Electronic assembly and electrical equipment
By designing the heat dissipation channel between the tablet and the electronic component in the electronic component, the problem of poor heat dissipation effect caused by poor thermal conductivity of the MOS tube is solved, and a more effective heat dissipation effect and a longer service life are achieved.
Patent Information
- Application Number
- CN202421741564.6
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-07-22
- Publication Date
- 2025-05-02
- Estimated Expiration
- 2034-07-22
AI Technical Summary
The MOS tube will heat up when there is too much current. In the prior art, due to the poor thermal conductivity of the gland material, the heat on the other side of the MOS tube cannot be effectively dissipated, resulting in poor heat dissipation effect.
An electronic component is designed, including a heat sink, a tablet and an electronic component part. By configuring the tablet and the electronic component part to have a heat dissipation channel, the heat from the electronic component part close to the tablet side can be dissipated in time, thereby improving the heat dissipation effect.
By setting a heat dissipation channel between the tablet and the electronic component part, the heat dissipation effect of the MOS tube is effectively improved and its service life is extended.
Smart Images
Figure CN222826406U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to the technical field of electronic equipment, in particular to an electronic component and electrical equipment. Background Art
[0002] MOS tube is a component widely used in the electronics industry. It is often used in digital logic circuits, analog circuits, drive circuits and power supply fields. With the continuous development of technology, there may be more application scenarios in the future.
[0003] The MOS tube will generate heat when a large current flows. In order to prevent the MOS tube from being at high temperature for a long time and thus shortening the service life of the MOS tube, a heat sink is usually provided on one side of the MOS tube to dissipate the heat. However, the MOS tube is fixed to the heat sink through a gland on the other side. Since the gland is flat on the MOS tube, when the thermal conductivity of the gland material is poor, the heat on the other side of the MOS tube cannot be dissipated well, resulting in poor heat dissipation of the MOS tube. Utility Model Content
[0004] The main purpose of the embodiments of the utility model is to provide an electronic component and an electrical device, aiming to improve the technical problem of poor heat dissipation effect of the existing MOS tube.
[0005] An embodiment of the utility model provides an electronic component, comprising:
[0006] Heat sink;
[0007] A pressing sheet connected to the heat sink;
[0008] An electronic component part connected to the pressing sheet and arranged between the heat sink and the pressing sheet;
[0009] Wherein, a heat dissipation channel is configured between the pressing sheet and the electronic component portion.
[0010] In some embodiments of the present invention, the pressing sheet has a bending portion, and the bending portion cooperates with the electronic component portion to form the heat dissipation channel.
[0011] In some embodiments of the present invention, a plurality of heat dissipation fins spaced apart from each other are disposed on a side of the heat sink facing away from the electronic component.
[0012] In some embodiments of the present invention, the plurality of heat dissipation fins spaced apart from each other include a plurality of first sub-fins and a plurality of second sub-fins, a second sub-fin is arranged between every two of the first sub-fins, and the length of the first sub-fin is greater than the length of the second sub-fin.
[0013] In some embodiments of the present invention, the electronic component portion includes an electronic component and an insulating component, the electronic component is arranged on a side of the insulating component close to the heat sink, the insulating component is arranged between the electronic component and the pressing plate, and the pressing plate and the insulating component are configured to have the heat dissipation channel.
[0014] In some embodiments of the present invention, the pressing sheet includes a sub-sheet and an insulating sleeve, and the insulating sleeve is sleeved on the sub-sheet.
[0015] In some embodiments of the present invention, the electronic component further includes a heat conductive sheet, and the heat conductive sheet is disposed between the electronic component portion and the heat sink.
[0016] In some embodiments of the present invention, the heat conducting sheet is made of aluminum nitride.
[0017] In some embodiments of the present invention, the pressing sheet has a heat dissipation hole, and the heat dissipation hole is communicated with the heat dissipation channel.
[0018] In some embodiments of the present invention, the present invention further provides an electrical device, comprising the above-mentioned electronic component.
