Equipment for grinding and polishing wafer

Abstract

The utility model belongs to the technical field of polishing equipment, and particularly relates to wafer grinding and polishing equipment which comprises an equipment body, a first funnel is arranged below a grinding disc, a second funnel is arranged below a water outlet of the first funnel, and a drainage box is arranged at the bottom of the second funnel in a penetrating mode. A drainage pipe is arranged on one side of the drainage box in a penetrating mode, and a circulating pump is arranged at the top of the water storage tank. By installing the first funnel and the second funnel, cleaning liquid flows into the equipment main body through the surface of the grinding disc, then flows into the first funnel and flows into the drainage box through the collecting disc, and the cleaning liquid flows into the equipment main body through the suction force of the absorption end of the circulating pump; the cleaning liquid in the water storage tank can be absorbed into the water storage tank through the drainage pipe, so that the cyclic utilization effect of the cleaning liquid is achieved, and the technical problem that the cleaning liquid is discharged to the outside through the water outlet pipeline to cause waste due to the fact that the cleaning liquid cannot be recycled generally after being used is effectively solved.

Description

Technical Field

[0001] The utility model relates to the technical field of polishing equipment, in particular to a device used for wafer grinding and polishing. Background Art

[0002] Wafer grinding and polishing equipment is one of the key equipment used in semiconductor wafer processing. Its main function is to control and adjust the thickness of the wafer, and to grind and polish the surface to obtain a smooth surface and precise thickness. Wafer grinding and polishing equipment is widely used, mainly in the fields of wafer preparation, material research and optoelectronic device manufacturing in the semiconductor industry. By precisely controlling the grinding and polishing process, high-quality wafer surfaces can be obtained, improving device performance and reliability.

[0003] Patent document CN219444719U discloses a wafer grinding and polishing equipment, "including: a grinding chamber, a grinding disc, a grinding liquid adding mechanism and a grinding liquid cleaning mechanism; the grinding disc is arranged in the grinding chamber for grinding wafers; the grinding liquid adding mechanism is used to add grinding liquid to the grinding disc; the grinding liquid cleaning mechanism is arranged on the inner wall of the grinding chamber for cleaning the grinding liquid splashed onto the inner wall of the grinding chamber. The wafer grinding and polishing equipment disclosed in the present invention is provided with a grinding liquid cleaning mechanism near the inner wall of the grinding chamber to flush and clean the grinding liquid that is splashed onto the walls around the grinding chamber by the grinding disc to prevent the grinding liquid from crystallizing, thereby avoiding the mechanical vibration generated during the operation of the grinding disc, causing the grinding liquid crystals to be shaken off, and preventing the mechanical scratches on the wafer being or about to be ground caused by the grinding liquid crystals falling on the grinding disc."

[0004] However, the wafer grinding and polishing equipment disclosed in the above-mentioned public document does not take into account that a large amount of cleaning liquid needs to be sprayed during the use of the polishing equipment. The cleaning liquid usually cannot be recycled after use and will be discharged to the outside through the outlet pipe, causing waste. Therefore, it is necessary to develop a device for wafer grinding and polishing, which can effectively solve the problems raised above. Utility Model Content

[0005] The utility model aims to provide a device for wafer grinding and polishing to solve the technical problem in the above-mentioned background technology that the cleaning liquid after use usually cannot be recycled and will be discharged to the outside through the water outlet pipe, causing waste.

[0006] To achieve the above-mentioned purpose, the utility model provides the following technical solutions: a device for wafer grinding and polishing, comprising a device body, a grinding disc is provided through the device body, a first funnel is provided below the grinding disc, a second funnel is provided below the water outlet of the first funnel, a drainage box is provided through the bottom of the second funnel, and a drainage pipe is provided through one side of the drainage box;

[0007] A water tank is arranged in the main body of the equipment, and one side of the water tank is connected with the drainage pipe. A circulation pump is arranged on the top of the water tank, and a suction pipe is arranged at the absorption end of the circulation pump, and the suction pipe extends to the inside of the water tank. A shower pipe is arranged on the main body of the equipment, and the bottom of the shower pipe is connected with the output end of the circulation pump.

[0008] Preferably, a support frame is fixedly provided on the equipment body, a telescopic rod is fixedly provided on the support frame, a polishing plate is provided at the telescopic end of the telescopic rod, and the polishing plate is correspondingly located above the grinding disc.

