Power module packaging structure and electrical equipment

Abstract

The utility model discloses a power module packaging structure and electrical equipment, the power module packaging structure is additionally provided with a conduction piece, an external terminal is electrically connected with a substrate through the conduction piece, the external terminal is connected to the end portion, located outside a packaging body, of the conduction piece, and the other end of the conduction piece penetrates through the packaging body to be electrically connected with the substrate. The section, located in the packaging body, of the conducting piece is combined with the packaging body to form an integral structure, the packaging body and the conducting piece are combined into a whole, the stress in the packaging body can be shared, the stress between the combination faces of the substrate and the packaging body is greatly reduced, the layering phenomenon of the substrate and the packaging body is reduced, and the packaging body and the conducting piece are combined into the integral structure. The substrate and the electric connection end part of the conduction piece can be isolated from the external environment, external impurities are not easy to enter an interface between the substrate and the packaging body, the isolation protection of the power chip group on the substrate is improved, the reliable work of the power chip group is facilitated, the service life of the power chip group is prolonged, and the production cost is reduced. And thus, the overall performance of the electrical equipment applied to the power module packaging structure is improved.

Description

Technical Field

[0001] The present application relates to the field of power module packaging, and in particular to a power module packaging structure and electrical equipment. Background Art

[0002] See also Figure 1 The power module packaging structure usually includes a substrate 1' and a number of power components 3' such as chips mounted on the substrate 1'. In order to protect the chip from interference from external mechanical, electrical, chemical and other factors, a plastic package 2' is usually used to cover the chip. When the plastic package 2' covers the chip, the electrical connection area with the external terminal on the substrate 1' is avoided. In other words, a through hole 21' is provided on the plastic package 2' to avoid the electrical connection area on the substrate 1'. The external terminal passes through the through hole 21' of the plastic package 2' and is welded and connected to the substrate 1' to realize the electrical connection between the external circuit and the circuit formed by each chip on the substrate 1'.

[0003] Whether the power module packaging structure can work reliably is related to the overall performance of the product to which it is applied. Therefore, the reliability of the power module packaging structure is one of the main issues that technicians in this field are concerned about. Utility Model Content

[0004] The purpose of the present application is to provide a power module packaging structure and electrical equipment with relatively high working reliability.

[0005] The present application provides a power module packaging structure, including the following components:

[0006] substrate;

[0007] at least one power chipset, each of the power chipsets being mounted on the substrate;

[0008] A packaging body, covering at least one side of the substrate on which the power chipset is mounted, so as to isolate the power chipset from the external environment;

[0009] A conductive member, one end of which is exposed outside the package to be connected to an external terminal, and the other end of which passes through the package to be electrically connected to the substrate. The segment of the conductive member located inside the package is combined with the package to form an integral structure.

[0010] Compared with the prior art in which the external terminal is directly welded to the substrate, the power module packaging structure in the embodiment of the present application is additionally provided with a conductive part, through which the external terminal is electrically connected to the substrate, and the external terminal is connected to the end of the conductive part located outside the package body, and the other end of the conductive part passes through the package body to be electrically connected to the substrate, and the segment of the conductive part located inside the package body is combined with the package body to form an integral structure. In this way, the package body and the conductive part are combined as a whole to share the stress inside the package body, and the stress between the bonding surface of the substrate and the package body is greatly reduced, thereby reducing the occurrence of delamination between the two. In addition, the package body and the conductive part are combined as an integral structure, which can isolate the substrate and the electrically connected end of the conductive part from the external environment, and external impurities are not easy to enter the interface between the substrate and the package body, thereby improving the isolation protection of the power chipset on the substrate, which is beneficial to the reliable operation of the power chipset and increasing the service life of the power chip, thereby improving the overall performance of the electrical equipment to which the power module packaging structure is applied.

[0011] In one example, the conductive member includes a first end surface and a second end surface arranged along the thickness direction of the substrate, the first end surface is electrically connected to the substrate, and the second end surface is used for welding connection with the external terminal.

