRAWINGS
[0017] Figure 1 This is a schematic diagram of the overall external structure of a device for preparing nano-tin-silver-copper solder paste according to the utility model;
[0018] Figure 2 This is a schematic diagram of the structure of an adjusting component of a device for preparing nano-tin-silver-copper solder paste according to the utility model;
[0019] Figure 3 The utility model is a schematic diagram of the auxiliary component structure of a device for preparing nano-tin-silver-copper solder paste.
[0020] In the figure: 1. preparation tank; 2. screening tank; 3. bottom support plate; 4. adjustment component; 401. adjustment hole; 402. rotating rod; 403. adjustment slot; 404. hydraulic rod one; 405. auxiliary plate; 5. sub-screen; 6. external support frame; 7. mounting plate; 8. auxiliary component; 801. hydraulic rod two; 802. connecting plate; 803. top cover; 804. stirring rod. DETAILED DESCRIPTION
[0021] The following is a further detailed description of the implementation of the present invention in conjunction with the accompanying drawings and examples. The following examples are used to illustrate the present invention, but cannot be used to limit the scope of the present invention.
[0022] like Figure 1 and Figure 2 As shown, a preparation device of nano-tin-silver-copper solder paste includes a preparation tank 1 and an adjustment component 4, the lower end of the preparation tank 1 is connected to a sieve tank 2, and a sub-sieve 5 is installed inside the sieve tank 2, the adjustment component 4 for filtering and removing blocks of the paste is arranged on both sides of a bottom support plate 3, and the adjustment component 4 includes an adjustment hole 401, a rotating rod 402, an adjustment groove 403, a hydraulic rod 404 and an auxiliary plate 405, the top of the adjustment hole 401 is provided with a rotating rod 402, the motor at the end of the rotating rod 402 drives the bottom support plate 3 to turn over, so that the paste after preliminary mixing is turned down, and the lower end of the adjustment hole 401 is connected to the adjustment groove 403, the adjustment groove 403 provides an adjustment space for the auxiliary plate 405, and the lower end of the adjustment hole 401 is installed with a hydraulic rod 404, and the hydraulic rod 404 controls the lifting and lowering of the auxiliary plate 405 by telescoping. The bottom support plate 3 and the paste move downward. When moving downward, an auxiliary plate 405 is installed at the output end of the hydraulic rod 404. The auxiliary plate 405 also blocks and prevents overflow of the adjusting hole 401. The sub-screen 5 filters the downward-moving paste. At this time, the downward movement of the bottom support plate 3 can also promote filtration by pressurization, thereby obtaining a more uniform and delicate nano-tin-silver-copper solder paste. The preparation tank 1 and the screening tank 2 are internally connected, and a bottom support plate 3 is arranged at the upper end of the screening tank 2. The bottom support plate 3 plays a temporary blocking role at the bottom of the preparation tank 1. The adjusting hole 401 and the adjusting groove 403 are an integrated structure, and the size of the auxiliary plate 405 is consistent with the size of the adjusting hole 401. An external support frame 6 is installed on the outside of the screening tank 2, and two groups of external support frames 6 are symmetrically arranged about the vertical center axis of the screening tank 2. A mounting plate 7 is installed on the outside of the preparation tank 1.
[0023] like Figure 3 As shown, an auxiliary component 8 for assisting movement is provided at the upper end of the mounting plate 7, and the auxiliary component 8 includes a hydraulic rod 801 and a connecting plate 802, and the connecting plate 802 is installed at the output end of the hydraulic rod 801, and the hydraulic rod 801 controls the lifting and lowering of the top cover 803 by telescoping, and can drive the lifting and lowering of the stirring rod 804, providing a space for the bottom support plate 3 to turn over and rotate, and the auxiliary component 8 also includes a top cover 803 and a stirring rod 804, the top cover 803 is installed on the side of the connecting plate 802, and the stirring rod 804 is installed in the middle of the top cover 803 through a motor, the hydraulic rod 801 and the connecting plate 802 are symmetrically arranged in two groups about the vertical central axis of the top cover 803, and the top cover 803 and the stirring rod 804 are vertically distributed, and the stirring rod 804 is driven by the motor to mix the raw materials for preparing the nano tin-silver-copper solder paste in the preparation tank 1.
