Wafer cleaning device

Abstract

The utility model discloses a wafer cleaning device, which relates to the field of cleaning equipment and comprises a tank body and a rotating mechanism arranged in the tank body. The rotating mechanism comprises a rotating rod arranged in the length direction of the groove body and a transmission assembly arranged on the inner wall of the groove body, the rotating rod penetrates through the transmission assembly, the clamping plug is placed in the groove body so that the edge of the wafer can abut against the periphery of the rotating rod, the transmission assembly drives the rotating rod to rotate, and the clamping plug is arranged on the inner wall of the groove body. And the wafer is further driven to rotate in the clamping plug. The rotating rod is arranged in the groove body, the periphery of the rotating rod abuts against the edge of the wafer, the rotating rod is driven by the motor to rotate, the wafer rotates in the clamping plug, it is guaranteed that the edge of the wafer can be cleaned or etched by fully utilizing cleaning liquid through rotation, and defective products are avoided.

Description

Technical Field

[0001] The utility model relates to the field of cleaning equipment, in particular to a wafer cleaning device. Background Art

[0002] Wafer refers to the silicon chip used in the production of silicon semiconductor integrated circuits. Because of its round shape, it is called a wafer. During the production process, the wafer needs to be cleaned before annealing. The cleaning process is to clean the wafer in the alkaline cleaning tank in the alkaline cleaning area and the acid cleaning tank in the acid cleaning area under high temperature conditions.

[0003] At present, since wafers cannot be directly placed in a cleaning tank for cleaning or etching, a plug is usually provided for loading wafers and then placed in the cleaning tank for cleaning. A plurality of slots for placing wafers are provided on both sides of the plug, and the edges of the wafers are inserted into the slots for fixing, and then the plug is placed in the cleaning tank for cleaning or etching.

[0004] However, the portion of the wafer that is in direct contact with the cleaning liquid can be fully cleaned or etched. However, since part of the edge of the wafer is located in the slot or even in contact with the plug, the cleaning or etching effect of part of the edge is deviated and uneven, thereby affecting the yield of the wafer. Utility Model Content

[0005] Based on this, the purpose of the utility model is to provide a wafer cleaning device, which aims to solve the current problem that due to part of the edge of the wafer being located in the slot or even in contact with the plug, the cleaning or etching effect of part of the edge is deviated and uneven, thereby affecting the yield of the wafer.

[0006] To achieve the above-mentioned purpose, the utility model is implemented through the following technical solutions: a wafer cleaning device, comprising a tank body and a rotating mechanism arranged in the tank body;

[0007] The rotating mechanism includes a rotating rod arranged along the length direction of the trough body, and a transmission assembly arranged on the inner wall of the trough body. The rotating rod passes through the transmission assembly, and the plug is placed inside the trough body so that the edge of the wafer abuts against the outer periphery of the rotating rod. The transmission assembly drives the rotating rod to rotate, thereby driving the wafer to rotate in the plug.

[0008] In summary, according to a wafer cleaning device proposed by the utility model, a rotating rod is arranged in the slot body, and its outer periphery is pressed against the edge of the wafer, and the rotating rod is driven to rotate by a motor, so that the wafer rotates inside the plug, ensuring that the edge of the wafer can fully utilize the cleaning liquid for cleaning or etching through rotation, thereby avoiding the generation of defective products. Specifically, the wafer cleaning device includes a slot body and a rotating mechanism arranged in the slot body. The rotating mechanism includes a rotating rod arranged along the length direction of the slot body, and a transmission assembly arranged on the inner wall of the slot body, the rotating rod is penetrated in the transmission assembly, so that the transmission assembly can drive the rotating rod to rotate, and the plug is placed inside the slot body, so that the edge of the wafer is pressed against the outer periphery of the rotating rod, and the transmission assembly drives the rotating rod to rotate, thereby driving the wafer to rotate in the plug, so that the edge of the wafer can fully utilize the cleaning liquid for cleaning or etching through rotation, thereby improving the yield rate of the wafer.

