Equipment integrating dispensing and die bonding

Abstract

The utility model discloses equipment integrating glue dispensing and die bonding. The equipment comprises a rack, a feeding module, a glue dispensing workbench, a glue dispensing module, a die bonding workbench, a die supply module, a welding head module and a discharging module, the feeding module is used for placing a bracket on the dispensing workbench, the dispensing module is used for dispensing the bracket on the dispensing workbench, the die bonding workbench is used for receiving the bracket from the dispensing workbench, and the wafer supply module is used for providing a wafer; the welding head module comprises a driver, a swing arm, a welding head and a power device, the welding head is fixed to the swing arm, the driver is used for driving the swing arm to rotate, the swing arm rotates to drive the welding head to move to the position above the crystal supply module or the crystal fixing workbench, and the power device is used for pushing the swing arm to deform downwards. The swing arm has elasticity for automatically resetting upwards; the blanking module is used for blanking the bracket on the die bonding workbench to a preset position; the problem of how to improve the efficiency of the die bonding process is mainly solved.

Description

Technical Field

[0001] The utility model relates to the technical field of crystal bonding, in particular to a device integrating glue dispensing and crystal bonding. Background Art

[0002] The die bonding process is to first use a glue dispenser to dispense glue on the position where the chip is installed on the bracket, then move the glue-coated bracket to the die bonding station, then the swing arm picks up the chip from the chip supply module and drives the chip to rotate to the position of the bracket, and finally the swing arm drives the chip down so that the chip is fixed on the bracket through the glue to complete the die bonding process.

[0003] In the prior art, the glue dispensing of the bracket and the fixing of the wafer are two separate devices. The bracket first completes the glue dispensing on one device, and then goes to another device to complete the crystal bonding. In this process, the feeding time of the bracket is additionally increased, so that the total time consumed by the crystal bonding process is relatively long, and the crystal bonding efficiency needs to be improved. In addition, the lifting drive (used to drive the swing arm to lift so that the swing arm can absorb the wafer or place the wafer on the bracket) and the rotation drive (used to drive the swing arm to rotate so that the swing arm can switch back and forth between the crystal supply module and the bracket) inside the existing swing arm for crystal bonding are connected together, that is, the rotation drive drives the lifting drive and the swing arm to lift together at the same time. In particular, when multiple sets of lifting drives and multiple swing arms are set to improve the crystal bonding efficiency, the overall structure is very bulky, and the moment of inertia during rotation is very large, which makes the load of the rotation drive large, thereby causing a certain impact on the rotation accuracy and rotation rate of the rotation drive, thereby affecting the crystal bonding efficiency and the stability of the crystal bonding process. Utility Model Content

[0004] The purpose of the utility model is to provide a device integrating dispensing and crystal bonding, mainly to solve the technical problem of how to improve the working efficiency of the crystal bonding process.

[0005] To achieve this purpose, the utility model adopts the following technical solutions:

[0006] A device integrating dispensing and crystal bonding, comprising a frame and a loading module, a dispensing workbench, a dispensing module, a crystal bonding workbench, a crystal supply module, a welding head module and a dispensing module respectively arranged on the frame;

[0007] The loading module is used to automatically place the bracket on the dispensing workbench, the dispensing module is used to dispense glue on the bracket on the dispensing workbench, the crystal bonding workbench is used to receive the bracket from the dispensing workbench, and the crystal supply module is used to automatically provide the wafer;

[0008] The welding head module comprises a driver, a swing arm, a welding head and a power device, the driver and the power device are both connected to the frame, the welding head is fixed to the swing arm, the driver is connected to the swing arm and is used to drive the swing arm to rotate, the swing arm rotation is used to drive the welding head to move above the crystal supply module or the crystal bonding workbench, the welding head is used to pick up the wafer from the crystal supply module, the power device is used to push the swing arm to deform downward, so that the welding head can pick up the wafer downward or can apply downward pressure to the wafer so that the wafer can be fixed on the bracket, and the swing arm has the elasticity of automatically resetting upward;

[0009] The unloading module is used to unload the bracket on the die-bonding workbench to a preset position.

[0010] In one of the technical solutions, the dispensing module includes at least two sets of dispensing mechanisms, each set of the dispensing mechanisms includes a connected driving device and a dispensing head, the driving device is used to drive the dispensing head to move in three axes, and the dispensing heads on multiple sets of the dispensing mechanisms are used to dispense glue to the bracket located on the dispensing workbench.

