Semiconductor device

Abstract

The utility model relates to the technical field of electronic packaging, and discloses a semiconductor device which comprises a lead frame, a semiconductor chip, an electronic element and a plastic package body, the lead frame comprises a main body structure, a pin structure and a balance structure, the main body structure is used for bearing the semiconductor chip and the electronic element, and the pin structure is used for bearing the electronic element. The pin structure and the balance structure are located on the two opposite sides of the main body structure respectively and fixedly connected with the main body structure, the pin structure is used for being correspondingly and electrically connected with the semiconductor chip and the electronic element, and the plastic package body is used for sealing the main body structure, the semiconductor chip and the electronic element. According to the semiconductor device disclosed by the invention, the balance structure is introduced, and the balance structure and the pin structure are located on the two opposite sides of the main body structure respectively, so that symmetrical force distribution can be provided together, and the stability of the overall structure is kept when the semiconductor device is stressed or vibrates.

Description

Technical Field

[0001] The utility model relates to the technical field of electronic packaging, in particular to a semiconductor device. Background Art

[0002] The packaging structure refers to encapsulating electronic components (such as chips, resistors, capacitors, etc.) in a package to protect the components from interference and physical damage from the external environment. Specifically, packaging electronic components together can make the electronic components less susceptible to external environmental influences such as mechanical shock, moisture, and dust. In addition, integrating multiple electronic components in one package to form an independent functional module can simplify the circuit design and manufacturing process and reduce the size of the system. At the same time, the packaging structure can provide a standard pin layout and interface, so that electronic components can be easily installed on circuit boards or other substrates, reducing the difficulty of assembly and maintenance.

[0003] In short, the packaging structure plays a role in protecting electronic components, simplifying circuit design, facilitating installation and maintenance in the electronic field, and is widely used in integrated circuits, electronic devices, sensors and electronic components. Specifically, in the field of semiconductor devices, semiconductor devices usually contain some sensitive components, such as sensor chips, circuits, and inductive components. The packaging structure can package these components together to improve the reliability, stability and life of semiconductor devices. At the same time, semiconductor devices can also integrate multiple sensors to form multifunctional semiconductor devices. Taking semiconductor devices integrated with capacitors and magnetic induction devices as an example, integrating capacitors into magnetic sensors can improve the sensor's anti-EMI interference ability, reduce EMI radiation, improve signal quality and accuracy, and enhance the sensor's EMC compliance. When packaging such multifunctional semiconductor devices, the prior art usually chooses to use multiple plastic packages to package the corresponding functional elements, and the plastic packages are connected by leads, or multiple corresponding functional elements are integrated in one plastic package, and a thin and long electrical connection lead is drawn from one side of the plastic package for connection with subsequent electronic equipment. The former is prone to large size and limited application scenarios when used; the latter is prone to overall imbalance of the semiconductor device due to the single-sided setting of the electrical connection leads when used. If the semiconductor device is unbalanced as a whole, it may affect the accuracy of the sensor. For example, when affected by mechanical stress and vibration, internal components are prone to shifting, affecting the precise transmission of the sensor. When the sensor is measuring, the sensor itself may also shift, resulting in inaccurate measurement, affecting the working stability and reliability of the sensor. Utility Model Content

[0004] The embodiments of the present utility model provide a semiconductor device to effectively solve the problems of existing semiconductor devices being large in size, limited in application scenarios, and having working stability and reliability affected by overall imbalance.

[0005] In order to solve the above technical problems, the embodiments of the present utility model disclose the following technical solutions:

[0006] A semiconductor device comprises: a lead frame, a semiconductor chip, an electronic component and a plastic package, wherein the lead frame comprises a main structure, a pin structure and a balance structure, wherein the main structure carries the semiconductor chip and the electronic component, the pin structure and the balance structure are respectively located on two opposite sides of the main structure and are fixedly connected to the main structure, the pin structure is electrically connected to the semiconductor chip and the electronic component, and the plastic package seals the main structure, the semiconductor chip and the electronic component.

[0007] In addition to one or more of the features disclosed above, or as an alternative, a positioning structure is also included, wherein the positioning structure and the balancing structure are located on the same side of the main structure and are fixedly connected to the main structure, and the positioning structure and the balancing structure are spaced apart to form a positioning gap between the positioning structure and the balancing structure.

[0008] In addition to one or more features disclosed above, or as an alternative, at least two positioning structures are provided, and the two positioning structures are respectively located on both sides of the balancing structure, and both form the positioning gap with the positioning structure.

[0009] In addition to or as an alternative to one or more features disclosed above, the pin structure includes at least two first pins, the first pins correspond to the positioning structure one by one, and the first pins and the positioning structure are symmetrically arranged based on the main structure.