[0009] Furthermore, the transmission assembly at least includes a first transmission member coaxially connected to the motor inside the trough body, and a second transmission member meshing with the first transmission member, and the rotating rod is disposed at the center of the second transmission member.

[0010] Furthermore, a vibration bracket is provided on the inner wall of the tank body, and the first transmission member and the second transmission member are provided on a side of the vibration bracket away from the motor to drive the rotating rod to vibrate.

[0011] Furthermore, at least two mounting bars parallel to the rotating rod are provided at the bottom of the trough body, and the mounting bars are provided on both sides of the rotating rod.

[0012] Furthermore, any of the installation bars is provided with a plurality of limiting blocks for installing the plug, and the plug is placed in a fixing space enclosed by the limiting blocks.

[0013] Furthermore, the slot of the slot body is also provided with a flap assembly, and the flap assembly includes a first flap and a second flap rotatably connected to the side of the slot body to close the internal space of the slot body.

[0014] Furthermore, the rotating rod is provided with a plurality of notches for avoiding the stuck edge.

[0015] Furthermore, a limiting portion is provided on one side of the plug close to the mounting bar, and the limiting portion is clamped in the limiting block.

[0016] Additional aspects and advantages of the present invention will be given in part in the following description, and in part will become apparent from the following description, or will be learned through the practice of the present invention. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] The above and / or additional aspects and advantages of the present invention will become apparent and easily understood from the description of the embodiments in conjunction with the following drawings, in which:

[0018] Figure 1 This is a schematic structural diagram of a wafer cleaning device in one embodiment of the utility model;

[0019] Figure 2 This is a schematic diagram of the internal structure of a wafer cleaning device in one embodiment of the utility model;

[0020] Figure 3 is a schematic diagram of the structure of the rotating rod;

[0021] Figure 4 Schematic diagram of the structure of the jam;

[0022] Figure 5 This is a bottom schematic diagram of the jam.

[0023] Component symbol description:

[0024] The trough body 100, the transmission mechanism 200, the rotating rod 210, the notch portion 211, the transmission assembly 220, the first transmission member 221, the second transmission member 222, the vibration bracket 300, the mounting bar 400, the limit block 500, the flip cover assembly 600, the first flip cover 610, the second flip cover 620, the plug 700, and the limit portion 710. DETAILED DESCRIPTION

[0025] In order to make the purpose, features and advantages of the utility model more obvious and easy to understand, the specific implementation methods of the utility model are described in detail below in conjunction with the accompanying drawings. Several embodiments of the utility model are given in the accompanying drawings. However, the utility model can be implemented in many different forms and is not limited to the embodiments described herein. On the contrary, the purpose of providing these embodiments is to make the disclosure of the utility model more thorough and comprehensive.

[0026] It should be noted that when an element is referred to as being "fixed on" another element, it may be directly on the other element or there may also be a central element. When an element is considered to be "connected to" another element, it may be directly connected to the other element or there may be a central element at the same time. The terms "vertical", "horizontal", "left", "right", "upper", "lower" and similar expressions used herein are for illustrative purposes only and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on the present utility model.

[0027] In the present invention, unless otherwise clearly specified and limited, the terms "installed", "connected", "connected", "fixed" and the like should be understood in a broad sense. For example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection, or it can be indirectly connected through an intermediate medium, or it can be internal communication between two components. For those of ordinary skill in the art, the specific meanings of the above terms in the present invention can be understood according to the specific circumstances. The term "and / or" used herein includes any and all combinations of one or more related listed items.

[0028] Please combine Figure 1-Figure 5 , which is a schematic structural diagram of a wafer cleaning device provided in one embodiment of the utility model, the wafer cleaning device comprises a tank body 100 and a transmission mechanism 200 disposed in the tank body 100, wherein:

[0029] In order to contain the cleaning liquid, the inner wall of the tank body 100 is sealed to prevent leakage of the cleaning liquid. In order to drive the transmission mechanism 200 to rotate, a motor is installed inside the tank body 100 to clean the wafer through the transmission mechanism 200. The transmission mechanism 200 includes a rotating rod 210 arranged along the length direction of the tank body 100, and a transmission assembly 220 arranged inside the tank body 100. The transmission assembly 220 is connected to the motor arranged in the tank body 100, so that the motor drives the transmission assembly 220 to rotate, thereby driving the rotating rod 210 to rotate.

