Die-cutting machine for adhesive tape production
By introducing a guide mechanism and a buffer mechanism into the die-cutting machine, the problem of easy dislocation of the tape during the die-cutting process is solved, and the die-cutting accuracy and production stability are improved.
Patent Information
- Application Number
- CN202421827190.X
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-07-31
- Publication Date
- 2025-05-02
- Estimated Expiration
- 2034-07-31
AI Technical Summary
The existing flat flat die cutting machines lack effective guide mechanisms during the tape die cutting process, which leads to easy dislocation of the tape, affecting the die cutting accuracy and production stability.
A die-cutting machine including a die-cutting mechanism, a drive mechanism, a guide mechanism and a buffer mechanism is designed. The guide mechanism guides the tape through the feed plate, the discharge plate and the guide column to avoid deviation; the buffer mechanism reduces vibration of the die-cutting mechanism through the buffer member.
It effectively avoids the offset of the tape during the die-cutting process, improves the die-cutting accuracy, and operates stably through the buffer mechanism, ensuring the overall stability of the die-cutting machine.
Smart Images
Figure CN222819148U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to the technical field of die-cutting machines, in particular to a die-cutting machine used for producing adhesive tapes. Background Art
[0002] Tape die-cutting equipment is a machine used to process tape materials into specific shapes and sizes. Die-cutting is a precision machining process that uses pressure to cut the tape into the desired shape through a pre-designed mold. Existing tape die-cutting equipment generally includes flat die-cutting machines, round film cutting machines, round flat die-cutting machines, and laser die-cutting machines. Existing tape die-cutting equipment generally includes a feeding system, a die-cutting unit, a waste handling system, and a receiving system. Among them, the feeding system places the tape raw materials on the roll rack and feeds the tape materials into the die-cutting unit automatically or manually; the die-cutting unit cuts the tape through a mold customized according to the design requirements, and the mold can be a roller or a flat plate; the die-cutting unit generally presses the mold on the tape through a hydraulic or mechanical pressure drive unit to complete the cutting; the waste handling system rolls up the cut corners and waste in time through the waste reel to ensure the cleanliness of the working area; the receiving system is generally combined with the die-cutting unit to collect and discharge the die-cut products.
[0003] When the existing flat die-cutting machine is working, the tape passes between the upper die and the lower die of the die-cutting machine. Under the drive of the driving mechanism, the upper and lower dies cooperate with each other to complete the die-cutting action of the tape. However, there is a lack of effective guiding mechanism between the upper and lower dies of this type of die-cutting machine to guide the conveying direction of the tape, which causes the tape to be easily misaligned between the die-cutting units during the die-cutting process, affecting the die-cutting accuracy of the tape, which is not conducive to the stable production. Utility Model Content
[0004] Based on this, it is necessary to provide a die-cutting machine for tape production to address the technical problem that the tape is easily offset during the processing of the existing flat-pressed flat tape die-cutting machine.
[0005] A die-cutting machine for producing adhesive tapes, comprising a die-cutting mechanism, a driving mechanism, a guiding mechanism and a buffer mechanism, wherein the driving mechanism drives the die-cutting mechanism to drive the die-cutting mechanism to perform die-cutting processing on the adhesive tape; the guiding mechanism is arranged at the output end of the die-cutting mechanism, and when the output end of the die-cutting mechanism performs die-cutting on the adhesive tape, the guiding mechanism can guide the adhesive tape entering the output end of the die-cutting mechanism and outputted from the output end of the die-cutting mechanism; the buffer mechanism is arranged between the die-cutting mechanism and the driving mechanism, and when the die-cutting mechanism is working, the vibration generated by the die-cutting mechanism can be buffered by the buffer mechanism.
[0006] The die-cutting mechanism includes a support, an upper die assembly and a lower die assembly. The upper die assembly and the lower die assembly are arranged in relative cooperation with each other, and the support is connected to the driving mechanism; the upper die assembly is arranged on the top side of the support and connected to the support; the lower die assembly is arranged between the upper die assembly and the support, and the lower die assembly is connected to the output end of the driving mechanism, so that the driving mechanism can drive the lower die assembly to reciprocate between the support and the upper die assembly.
[0007] The guide mechanism is arranged on both sides of the lower die assembly. The adhesive tape is inputted between the lower die assembly and the upper die assembly by the guide mechanism at one end of the lower die assembly. After die cutting is completed, the adhesive tape is outputted and discharged by the guide mechanism at the other end of the lower die assembly.
