Semiconductor structure and semiconductor package

Abstract

The embodiment of the utility model relates to a semiconductor structure and a semiconductor package. The embodiment of the utility model relates to a semiconductor structure, comprising a first electric waveguide which is made of a first dielectric material and is configured to transmit electric signals; a second electrical waveguide formed from the first dielectric material and disposed adjacent to a first side of the first electrical waveguide; and a third electrical waveguide formed from the first dielectric material and positioned adjacent a second side of the first electrical waveguide opposite the first side. The second electrical waveguide and the third electrical waveguide are configured to form a composite waveguide with the first electrical waveguide for transmitting the electrical signal.

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