[0011] In one of the technical solutions, the driving device includes a first linear module, a second linear module and a third linear module which are connected in sequence, the first linear module is connected to the frame, the third linear module is connected to the dispensing head, and the first linear module, the second linear module and the third linear module are linked together to drive the dispensing head to move in three axes in space.

[0012] In one of the technical solutions, the dispensing workbench or the solid crystal workbench includes an X-axis module, a Y-axis module and a conveying mechanism connected in sequence, the X-axis module is connected to the frame, the X-axis module and the Y-axis module jointly drive the conveying mechanism to perform two-axis planar movement in the horizontal direction, and the conveying mechanism is used to carry the bracket and drive the bracket to move.

[0013] In one of the technical solutions, the power device includes a screw module, a lifting block, a spring and a pressure block;

[0014] The screw module is connected to the frame, the screw module is connected to the lifting block and is used to drive the lifting block to move in the vertical direction, the pressure block is slidably connected to the frame in the vertical direction, the spring is arranged between the lifting block and the pressure block and is used to apply a downward elastic force to the pressure block, and the pressure block is used to push the swing arm to deform downward.

[0015] In one of the technical solutions, the swing arm includes a main body and at least one elastic member arranged on the main body, the driver is connected to the main body and is used to drive the main body to rotate, each of the elastic members is connected to the welding head, and the power device is used to push the elastic member to deform downward.

[0016] In one of the technical solutions, the elastic member includes two carbon fiber plates, the two carbon fiber plates are arranged at intervals in the vertical direction, and the welding heads are connected to the two carbon fiber plates at the same time.

[0017] In one of the technical solutions, two elastic members are connected to the main body. When the main body rotates, one of the elastic members is located above the crystal supply module, and the other elastic member is located above the crystal bonding workbench.

[0018] A power device is arranged above each of the two elastic members, one of the power devices is used to push one of the elastic members to deform downward, and the other power device is used to push the other elastic member to deform downward.

[0019] In one of the technical solutions, the crystal supply module includes a wafer moving device and a pin mechanism respectively connected to the frame; the wafer moving device is used to drive the wafer to move on the horizontal plane and rotate around the vertical direction as the axis, and there are multiple chips on the wafer. The pin mechanism is located in the middle of the wafer moving device and is used to eject the chips on the wafer upward.

[0020] In one of the technical solutions, the wafer moving device includes a first lateral shifting module, a second lateral shifting module, a film expansion mechanism and a blue film which are connected in sequence, the blue film is used to carry the wafer, the film expansion mechanism is connected to the blue film and is used to drive the blue film to deform downward, and the first lateral shifting module and the second lateral shifting module are used to jointly drive the film expansion mechanism and the blue film to move on a horizontal plane;

[0021] The ejector mechanism is located in the middle of the film expansion mechanism, and includes a first fine-tuning module, a second fine-tuning module, a lifting mechanism and an ejector which are sequentially connected. The first fine-tuning module and the second fine-tuning module are used to jointly drive the lifting mechanism and the ejector to move on a horizontal plane, and the lifting mechanism is used to drive the ejector to move in a vertical direction. The ejector moves upward to eject the chip on the wafer.

[0022] Compared with the prior art, the device integrating dispensing and crystal bonding provided by the utility model has at least the following beneficial effects:

[0023] When the equipment is working, the loading module automatically moves the bracket to the dispensing workbench, and then the dispensing module performs dispensing operation on the bracket on the dispensing workbench, so that the designated positions on the surface of the bracket are all coated with adhesive. Then the bracket on the dispensing workbench is transferred to the crystal bonding workbench, and then the power device in the welding head module drives the swing arm to deform downward, so that the welding head descends and picks up the chip from the crystal supply module, and then the driver drives the swing arm to rotate to the top of the crystal bonding workbench, and then the power device drives the swing arm to deform downward, so that the welding head descends and presses the chip on the bracket. At this time, the chip will be bonded to the chip through the adhesive to realize the crystal bonding process of the chip, and finally the unloading module unloads the bracket with the chip fixed to the preset position.