[0008] The guiding mechanism includes a feed plate, a discharge plate and a plurality of guide columns. The feed plate and the discharge plate are correspondingly arranged on both sides of the lower die assembly. The tape is fed from one end of the feed plate and input between the lower die assembly and the upper die assembly. After die-cutting, the main body of the tape is output from one end of the discharge plate and discharged. The plurality of guide columns are slidably connected to the feed plate and the discharge plate respectively.
[0009] In one embodiment, the two guide posts are slidably connected to the feed plate.
[0010] In one of the embodiments, the four guide posts are slidably connected to the discharge plate, and the four guide posts are arranged as two groups of parallel guide posts corresponding to the feed plate along the conveying direction of the tape.
[0011] In one of the embodiments, the support is provided with a plurality of lifting guide posts, and the plurality of lifting guide posts are respectively provided between the support and the upper mold assembly, so as to define the relative position between the upper mold assembly and the support.
[0012] In one embodiment, the lower mold assembly and the buffer mechanism are respectively sleeved on the side surfaces of a plurality of lifting guide pillars.
[0013] In one embodiment, the buffer mechanism includes a plurality of buffer members, which are respectively sleeved on the side surfaces of a plurality of lifting guide pillars, and two ends of each buffer member are respectively in contact with the support and the lower mold assembly.
[0014] In one embodiment, the upper mold assembly includes an upper mold base and an upper mold plate. The upper mold base is connected to the top ends of a plurality of lifting guide pins, and the upper mold plate is disposed on the bottom side surface of the upper mold base.
[0015] In one embodiment, the above-mentioned lower mold assembly includes a lower mold base and a lower mold plate. The lower mold base is arranged on the bottom side of the upper mold assembly and connected to the output end of the driving mechanism. The lower mold plate is arranged on the top side surface of the lower mold base, so that the lower mold plate corresponds to the upper mold plate.
[0016] In one embodiment, the feed plate and the discharge plate are respectively disposed on two sides of the lower die base.
[0017] In one of the embodiments, the above-mentioned lower mold base is provided with a material discharge cavity and a material discharge channel. The material discharge cavity is arranged inside the lower mold base, and the material discharge cavity is connected to the bottom side of the lower mold plate; the material discharge channel is arranged in the material discharge cavity, and one end of the material discharge channel is connected to the bottom side of the lower mold plate, and the other end of the material discharge channel extends to the outside of the lower mold base.
[0018] In one embodiment, the driving mechanism includes an eccentric shaft and a connecting rod. The eccentric shaft is rotatably mounted on a support. One end of the connecting rod is cooperatively connected to a side surface of the eccentric shaft, and the other end of the connecting rod is drivingly connected to the lower mold base.
[0019] The utility model of the die-cutting machine for tape production guides the tape entering the output end of the die-cutting mechanism and outputted from the output end of the die-cutting mechanism through a guiding mechanism, so as to avoid the offset between the tape and the die-cutting mechanism and improve the processing accuracy; when the die-cutting mechanism is working, the die-cutting mechanism can reduce the influence of vibration through a buffer mechanism, so as to ensure the overall operation stability of the die-cutting machine. Specifically, the die-cutting machine for tape production includes a die-cutting mechanism, a driving mechanism, a guiding mechanism and a buffer mechanism, the driving mechanism drives the die-cutting mechanism to drive the die-cutting mechanism to operate to perform die-cutting processing on the tape; the guiding mechanism is arranged at the output end of the die-cutting mechanism, when the output end of the die-cutting mechanism performs die-cutting on the tape, the guiding mechanism can guide the tape entering the output end of the die-cutting mechanism and outputted from the output end of the die-cutting mechanism; the buffer mechanism is arranged between the die-cutting mechanism and the driving mechanism, when the die-cutting mechanism is working, the vibration generated by the die-cutting mechanism can be buffered by the buffer mechanism. BRIEF DESCRIPTION OF THE DRAWINGS
[0020] Figure 1 A schematic diagram of the structure of a die-cutting machine for producing adhesive tape in one embodiment;
[0021] Figure 2 A schematic diagram of the structure of a die-cutting machine for producing adhesive tape in one embodiment;
[0022] Figure 3 A schematic diagram of the structure of a die-cutting machine for producing adhesive tape in one embodiment;
[0023] Figure 4 for Figure 3 An enlarged structural schematic diagram of the AA portion in the illustrated embodiment. DETAILED DESCRIPTION
[0024] In order to make the above-mentioned purposes, features and advantages of the utility model more obvious and easy to understand, the specific implementation methods of the utility model are described in detail below in conjunction with the accompanying drawings. In the following description, many specific details are set forth to facilitate a full understanding of the utility model. However, the utility model can be implemented in many other ways different from those described herein, and those skilled in the art can make similar improvements without violating the connotation of the utility model, so the utility model is not limited by the specific embodiments disclosed below.
