Water quenching mechanism and silicon material processing equipment

Abstract

The embodiment of the utility model relates to the technical field of silicon material processing, and particularly discloses a water quenching mechanism and silicon material processing equipment, and the water quenching mechanism comprises a water tank, a first carrying assembly and a second carrying assembly. A feeding area and a discharging area are arranged on the two opposite sides of the water tank correspondingly. The first carrying assembly is movably connected with the water tank, and the first carrying assembly is used for transferring the silicon materials in the feeding area into the water tank. The second carrying assembly is movably connected with the water tank and used for transferring the silicon materials on the first carrying assembly to the discharging area. Through the structure, the first carrying assembly carries a silicon material from a feeding area into the water tank for cooling water quenching, and the second carrying assembly receives the silicon material from the first carrying assembly and carries the silicon material to a discharging area. Therefore, when the silicon material is subjected to water quenching, the first carrying assembly and the second carrying assembly transfer the silicon material, so that the working efficiency is improved.

Description

Technical Field

[0001] The embodiments of the present application relate to the technical field of silicon material processing, and in particular to a water quenching mechanism and silicon material processing equipment. Background Art

[0002] Silicon is an extremely common element. It rarely appears in nature in the form of a single substance, but is widely found in rocks, gravel, and dust in the form of complex silicates or silicon dioxide. High-purity single crystal silicon is an important semiconductor material.

[0003] In the process of realizing the present application, the inventor found that: currently, in the process of silicon material processing, the heated silicon material needs to be placed in cold water for water quenching. However, these mechanisms waste a lot of time for water quenching during the process of silicon material entering and leaving the water tank, and the work efficiency is low. Utility Model Content

[0004] The embodiments of the present application provide a water quenching mechanism and silicon material processing equipment, which can improve the current situation in which these mechanisms waste a lot of time on water quenching during the process of silicon material entering and leaving the water tank, resulting in low work efficiency.

[0005] In order to solve the above technical problems, a technical solution adopted in the present application is: a water quenching mechanism is provided. The water quenching mechanism includes: a water tank, a first carrier assembly and a second carrier assembly. The water tank is provided with a loading area and a unloading area on opposite sides thereof. The first carrier assembly is movably connected to the water tank, and the first carrier assembly is used to transfer the silicon material in the loading area to the water tank. The second carrier assembly is movably connected to the water tank, and the second carrier assembly is used to transfer the silicon material on the first carrier assembly to the unloading area.

[0006] Optionally, the first carrier assembly includes: a first translation structure, a first lifting structure and a first bearing member. The first translation structure can move relative to the water tank along a first direction. The first lifting structure can be movably connected to the first translation structure, and the first lifting structure can move relative to the first translation structure along a second direction. The first bearing member is installed on the first lifting structure, and the first bearing member is used to carry silicon materials. The first direction is perpendicular to the second direction.

[0007] Optionally, the second carrier assembly includes: a second translation structure, a second lifting structure and a second bearing member. The second translation structure can move relative to the water tank along a first direction. The second lifting structure can be movably connected to the second translation structure, and the second lifting structure can move relative to the second translation structure along a second direction. The second bearing member is installed on the second lifting structure, and the second bearing member is used to receive the silicon material on the first bearing member.

[0008] Optionally, along a third direction, the first translation structure and the second translation structure are respectively arranged on two sides of the water tank, wherein the third direction is respectively perpendicular to the first direction and the second direction.

[0009] Optionally, the first bearing member includes a plurality of first bearing plates, the plurality of first bearing plates are sequentially spaced along the third direction, and a first avoidance gap is provided between each adjacent two first bearing plates. The second bearing member includes a plurality of second bearing plates, the plurality of second bearing plates are sequentially spaced along the third direction, and a second avoidance gap is provided between each adjacent two second bearing plates. The second bearing member can move relative to the first bearing member so that each first bearing plate is inserted into a corresponding second avoidance gap, and each second bearing plate is inserted into a corresponding first avoidance gap.