[0009] Preferably, an outer baffle is fixedly provided on the equipment body, and an inner baffle is fixedly provided on the bottom of the grinding disc.

[0010] Preferably, an opening and closing door is provided on the front of the device body, and four groups of supporting legs are fixedly provided on the bottom of the device body.

[0011] Preferably, a fixing seat is fixedly arranged in the main body of the equipment, a servo motor is fixedly arranged on the top of the fixing seat, and the output end of the servo motor is connected to the grinding disc.

[0012] Preferably, a collecting tray is mounted on the second funnel, and the collecting tray is correspondingly located below the water outlet of the first funnel.

[0013] Preferably, two sets of slide rails are fixedly provided on an inner wall of one side of the main body of the device, clamping plates are fixedly provided on both sides of the collection tray, and the clamping plates can be engaged with the slide rails, and a filter screen is provided in the collection tray.

[0014] Preferably, a water inlet is provided through one side of the water tank, a drain is provided through one side of the water tank, and the drain is located below the water inlet.

[0015] Compared with the prior art, the beneficial effects of the utility model are:

[0016] 1. The utility model is equipped with a drainage box, a drainage pipe, a water storage tank, a circulation pump, a water suction pipe, a first funnel and a second funnel. When the equipment for wafer grinding and polishing is used, the circulation pump runs when the cleaning liquid is sprayed, and the cleaning liquid is absorbed by the absorption end and transmitted to the shower nozzle for spraying. The cleaning liquid will flow into the interior of the equipment body through the surface of the grinding disk, and then the cleaning liquid will flow into the first funnel, and then the cleaning liquid will flow into the drainage box through the collecting disk. Through the suction force of the absorption end of the circulation pump, the cleaning liquid in the drainage box can be absorbed into the water storage tank through the drainage pipe, and then absorbed by the water suction pipe and transmitted to the shower nozzle for spraying, thereby forming a recycling effect of the cleaning liquid, and effectively solving the technical problem that the cleaning liquid cannot be recycled after use and will be discharged to the outside through the outlet pipe, causing waste.

[0017] 2. The utility model is equipped with a collecting tray, a filter, a second funnel, a slide rail and a card plate. When the cleaning liquid enters the collecting tray, the filter can filter the fine crystals produced after polishing in the water. The fine crystals are blocked in the collecting tray to form storage. By arranging the slide rail and the card plate, the collecting tray can be clamped and fixed. The staff can open the opening and closing door, take out the collecting tray and replace the filter, which effectively avoids the problem of fine crystals being sprayed out through the spray pipe and scratching the wafer. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] Figure 1 It is a schematic diagram of the overall structure of the utility model;

[0019] Figure 2 It is a schematic diagram of the planar structure of the main body of the equipment of the utility model;

[0020] Figure 3 For the utility model Figure 2 A schematic diagram of the enlarged structure in the middle;

[0021] Figure 4 For the utility model Figure 2 A magnified schematic diagram of structure B in the middle.

[0022] In the figure: 1. Equipment body; 11. Support frame; 111. Telescopic rod; 112. Polishing plate; 113. Outer baffle; 114. Opening and closing door; 115. Support leg; 12. Grinding disc; 121. Inner baffle; 122. Servo motor; 123. Fixed seat; 13. Spray pipe; 2. First funnel; 21. Collecting tray; 211. Filter net; 212. Second funnel; 22. Slide rail; 221. Card; 3. Drainage box; 31. Drainage pipe; 32. Water storage tank; 321. Circulation pump; 322. Suction pipe; 323. Water inlet; 324. Drainage outlet. DETAILED DESCRIPTION

[0023] The following will be combined with the drawings in the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.

[0024] See also Figure 1 , Figure 2 , Figure 3 and Figure 4 , a device for wafer grinding and polishing, comprising a device body 1, a grinding disc 12 is provided through the device body 1, a first funnel 2 is provided below the grinding disc 12, a second funnel 212 is provided below the water outlet of the first funnel 2, a drainage box 3 is provided through the bottom of the second funnel 212, and a drainage pipe 31 is provided through one side of the drainage box 3;

[0025] The top of the first funnel 2 is fixedly connected to the top of the inner wall of the equipment body 1. The first funnel 2 is tilted and located directly below the grinding disc 12. A water tank 32 is arranged in the equipment body 1, and one side of the water tank 32 is connected to the drainage pipe 31. A circulating pump 321 is arranged on the top of the water tank 32. A suction pipe 322 is arranged at the absorption end of the circulating pump 321, and the suction pipe 322 extends to the inside of the water tank 32. A shower pipe 13 is arranged on the equipment body 1, and the bottom of the shower pipe 13 is connected to the output end of the circulating pump 321.