[0025] In the description of the present invention, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", "clockwise", "counterclockwise", "axial", "radial", "circumferential" and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the referred device or element must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as a limitation on the present invention.
[0026] In addition, the terms "first" and "second" are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Therefore, the features defined as "first" and "second" may explicitly or implicitly include at least one of the features. In the description of the present utility model, the meaning of "plurality" is at least two, such as two, three, etc., unless otherwise clearly and specifically defined.
[0027] In the present invention, unless otherwise clearly specified and limited, the terms "installed", "connected", "connected", "fixed" and the like should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium, it can be the internal connection of two elements or the interaction relationship between two elements, unless otherwise clearly defined. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.
[0028] In the present utility model, unless otherwise clearly specified and limited, a first feature being "above" or "below" a second feature may mean that the first and second features are in direct contact, or the first and second features are in indirect contact through an intermediate medium. Moreover, a first feature being "above", "above" or "above" a second feature may mean that the first feature is directly above or obliquely above the second feature, or simply means that the first feature is higher in level than the second feature. A first feature being "below", "below" or "below" a second feature may mean that the first feature is directly below or obliquely below the second feature, or simply means that the first feature is lower in level than the second feature.
[0029] It should be noted that when an element is referred to as being "fixed to" or "disposed on" another element, it may be directly on the other element or there may be a central element. When an element is considered to be "connected to" another element, it may be directly connected to the other element or there may be a central element at the same time. The terms "vertical", "horizontal", "upper", "lower", "left", "right" and similar expressions used herein are for illustrative purposes only and are not intended to be the only implementation method.
[0030] See also Figures 1 to 4 The utility model discloses a die-cutting machine 10 for producing adhesive tapes, which includes a die-cutting mechanism 100, a driving mechanism 200, a guiding mechanism 300 and a buffer mechanism 400. The driving mechanism 200 drives the die-cutting mechanism 100, thereby driving the die-cutting mechanism 100 to operate to perform die-cutting processing on the adhesive tape; the guiding mechanism 300 is arranged at the output end of the die-cutting mechanism 100. When the output end of the die-cutting mechanism 100 performs die-cutting on the adhesive tape, the guiding mechanism 300 can guide the adhesive tape entering the output end of the die-cutting mechanism 100 and outputted from the output end of the die-cutting mechanism 100, so as to avoid the offset between the adhesive tape and the die-cutting mechanism 100 and improve the processing accuracy; the buffer mechanism 400 is arranged between the die-cutting mechanism 100 and the driving mechanism 200. When the die-cutting mechanism 100 is working, the vibration generated by the die-cutting mechanism 100 can be buffered by the buffer mechanism 400, thereby reducing the influence of the vibration on the driving mechanism 200, thereby ensuring the overall operation stability of the die-cutting machine.
[0031] Furthermore, the die-cutting mechanism 100 includes a support 110, an upper die assembly 120 and a lower die assembly 130. The upper die assembly 120 and the lower die assembly 130 are arranged to cooperate with each other, and the support 110 is connected to the driving mechanism 200; the upper die assembly 120 is arranged on the top side of the support 110 and connected to the support 110; the lower die assembly 130 is arranged between the upper die assembly 120 and the support 110, and the lower die assembly 130 is connected to the output end of the driving mechanism 200, so that the driving mechanism 200 can drive the lower die assembly 130 to reciprocate between the support 110 and the upper die assembly 120. When the driving mechanism 200 drives the lower die assembly 130 to cooperate with the upper die assembly 120, the upper die assembly 120 and the lower die assembly 130 cooperate to complete the die-cutting process of the tape.
[0032] Furthermore, the guide mechanism 300 is arranged on both sides of the lower mold assembly 130, and the adhesive tape is fed from one end of the lower mold assembly 130 to between the lower mold assembly 130 and the upper mold assembly 120, and is output and discharged from the guide mechanism 300 at the other end of the lower mold assembly 130 after die-cutting is completed. Specifically, the guide mechanism 300 includes a feed plate 310, a discharge plate 320, and a plurality of guide posts 330. The feed plate 310 and the discharge plate 320 are correspondingly arranged on both sides of the lower mold assembly 130, and the adhesive tape is fed from one end of the feed plate 310 and input to between the lower mold assembly 130 and the upper mold assembly 120, and the main body of the adhesive tape after die-cutting is output and discharged from one end of the discharge plate 320; a plurality of guide posts 330 are slidably connected to the feed plate 310 and the discharge plate 320, respectively; in this embodiment, the two guide posts 330 are slidably connected to the feed plate 310, and the distance between the two guide posts 330 can be adjusted by sliding. The four guide posts 330 are slidably connected to the discharge plate 320, and the four guide posts 330 are arranged as two groups of parallel guide posts 330 corresponding to the feed plate 310 along the conveying direction of the tape. The distance between the guide posts 330 of each group of guide posts 330 can be adjusted by sliding to cooperate with the feed plate 310 to further limit the relative position of the tape on the surface of the discharge plate 320, thereby realizing the guiding function of the discharge plate 320 while ensuring the smoothness and flatness of the tape conveying, thereby further improving the die-cutting processing accuracy of the tape.