[0010] Optionally, one end of several first supporting plates facing the loading area is connected to the first lifting structure respectively, and one end of several second supporting plates away from the loading area is connected to the second lifting structure respectively; or one end of several first supporting plates facing the unloading area is connected to the first lifting structure respectively, and one end of several second supporting plates away from the unloading area is connected to the second lifting structure respectively.

[0011] Optionally, the water quenching mechanism further comprises a material unloading platform and a third carrier assembly, wherein the material unloading platform is arranged in the material unloading area, and the third carrier assembly is rotatably connected to the material unloading platform. The second carrier assembly is used to transfer the silicon material on the first carrier assembly to the third carrier assembly, and the third carrier assembly is used to transfer the silicon material to the material unloading platform.

[0012] Optionally, the third carrier assembly includes a third carrier, the third carrier includes a plurality of third carrier plates arranged at intervals, a third avoidance gap is provided between each two adjacent third carrier plates, and the third carrier can be moved relative to the second carrier so that each third carrier plate is inserted into a corresponding second avoidance gap, and each second carrier plate is inserted into a corresponding third avoidance gap. The unloading platform includes a plurality of fourth carrier plates, a fourth avoidance gap is provided between each two adjacent fourth carrier plates, and the third carrier can be moved relative to the fourth carrier plate so that each third carrier plate is inserted into a corresponding fourth avoidance gap, and each fourth carrier plate is inserted into a corresponding third avoidance gap.

[0013] Optionally, the water quenching mechanism further includes a fourth transport assembly, which is disposed between the water tank and the third transport assembly, and is used to transfer the silicon material on the second transport assembly to the third transport assembly.

[0014] In order to solve the above technical problems, another technical solution adopted in the present application is: to provide a silicon material processing equipment, including the above water quenching mechanism.

[0015] The beneficial effect of the embodiment of the present application is that, different from the prior art, the embodiment of the present application provides a water quenching mechanism. The water quenching mechanism includes: a water tank, a first carrier assembly and a second carrier assembly. The opposite sides of the water tank are respectively provided with a loading area and a unloading area. The first carrier assembly is movably connected to the water tank, and the first carrier assembly is used to transfer the silicon material in the loading area to the water tank. The second carrier assembly is movably connected to the water tank, and the second carrier assembly is used to transfer the silicon material on the first carrier assembly to the unloading area. Through the above structure, the first carrier assembly transports the silicon material from the loading area to the water tank for cooling and water quenching, and the second carrier assembly receives the silicon material from the first carrier assembly and transports it to the unloading area. Thus, while the silicon material is being water quenched, the first carrier assembly and the second carrier assembly hand over the silicon material to improve work efficiency. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] In order to more clearly illustrate the technical solutions of the embodiments of the present application, the drawings required for use in the embodiments of the present application will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on the drawings without paying creative work.

[0017] Figure 1 is a three-dimensional diagram of a water quenching mechanism provided in one embodiment of the present application;

[0018] Figure 2 It is a plan view of a water quenching mechanism provided in one embodiment of the present application;

[0019] Figure 3 is a partial stereoscopic diagram of a first carrier assembly provided in one embodiment of the present application;

[0020] Figure 4 is a partial three-dimensional diagram of a second carrier assembly provided in one embodiment of the present application;

[0021] Figure 5 It is a partial stereoscopic diagram of a water quenching mechanism provided in one embodiment of the present application;

[0022] Figure 6is a partial three-dimensional diagram of a third carrier assembly provided in one embodiment of the present application;

[0023] Figure 7 It is a partial stereoscopic view of a fourth carrier assembly provided in one embodiment of the present application.

[0024] The reference numerals are as follows:

[0025] Water quenching mechanism 1000 Second loading plate 331 First Direction X Second extension arm 332 Second direction Y Second avoidance gap 333 The third direction Z Unloading table 400 Water tank 100 Fourth load plate 410 Loading area 110 Fourth avoidance gap 420 Unloading area 120 Limiting plate 430 water inlet 130 blanking port 440 Water outlet 140 Support frame 450 First carrier assembly 200 The third carrier assembly 500 First translation structure 210 The third bearing member 510 The first lifting structure 220 The third carrier plate 511 First bearing member 230 The third avoidance gap 512 First loading plate 231 Swing arm 520 First avoidance gap 232 Rocker 530 First extension arm 233 Fourth carrier assembly 600 First bending arm 234 Fifth bearing member 610 Second carrier assembly 300 Fifth load plate 611 The second translation structure 310 Fifth avoidance gap 612 Second lifting structure 320 The third translation structure 620 Second bearing member 330 The third lifting structure 630 DETAILED DESCRIPTION