[0026] When the equipment for wafer grinding and polishing is used, the circulation pump 321 runs when spraying the cleaning liquid, and absorbs the cleaning liquid through the absorption end and transmits it into the shower nozzle 13 for spraying. The first funnel 2 is located below the outer baffle 113, and a gap is left between the grinding disc 12 and the equipment body 1. The cleaning liquid will flow into the interior of the equipment body 1 through the surface of the grinding disc 12 through the remaining gap, and then the cleaning liquid will flow into the first funnel 2, and then the cleaning liquid will flow into the drainage box 3 through the collecting plate 21. Through the suction force of the absorption end of the circulation pump 321, the cleaning liquid in the drainage box 3 can be absorbed into the water storage tank 32 through the drainage pipe 31, and then absorbed by the water suction pipe 322. Transmitted into the shower nozzle 13 for spraying, thereby forming a recycling effect of the cleaning liquid, which effectively solves the technical problem that the cleaning liquid cannot be recycled after use and will be discharged to the outside through the outlet pipe, causing waste.

[0027] See also Figure 1 and Figure 2A support frame 11 is fixedly provided on the equipment body 1, a telescopic rod 111 is fixedly provided on the support frame 11, a polishing plate 112 is provided at the telescopic end of the telescopic rod 111, and the polishing plate 112 is correspondingly located above the grinding disc 12, an outer baffle 113 is fixedly provided on the equipment body 1, an inner baffle 121 is fixedly provided at the bottom of the grinding disc 12, an opening and closing door 114 is provided on the front of the equipment body 1, and four groups of supporting legs 115 are fixedly provided at the bottom of the equipment body 1. The support frame 11 plays a role in providing a stable installation of the telescopic rod 111. The operation of the telescopic rod 111 can push the polishing plate 112 downward for polishing. The outer baffle 113 and the inner baffle 121 can prevent the splashing of the cleaning liquid. The opening and closing door 114 is provided to facilitate personnel to observe the operation status inside the equipment body 1.

[0028] See also Figure 1 and Figure 2 A fixing seat 123 is fixedly arranged in the main body 1 of the equipment, a servo motor 122 is fixedly arranged on the top of the fixing seat 123, and the output end of the servo motor 122 is connected to the grinding disc 12, a water inlet 323 is penetrated on one side of the water tank 32, a drain 324 is penetrated on one side of the water tank 32, and the drain 324 is located below the water inlet 323, the fixing seat 123 plays the role of fixing the servo motor 122, and the operation of the servo motor 122 will drive the grinding disc 12 to rotate to form the effect of polishing the wafer. The water inlet 323 is used to inject cleaning liquid into the water tank 32, and the drain 324 can discharge unusable sewage.

[0029] See also Figure 2 and Figure 3 A collecting tray 21 is mounted on the second funnel 212, and the collecting tray 21 is located below the water outlet of the first funnel 2. Two sets of slide rails 22 are fixedly arranged on the inner wall of one side of the equipment body 1. Card plates 221 are fixedly arranged on both sides of the collecting tray 21, and the card plates 221 can be engaged with the slide rails 22. A filter net 211 is arranged in the collecting tray 21.

[0030] When the cleaning liquid enters the collection tray 21, the filter 211 can filter the fine crystals produced in the water after polishing. The fine crystals are blocked in the collection tray 21 for storage. By setting the slide rail 22 and the clamping plate 221, the collection tray 21 can be clamped and fixed. The staff can open the opening and closing door 114, take out the collection tray 21 and replace the filter 211, which effectively avoids the problem of fine crystals being sprayed out through the spray pipe 13 and scratching the wafer.