[0033] Furthermore, the support 110 is provided with a plurality of lifting guide posts 111 , and the plurality of lifting guide posts 111 are respectively provided between the support 110 and the upper mold assembly 120 , so as to define the relative position between the upper mold assembly 120 and the support 110 . Specifically, the lower mold assembly 130 and the buffer mechanism 400 are respectively mounted on the side surfaces of a plurality of lifting guide pillars 111, so that when the driving mechanism 200 drives the lower mold assembly 130 to lift and reciprocate between the support 110 and the upper mold assembly 120, the plurality of lifting guide pillars 111 can effectively limit the lifting trajectory of the lower mold assembly 130, thereby ensuring the matching accuracy between the lower mold assembly 130 and the upper mold assembly 120. At the same time, during the lifting process of the lower mold assembly 130, the buffer mechanism 400 mounted on the plurality of lifting guide pillars 111 buffers the movement process of the lower mold assembly 130, thereby limiting the impact force between the lower mold assembly 130 and the upper mold assembly 120 and the support 110 within a preset range, thereby avoiding damage to the lower mold assembly 130, the upper mold assembly 120 and the support 110 due to excessive impact force. In this embodiment, the buffer mechanism 400 includes a plurality of buffer members 410 . The plurality of buffer members 410 are respectively sleeved on the side surfaces of the plurality of lifting guide pillars 111 , and two ends of each buffer member 410 are respectively in contact with the support 110 and the lower mold assembly 130 .
[0034] Further, the upper die assembly 120 includes an upper die base 121 and an upper die plate 122, the upper die base 121 is connected to the top of the plurality of lifting guide pillars 111, and the upper die plate 122 is arranged on the bottom surface of the upper die base 121; correspondingly, the lower die assembly 130 includes a lower die base 131 and a lower die plate 132, the lower die base 131 is arranged on the bottom side of the upper die assembly 120 and connected to the output end of the driving mechanism 200, and the lower die plate 132 is arranged on the top surface of the lower die base 131, so that the lower die plate 132 corresponds to the upper die plate 122. Specifically, the feed plate 310 and the discharge plate 320 are respectively arranged on both sides of the lower die base 131.
[0035] Furthermore, the lower die base 131 is provided with a material discharge cavity a and a material discharge channel 1311. The material discharge cavity a is provided inside the lower die base 131, and the material discharge cavity a is connected to the bottom side of the lower mold plate 132; the material discharge channel 1311 is provided inside the material discharge cavity a, and one end of the material discharge channel 1311 is connected to the bottom side of the lower mold plate 132, and the other end of the material discharge channel 1311 extends to the outside of the lower die base 131. In actual application, after the adhesive tape is die-cut by the lower mold plate 132 and the upper mold plate 122, the main body of the adhesive tape is discharged through the discharge plate 320, and the die-cut product is separated from the main body of the adhesive tape and falls into the material discharge cavity a, and then discharged to the outside of the lower die base 131 through the material discharge channel 1311, thereby completing the product discharge.
[0036] Furthermore, the driving mechanism 200 includes an eccentric shaft 210 and a connecting rod 220. The eccentric shaft 210 is rotatably mounted on the support 110. One end of the connecting rod 220 is cooperatively connected to the side surface of the eccentric shaft 210, and the other end of the connecting rod 220 is drivingly connected to the lower mold base 131. Thus, the external driving device drives the eccentric shaft 210 to rotate, and then drives the lower mold base 131 to perform reciprocating lifting and lowering motions through the connecting rod 220.