[0026] In order to facilitate the understanding of the present application, the present application is described in more detail below in conjunction with the accompanying drawings and specific embodiments. It should be noted that when an element is described as "fixed to" another element, it can be directly on the other element, or there can be one or more centered elements therebetween. When an element is described as "connected to" another element, it can be directly connected to the other element, or there can be one or more centered elements therebetween. The terms "vertical", "horizontal", "left", "right" and similar expressions used in this specification are for illustrative purposes only.

[0027] Unless otherwise defined, all technical and scientific terms used in this specification have the same meaning as those commonly understood by those skilled in the art to which this application belongs. The terms used in this specification and in the specification of this application are only for the purpose of describing specific embodiments and are not intended to limit this application. The term "and / or" used in this specification includes any and all combinations of one or more of the related listed items.

[0028] The present application provides a silicon material processing equipment, including a feeding mechanism, a heating mechanism, a water quenching mechanism 1000 and a feeding mechanism, etc. The feeding mechanism, the heating mechanism, the water quenching mechanism 1000 and the feeding mechanism are connected in sequence, so that the silicon material is transported from the feeding mechanism to the heating mechanism for heating, then transported to the water quenching mechanism 1000 for water quenching and blasting, and finally flows into the feeding mechanism to complete the process. It can be understood that the silicon material processed by the silicon material processing equipment provided by the present application can be a silicon rod or a silicon block, which will be uniformly described as silicon material in the following text without distinction.

[0029] For the aforementioned water quenching mechanism 1000, see Figure 1The water quenching mechanism 1000 includes: a water tank 100, a first carrier assembly 200 and a second carrier assembly 300. The water tank 100 is provided with a loading area 110 and a unloading area 120 on opposite sides thereof. The first carrier assembly 200 is movably connected to the water tank 100, and the first carrier assembly 200 is used to transfer the silicon material in the loading area 110 to the water tank 100. The second carrier assembly 300 is movably connected to the water tank 100, and the second carrier assembly 300 is used to transfer the silicon material on the first carrier assembly 200 to the unloading area 120. It can be understood that the first carrier assembly 200 receives the silicon material from the loading area 110, moves toward the water tank 100, and then lowers the silicon material into the water tank 100 for water quenching and blasting. At the same time, the first carrier assembly 200 carries the silicon material and moves horizontally toward the other end of the water tank 100. Specifically, the second carrier assembly 300 is located on one side of the first carrier assembly 200 close to the bottom of the water tank 100, so that the broken silicon material can be received during the silicon material explosion process to prevent the silicon material from sinking to the bottom of the water tank 100. When the first carrier assembly 200 and the second carrier assembly 300 move to the other end of the water tank 100 at the same time, the second carrier assembly 300 rises, receives all the silicon material and carries it to the unloading area 120, so that the first carrier assembly 200 and the second carrier assembly 300 alternately carry the silicon material in the cooling tank, so as to ensure the process time of the silicon material water quenching, and complete the transfer of the silicon material by the first carrier assembly 200 and the second carrier assembly 300. Through the above structure, the first carrier assembly 200 carries the silicon material from the loading area 110 to the water tank 100 for cooling and water quenching, and the second carrier assembly 300 receives the silicon material from the first carrier assembly 200 and carries it to the unloading area 120. Therefore, the first carrier assembly 200 and the second carrier assembly 300 transfer the silicon material while the silicon material is being water quenched, so as to improve the working efficiency.