[0010] In addition to or as an alternative to one or more of the features disclosed above, the pin structure further includes a second pin, the second pin includes a positioning through hole, and the positioning through hole is arranged to fit the plastic package body.

[0011] In addition to or as an alternative to one or more features disclosed above, the second pin and the balancing structure are symmetrically arranged based on the main structure, and the width of a portion of the second pin close to the plastic package body is equal to the width of the balancing structure.

[0012] In addition to or as an alternative to one or more of the features disclosed above, the pin structure further includes an auxiliary positioning hole, and the auxiliary positioning hole is at least opened on a portion of the second pin away from the main structure or on any of the first pins.

[0013] In addition to one or more of the features disclosed above, or as an alternative, a support structure is also included, which includes a support plate and a first positioning member, the first positioning member and the lead frame are located on the same side of the support plate, and the first positioning member is fixedly connected to the support plate and inserted into the corresponding positioning gap.

[0014] In addition to one or more of the features disclosed above, or as an alternative, the support structure also includes a second positioning member, the second positioning member and the lead frame are located on the same side of the support plate, the second positioning member is fixedly connected to the support plate and inserted into the positioning through hole.

[0015] In addition to one or more of the features disclosed above, or as an alternative, the support structure also includes two third positioning members, and the two third positioning members and the lead frame are located on the same side of the support plate, and the two third positioning members are fixedly connected to the support plate and respectively abut against two opposite side surfaces of the plastic package body.

[0016] In addition to or as an alternative to one or more of the features disclosed above, the semiconductor chip is a magnetic induction chip, and the electronic component is a capacitive component.

[0017] One of the above technical solutions has the following advantages or beneficial effects: the semiconductor device disclosed in the present application introduces a balancing structure, and the balancing structure and the pin structure are respectively located on opposite sides of the main structure, which can provide symmetrical force distribution together, thereby maintaining the stability of the overall structure when subjected to force or vibration. At the same time, the semiconductor device disclosed in the present application uses a plastic package to encapsulate the chip and the electronic components as a whole, and the size is relatively reduced, which is suitable for more miniaturized application scenarios. Furthermore, the semiconductor device disclosed in the present application, by setting a positioning structure, forms a positioning gap between the positioning structure and the balancing structure, which can improve the accuracy and efficiency of the packaging process, ensure product quality and stability, and the positioning structure and the first pin are respectively located on both sides of the main structure, and the positioning structure corresponds to the first pin one by one, and is symmetrical about the main structure, further improving the mechanical balance of the semiconductor device. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] The technical solutions and other beneficial effects of the present invention will be made apparent by describing in detail the specific embodiments of the present invention in conjunction with the accompanying drawings.

[0019] Figure 1 A schematic diagram of a semiconductor device according to an embodiment of the present application is shown in FIG. Figure 1 ;

[0020] Figure 2 The structure of the lead frame provided in the embodiment of the present application is shown in FIG. Figure 1 ;

[0021] Figure 3 The structure of the lead frame provided in the embodiment of the present application is shown in FIG. Figure 2 ;

[0022] Figure 4 A schematic diagram of a semiconductor device according to an embodiment of the present application is shown in FIG. Figure 2 ;

[0023] Figure 5 A schematic diagram of a semiconductor device according to an embodiment of the present application is shown in FIG. Figure 3 ;

[0024] Figure 6 A schematic diagram of a semiconductor device according to an embodiment of the present application is shown in FIG. Figure 4 ;

[0025] Description of reference numerals:

[0026] 10. Lead frame; 100. Main structure; 101. Balance structure; 102. Pin structure; 1021. First pin; 1022. Second pin; 103. Positioning structure; 104. Support structure; 1041. Support plate; 1042. First positioning member; 1043. Second positioning member; 1044. Third positioning member; 1045. Fourth positioning member; 105. Positioning gap; 106. Positioning through hole; 107. Auxiliary positioning hole; 20. Semiconductor chip;

[0027] 30. Electronic components;

[0028] 40. Plastic sealing body. DETAILED DESCRIPTION

[0029] In order to make the purpose, technical solution and beneficial effects of the utility model clearer, the utility model is further described in detail below in conjunction with the accompanying drawings and specific implementation methods. It should be understood that the specific implementation methods described in this specification are only for explaining the utility model, and are not intended to limit the utility model.

[0030] In the description of the present utility model, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", "clockwise", "counterclockwise" and the like indicate positions or positional relationships based on the positions or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present utility model and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on the present utility model. In addition, the terms "first" and "second" are only used for descriptive purposes, and cannot be understood as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Therefore, the features defined as "first" and "second" may explicitly or implicitly include one or more of the said features. In the description of the present utility model, the meaning of "multiple" refers to two or more, unless otherwise clearly and specifically defined.