[0024] This solution integrates the dispensing of the bracket and the fixing of the chip on the same device to improve the chip bonding efficiency. Moreover, the driver for driving the swing arm to rotate and the power device for driving the swing arm to descend are separately connected. It can be understood that the power device of this solution is only used to drive the welding head to descend and is not used to drive the welding head to move upward. The upward movement of the welding head is achieved by the elasticity of the swing arm itself, so that the driver no longer bears the load of the power device. Therefore, the speed at which the driver drives the swing arm to rotate is improved, and the driving accuracy of the driver is also guaranteed due to the lighter load. While improving the bonding efficiency, the stability of the bonding process is also improved. BRIEF DESCRIPTION OF THE DRAWINGS

[0025] In order to more clearly illustrate the embodiments of the utility model or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the utility model. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative labor.

[0026] Figure 1 A schematic diagram of the structure of a device integrating dispensing and die bonding provided in an embodiment of the present application;

[0027] Figure 2 A schematic diagram of the structure of a dispensing workbench or a die bonding workbench provided in an embodiment of the present application;

[0028] Figure 3 A schematic diagram of the structure of the dispensing module provided in the embodiment of the present application;

[0029] Figure 4 A structural exploded diagram of a wafer supply module provided in an embodiment of the present application;

[0030] Figure 5 A structural exploded diagram of a wafer moving device provided in an embodiment of the present application;

[0031] Figure 6 An exploded view of the structure of the ejector mechanism provided in the embodiment of the present application;

[0032] Figure 7 A structural exploded diagram of a welding head module provided in an embodiment of the present application;

[0033] Figure 8 for Figure 7 A partial enlarged view of the middle A;

[0034] Fig. 9 A schematic diagram of the structure of the swing arm and two welding heads when they are connected in an embodiment of the present application.

[0035] Among them, the reference numerals in the figure are:

[0036] 1. Frame; 2. Loading module;

[0037] 3. Glue dispensing workbench; 31. X-axis module; 32. Y-axis module; 33. Conveying mechanism;

[0038] 4. Glue dispensing module; 41. Glue dispensing mechanism; 411. Driving device; 4111. First linear module; 4112. Second linear module; 4113. Third linear module; 412. Glue dispensing head;

[0039] 5. Crystal bonding workbench; 6. Crystal supply module; 61. Wafer moving device; 611. First lateral shift module; 612. Second lateral shift module; 613. Film expansion mechanism; 62. Ejector mechanism; 621. First fine-tuning module; 622. Second fine-tuning module; 623. Elevating mechanism; 624. Ejector;

[0040] 7. Welding head module; 71. Driver; 72. Swing arm; 721. Main body; 722. Elastic part; 7221. Carbon fiber plate; 73. Welding head; 74. Power device; 741. Screw module; 742. Lifting block; 743. Spring; 744. Pressing block; 8. Unloading module. DETAILED DESCRIPTION

[0041] In order to make the technical problems, technical solutions and beneficial effects to be solved by the present application more clearly understood, the present application is further described in detail below in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are only used to explain the present application and are not used to limit the present application.

[0042] It should be noted that when an element is referred to as being "fixed to" or "disposed on" another element, it can be directly on the other element or indirectly on the other element. When an element is referred to as being "connected to" another element, it can be directly connected to the other element or indirectly connected to the other element.

[0043] It should be understood that the orientations or positional relationships indicated by terms such as "upper", "lower", "top", "bottom", "inside", and "outside" are based on the orientations or positional relationships shown in the accompanying drawings and are only for the convenience of describing the present application and simplifying the description. They do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as a limitation on the present application.

[0044] In addition, the terms "first" and "second" are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of the features. In the description of this application, the meaning of "plurality" is two or more, unless otherwise clearly and specifically defined.

[0045] In order to make the purpose, technical solutions and advantages of the present invention more clearly understood, the present invention is further described in detail below in conjunction with the accompanying drawings and embodiments.

[0046] See also Figure 1 The present embodiment provides a device integrating glue dispensing and crystal bonding, including a frame 1 and a loading module 2, a glue dispensing workbench 3, a glue dispensing module 4, a crystal bonding workbench 5, a crystal supply module 6, a welding head module 7 and a unloading module 8 which are respectively arranged on the frame 1.