[0030] For the first carrier assembly 200, see Figure 2, and in combination with other drawings. The first carrier assembly 200 includes: a first translation structure 210, a first lifting structure 220 and a first bearing member 230. The first translation structure 210 can move relative to the water tank 100 along a first direction X. The first lifting structure 220 is movably connected to the first translation structure 210, and the first lifting structure 220 can move relative to the first translation structure 210 along a second direction Y. The first bearing member 230 is installed on the first lifting structure 220, and the first bearing member 230 is used to carry silicon materials. Among them, the first direction X is perpendicular to the second direction Y. It can be understood that by setting the first lifting structure 220, the first bearing member 230 is driven to extend into the water tank 100 or leave the water tank 100. The first translation structure 210 is configured as a mechanical structure including a guide rail, a motor and a base, which is relatively common and will not be repeated here. The first carrier 230 extends toward the inside of the water tank 100, and the extension length of the first carrier 230 is less than the width of the water tank 100, thereby fully utilizing the internal space of the water tank 100, increasing the contact area between water and silicon material, improving heat exchange efficiency, and thus improving water quenching efficiency of silicon material.

[0031] For the second carrier assembly 300, see Figure 2 , and in combination with other drawings. The second carrier assembly 300 includes a second translation structure 310, a second lifting structure 320 and a second carrier 330. The second translation structure 310 can move relative to the water tank 100 along the first direction X. The second lifting structure 320 is movably connected to the second translation structure 310, and the second lifting structure 320 can move relative to the second translation structure 310 along the second direction Y. The second carrier 330 is installed on the second lifting structure 320, and the second carrier 330 is used to receive the silicon material on the first carrier 230. It can be understood that by setting the second lifting structure 320, the second carrier 330 is driven to extend into the water tank 100 or leave the water tank 100. The second translation structure 310 is configured as a mechanical structure including a guide rail, a motor and a base, which is relatively common and will not be repeated here. The second bearing member 330 extends toward the inside of the water tank 100, and the extension length of the second bearing member 330 is less than the width of the water tank 100, so as to make full use of the internal space of the water tank 100, increase the contact area between water and silicon material, improve the heat exchange efficiency, and improve the water quenching efficiency of silicon material. Combined with the above-mentioned first translation structure 210, the first translation structure 210 and the second translation structure 310 are arranged on both sides of the water tank 100 along the third direction Z, specifically on both sides of the direction perpendicular to the connection line of the loading area 110 and the unloading area 120. The first translation structure 210 and the second translation structure 310 are arranged on both sides of the water tank 100 along the third direction Z so that the two translation structures can move at the same time without interfering with each other, and make full use of the space on both sides of the water tank 100, improve the silicon material transmission efficiency, and reduce the volume of the water quenching mechanism 1000.

[0032] For further description in combination with the first carrier assembly 200 and the second carrier assembly 300, please refer to Figures 2 to 4 , and in combination with other drawings. The first carrier 230 includes a plurality of first carrier plates 231, which are arranged in sequence along the third direction Z at intervals, and a first avoidance gap 232 is provided between each adjacent two first carrier plates 231. The second carrier 330 includes a plurality of second carrier plates 331, which are arranged in sequence along the third direction Z at intervals, and a second avoidance gap 333 is provided between each adjacent two second carrier plates 331. The second carrier 330 can move relative to the first carrier 230, so that each first carrier plate 231 is inserted into a corresponding second avoidance gap 333, and each second carrier plate 331 is inserted into a corresponding first avoidance gap 232. On the other hand, the plurality of first carrier plates 231 arranged at intervals can also adapt to silicon materials of different shapes, and a plurality of first avoidance gaps 232 are reserved to clamp silicon blocks or silicon materials of irregular shapes.

[0033] Further, one end of the plurality of first bearing plates 231 facing the loading area 110 is respectively connected to the first lifting structure 220, and one end of the plurality of second bearing plates 331 facing away from the loading area 110 is respectively connected to the second lifting structure 320; or one end of the plurality of first bearing plates 231 facing the unloading area 120 is respectively connected to the first lifting structure 220, and one end of the plurality of second bearing plates 331 facing away from the unloading area 120 is respectively connected to the second lifting structure 320. Through the above structure, the first bearing plate 231 and the second bearing plate 331 are arranged opposite to each other, so that the first avoidance gap 232 and the second bearing plate 331, and the second avoidance gap 333 and the first bearing plate 231 are plugged and matched to avoid interference.