[0012] In one example, the second end surface is flush with the outer surface of the package body;

[0013] Alternatively, the second end surface is lower than the outer surface of the package body, the outer surface of the package body further has a groove, and the second end surface is located at the bottom wall of the groove;

[0014] Alternatively, the second end surface is higher than the outer surface of the package body.

[0015] In one example, an area of ​​the first end surface is smaller than an area of ​​the second end surface.

[0016] In one example, the conductive member includes at least one of a columnar structure, a linear structure, or a sheet structure.

[0017] In one example, the columnar structure is a frustum structure, and the first end face and the second end face are two end faces of the frustum structure arranged along its axial direction;

[0018] In one example, along the thickness direction of the substrate, the columnar structure includes a first column segment and a second column segment connected, the outer diameter of the first column segment is smaller than the outer diameter of the second column segment, the first end face is the end face of the first column segment away from the second column segment, and the second end face is the end face of the second column segment away from the first column segment.

[0019] In one example, the package completely wraps the substrate;

[0020] Alternatively or alternatively, the package body forms an integral structure with the substrate, the power chipset, and the conductive element.

[0021] In one example, the conductive member is a metal member.

[0022] An embodiment of the present application also provides an electrical device, including a battery pack and a three-phase motor, including a power module packaging structure as described in any of the above items, which is used to convert the direct current of the battery pack into the alternating current required by the three-phase motor, and the conductive parts in the power module packaging structure include two types: a first conductive part and a second conductive part, the outer end of the first conductive part is electrically connected to the circuit of the battery pack, and the outer end of the second conductive part is electrically connected to the circuit of the three-phase motor.

[0023] In the embodiment of the present application, the electrical device includes the above-mentioned power module packaging structure, and thus also has the above-mentioned technical effects of the power module packaging structure. BRIEF DESCRIPTION OF THE DRAWINGS

[0024] Figure 1 A schematic diagram of a power module packaging structure in current technology;

[0025] Figure 2 This is a schematic diagram of a power module packaging structure in one embodiment of the present application;

[0026] Figure 3 for Figure 2 A perspective view of the power module packaging structure shown;

[0027] Figure 4 for Figure 3 Schematic diagram of the cross-section at AA in the middle;

[0028] Figure 5 A cross-sectional view of a power module packaging structure according to another embodiment of the present application;

[0029] Figure 6 A cross-sectional view of a power module packaging structure according to another embodiment of the present application;

[0030] Figure 7 This is a cross-sectional view of a power module packaging structure according to another embodiment of the present application.

[0031] Figures 1 to 7 Description of the accompanying drawings:

[0032] 1' substrate; 2' plastic package; 21' through hole; 3' power component;

[0033] 1 substrate; 2 power chipset; 21 external connection terminal; 3 package body; 31 outer surface; 32 groove; 4 conductive member; 41 first end surface; 42 second end surface; 401 first column segment; 402 second column segment. DETAILED DESCRIPTION

[0034] With respect to the power module packaging structure mentioned in the background technology, the inventor of the present application found that due to factors such as stress release during the packaging process, a through hole 21' is provided at the plastic package body 2', and the stress release point is located at the edge of the bonding surface of the substrate 1' and the plastic package body 2'. Under the action of stress, the substrate 1' and the plastic package body 2' at the edge of the through hole 21' will produce a delamination phenomenon. When the delamination is serious, it is easy to cause the insulation failure of the chip adjacent to the through hole 21' and the outside world, and the external water vapor or other impurities can reach the chip position along the gap caused by the delamination, which seriously affects the performance and service life of the chip, and further affects the working reliability of the power module packaging structure.

[0035] Based on the above findings, the inventors of the present application have conducted extensive research and exploration and proposed a technical solution that reduces the delamination of the substrate and the plastic package and can improve the working reliability of the power module packaging structure.

[0036] In order to enable those skilled in the art to better understand the present application, the present application is further described in detail below in conjunction with the accompanying drawings and specific implementation methods.