[0047] During operation, the loading module 2 automatically places the bracket on the dispensing workbench 3, and then the dispensing module 4 dispenses glue to the preset position of the bracket on the dispensing workbench 3, so that the designated position on the surface of the bracket has adhesive glue, and then the bracket is transferred from the dispensing workbench 3 to the crystal bonding workbench 5. At the same time, the crystal supply module 6 automatically provides the chip, and the welding head module 7 picks up the chip from the crystal supply module 6 and places the chip on the bracket located on the crystal bonding workbench 5, so that the chip and the bracket are bonded to each other. When a preset number of chips are bonded to the bracket, the unloading module 8 finally unloads the bracket on the crystal bonding workbench 5 that has been bonded to the preset position. It can be seen that this solution integrates the dispensing of the bracket and the fixing of the chip on the same device to improve the crystal bonding efficiency of the chip.

[0048] Each module is described in detail below with reference to the accompanying drawings.

[0049] Please refer again Figure 1 The loading module 2 and the unloading module 8 are common prior arts, which may be structures that use a robot to automatically load and unload materials. They may also include a storage bin to automatically store more brackets and provide the brackets for feeding out one by one or automatically collecting the brackets one by one.

[0050] See also Figure 2, the glue dispensing workbench 3 specifically includes an X-axis module 31, a Y-axis module 32 and a conveying mechanism 33 connected in sequence, wherein the conveying mechanism 33 is used to carry the bracket and drive the bracket to move, so that the bracket can come to the predetermined position of the conveying mechanism 33, and the bracket can be transferred to the solid crystal workbench 5 under the drive of the conveying mechanism 33. The X-axis module 31 is connected to the frame 1, and the X-axis module 31 and the Y-axis module 32 are used to jointly drive the conveying mechanism 33 to make a two-axis plane movement in the horizontal direction, so that multiple positions on the bracket located at the conveying mechanism 33 can be located directly below the glue dispensing module 4, that is, the glue dispensing module 4 can dispense glue at multiple positions on the bracket, so that the bracket can subsequently fix a large number of wafers. Among them, the X-axis module 31 and the Y-axis module 32 can be screw modules, synchronous belt modules or linear motors, etc., and the conveying mechanism 33 can be a belt conveyor line or a roller conveyor line.

[0051] Please also read Figure 1 and Figure 2 The structure of the crystal bonding workbench 5 is preferably the same as that of the glue dispensing workbench 3, so that the crystal bonding workbench 5 can also drive the bracket to make two-axis planar movement in the horizontal direction, so that the welding head module 7 can place chips at multiple different positions of the bracket, and when the conveying mechanism 33 on the crystal bonding workbench 5 and the conveying mechanism 33 on the glue dispensing workbench 3 are connected to each other, the conveying mechanism 33 on the crystal bonding workbench 5 can receive the bracket from the glue dispensing workbench 3, and the conveying mechanism 33 on the crystal bonding workbench 5 can also send the bracket that has completed crystal bonding to the direction of the unloading module 8, so that the unloading module 8 can unload the bracket that has completed crystal bonding.

[0052] See also Figure 3The dispensing module 4 specifically includes at least two dispensing mechanisms 41, each dispensing mechanism 41 includes a connected driving device 411 and a dispensing head 412, and the driving device 411 specifically includes a first linear module 4111, a second linear module 4112 and a third linear module 4113 which are connected in sequence, wherein the first linear module 4111 is connected to the frame 1, and the third linear module 4113 is connected to the above-mentioned dispensing head 412, and through the joint linkage of the first linear module 4111, the second linear module 4112 and the third linear module 4113, the dispensing head 412 can be driven to move in three-axis space, so that the dispensing head 412 can accurately dispense glue at a predetermined position on the bracket at a suitable height position. Since the dispensing head 412 in each dispensing mechanism 41 can independently move in three-axis space, the dispensing module 4 can simultaneously accurately dispense glue at multiple positions on the bracket, so as to greatly improve the efficiency of dispensing. When the dispensing workbench 3 drives the bracket to move on the plane and each set of dispensing mechanism 41 dispenses glue to the bracket at the same time, the dispensing module 4 can quickly and accurately complete the dispensing at various positions of the bracket. Among them, the first linear module 4111, the second linear module 4112 and the third linear module 4113 can all be screw modules, synchronous belt modules or linear motors.

[0053] See also Figure 4 The wafer supply module 6 specifically includes a wafer moving device 61 and a pin mechanism 62. The wafer moving device 61 and the pin mechanism 62 are respectively connected to the frame 1. The wafer moving device 61 is used to drive the wafer to move on the horizontal plane. The wafer moving device 61 is also used to rotate with the vertical direction as the axis. There are multiple chips on the wafer. The pin mechanism 62 is located in the middle of the wafer moving device 61 and is used to eject the chips on the wafer upward.