[0034] Still need to explain, please refer to Figures 2 to 4 , and in combination with other drawings. The first bearing member 230 also includes: a first extension arm 233 and a first bending arm 234. The first extension arm 233 is installed on the first lifting structure 220 and extends horizontally toward the other side of the water tank 100 and then extends toward the bottom of the water tank 100. The first bending arm 234 is installed at one end of the first extension arm 233 away from the first lifting structure 220, and the first bending arm 234 extends in a direction away from the bottom of the water tank 100. The first bearing plate 231 is installed on the first bending arm 234. By setting the first bending arm 234, the distance between the first bearing plate 231 and the bottom of the water tank 100 is increased, so that the silicon material with higher heat can be immersed in a position close to the middle of the water tank 100, so that the upper and lower surfaces are heated more evenly, thereby improving the water quenching efficiency of the silicon material.

[0035] For further information, see Figures 2 to 4, and combined with other drawings. The second carrier 330 also includes a second extension arm 332, which is mounted on the second lifting structure 320 and extends toward the cooling trough. Combined with the above-mentioned first bending arm 234, the first bending arm 234 makes way for the movement space of the second extension arm 332 to prevent interference. In addition, the staggered first carrier plate 231 and the second carrier plate 331 can, on the one hand, alternately receive silicon materials, thereby completing the transfer of silicon materials; on the other hand, the second carrier plate 331 can also receive silicon materials dropped from the first carrier plate 231. Optionally, the width of the first avoidance gap 232 is equal to the width of the second avoidance gap 333; or, the width of the first avoidance gap 232 is greater than the width of the second avoidance gap 333, so that the second carrier plate 331 can receive silicon materials dropped from the first carrier plate 231. By providing the first avoidance gap 232 and the second avoidance gap 333, the contact area between the first supporting plate 231 and the second supporting plate 331 and the silicon material can be reduced, thereby increasing the contact area between water and the silicon material, thereby improving the heat exchange efficiency and the water quenching efficiency of the silicon material.

[0036] In the embodiments of this application, please refer to Figure 5 , and in combination with other drawings. The water quenching mechanism 1000 also includes a material unloading platform 400 and a third carrier assembly 500. The material unloading platform 400 is arranged in the material unloading area 120, and the third carrier assembly 500 is rotatably connected to the material unloading platform 400. The second carrier assembly 300 is used to transfer the silicon material on the first carrier assembly 200 to the third carrier assembly 500, and the third carrier assembly 500 is used to transfer the silicon material to the material unloading platform 400. Specifically, the material unloading platform 400 is arranged at an angle, and one end of the material unloading platform 400 close to the third carrier assembly 500 is higher than the other end to facilitate unloading. A jaw crusher can also be arranged at one end of the material unloading platform 400 away from the third carrier assembly 500 to further process the silicon material. It can be understood that the third carrier assembly 500 is arranged as a rotatable structure in order to facilitate unloading, so that the setting position of the material unloading platform 400 can be adjusted according to actual usage.

[0037] For further information, see Figures 5 to 7, and in combination with other drawings. The third carrier assembly 500 includes a third carrier 510, and the third carrier 510 includes a plurality of third carrier plates 511 arranged at intervals, and a third avoidance gap 512 is provided between each two adjacent third carrier plates 511. The unloading platform 400 includes a plurality of fourth carrier plates 410, and a fourth avoidance gap 420 is provided between each two adjacent fourth carrier plates 410. The third carrier 510 can move relative to the fourth carrier plates 410, so that each third carrier plate 511 is inserted into a corresponding fourth avoidance gap 420, and each fourth carrier plate 410 is inserted into a corresponding third avoidance gap 512. Through the above structure, the third carrier plate 511 can be at least partially plugged into the unloading platform 400, so that the third carrier plate 511 and the unloading platform 400 form a plane, so that the silicon material can be dropped along the third carrier plate 511 and the unloading platform 400. In some embodiments, since the third carrier component 500 needs to receive silicon material from the second carrier component 300, further description is given in combination with the above-mentioned third carrier plate 511, the third avoidance gap 512, the second carrier plate 331 and the second carrier gap: the third carrier 510 can be moved relative to the second carrier 330, so that each third carrier plate 511 is inserted into a corresponding second avoidance gap 333, and each second carrier plate 331 is inserted into a corresponding third avoidance gap 512, thereby facilitating the third carrier 510 to receive silicon material from the second carrier 330.