[0031] Working principle: when the equipment for wafer grinding and polishing is used, when the cleaning liquid is sprayed, the circulating pump 321 is running, and the cleaning liquid is absorbed by the absorption end and transmitted into the shower nozzle 13 for spraying. The cleaning liquid will flow into the interior of the equipment body 1 through the surface of the grinding disc 12, and then the cleaning liquid will flow into the first funnel 2, and then the cleaning liquid will flow into the drainage box 3 through the collection plate 21. Through the suction force of the absorption end of the circulating pump 321, the cleaning liquid in the drainage box 3 can be absorbed into the water storage tank 32 through the drainage pipe 31, and then the cleaning liquid is absorbed by the water suction pipe 322 and transmitted into the shower nozzle 13 for spraying, thereby forming The recycling effect of the cleaning liquid effectively solves the technical problem that the cleaning liquid cannot be recycled after use and will be discharged to the outside through the water outlet pipe, causing waste. When the cleaning liquid enters the collection tray 21, the filter screen 211 can filter the fine crystals produced after polishing in the water liquid. The fine crystals are blocked in the collection tray 21 to form storage. By setting the slide rail 22 and the clamping plate 221, the collection tray 21 can be clamped and fixed. The staff can open the opening and closing door 114, take out the collection tray 21 and replace the filter screen 211, which effectively avoids the problem of fine crystals being sprayed out through the shower pipe 13 and scratching the wafer.

[0032] It is obvious to those skilled in the art that the present invention is not limited to the details of the exemplary embodiments described above, and that the present invention can be implemented in other specific forms without departing from the spirit or essential features of the present invention. Therefore, the embodiments should be regarded as exemplary and non-restrictive from any point of view, and the scope of the present invention is defined by the appended claims rather than the above description, and it is intended that all changes falling within the meaning and scope of the equivalent elements of the claims be included in the present invention. Any reference numeral in a claim should not be regarded as limiting the claim to which it relates.

Claims

1. A device for wafer grinding and polishing, comprising a device body (1), characterized in that: A grinding disc (12) is provided through the main body (1) of the equipment, a first funnel (2) is provided below the grinding disc (12), a second funnel (212) is provided below the water outlet of the first funnel (2), a drainage box (3) is provided through the bottom of the second funnel (212), and a drainage pipe (31) is provided through one side of the drainage box (3); A water tank (32) is arranged in the equipment body (1), and one side of the water tank (32) is connected to the drainage pipe (31); a circulation pump (321) is arranged on the top of the water tank (32); a water suction pipe (322) is arranged at the absorption end of the circulation pump (321), and the water suction pipe (322) extends to the inside of the water tank (32); a shower pipe (13) is arranged on the equipment body (1), and the bottom of the shower pipe (13) is connected to the output end of the circulation pump (321).

2. The device for wafer grinding and polishing according to claim 1, characterized in that: A support frame (11) is fixedly arranged on the equipment body (1), a telescopic rod (111) is fixedly arranged on the support frame (11), a polishing plate (112) is arranged at the telescopic end of the telescopic rod (111), and the polishing plate (112) is correspondingly located above the grinding disc (12).

3. The device for wafer grinding and polishing according to claim 2, characterized in that: An outer baffle (113) is fixedly arranged on the equipment body (1), and an inner baffle (121) is fixedly arranged on the bottom of the grinding disc (12).

4. The device for wafer grinding and polishing according to claim 2, characterized in that: An opening and closing door (114) is arranged on the front of the device body (1), and four groups of supporting legs (115) are fixedly arranged on the bottom of the device body (1).

5. The device for wafer grinding and polishing according to claim 2, characterized in that: A fixing seat (123) is fixedly arranged in the equipment body (1), a servo motor (122) is fixedly arranged on the top of the fixing seat (123), and an output end of the servo motor (122) is connected to the grinding disc (12).

6. The device for wafer grinding and polishing according to claim 1, characterized in that: The second funnel (212) is provided with a collecting tray (21) which is snap-fitted thereon, and the collecting tray (21) is correspondingly located below the water outlet of the first funnel (2).

7. The device for wafer grinding and polishing according to claim 6, characterized in that: Two groups of slide rails (22) are fixedly arranged on an inner wall of one side of the device body (1), and clamping plates (221) are fixedly arranged on both sides of the collection tray (21), and the clamping plates (221) can be engaged with the slide rails (22), and a filter screen (211) is arranged in the collection tray (21).

8. The device for wafer grinding and polishing according to claim 1, characterized in that: A water inlet (323) is provided through one side of the water storage tank (32), and a water outlet (324) is provided through one side of the water storage tank (32), and the water outlet (324) is located below the water inlet (323).

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