[0054] See also Figure 5The wafer moving device 61 specifically includes a first lateral moving module 611, a second lateral moving module 612, a film expanding mechanism 613 and a blue film (not shown in the figure) which are connected in sequence, wherein the blue film is used to carry the wafer, the film expanding mechanism 613 is connected to the blue film and is used to drive the blue film to deform downward so as to tighten the blue film downward, thereby facilitating the welding head module 7 to pick up the chip from the wafer, and the first lateral moving module 611 and the second lateral moving module 612 are used to jointly drive the film expanding mechanism 613 and the blue film to move together on the horizontal plane, so as to drive the wafer on the film expanding mechanism 613 to move in a plane, so that the chip at the specified position on the wafer can be located directly above the ejector pin mechanism 62, thereby facilitating the chip at the specified position on the wafer to be ejected upward by the ejector pin mechanism 62. Among them, the first transverse moving module 611 and the second transverse moving module 612 can be a screw module, a synchronous belt module or a linear motor, etc., and the film expansion mechanism 613 can be a structural design of a screw nut. The screw can be driven up and down by rotating the drive nut. When the screw and the blue film are fixed, the function of tightening the blue film downward can be achieved.

[0055] See also Figure 6 The ejector mechanism 62 is located in the middle of the film expansion mechanism 613. The ejector mechanism 62 specifically includes a first fine-tuning module 621, a second fine-tuning module 622, an ejection mechanism 623 and an ejector 624 which are connected in sequence. The first fine-tuning module 621 and the second fine-tuning module 622 are used to jointly drive the ejection mechanism 623 and the ejector 624 to move on the horizontal plane, so that the ejector 624 can accurately move to the position directly below the wafer to be ejected, and the ejection mechanism 623 is used to drive the ejector 624 to move in the vertical direction. When the ejector 624 moves upward, the ejector 624 can eject the wafer on the wafer, so that the wafer is separated from the wafer and taken out by the welding head module 7. Among them, the first fine-tuning module 621, the second fine-tuning module 622 and the ejection mechanism 623 can be a screw module, a synchronous belt module or a linear motor.

[0056] Please also read Figures 7 to 9The welding head module 7 specifically includes a driver 71, a swing arm 72, a welding head 73 and a power device 74, wherein the driver 71 and the power device 74 are separately connected to the frame 1, the welding head 73 is fixed on the swing arm 72, the driver 71 is connected to the swing arm 72 and is used to drive the swing arm 72 to rotate with the vertical direction as the axis, and the rotation of the swing arm 72 is used to drive the welding head 73 to reciprocate between the crystal supply module 6 and the crystal bonding workbench 5, that is, the welding head 73 can be moved to the top of the crystal supply module 6 or the crystal bonding workbench 5. There are two power devices 74, one of which is located above the crystal supply module 6, and the other is located above the crystal fixing workbench 5. When the welding head 73 is located above the crystal supply module 6, one of the power devices 74 will push the swing arm 72 to deform downward, so that the welding head 73 can pick up the wafer from the crystal supply module 6; when the welding head 73 is located above the crystal fixing workbench 5, the other power device 74 will push the swing arm 72 to deform downward, so that the welding head 73 can apply downward pressure to the wafer and fix the wafer on the bracket. The swing arm 72 has the elasticity of automatically resetting upward. When the power device 74 resets upward without applying downward pressure to the swing arm 72, the swing arm 72 will automatically reset upward due to its own elasticity. Among them, the driver 71 can be a rotary cylinder, a stepper motor or a servo motor, etc., and the power device 74 can be a screw module, a synchronous belt module or a linear motor, etc.

[0057] This paragraph supplements the content of the previous paragraph. In this solution, the driver 71 used to drive the swing arm 72 to rotate and the power device 74 used to drive the swing arm 72 to descend are separately connected. It can be understood that the power device 74 of this solution is only used to drive the welding head 73 to descend and is not used to drive the welding head 73 to move upward. The upward movement of the welding head 73 is achieved by the elasticity of the swing arm 72 itself, so that the driver 71 no longer bears the load of the power device 74. Therefore, the speed at which the driver 71 drives the swing arm 72 to rotate is improved, and the driving accuracy of the driver 71 is also guaranteed due to the light load. While improving the efficiency of the solid crystal, the stability of the solid crystal process is also improved.