[0037] Please refer to Figures 2 to 7 , Figure 2 This is a schematic diagram of a power module packaging structure in one embodiment of the present application; Figure 3 for Figure 2 A perspective view of the power module packaging structure shown; Figure 4 for Figure 3 Schematic diagram of the cross-section at AA in the middle; Figure 5 A cross-sectional view of a power module packaging structure according to another embodiment of the present application; Figure 6 A cross-sectional view of a power module packaging structure according to another embodiment of the present application; Figure 7 This is a cross-sectional view of a power module packaging structure according to another embodiment of the present application. Figure 5 , Figure 6 and Figure 7 The cross-sectional view of the power module packaging structure in the embodiment Figure 3 The cross-sectional positions of the power module packaging structures shown are the same.

[0038] The embodiment of the present application provides a power module packaging structure, which is mainly used to realize energy conversion, power amplification, control power supply current or provide overcurrent, overvoltage and other protection functions. The power module packaging structure includes a substrate 1 and a power chipset 2. The power chipset 2 includes at least two power chips. The power chipset is provided with an interconnection structure (not shown in the figure) for electrical connection of the power chips. The power chipset 2 is also provided with an external connection terminal 21, which is used to electrically connect to an external circuit. Figure 2Only two external connection terminals 21 of the power chipset 2 are shown, and the others are not shown. External control signals can be transmitted to the power chipset 2 from the external connection terminals 21. The power chipset 2 is mounted on the substrate 1 and can be electrically connected to the substrate 1. The power chipset 2 can be mounted on the substrate 1 by a mounting process. The substrate 1 can be a copper-clad ceramic substrate 1. Of course, the substrate 1 can be other materials, such as an aluminum-clad ceramic substrate 1. The power chipset 2 usually uses silicon-based, silicon carbide-based or gallium nitride-based chips as core components.

[0039] In the embodiment of the present application, the power module packaging structure also includes a packaging body 3, which covers at least one side of the substrate 1 where the power chipset is installed. The main function of the packaging body 3 is to isolate the power chipset from the external environment. The packaging body 3 usually uses an insulating material, which can be a plastic material, such as silicone or epoxy resin. In addition to good insulation, epoxy resin also has high strength and rigidity, can withstand greater pressure and impact, and also has the characteristics of wear resistance and high temperature resistance. Epoxy resin can play a good protective role on the power chipset, which is beneficial to improve the service life and working reliability of the power module packaging structure.

[0040] The package body 3 can be formed on the surface of the substrate 1 and the power chipset 2 by an injection molding process.

[0041] In the embodiment of the present application, the power module packaging structure further includes a conductive member 4, one end of which is exposed outside the packaging body 3, and the other end passes through the packaging body 3 to be electrically connected to the substrate 1. The main function of the conductive member 4 is to serve as an electrically connected wire, and the conductive member 4 can be a metal member with relatively good conductive properties, such as copper, aluminum or other alloy members, and of course the conductive member 4 can also be other conductive materials.

[0042] In a specific example, the power module packaging structure is used to convert the direct current of the battery pack in the electrical device into the alternating current required by the three-phase motor. The conductive member 4 in the power module packaging structure includes two types: a first conductive member and a second conductive member, wherein the outer end of the first conductive member is electrically connected to the circuit of the battery pack, and the outer end of the second conductive member is electrically connected to the circuit of the three-phase motor. Figure 2 The example of six conductive members 4 arranged on the substrate 1 is shown in the figure, wherein the two conductive members 4 in the middle are first conductive members, the two first conductive members are electrically connected to the positive and negative electrodes of the battery pack, the four conductive members 4 located at the four corners are second conductive members, the four second conductive members are electrically connected to the circuit of the three-phase motor, so that the power module packaging structure can convert the direct current provided by the battery pack into the alternating current required by the three-phase motor. Of course, the number of conductive members 4 arranged on the substrate 1 depends on the function realized by the power module packaging structure and the external circuit structure, and is not limited to the above description in this article.

[0043] The circuits of the battery pack and the three-phase motor can be connected to the corresponding conductive members 4 through connecting cables. The connecting cables can be copper cables or other metal cables.