[0019] An embodiment of the utility model provides an electronic component and an electrical device, wherein the electronic component includes a heat sink, a pressing plate and an electronic component part. The pressing plate, the electronic component part and the heat sink are connected in sequence to fasten the electronic component part between the pressing plate and the heat sink, and a heat dissipation channel is provided between the pressing plate and the electronic component part so that the heat on the side of the electronic component part close to the pressing plate can be dissipated in time, thereby improving the heat dissipation effect of the electronic component. BRIEF DESCRIPTION OF THE DRAWINGS
[0020] In order to more clearly illustrate the embodiments of the utility model or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the utility model. For ordinary technicians in this field, other drawings can be obtained based on the structures shown in these drawings without paying creative work.
[0021] Figure 1 This is a schematic diagram of the structure of an electronic component of an embodiment of the utility model;
[0022] Figure 2 This is a schematic structural diagram of a tablet press of an electronic component according to an embodiment of the utility model;
[0023] Figure 3 This is a schematic diagram of the exploded structure of an electronic component in one embodiment of the utility model;
[0024] Figure 4 A schematic diagram of the structure of a heat sink of an electronic component according to an embodiment of the utility model;
[0025] Figure 5 It is a structural schematic diagram of an electronic component according to another embodiment of the utility model.
[0026] Reference numerals: 100, heat sink; 110, heat sink fin; 111, first sub-fin; 112, second sub-fin; 300, electronic component portion; 310, electronic component; 320, insulating component; 400, pressing sheet; 500, heat dissipation channel; 600, heat conductive sheet. DETAILED DESCRIPTION
[0027] The following will be combined with the drawings in the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments of the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.
[0028] It should be noted that all directional indications in the embodiments of the present invention (such as up, down, left, right, front, back...) are only used to explain the relative position relationship, movement status, etc. between the components under a certain specific posture (as shown in the accompanying drawings). If the specific posture changes, the directional indication will also change accordingly.
[0029] In the present invention, unless otherwise clearly specified and limited, the terms "connection", "fixation", etc. should be understood in a broad sense. For example, "fixation" can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium, it can be the internal connection of two elements or the interaction relationship between two elements, unless otherwise clearly defined. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.
[0030] In addition, if there are descriptions involving "first", "second", etc. in the embodiments of the utility model, the descriptions of "first", "second", etc. are only used for descriptive purposes and cannot be understood as indicating or implying their relative importance or implicitly indicating the number of technical features indicated. Therefore, the features defined as "first" and "second" may explicitly or implicitly include at least one of the features. In addition, the meaning of "and / or" appearing in the full text includes three parallel solutions. Taking "A and / or B" as an example, it includes solution A, solution B, or solutions that satisfy both A and B. In addition, the technical solutions between the various embodiments can be combined with each other, but it must be based on the ability of ordinary technicians in this field to implement. When the combination of technical solutions is contradictory or cannot be implemented, it should be deemed that such combination of technical solutions does not exist and is not within the scope of protection required by the utility model.
[0031] like Figure 1-Figure 5 As shown, the utility model provides an electronic assembly, which includes a heat sink 100, a pressing sheet 400 and an electronic component part 300, wherein the pressing sheet 400 is connected to the heat sink 100. The electronic component part 300 is connected to the pressing sheet 400, and the electronic component part 300 is arranged between the heat sink 100 and the pressing sheet 400, wherein a heat dissipation channel 500 is configured between the pressing sheet 400 and the electronic component part 300.
[0032] The electronic component part 300 may be a single electronic component, such as a MOS tube; the electronic component part 300 may also be an electronic component and an insulating member 320 connected to the electronic component, such as a MOS tube and an insulating sheet arranged on the other side of the MOS tube.
[0033] The heat sink 100 is generally made of metal material. By contacting the electronic component portion 300 with the heat sink 100 , the heat of the electronic component portion 300 can be transferred to the heat sink 100 and dissipated through the heat sink 100 .
[0034] The pressing sheet 400 is generally a hard structure, such as made of hard metal, and its main purpose is to make the electronic component part 300 and the heat sink 100 fit tightly together through the pressing sheet 400, thereby ensuring the heat dissipation effect of the heat sink 100 on the electronic component part 300.
[0035] Generally, a connecting piece such as a screw or a bolt is passed through the pressing sheet 400 , the electronic component portion 300 and the heat sink 100 in sequence to connect and tighten the three.