[0030] In order to allow the wafer to rotate inside the plug 700, the rotating rod 210 passes through the bottom of the plug 700 and presses its circumferential surface against the edge of the wafer. The rotating rod 210 is driven to rotate by the transmission assembly 220, so that the edge of the wafer can fully contact the cleaning liquid to clean and etch its edge, thereby ensuring the yield rate of the wafer.

[0031] In order to allow the wafer to contact the circumferential surface of the rotating rod 210, the bottom of the plug 700 is hollowed out, the distance between its two side edges is smaller than the diameter of the wafer, and slots are provided on the two side edges one by one. When the wafer is placed in the slot, the lowest point of the wafer directly abuts against the circumferential surface of the rotating rod 210, thereby achieving the purpose of using the rotating rod 210 to drive the wafer to rotate.

[0032] Since the motor rotates too fast, in order to prevent the rotating rod 210 from rotating too fast and making it difficult to drive the wafer to rotate, a transmission assembly 220 is arranged on the inner wall of the tank body 100. The transmission assembly 220 at least includes a first transmission member 221 coaxially connected to the motor inside the tank body 100, and a second transmission member 222 meshingly connected to the first transmission member 221. The motor coaxially drives the first transmission member 221 to rotate. Since the second transmission member 222 meshes with the first transmission member 221, the second transmission member 222 rotates following the first transmission member 221. Since the rotating rod 210 is arranged at the center of the second transmission member 222, the rotating rod 210 is rotated.

[0033] Furthermore, in order to prevent the rotating rod 210 from rotating too fast, a multi-stage transmission member is usually provided. Since the diameters and circumferences of the transmission members are not equal, the rotation speed of the second transmission member 222 is controlled in this way. In this embodiment, the first transmission member 221 and the second transmission member 222 are both gears. The rotation speed of the rotating rod 210 can be controlled by setting gears of different diameters and circumferences, thereby ensuring that the rotating rod 210 can drive the wafer to rotate stably. It is worth noting that this solution is not limited to using gears as transmission members, but can also use transmission belts to connect, or other methods that can adjust the rotation speed, thereby ensuring that the edge of the wafer can be fully cleaned or etched.

[0034] In order to further enhance the degree of wafer cleaning or etching, a vibration bracket 300 is further provided between the transmission assembly 220 and the motor. When the rotating rod 210 drives the wafer to rotate, the vibration bracket 300 is vibrated while the rotating rod 210 is also vibrated, thereby causing the wafer inside the plug 700 to vibrate at the same time, thereby enhancing the vibration frequency of the wafer inside the cleaning liquid and improving the cleaning efficiency.

[0035] In order to fix the plug 700 inside the tank body 100, at least two mounting bars 400 parallel to the rotating rod 210 are provided at the bottom of the tank body 100, and the mounting bars 400 are provided on both sides of the rotating rod 210 for mounting the plug 700. In order to further fix the plug 700 on the mounting bars 400, a plurality of limit blocks 500 for mounting the plug 700 are provided on the mounting bars 400. In this embodiment, the limit blocks 500 are L-shaped brackets, and the number of the mounting bars 400 is two. Four limit blocks 500 together enclose a space for clamping, and a limit portion 710 is also provided at the bottom of the plug 700, and the limit blocks 500 are clamped in the limit portion 710, so that the plug 700 is clamped on the mounting bars 400, so as to avoid being separated from the mounting bars 400 during the wafer cleaning or etching process, so as to damage the wafer.

[0036] When the plug 700 is placed on the mounting bar 400 , in order to prevent the side of the plug 700 from pressing the rotating rod 210 and making it difficult for it to contact the edge of the wafer, a plurality of notches 211 are provided on the rotating rod 210 to avoid the plug 700 .