[0024] In summary, the preparation device of the nano-tin-silver-copper solder paste is firstly based on Figure 1-Figure 3 In the structure shown in the figure, the raw materials for preparing the nano-tin-silver-copper solder paste are added into the preparation tank 1, the bottom support plate 3 plays a temporary blocking role at the bottom of the preparation tank 1, the hydraulic rod 801 is contracted to make the top cover 803 descend and be installed on the top of the preparation tank 1, and then the motor at the end of the stirring rod 804 is turned on to mix the raw materials for preparing the nano-tin-silver-copper solder paste in the preparation tank 1. After the mixing is completed, the hydraulic rod 801 is controlled to extend so that the top cover 803 drives the stirring rod 804 to move upward to provide space for the bottom support plate 3 to turn over and rotate. , then turn on the side motor of the rotating rod 402 to turn the bottom support plate 3 over and rotate, so that the initially mixed paste turns over and faces downward, and then control the hydraulic rod 404 to contract and control the auxiliary plate 405 to move downward, so that the bottom support plate 3 and the paste move downward. When moving downward, the sub-screen 5 filters the paste that moves downward. The downward movement of the bottom support plate 3 can also play a role in pressurizing and promoting filtration, so as to obtain a more uniform and delicate nano-tin-silver-copper solder paste. At this time, the auxiliary plate 405 also plays a role in blocking and preventing overflow of the adjustment hole 401.
[0025] The embodiments of the present invention are provided for the purpose of illustration and description, and are not intended to be exhaustive or to limit the present invention to the disclosed forms. Many modifications and variations will be apparent to those of ordinary skill in the art. The embodiments are selected and described to better illustrate the principles and practical applications of the present invention, and to enable those of ordinary skill in the art to understand the present invention and thereby design various embodiments with various modifications suitable for specific uses.
Claims
1. A device for preparing nano-tin-silver-copper solder paste, comprising a preparation tank (1) and an adjustment component (4), characterized in that: The lower end of the preparation tank (1) is connected to a screening tank (2), and a sub-screen (5) is installed inside the screening tank (2). The adjustment component (4) for filtering and removing blocks from the paste is arranged on both sides of the bottom support plate (3), and the adjustment component (4) includes an adjustment hole (401), a rotating rod (402), an adjustment groove (403), a hydraulic rod 1 (404) and an auxiliary plate (405). The top end of the adjustment hole (401) is provided with a rotating rod (402), and the lower end of the adjustment hole (401) is connected to the adjustment groove (403). The lower end of the adjustment hole (401) is installed with a hydraulic rod 1 (404), and the output end of the hydraulic rod 1 (404) is installed with an auxiliary plate (405).
2. A preparation device for a nano-tin-silver-copper solder paste according to claim 1, characterized in that: The interiors of the preparation tank (1) and the screening tank (2) are connected, and a bottom support plate (3) is provided at the upper end of the interior of the screening tank (2).
3. A preparation device for a nano-tin-silver-copper solder paste according to claim 1, characterized in that: The adjustment hole (401) and the adjustment groove (403) are an integrated structure, and the size of the auxiliary plate (405) matches the size of the adjustment hole (401).
4. A preparation device for a nano-tin-silver-copper solder paste according to claim 1, characterized in that: An external support frame (6) is installed outside the screening tank (2), and two groups of the external support frames (6) are symmetrically arranged about the vertical center axis of the screening tank (2).
5. The preparation device of a nano-tin-silver-copper solder paste according to claim 1, characterized in that: A mounting plate (7) is installed on the outside of the preparation tank (1), and an auxiliary component (8) for assisting movement is arranged on the upper end of the mounting plate (7).
6. A preparation device for nano-tin-silver-copper solder paste according to claim 5, characterized in that: The auxiliary component (8) comprises a second hydraulic rod (801) and a connecting plate (802), and the connecting plate (802) is installed at the output end of the second hydraulic rod (801).
7. The preparation device of a nano-tin-silver-copper solder paste according to claim 6, characterized in that: The auxiliary component (8) further comprises a top cover (803) and a stirring rod (804); the top cover (803) is installed on the side of the connecting plate (802), and the stirring rod (804) is installed in the middle of the top cover (803) via a motor.
8. The preparation device of a nano-tin-silver-copper solder paste according to claim 7, characterized in that: The hydraulic rod 2 (801) and the connecting plate (802) are symmetrically arranged in two groups about the vertical center axis of the top cover (803), and the top cover (803) and the stirring rod (804) are vertically distributed.