[0036] It can be understood that the utility model connects the pressing sheet 400, the electronic component part 300 and the heat sink 100 in sequence to fasten the electronic component part 300 between the pressing sheet 400 and the heat sink 100, and at the same time provides a heat dissipation channel 500 between the pressing sheet 400 and the electronic component part 300, so that the heat of the electronic component part 300 close to the pressing sheet 400 can be dissipated in time, thereby improving the heat dissipation effect of the electronic component.
[0037] In some embodiments, the pressing sheet 400 has a bending portion, and the bending portion cooperates with the electronic component portion 300 to form a heat dissipation channel 500 .
[0038] For example, the pressing sheet 400 includes a top, a bent portion, and a bottom connected in sequence, the top and the bottom are both in contact with the electronic component portion 300, and the bent portion is raised relative to the top and the bottom, so that when the pressing sheet 400 is connected to the electronic component portion 300, the bent portion can form a heat dissipation channel 500 with the electronic component portion 300. That is, the heat dissipation channel 500 is substantially a gap between the pressing sheet 400 and the electronic component portion 300.
[0039] Generally, a fastener such as a screw or a bolt passes through the top to connect the electronic component portion 300 and the heat sink 100 .
[0040] In some embodiments, a pressing sheet 400 may include a plurality of bending portions, for example, the pressing sheet 400 includes a top portion, a first bending portion, a second bending portion, and a bottom portion connected in sequence.
[0041] In some embodiments, a plurality of heat dissipation fins 110 spaced apart from each other are disposed on a side of the heat sink 100 facing away from the electronic component portion 300 .
[0042] In some embodiments, the plurality of heat dissipation fins 110 are arranged at equal intervals.
[0043] It is understandable that by disposing a plurality of heat dissipation fins 110 at some portions of the heat sink 100 away from the electronic component portion 300 , the contact area between the heat sink 100 and the air is increased by the heat dissipation fins 110 , thereby improving the heat dissipation effect of the heat sink 100 .
[0044] In some embodiments, the plurality of heat sink fins 110 spaced apart from each other include a plurality of first sub-fins 111 and a plurality of second sub-fins 112 , a second sub-fin 112 is disposed between every two first sub-fins 111 , and the length of the first sub-fin 111 is greater than the length of the second sub-fin 112 .
[0045] It can be understood that by providing a relatively short second sub-fin 112 between two longer first sub-fins 111 , a larger heat dissipation space can be ensured between the two long fins, so that the heat of the three adjacent fins will not be too concentrated, thereby improving the heat dissipation effect of the heat sink 100 .
[0046] In some embodiments, the length of the first sub-fin 111 is twice the length of the second sub-fin 112 , so that there is a larger heat dissipation space between the two first sub-fins 111 .
[0047] In some embodiments, the electronic component portion 300 includes an electronic component 310 and an insulating component 320 , the electronic component 310 is disposed on a side of the insulating component 320 close to the heat sink 100 , the insulating component 320 is disposed between the electronic component 310 and the pressing sheet 400 , and a heat dissipation channel 500 is configured between the pressing sheet 400 and the insulating component 320 .
[0048] Among them, the electronic component 310 can be an electronic micro-component such as a diode or a transistor, and the insulating component 320 is a sheet structure attached to the side of the electronic component 310 close to the pressing sheet 400. Its purpose is to insulate the pressing sheet 400 from the electronic component 310 when the pressing sheet 400 is a conductive material.
[0049] Meanwhile, compared with the conventional pressing sheet 400 which is closely attached to the insulating member 320 and affects heat dissipation, the heat dissipation channel 500 formed by the pressing sheet 400 and the insulating member 320 of the utility model can accelerate the heat dissipation of the electronic component 310 and improve the overall heat dissipation efficiency of the electronic assembly.
[0050] In some embodiments, the pressing sheet 400 includes a sub-sheet and an insulating sleeve, and the insulating sleeve is provided on the sub-sheet. It can be understood that this solution can insulate the electronic component part 300 from the sub-sheet when the sub-sheet is a conductive material, and can also achieve the fastening of the electronic component part 300.