[0044] Compared with the prior art in which the external terminal is directly welded to the substrate 1, the power module packaging structure in the embodiment of the present application is additionally provided with a conductive part 4, through which the external terminal is electrically connected to the substrate 1, and the external terminal is connected to the end of the conductive part 4 located outside the packaging body 3, and the other end of the conductive part 4 passes through the packaging body 3 to be electrically connected to the substrate 1, and the segment of the conductive part 4 located inside the packaging body 3 is combined with the packaging body 3 as an integral structure, so that the packaging body 3 and the conductive part 4 are combined as a whole to share the stress inside the packaging body 4, and the stress between the bonding surface of the substrate 1 and the packaging body 3 is greatly reduced, reducing the occurrence of delamination between the two, and the packaging body 3 and the conductive part 4 are combined as an integral structure, which can isolate the electrically connected ends of the substrate 1 and the conductive part 4 from the external environment, effectively preventing external media from entering the interface between the substrate 1 and the packaging body 3, thereby improving the insulation isolation protection capability of the power chipset 2, which is beneficial to the reliable operation of the power chipset 2 and improving the service life of the power chipset 2, thereby improving the overall performance of the electrical equipment to which the power module packaging structure is applied.

[0045] Even in some examples, if there is an opening on the package body 3, the position of the opening does not need to extend to the position of the substrate 1, and the opening can be at a longer distance from the substrate, thereby reducing the probability of delamination of the opening at the interface between the substrate 1 and the package body 3 in the prior art.

[0046] In the embodiment of the present application, the conductive member 4 includes a first end face 41 and a second end face 42 arranged along the thickness direction of the substrate 1, the first end face 41 is electrically connected to the substrate 1, and the second end face 42 is used for welding connection with the external terminal. In this embodiment, the second end face 42 is welded to the external terminal, and is firmly fixed, which is conducive to improving the reliability of the electrical connection, and the welding process is simple and occupies a small space.

[0047] In this embodiment, the first end face 41 may also be connected to the substrate 1 by welding, or the first end face 41 may be an integral structure with the metal layer of the substrate 1. That is, the substrate 1 includes a combined metal layer and an insulating layer, and the conductive member 4 is an integral structure with the metal layer. In this way, the conductive member 4 and the substrate 1 can be electrically connected without welding.

[0048] Please refer to Figure 4 , Figure 5 and Figure 7 In the embodiment of the present application, the second end face 42 can be flush with the outer surface 31 of the package body 3, so there is no need to process other structures on the package body 3, the molding process is simple, and the surface of the power module packaging structure is relatively flat, and impurities such as dust and water vapor in the external environment are not easy to be retained on the surface of the power module packaging structure.

[0049] Please refer to Figure 6 Of course, the second end face 42 may not be flush with the outer surface 31 of the package body 3. In one example, the second end face 42 is lower than the outer surface 31 of the package body 3. The outer surface of the package body 3 also has a groove 32, and the second end face 42 is located on the bottom wall of the groove 32. In this embodiment, part of the second end face 42 can be combined with the package body 3, which can improve the reliability of the combination of the conductive part 4 and the package body 3, and the groove 32 can also provide welding positioning to a certain extent.

[0050] The bottom wall of the groove 32 has a predetermined distance from the bonding surface of the substrate 1 and the package body 3 , and the predetermined distance can be determined according to whether the conductive member 4 can meet the use requirements and the bonding reliability of the package body 3 and the conductive member 4 .

[0051] Furthermore, in an example, the end of the conductive member 4 connected to the external terminal may have a section extending out of the package body 3, and the second end surface 42 may be higher than the outer surface of the package body 3. This facilitates welding of the external terminal and the conductive member 4.

[0052] In the embodiment of the present application, since the first end face 41 of the conductive member 4 electrically connected to the substrate is located inside the package body 3, the package body 3 has a certain protective effect on the electrical connection position of the first end face 41 and the substrate, and the connection stability between the two is relatively high. The second end face 42 of the conductive member 4 is located outside the package body 3, and the larger the welding area between the second end face 42 and the external terminal, the higher the connection stability between the two.