[0038] For further information, see Figure 5 , and in combination with other drawings. The above-mentioned unloading platform 400 also includes a limit plate 430, a drop opening 440 and a support frame 450. The limit plates 430 are arranged on both sides of the fourth supporting plate 410. The limit plates 430 are used to prevent the silicon material from deviating and falling out when sliding down the surface of the fourth supporting plate 410, thereby playing a role of limiting guidance. The support frame 450 and the fourth supporting plate 410 are mutually inclined and supported, and the support frame 450 is hollowed out. The drop opening 440 is arranged below the fourth avoidance gap 420 and the hollowed-out support frame 450, so that when the silicon material slides down the inclined surface of the unloading platform 400, part of the silicon material debris can fall to the drop opening 450, which is convenient for the collection of silicon material debris.

[0039] For further information, see Figures 5 to 7, and in combination with other drawings. The third carrier assembly 500 also includes a swing arm 520 and a rocker arm 530. The rocker arm 530 can drive the swing arm 520 to rotate between the second carrier assembly 300 and the unloading platform 400. The swing arm 520 is installed on the rocker arm 530. The swing arm 520 can swing relative to the rocker arm 530 in the vertical direction, so as to facilitate the third carrier 510 to be tilted to be flush with the unloading platform 400. That is, the rocker arm 530 drives the swing arm 520 to rotate the third carrier plate 511 to the second carrier plate 331 to receive the silicon material, and then the rocker arm 530 drives the swing arm 520 and the third carrier plate 511 to rotate to the unloading platform 400, and the swing arm 520 drives the third carrier plate 511 to be tilted to be flush with the fourth carrier plate 410, so as to facilitate the unloading of the silicon material. Optionally, the angles at which the swing arm 520 and the rocker arm 530 rotate are not fixed. When the angles at which the swing arm 520 and the rocker arm 530 rotate are small, the space occupied by the third carrier assembly 500 can be further reduced, and the volume of the device can be reduced. However, in the present application, it is only necessary for the swing arm 520 to swing the rocker arm 530 and the third carrier plate 511 to receive the silicon material on the second carrier plate 331, and to pour the silicon material onto the unloading platform 400 through the rocker arm 530. The angles at which the swing arm 520 and the rocker arm 530 rotate are not limited. Preferably, after the swing arm 520 swings and the rocker arm 530 rotates, the third carrier 510 is flush with the plane where the unloading platform 400 is located, so that the silicon material is easily unloaded along the inclined plane where the unloading platform 400 is located, thereby improving the unloading efficiency.

