Temperature and pressure sensor

Abstract

The utility model relates to a temperature and pressure sensor, and the sensor comprises a pressure interface which is used for installing all parts; the shell is used for forming a mounting cavity with the pressure interface; the shell is connected with the pressure interface; the circuit board is used for signal conditioning; the circuit board is arranged in the mounting cavity; the pressure core body is used for sensing pressure; and the pressure core body is arranged on the pressure interface. The temperature and pressure sensor provided by the embodiment of the utility model solves the problems that the size of the front end of a pressure interface of a traditional temperature and pressure sensor is relatively long or the temperature response time is too slow and the structural stability is relatively poor, is convenient to install and simple in structure, avoids providing a new adaptation requirement for a client installation end, and improves the user experience. The application range and the external interference resistance of the temperature and pressure sensor are greatly improved.

Description

Technical Field

[0001] The present application relates to the field of sensors, and in particular to a temperature and pressure sensor. Background Art

[0002] Traditional temperature and pressure sensor designs mostly use a PT1000 chip resistor soldered into the internal pressure core, and finally lead out through the gold-plated lead posts of the core. However, this method has two problems: (1) The quality of manual soldering is uneven, resulting in poor product stability. Once the solder joint falls off due to the external environment, it will damage the internal pressure chip and cause product failure; (2) The temperature response is too slow. For gas temperature measurement, the gas temperature passes through the metal pressure interface, the dielectric isolation diaphragm on the pressure core, and then passes through the internal silicone oil to be transmitted to the PT1000 temperature resistor. The entire path is too long, resulting in a slow temperature dynamic response.

[0003] Traditional temperature and pressure sensors also use armored temperature resistors, which are welded to the front end of the pressure interface. Although the temperature response is very fast, this increases the front end size of the product to a certain extent, and also puts forward new requirements for the installation end. At the same time, the front end size is too long and there is an additional process welding point. In the process of repeated impact by high pressure, the structural stability has yet to be verified, so it needs to be improved. Utility Model Content

[0004] In order to solve the above technical problem or at least partially solve the above technical problem, the present application provides a temperature and pressure sensor.

[0005] In a first aspect, the present application provides a temperature and pressure sensor, comprising:

[0006] Pressure interface, used to install various parts;

[0007] A housing, used to form a mounting cavity with the pressure interface; the housing is connected to the pressure interface;

[0008] A circuit board, used for signal conditioning; the circuit board is arranged in the mounting cavity;

[0009] The pressure core is used to sense pressure; the pressure core is arranged on the pressure interface.

[0010] Preferably, a gas inlet port is provided at the bottom of the pressure interface.

[0011] Preferably, a thread is provided on the outer side wall of the gas inlet end.

[0012] Preferably, a temperature resistor is provided on the circuit board.

[0013] Preferably, the pressure interface and the pressure core are connected by laser welding.

[0014] Preferably, the pressure interface is connected to the housing by laser welding.

[0015] Preferably, the pressure interface is connected to the circuit board via screws.

[0016] The above technical solution provided by the embodiment of the present application has the following advantages compared with the prior art:

[0017] A temperature and pressure sensor provided in an embodiment of the present application solves the problems of a traditional temperature and pressure sensor having a long front-end size of a pressure interface, a slow temperature response time, and poor structural stability. At the same time, it is easy to install and has a simple structure, avoiding new adaptation requirements for the customer's installation end, and greatly improving the scope of application of the temperature and pressure sensor and its ability to resist external interference. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] The accompanying drawings herein are incorporated in and constitute a part of the specification, illustrate embodiments consistent with the present utility model, and together with the description, are used to explain the principles of the present utility model.

[0019] In order to more clearly illustrate the technical solutions in the embodiments of the utility model or the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, for ordinary technicians in this field, other drawings can be obtained based on these drawings without paying any creative labor.

[0020] Figure 1 A schematic diagram of the structure of a temperature and pressure sensor provided in an embodiment of the present application. DETAILED DESCRIPTION

[0021] In order to make the purpose, technical solution and advantages of the embodiments of the present application clearer, the technical solution in the embodiments of the present application will be clearly and completely described below in conjunction with the drawings in the embodiments of the present application. Obviously, the described embodiments are part of the embodiments of the present application, not all of the embodiments. Based on the embodiments in the present application, all other embodiments obtained by ordinary technicians in this field without making creative work are within the scope of protection of this application.