[0037] It is worth emphasizing that the slot of the trough body 100 is also provided with a flip cover assembly 600, and the flip cover assembly 600 includes a first flip cover 610 and a second flip cover 620 which are rotatably connected to the side of the trough body 100. When it is in a shutdown state or a working state, the first flip cover 610 and the second flip cover 620 are closed to prevent other liquid medicine from falling into the trough body 100 and contaminating the liquid medicine. When the pharmaceutical trough needs to be used, the first flip cover 610 and the second flip cover 620 are opened, and the plug 700 is inserted.

[0038] In summary, according to a wafer cleaning device proposed by the utility model, a rotating rod is arranged in the slot body, and its outer periphery is pressed against the edge of the wafer, and the rotating rod is driven to rotate by a motor, so that the wafer rotates inside the plug, ensuring that the edge of the wafer can fully utilize the cleaning liquid for cleaning or etching through rotation, thereby avoiding the generation of defective products. Specifically, the wafer cleaning device includes a slot body and a rotating mechanism arranged in the slot body. The rotating mechanism includes a rotating rod arranged along the length direction of the slot body, and a transmission assembly arranged on the inner wall of the slot body, the rotating rod is penetrated in the transmission assembly, so that the transmission assembly can drive the rotating rod to rotate, and the plug is placed inside the slot body, so that the edge of the wafer is pressed against the outer periphery of the rotating rod, and the transmission assembly drives the rotating rod to rotate, thereby driving the wafer to rotate in the plug, so that the edge of the wafer can fully utilize the cleaning liquid for cleaning or etching through rotation, thereby improving the yield rate of the wafer.

[0039] In the description of this specification, the description with reference to the terms "one embodiment", "some embodiments", "example", "specific example", or "some examples" means that the specific features, structures, materials or characteristics described in conjunction with the embodiment or example are included in at least one embodiment or example of the utility model. In this specification, the schematic representation of the above terms does not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials or characteristics described can be combined in any one or more embodiments or examples in a suitable manner.

[0040] The above-mentioned embodiments only express several implementation methods of the utility model, and the descriptions are relatively specific and detailed, but they cannot be understood as limiting the scope of the utility model patent. It should be pointed out that for ordinary technicians in this field, several modifications and improvements can be made without departing from the concept of the utility model, which all belong to the protection scope of the utility model. Therefore, the protection scope of the utility model patent shall be based on the attached claims.

Claims

1. A wafer cleaning device, characterized in that: It comprises a tank body and a rotating mechanism arranged in the tank body; The rotating mechanism includes a rotating rod arranged along the length direction of the trough body, and a transmission assembly arranged on the inner wall of the trough body. The rotating rod passes through the transmission assembly, and the plug is placed inside the trough body so that the edge of the wafer abuts against the outer periphery of the rotating rod. The transmission assembly drives the rotating rod to rotate, thereby driving the wafer to rotate in the plug.

2. The wafer cleaning device according to claim 1, characterized in that: The transmission assembly at least includes a first transmission member coaxially connected to the motor inside the tank body, and a second transmission member meshing with the first transmission member, and the rotating rod is arranged at the center of the second transmission member.

3. The wafer cleaning device according to claim 2, characterized in that: A vibration bracket is disposed on the inner wall of the tank body, and the first transmission member and the second transmission member are disposed on a side of the vibration bracket away from the motor to drive the rotating rod to vibrate.

4. The wafer cleaning device according to claim 1, characterized in that: At least two mounting bars parallel to the rotating rod are arranged at the bottom of the trough body, and the mounting bars are arranged on both sides of the rotating rod.

5. The wafer cleaning device according to claim 4, characterized in that: Any of the installation bars is provided with a plurality of limiting blocks for installing the plug, and the plug is placed in a fixing space enclosed by the limiting blocks.

6. The wafer cleaning device according to claim 1, characterized in that: The slot of the slot body is also provided with a flap assembly, and the flap assembly includes a first flap and a second flap rotatably connected to the side of the slot body to close the internal space of the slot body.

7. The wafer cleaning device according to claim 1, characterized in that: The rotating rod is provided with a plurality of notches for avoiding the jamming edge.

8. The wafer cleaning device according to claim 7, characterized in that: A limiting portion is provided on one side of the plug close to the mounting bar, and the limiting portion is clamped in the limiting block.

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