[0037] In summary, the die-cutting machine for tape production disclosed by the utility model guides the tape entering the output end of the die-cutting mechanism and outputted from the output end of the die-cutting mechanism through a guiding mechanism, so as to avoid the offset between the tape and the die-cutting mechanism and to improve the processing accuracy; when the die-cutting mechanism is working, the die-cutting mechanism can reduce the influence of vibration through a buffer mechanism, so as to ensure the overall operation stability of the die-cutting machine. Specifically, the die-cutting machine for tape production includes a die-cutting mechanism, a driving mechanism, a guiding mechanism and a buffer mechanism, the driving mechanism drives the die-cutting mechanism to drive the die-cutting mechanism to operate to perform die-cutting processing on the tape; the guiding mechanism is arranged at the output end of the die-cutting mechanism, and when the output end of the die-cutting mechanism performs die-cutting on the tape, the guiding mechanism can guide the tape entering the output end of the die-cutting mechanism and outputted from the output end of the die-cutting mechanism; the buffer mechanism is arranged between the die-cutting mechanism and the driving mechanism, and when the die-cutting mechanism is working, the vibration generated by the die-cutting mechanism can be buffered by the buffer mechanism.
[0038] The technical features of the above-described embodiments may be arbitrarily combined. To make the description concise, not all possible combinations of the technical features in the above-described embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.
[0039] The above-mentioned embodiments only express several implementation methods of the utility model, and the description is relatively specific and detailed, but it cannot be understood as limiting the scope of the utility model patent. It should be pointed out that for ordinary technicians in this field, several modifications and improvements can be made without departing from the concept of the utility model, which all belong to the protection scope of the utility model. Therefore, the protection scope of the utility model patent shall be based on the attached claims.
Claims
1. A die-cutting machine for producing adhesive tapes, characterized in that: include: A die-cutting mechanism, a driving mechanism, a guiding mechanism and a buffer mechanism, wherein the driving mechanism is connected to the die-cutting mechanism; the guiding mechanism is arranged at the output end of the die-cutting mechanism; and the buffer mechanism is arranged between the die-cutting mechanism and the driving mechanism; The die-cutting mechanism comprises a support, an upper die assembly and a lower die assembly, wherein the upper die assembly and the lower die assembly are arranged in a relatively cooperative manner, and the support is connected to the driving mechanism; the upper die assembly is arranged on the top side of the support and connected to the support; the lower die assembly is arranged between the upper die assembly and the support, and the lower die assembly is connected to the output end of the driving mechanism; The guide mechanism is arranged on both sides of the lower mold assembly; The guide mechanism includes a feed plate, a discharge plate and a plurality of guide posts, wherein the feed plate and the discharge plate are correspondingly arranged on both sides of the lower mold assembly; and the plurality of guide posts are respectively slidably connected to the feed plate and the discharge plate.
2. The die-cutting machine for adhesive tape production according to claim 1, characterized in that: The two guide posts are slidably connected to the feed plate.
3. The die-cutting machine for adhesive tape production according to claim 2, characterized in that: The four guide posts are slidably connected to the discharge plate, and the four guide posts are arranged as two groups of parallel guide posts corresponding to the feed plate along the conveying direction of the tape.
4. The die-cutting machine for adhesive tape production according to claim 3, characterized in that: The support is provided with a plurality of lifting guide columns, and the plurality of lifting guide columns are respectively arranged between the support and the upper mold assembly.
5. The die-cutting machine for adhesive tape production according to claim 4, characterized in that: The lower mold assembly and the buffer mechanism are respectively sleeved on the side surfaces of a plurality of the lifting guide pillars.
6. The die-cutting machine for adhesive tape production according to claim 5, characterized in that: The buffer mechanism comprises a plurality of buffer members, which are respectively sleeved on the side surfaces of a plurality of lifting guide pillars, and two ends of each buffer member are respectively in contact with the support and the lower mold assembly.
7. The die-cutting machine for adhesive tape production according to claim 6, characterized in that: The upper mold assembly comprises an upper mold base and an upper mold plate, wherein the upper mold base is connected to the top ends of a plurality of the lifting guide pillars, and the upper mold plate is arranged on the bottom side surface of the upper mold base.
8. The die-cutting machine for adhesive tape production according to claim 7, characterized in that: The lower mold assembly includes a lower mold base and a lower mold plate. The lower mold base is arranged on the bottom side of the upper mold assembly and connected to the output end of the driving mechanism. The lower mold plate is arranged on the top side surface of the lower mold base, so that the lower mold plate corresponds to the upper mold plate.
9. The die-cutting machine for adhesive tape production according to claim 8, characterized in that: The feed plate and the discharge plate are respectively arranged on two sides of the lower die base.
10. The die-cutting machine for adhesive tape production according to claim 9, characterized in that: The lower die base is provided with a material removal cavity and a material removal channel. The material removal cavity is arranged inside the lower die base, and the material removal cavity is connected to the bottom side of the lower template; the material removal channel is arranged in the material removal cavity, and one end of the material removal channel is connected to the bottom side of the lower template, and the other end of the material removal channel extends to the outside of the lower die base.