[0058] Please read again Figures 7 to 9The power device 74 specifically includes a screw module 741, a lifting block 742, a spring 743 and a pressure block 744, wherein the screw module 741 is connected to the frame 1, the screw module 741 is connected to the lifting block 742 and is used to drive the lifting block 742 to move in the vertical direction, and the pressure block 744 is slidably connected to the frame 1 in the vertical direction, and the spring 743 is arranged between the lifting block 742 and the pressure block 744 and is used to apply a downward elastic force to the pressure block 744. When the lifting block 742 moves downward under the drive of the screw module 741, the lifting block 742 drives the pressure block 744 to move downward together through the spring 743, so that the pressure block 744 can The spring 743 is provided between the lifting block 742 and the pressing block 744, so that the pressing block 744 can apply downward pressure to the swing arm 72 in an elastic contact manner, thereby avoiding the problem that the pressing block 744 acts on the swing arm 72 in a hard contact manner, causing the welding head 73 to apply excessive force to the wafer, thereby avoiding the phenomenon that the welding head 73 causes damage to the wafer when picking up the wafer or fixing the wafer on the bracket.

[0059] Please read again Figures 7 to 9 The swing arm 72 specifically includes a main body 721 and at least one elastic member 722 arranged on the main body 721. The driver 71 is connected to the main body 721 and is used to drive the main body 721 to rotate along the vertical axis. Each elastic member 722 is connected to a welding head 73. The above-mentioned power device 74 is used to push the elastic member 722 to deform downward so that the welding head 73 can move downward. When the power device 74 resets upward without applying pressure to the elastic member 722, the elastic member 722 will automatically reset upward due to its own elasticity. In this embodiment, two elastic members 722 are preferably connected to the main body 721. When the main body 721 rotates, one of the elastic members 722 is located above the crystal supply module 6, and the other elastic member 722 is located above the crystal bonding workbench 5, so that the welding heads 73 on the two elastic members 722 can operate at the same time, that is, while the welding head 73 on one of the elastic members 722 picks up the wafer on the crystal supply module 6, the welding head 73 on the other elastic member 722 presses the wafer down to fix the wafer on the bracket, thereby improving the efficiency of crystal bonding. Of course, in order to enable the welding heads 73 on the two elastic members 722 to operate at the same time, the above-mentioned power device 74 needs to be set above the two elastic members 722, one of the power devices 74 is used to push one of the elastic members 722 to deform downward, and the other power device 74 is used to push the other elastic member 722 to deform downward.

[0060] Please read again Figures 7 to 9The elastic member 722 specifically includes two carbon fiber plates 7221, and the two carbon fiber plates 7221 are arranged at intervals in the vertical direction. A welding head 73 is connected to the two carbon fiber plates 7221 at the same time. Because the carbon fiber plates 7221 still have good elasticity after being subjected to multiple forces, the reliability of the welding head 73 being able to reset upward after working for a long time can be improved. By using two carbon fiber plates 7221 arranged at intervals in the vertical direction to fix a welding head 73, the problem of excessive rotation of the welding head 73 when moving downward can be solved, ensuring that the welding head 73 moves downward in a vertical posture as much as possible, so as to improve the stability of the welding head 73 picking up the chip and the stability of the welding head 73 applying downward force to the chip to accurately bond the chip to the bracket.

[0061] The above are only preferred embodiments of the present invention, and only specifically describe the technical principles of the present invention. These descriptions are only for the purpose of explaining the principles of the present invention, and cannot be interpreted as limiting the scope of protection of the present invention in any way. Based on the explanation here, any modifications, equivalent substitutions and improvements made within the spirit and principles of the present invention, and other specific implementation methods of the present invention that can be associated with by technicians in this field without creative labor, should be included in the scope of protection of the present invention.

Claims

1. A device integrating dispensing and crystal bonding, characterized in that: It includes a frame and a loading module, a dispensing workbench, a dispensing module, a crystal bonding workbench, a crystal supply module, a welding head module and a unloading module respectively arranged on the frame; The loading module is used to automatically place the bracket on the dispensing workbench, the dispensing module is used to dispense glue on the bracket on the dispensing workbench, the crystal bonding workbench is used to receive the bracket from the dispensing workbench, and the crystal supply module is used to automatically provide the wafer; The welding head module comprises a driver, a swing arm, a welding head and a power device, the driver and the power device are both connected to the frame, the welding head is fixed to the swing arm, the driver is connected to the swing arm and is used to drive the swing arm to rotate, the swing arm rotation is used to drive the welding head to move above the crystal supply module or the crystal bonding workbench, the welding head is used to pick up the wafer from the crystal supply module, the power device is used to push the swing arm to deform downward, so that the welding head can pick up the wafer downward or can apply downward pressure to the wafer so that the wafer can be fixed on the bracket, and the swing arm has the elasticity of automatically resetting upward; The unloading module is used to unload the bracket on the die-bonding workbench to a preset position.