[0040] In conjunction with the above embodiments, please refer to Figures 5 to 7, and in combination with other drawings. The water quenching mechanism 1000 also includes a fourth carrier assembly 600, which is arranged between the water tank 100 and the third carrier assembly 500. The fourth carrier assembly 600 is used to transfer the silicon material on the second carrier assembly 300 to the third carrier assembly 500. Specifically, the fourth carrier assembly 600 includes: a third translation structure 620, a third lifting structure 630 and a fifth carrier 610. The third translation structure 620 extends from the second translation structure 310, and the movement distances of the third translation structure 620, the second translation structure 310 and the first translation structure 210 are equal. The third lifting structure 630 is installed on the third translation structure 620, and the third lifting structure 630 is arranged parallel to the second lifting structure 320. By setting the third lifting structure 630, it is convenient to take the silicon material from the second carrier assembly 300 through lifting movement, and it is convenient to transfer the silicon material to the third carrier assembly 500 through lifting movement. The fifth carrier 610 is installed on the third lifting structure 630, and the fifth carrier 610 includes a plurality of fifth carrier plates 611. A fifth avoidance gap 612 is provided between each two adjacent fifth carrier plates 611. In combination with the above embodiments, it can be understood that the fifth carrier 610 can be moved relative to the second carrier 330, so that each fifth carrier plate 611 is inserted into a corresponding second avoidance gap 333, and each second carrier plate 331 is inserted into a corresponding fifth avoidance gap 612, thereby facilitating the fifth carrier 610 to receive silicon material from the second carrier 330; or, the fifth carrier 610 can be moved relative to the third carrier 510, so that each fifth carrier plate 611 is inserted into a corresponding third avoidance gap 512, and each third carrier plate 511 is inserted into a corresponding fifth avoidance gap 612, thereby facilitating the third carrier 510 to receive silicon material from the fifth carrier 610. Through the above structure, the movement distances of the third translation structure 620, the second translation structure 310 and the first translation structure 210 are equal, so that when the third translation structure 620 completes receiving the silicon material at the second translation structure 310, the second translation structure 310 can return to the loading area 110 with the first translation structure 210, so that the transfer of silicon material between the second carrier assembly 300 and the fourth carrier assembly 600 will not affect the transfer of silicon material between the next batch of the first carrier assembly 200 and the second carrier assembly 300, thereby achieving the relay transfer of silicon material between the first carrier assembly 200, the second carrier assembly 300 and the fourth carrier assembly 600, thereby improving the work efficiency. In some other embodiments, such a setting can also set other processing stations at the fourth carrier assembly 600, thereby improving the functionality of the aforementioned silicon material processing equipment.

[0041] For the above-mentioned first carrier assembly 200, second carrier assembly 300 and fourth carrier assembly 600, the present application provides a photoelectric module to detect the current position of the carrier assembly, thereby facilitating the relay transfer of silicon materials between the various carrier assemblies and improving work efficiency.

[0042] For the above water tank 100, please review Figure 1 , and combined with other drawings. The water tank 100 is also provided with a water inlet 130 and a water outlet 140. The water inlet 130 is arranged on the box body near the loading area 110 and away from the bottom plate, and the water outlet 140 is concavely arranged on the bottom plate near the unloading area 120. Through the above structure, the water temperature at the water inlet 130 near the aforementioned heating mechanism has not undergone heat exchange with the heated silicon material, so the water temperature is relatively low, and the water can fully exchange heat with the silicon material. The water after heat exchange flows out of the water tank 100 through the water outlet 140. It should be noted that a filter port is also provided at the water outlet 140 to prevent broken silicon material debris from flowing out of the water tank 100 with the water, causing a waste of resources.

[0043] The embodiment of the present application provides a water quenching mechanism 1000. The water quenching mechanism 1000 includes: a water tank 100, a first carrier assembly 200 and a second carrier assembly 300. A loading area 110 and a unloading area 120 are respectively provided on opposite sides of the water tank 100. The first carrier assembly 200 is movably connected to the water tank 100, and the first carrier assembly 200 is used to transfer the silicon material in the loading area 110 to the water tank 100. The second carrier assembly 300 is movably connected to the water tank 100, and the second carrier assembly 300 is used to transfer the silicon material on the first carrier assembly 200 to the unloading area 120. Through the above structure, the first carrier assembly 200 carries the silicon material from the loading area 110 to the water tank 100 for cooling and water quenching, and the second carrier assembly 300 receives the silicon material from the first carrier assembly 200 and carries it to the unloading area 120. Therefore, the first carrier assembly 200 and the second carrier assembly 300 transfer the silicon material while the silicon material is being water quenched, so as to improve the working efficiency.

[0044] Based on the same inventive concept, the present application also provides a silicon material processing device, which includes the above-mentioned water quenching mechanism 1000. The structure and function of the water quenching mechanism 1000 can be found in the above-mentioned embodiment, which will not be described in detail here.

[0045] It should be noted that the preferred embodiments of the present application are given in the specification and drawings of the present application. However, the present application can be implemented in many different forms and is not limited to the embodiments described in the specification. These embodiments are not used as additional limitations on the content of the present application. The purpose of providing these embodiments is to make the understanding of the disclosure of the present application more thorough and comprehensive. In addition, the above-mentioned technical features continue to be combined with each other to form various embodiments not listed above, which are all regarded as the scope of the description of the present application; further, for ordinary technicians in this field, they can be improved or transformed according to the above description, and all these improvements and transformations should belong to the scope of protection of the claims attached to the present application.