[0022] like Figure 1 , the present application provides a temperature and pressure sensor, comprising:

[0023] Pressure interface 1, used to install various parts;

[0024] The housing 2 is used to form a mounting cavity with the pressure interface 1; the housing 2 is connected to the pressure interface 1;

[0025] A circuit board 3 is used for signal conditioning; the circuit board 3 is arranged in the mounting cavity;

[0026] The pressure core 4 is used for sensing pressure; the pressure core 4 is arranged on the pressure interface 1 .

[0027] Specifically, the pressure interface 1 is used to connect to the gas outlet port of the object to be detected, the pressure core 4 is used to sense the gas pressure, and the circuit board 3 is used to calculate the detection value of the pressure core 4 .

[0028] In the embodiment of the present application, a gas inlet end 5 is provided at the bottom of the pressure interface 1 , and a thread is provided on the outer side wall of the gas inlet end 5 .

[0029] Specifically, the gas inlet port 5 is used to be connected to the gas outlet port of the object to be detected, and the thread is used to be screwed to the object to be detected.

[0030] In the embodiment of the present application, a temperature resistor 6 is provided on the circuit board 3 .

[0031] Specifically, the temperature resistor 6 is used to detect the gas temperature of the object to be detected.

[0032] In the embodiment of the present application, the pressure interface 1 and the pressure core 4 are connected by laser welding.

[0033] Specifically, the pressure core 4 is installed in the upper cavity of the pressure interface 1 and is reliably connected to the pressure interface 1 through laser welding. It is a key measuring component.

[0034] In the embodiment of the present application, the pressure interface 1 and the housing 2 are connected by laser welding.

[0035] Specifically, the housing 2 is installed in the upper cavity of the pressure interface 1 and is reliably connected to the pressure interface 1 through laser welding. The housing 2 is a key supporting component.

[0036] In the embodiment of the present application, the pressure interface 1 and the circuit board 3 are connected by screws.

[0037] Specifically, the circuit board 3 is installed in the upper cavity of the pressure interface 1 and is connected to the pressure interface 1 via screws, playing a role in signal conditioning and conversion.

[0038] A temperature and pressure sensor provided in an embodiment of the present application solves the problems of a traditional temperature and pressure sensor having a long front-end size of a pressure interface, a slow temperature response time, and poor structural stability. At the same time, it is easy to install and has a simple structure, avoiding new adaptation requirements for the customer's installation end, and greatly improving the scope of application of the temperature and pressure sensor and its ability to resist external interference.

[0039] It should be noted that, in this article, relational terms such as "first" and "second" are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Moreover, the terms "include", "comprise" or any other variants thereof are intended to cover non-exclusive inclusion, so that a process, method, article or device including a series of elements includes not only those elements, but also other elements not explicitly listed, or also includes elements inherent to such process, method, article or device. In the absence of further restrictions, the elements defined by the sentence "comprise a ..." do not exclude the existence of other identical elements in the process, method, article or device including the elements.

[0040] The above description is only a specific embodiment of the present invention, so that those skilled in the art can understand or implement the present invention. Various modifications to these embodiments will be obvious to those skilled in the art, and the general principles defined herein can be implemented in other embodiments without departing from the spirit or scope of the present invention. Therefore, the present invention will not be limited to the embodiments shown herein, but will conform to the widest scope consistent with the principles and novel features applied herein.

Claims

1. A temperature and pressure sensor, characterized in that: include: Pressure interface, used to install various parts; A housing, used to form a mounting cavity with the pressure interface; The housing is connected to the pressure interface; A circuit board, used for signal conditioning; the circuit board is arranged in the mounting cavity; A pressure core, used for sensing pressure; the pressure core is arranged on the pressure interface; A temperature resistor is arranged on the circuit board.

2. The temperature and pressure sensor according to claim 1, characterized in that: A gas inlet end is arranged at the bottom of the pressure interface.

3. The temperature and pressure sensor according to claim 2, characterized in that: The outer side wall of the gas inlet end is provided with threads.

4. The temperature and pressure sensor according to claim 1, characterized in that: The pressure interface and the pressure core are connected by laser welding.

5. The temperature and pressure sensor according to claim 1, characterized in that: The pressure interface is connected to the shell by laser welding.

6. The temperature and pressure sensor according to claim 1, characterized in that: The pressure interface is connected to the circuit board via screws.

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