2. The device integrating dispensing and bonding as claimed in claim 1, characterized in that: The dispensing module includes at least two sets of dispensing mechanisms, each set of the dispensing mechanisms includes a connected driving device and a dispensing head, the driving device is used to drive the dispensing head to move in three axes, and the dispensing heads on multiple sets of the dispensing mechanisms are used to dispense glue to the bracket located on the dispensing workbench.

3. The device integrating dispensing and bonding as claimed in claim 2, characterized in that: The driving device includes a first linear module, a second linear module and a third linear module which are connected in sequence, the first linear module is connected to the frame, the third linear module is connected to the dispensing head, and the first linear module, the second linear module and the third linear module are linked together to drive the dispensing head to move in three-axis space.

4. The device integrating dispensing and bonding as claimed in claim 1, characterized in that: The dispensing workbench or the solid crystal workbench includes an X-axis module, a Y-axis module and a conveying mechanism connected in sequence, the X-axis module is connected to the frame, the X-axis module and the Y-axis module are used to jointly drive the conveying mechanism to perform two-axis planar movement in the horizontal direction, and the conveying mechanism is used to carry the bracket and drive the bracket to move.

5. The device integrating dispensing and bonding as claimed in claim 1, characterized in that: The power device includes a screw module, a lifting block, a spring and a pressure block; The screw module is connected to the frame, the screw module is connected to the lifting block and is used to drive the lifting block to move in the vertical direction, the pressure block is slidably connected to the frame in the vertical direction, the spring is arranged between the lifting block and the pressure block and is used to apply a downward elastic force to the pressure block, and the pressure block is used to push the swing arm to deform downward.

6. The device integrating dispensing and bonding as claimed in claim 1, characterized in that: The swing arm includes a main body and at least one elastic member arranged on the main body, the driver is connected to the main body and is used to drive the main body to rotate, each of the elastic members is connected to the welding head, and the power device is used to push the elastic member to deform downward.

7. The device integrating dispensing and bonding as claimed in claim 6, characterized in that: The elastic member comprises two carbon fiber plates, the two carbon fiber plates are arranged at intervals in the vertical direction, and the welding heads are connected to the two carbon fiber plates at the same time.

8. The device integrating dispensing and bonding as claimed in claim 6, characterized in that: The main body is connected with two elastic members, and when the main body rotates, one of the elastic members is located above the crystal supply module, and the other elastic member is located above the crystal bonding workbench; A power device is arranged above each of the two elastic members, one of the power devices is used to push one of the elastic members to deform downward, and the other power device is used to push the other elastic member to deform downward.

9. The device integrating dispensing and bonding as claimed in claim 1, characterized in that: The wafer supply module includes a wafer moving device and a pin mechanism respectively connected to the frame; the wafer moving device is used to drive the wafer to move on the horizontal plane and rotate with the vertical direction as the axis, and there are multiple chips on the wafer. The pin mechanism is located in the middle of the wafer moving device and is used to eject the chips on the wafer upwards.

10. The device integrating dispensing and bonding as claimed in claim 9, characterized in that: The wafer moving device comprises a first lateral shifting module, a second lateral shifting module, a film expansion mechanism and a blue film which are connected in sequence, the blue film is used to carry the wafer, the film expansion mechanism is connected to the blue film and is used to drive the blue film to deform downward, and the first lateral shifting module and the second lateral shifting module are used to jointly drive the film expansion mechanism and the blue film to move on a horizontal plane; The ejector mechanism is located in the middle of the film expansion mechanism, and includes a first fine-tuning module, a second fine-tuning module, a lifting mechanism and an ejector which are sequentially connected. The first fine-tuning module and the second fine-tuning module are used to jointly drive the lifting mechanism and the ejector to move on a horizontal plane, and the lifting mechanism is used to drive the ejector to move in a vertical direction. The ejector moves upward to eject the chip on the wafer.

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