Claims

1. A water quenching mechanism, characterized in that: include: A water tank, wherein a loading area and a unloading area are respectively provided on opposite sides of the water tank; A first transport component is movably connected to the water tank, and the first transport component is used to transfer the silicon material in the loading area to the water tank; The second transport component is movably connected to the water tank, and the second transport component is used to transfer the silicon material on the first transport component to the unloading area.

2. The water quenching mechanism according to claim 1, characterized in that: The first carrier assembly comprises: a first translation structure, wherein the first translation structure is movable relative to the water tank along a first direction; A first lifting structure is movably connected to the first translation structure, and the first lifting structure can move relative to the first translation structure along a second direction; A first bearing member, installed on the first lifting structure, and the first bearing member is used to bear silicon material; The first direction is perpendicular to the second direction.

3. The water quenching mechanism according to claim 2, characterized in that: The second carrier assembly comprises: a second translation structure, the second translation structure being movable relative to the water tank along a first direction; a second lifting structure, movably connected to the second translation structure, wherein the second lifting structure can move relative to the second translation structure along a second direction; The second carrier is installed on the second lifting structure, and the second carrier is used to receive the silicon material on the first carrier.

4. The water quenching mechanism according to claim 3, characterized in that: Along the third direction, the first translation structure and the second translation structure are respectively arranged on two sides of the water tank; Wherein, the third direction is perpendicular to the first direction and the second direction respectively.

5. The water quenching mechanism according to claim 3, characterized in that: The first bearing member includes a plurality of first bearing plates, which are sequentially arranged at intervals along the third direction, and a first avoidance gap is provided between each two adjacent first bearing plates; The second bearing member includes a plurality of second bearing plates, the plurality of second bearing plates are sequentially arranged at intervals along the third direction, and a second avoidance gap is provided between each two adjacent second bearing plates; The second bearing member can move relative to the first bearing member, so that each of the first bearing plates is inserted into a corresponding second avoidance gap, and each of the second bearing plates is inserted into a corresponding first avoidance gap.

6. The water quenching mechanism according to claim 5, characterized in that: One end of a plurality of the first supporting plates facing the loading area is respectively connected to the first lifting structure, and one end of a plurality of the second supporting plates facing away from the loading area is respectively connected to the second lifting structure; or One end of a plurality of the first supporting plates facing the material unloading area is respectively connected to the first lifting structure, and one end of a plurality of the second supporting plates facing away from the material unloading area is respectively connected to the second lifting structure.

7. The water quenching mechanism according to any one of claims 1 to 6, characterized in that: The water quenching mechanism further includes a material unloading platform and a third carrier assembly, wherein the material unloading platform is arranged in the material unloading area, and the third carrier assembly is rotatably connected to the material unloading platform; The second transport assembly is used to transfer the silicon material on the first transport assembly to the third transport assembly, and the third transport assembly is used to transfer the silicon material to the unloading platform.

8. The water quenching mechanism according to claim 7, characterized in that: The third carrier assembly includes a third carrier, and the third carrier includes a plurality of third carrier plates arranged at intervals, and a third avoidance gap is provided between each two adjacent third carrier plates; The unloading table includes a plurality of fourth supporting plates, and a fourth avoidance gap is provided between each two adjacent fourth supporting plates. The third supporting member can move relative to the fourth supporting plates so that each third supporting plate is inserted into a corresponding fourth avoidance gap, and each fourth supporting plate is inserted into a corresponding third avoidance gap.

9. The water quenching mechanism according to claim 7, characterized in that: The water quenching mechanism further includes a fourth transport assembly, which is disposed between the water tank and the third transport assembly and is used to transfer the silicon material on the second transport assembly to the third transport assembly.

10. A silicon material processing equipment, characterized in that: It comprises a water quenching mechanism as claimed in any one of claims 1 to 9.

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