[0051] For example, the sub-sheet has a bending portion, and the insulating sleeve is sleeved on the sub-sheet, thereby forming a pressing sheet 400 with a bending portion, and a heat dissipation channel 500 is formed through the bending portion and the sub-sheet.
[0052] In some embodiments, the sub-sheets are generally made of hard metal material.
[0053] In some embodiments, the electronic assembly further includes a heat conductive sheet 600 , which is disposed between the electronic component portion 300 and the heat sink 100 .
[0054] The heat from the electronic component portion 300 can be quickly transferred to the heat sink 100 through the heat conductive sheet 600 .
[0055] Generally, the area of the heat conductive sheet 600 is larger than the area of the electronic component portion 300 close to the heat sink 100 , and smaller than the area of the heat sink 100 .
[0056] In some embodiments, the heat conductive sheet 600 is made of aluminum nitride. That is, by using aluminum nitride to make the heat conductive sheet 600, it has good thermal conductivity and insulation at the same time, which can ensure the safety of electronic components.
[0057] In some embodiments, the pressing sheet 400 has heat dissipation holes, and the heat dissipation holes are connected to the heat dissipation channels 500 .
[0058] For example, by providing heat dissipation holes on the pressing sheet 400 , the heat of the heat dissipation channel 500 can be dissipated through the heat dissipation holes to avoid heat accumulation.
[0059] For example, the pressing sheet 400 has a top, a bending portion and a bottom connected in sequence, the bending portion cooperates with the electronic component portion 300 to form a heat dissipation channel 500, and a heat dissipation hole is provided on the bending portion, and the heat dissipation hole is connected to the heat dissipation channel 500.
[0060] In some embodiments, the present invention further provides an electrical device, including the above-mentioned electronic components, such as a power adapter, a charging gun, etc.
[0061] Since the electrical device includes the electronic components of the above embodiment or the combined embodiment, it has at least some or all of the beneficial effects of the above electronic components, which will not be described one by one here.
[0062] The above description is only an optional embodiment of the present invention, and does not limit the patent scope of the present invention. All equivalent structural changes made by using the contents of the present invention specification and drawings under the application concept of the present invention, or directly / indirectly used in other related technical fields are included in the patent protection scope of the present invention.
Claims
1. An electronic component, characterized in that: include: Heat sink; A pressing sheet connected to the heat sink; An electronic component part connected to the pressing sheet and arranged between the heat sink and the pressing sheet; Wherein, a heat dissipation channel is configured between the pressing sheet and the electronic component portion.
2. The electronic component according to claim 1, characterized in that The pressing sheet has a bending portion, and the bending portion cooperates with the electronic component portion to form the heat dissipation channel.
3. The electronic component according to claim 1, characterized in that A plurality of heat dissipation fins spaced apart from each other are arranged on one side of the heat dissipation sheet away from the electronic component portion.
4. The electronic component according to claim 3, characterized in that: The plurality of heat dissipation fins spaced apart from each other include a plurality of first sub-fins and a plurality of second sub-fins, one second sub-fin is arranged between every two first sub-fins, and the length of the first sub-fin is greater than the length of the second sub-fin.
5. The electronic component according to claim 1, characterized in that The electronic component portion includes an electronic component and an insulating component. The electronic component is arranged on a side of the insulating component close to the heat sink. The insulating component is arranged between the electronic component and the pressing sheet. The heat dissipation channel is configured between the pressing sheet and the insulating component.
6. The electronic component according to claim 1, characterized in that The pressing sheet comprises a sub-sheet and an insulating sleeve, and the insulating sleeve is sleeved on the sub-sheet.
7. The electronic component according to any one of claims 1 to 6, characterized in that: The electronic assembly further includes a heat conducting sheet disposed between the electronic component portion and the heat sink.
8. The electronic component according to claim 7, characterized in that: The heat conducting sheet is made of aluminum nitride.
9. The electronic component according to claim 1, characterized in that: The pressing sheet has a heat dissipation hole, and the heat dissipation hole is communicated with the heat dissipation channel.
10. An electrical device, characterized in that: The electronic component comprises any one of claims 1 to 9.