[0053] Therefore, the area of ​​the first end face 41 of the conductive member 4 is smaller than the area of ​​the second end face 42. In this way, under the premise of ensuring the reliability of the electrical connection between the conductive member 4 and the substrate 1, the connection surface between the first end face 41 and the substrate 1 is as small as possible, reducing the area occupied by the substrate 1, which is conducive to optimizing the arrangement of the power chipset 2 on the substrate 1. In addition, the area of ​​the second end face 42 is relatively large, which can meet the welding reliability of the second end face 42 and the external terminal.

[0054] In a specific example, the conductive member 4 may be a columnar structure, and the columnar structure may be a frustum structure. Figure 4 and Figure 5 As shown, the first end face 41 and the second end face 42 are two end faces of the frustum structure along its axial direction, wherein the axial direction of the frustum structure is parallel to the thickness direction of the substrate 1. The frustum structure can be a solid shaft segment, and the conductive member 4 is a frustum structure with relatively high use strength.

[0055] Of course, the columnar structure is not limited to a frustum structure, and may also be a cylindrical or polygonal column, etc. Of course, the conductive member 4 may also be a linear structure (such as a metal wire), a sheet structure (such as a metal sheet), or a special-shaped structure (such as a combination of the above), etc., as long as electrical conduction can be achieved.

[0056] Please refer to Figure 7 In another specific example, along the thickness direction of the substrate 1, the columnar structure includes a first column segment 401 and a second column segment 402 connected to each other, the outer diameter of the first column segment 401 is smaller than the outer diameter of the second column segment 402, the first end face 41 is the end face of the first column segment 401 away from the second column segment 402, and the second end face 42 is the end face of the second column segment 402 away from the first column segment 401. The first column segment 401 and the second column segment 402 can be cylinders, or cylinders of other shapes. In this embodiment, the conductive member 4 can be processed into two column segments of different diameters through a metal shaft segment, and the processing technology is simple and the molding cost is relatively low.

[0057] Of course, the areas of the first end face 41 and the second end face 42 are not limited to the above-mentioned limited relationship, and the areas of the first end face 41 and the second end face 42 can also be the same, for example, the conductive member 4 is a cylinder of equal diameter, and the structure is relatively simple. Alternatively, the area of ​​the first end face 41 can also be larger than the area of ​​the second end face 42 to meet the needs of a specific application environment.

[0058] In the present application embodiment, Figure 4 , Figure 6 and Figure 7 As shown, the package body 3 of the power module package structure can completely wrap the substrate 1, so that the molding process is relatively simple, and the substrate 1 can be completely isolated from the external environment, thereby increasing the service life of the substrate 1. Of course, the package body 3 can also only wrap one side of the substrate 1 where the power chipset 2 is provided, such as Figure 5 shown.

[0059] In one example, the package 3 can form an integral structure with the substrate, the power chipset 2, and the conductive member 4, and the four can be formed into an integral structure by injection molding, which is a simple molding process. Of course, the above four can also be formed into an integral structure by bonding or other methods.

[0060] The present application also provides an electrical device, including a battery pack, a three-phase motor, and a power module packaging structure in any of the above embodiments, which is used to convert the direct current of the battery pack into the alternating current required by the three-phase motor. The conductive member 4 in the power module packaging structure includes two types: a first conductive member and a second conductive member, the outer end of the first conductive member is electrically connected to the circuit of the battery pack, and the outer end of the second conductive member is electrically connected to the circuit of the three-phase motor. The outer end of the first conductive member and the outer end of the second conductive member are the ends of the conductive members described in the above embodiments that are exposed outside the packaging body.

[0061] The electrical device may be a vehicle, or other devices.

[0062] The electrical device includes the above-mentioned power module packaging structure, so it also has the above-mentioned technical effects of the power module packaging structure.

[0063] For other information about electrical equipment, please refer to the existing technology, which will not be elaborated in this article.

[0064] In the embodiments of the present application, the terms "first" and "second" are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Therefore, the features defined as "first" and "second" may explicitly or implicitly include one or more of the features.

[0065] The directional terms mentioned in the embodiments of the present application, such as "inside", "outside", etc., are only references to the directions of the drawings. Therefore, the directional terms used are for better and clearer explanation and understanding of the embodiments of the present application, rather than indicating or implying that the referred device or element must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on the embodiments of the present application.

[0066] In the description of the embodiments of the present application, the terms "comprises", "includes" or any other variations thereof are intended to cover non-exclusive inclusion, so that a process, method, article or apparatus that includes a series of elements includes not only those elements, but also includes other elements not explicitly listed, or also includes elements inherent to such process, method, article or apparatus.

[0067] In the embodiments of the present application, "and / or" is only a description of the association relationship of the associated objects, indicating that there can be three relationships. For example, A and / or B can represent: A exists alone, A and B exist at the same time, and B exists alone. In addition, the character " / " in this article generally indicates that the associated objects before and after are in an "or" relationship.

[0068] Specific examples are used herein to illustrate the principles and implementation methods of the present application, and the description of the above embodiments is only used to help understand the method and core ideas of the present application. It should be pointed out that for ordinary technicians in this technical field, without departing from the principles of the present application, several improvements and modifications can be made to the present application, and these improvements and modifications also fall within the scope of protection of the claims of the present application.

Claims

1. A power module packaging structure, characterized in that: Includes the following components: substrate; at least one power chipset, each of the power chipsets being mounted on the substrate; A packaging body, covering at least one side of the substrate on which the power chipset is mounted, so as to isolate the power chipset from the external environment; A conductive member, one end of which is exposed outside the package to be connected to an external terminal, and the other end of which passes through the package to be electrically connected to the substrate. The segment of the conductive member located inside the package is combined with the package to form an integral structure.

2. The power module packaging structure according to claim 1, characterized in that: The conductive member includes a first end surface and a second end surface arranged along the thickness direction of the substrate, the first end surface is electrically connected to the substrate, and the second end surface is used for welding connection with the external terminal.

3. The power module packaging structure according to claim 2, characterized in that: The second end surface is flush with the outer surface of the packaging body; Alternatively, the second end surface is lower than the outer surface of the package body, the outer surface of the package body further has a groove, and the second end surface is located at the bottom wall of the groove; Alternatively, the second end surface is higher than the outer surface of the package body.

4. The power module packaging structure according to claim 2, characterized in that: An area of ​​the first end surface is smaller than an area of ​​the second end surface.

5. The power module packaging structure according to claim 4, characterized in that: The conductive element includes at least one of a columnar structure, a linear structure or a sheet structure.

6. The power module packaging structure according to claim 5, characterized in that: The columnar structure is a frustum structure, and the first end surface and the second end surface are two end surfaces of the frustum structure arranged along its axial direction.

7. The power module packaging structure according to claim 5, characterized in that: Along the thickness direction of the substrate, the column includes a first column segment and a second column segment connected, the outer diameter of the first column segment is smaller than the outer diameter of the second column segment, the first end face is the end face of the first column segment away from the second column segment, and the second end face is the end face of the second column segment away from the first column segment.

8. The power module packaging structure according to any one of claims 1 to 7, characterized in that: The package completely wraps the substrate; Alternatively or alternatively, the package body forms an integral structure with the substrate, the power chipset, and the conductive element.

9. The power module packaging structure according to any one of claims 1 to 7, characterized in that: The conductive part is a metal part.

10. An electrical device comprising a battery pack and a three-phase motor, characterized in that: A power module packaging structure comprising the power module packaging structure as claimed in any one of claims 1 to 9, which is used for converting the direct current of a battery pack into the alternating current required by a three-phase motor, wherein the conductive members in the power module packaging structure comprise two types: a first conductive member and a second conductive member, wherein the outer end of the first conductive member is electrically connected to the circuit of the battery pack, and the outer end of the second conductive member is electrically connected to the circuit of the three-phase motor.

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