[0031] In the description of the present utility model, it should be noted that, unless otherwise clearly specified and limited, the terms "installed", "connected", and "connected" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection, a direct connection, or an indirect connection through an intermediate medium, it can be the internal connection of two elements or the interaction relationship between two elements. For ordinary technicians in this field, the specific meanings of the above terms in the present utility model can be understood according to specific circumstances.

[0032] In the present utility model, unless otherwise clearly stipulated and limited, a first feature being "above" or "below" a second feature may include that the first and second features are in direct contact, or may include that the first and second features are not in direct contact but are in contact through another feature between them. Moreover, a first feature being "above", "above" and "above" a second feature includes that the first feature is directly above and obliquely above the second feature, or simply indicates that the first feature is higher in level than the second feature. A first feature being "below", "below" and "below" a second feature includes that the first feature is directly above and obliquely above the second feature, or simply indicates that the first feature is lower in level than the second feature.

[0033] The utility model embodiment discloses a semiconductor device, referring to Figure 1 and Figure 2The semiconductor device includes: a lead frame 10, a semiconductor chip 20, an electronic component 30 and a plastic package 40. The lead frame 10 includes a main structure 100, a pin structure 102 and a balance structure 101. The main structure 100 carries the semiconductor chip 20 and the electronic component 30. The pin structure 102 and the balance structure 101 are respectively located on opposite sides of the main structure 100 and are fixedly connected to the main structure 100. The pin structure 102 is electrically connected to the semiconductor chip 20 and the electronic component 30. The plastic package 40 seals the main structure 100, the semiconductor chip 20 and the electronic component 30.

[0034] Specifically, in different embodiments, the balancing structure 101 may be in different structural forms. The embodiment of the present application specifically but not limitingly proposes a structural form of the balancing structure 101, referring to Figure 1 The balance structure 101 is plate-shaped, and its thickness is consistent with that of the main structure 100. It should be noted that the material of the balance structure 101 can be a conductive metal or an insulating material. When the material of the balance structure 101 is a conductive metal, it can be integrally formed with the main structure 100. When the material of the balance structure 101 is an insulating material, it can be integrally formed with the plastic package 40.

[0035] Continue to refer to Figure 1 and Figure 2 The pin structure 102 disclosed in the embodiment of the present application includes a first pin 1021, which is a slender lead, and a plurality of first pins 1021 are provided. The embodiment of the present application takes two first pins 1021 as an example, and the two first pins 1021 are arranged in parallel. The first pin 1021 is made of a conductive material and can be integrally formed with the main structure 100. In the embodiment disclosed in the present application, the first pin 1021 and the balance structure 101 are located on opposite sides of the main structure 100, and can provide symmetrical force distribution together, so as to maintain the stability of the overall structure when subjected to force or vibration.

[0036] In order to facilitate the installation of semiconductor devices in some electronic devices, in some embodiments, the width of the balance structure 101 is generally greater than the width of the first pin 1021, so that the balance structure 101 can also be used as a connection point or a fixing point when installing the semiconductor device, so that the integrated semiconductor device is easier to install in other devices or systems, and the larger width of the balance structure 101 can also ensure the stability of the semiconductor device installed in other devices or systems. At the same time, in order to further improve the stability of the overall structure of the semiconductor device, the pin structure 102 disclosed in the embodiment of the present application also includes a second pin 1022, the second pin 1022 and the balance structure 101 are symmetrically arranged based on the main structure 100, and the width of the second pin 1022 close to the main structure 100 is equal to or close to the width of the balance structure 101, and the two first pins 1021 are located on both sides of the second pin 1022, and the width of the second pin 1022 away from the main structure 100 is equal to or close to the width of the first pin 1021. It should be noted that the second pin 1022 is made of a conductive material and can be integrally formed with the main structure 100. When the balancing structure 101 is also made of a conductive material, the balancing structure 101, the second pin 1022 and the main structure 100 can be integrally formed.

[0037] Furthermore, in order to improve the accuracy and efficiency of the semiconductor device packaging process and ensure product quality and stability, the semiconductor device disclosed in the present application also includes a positioning structure 103, which is fixedly connected to the main structure 100 and is located on the same side of the main structure 100 as the balancing structure 101, and the positioning structure 103 is spaced apart from the main structure 100 so that a positioning gap 105 is formed between the positioning structure 103 and the balancing structure 101. When packaging the semiconductor device, the clamping device can fix the lead frame 10 by inserting it into the positioning gap 105. In some embodiments, continue to refer to Figure 1 At least two positioning structures 103 are provided, and the two positioning structures 103 are respectively located on both sides of the balancing structure 101 , and both form a positioning gap 105 with the positioning structure 103 .

[0038] Furthermore, in order to further improve the stability of the overall structure of the semiconductor device, the width of the positioning structure 103 is usually close to the width of the first pin 1021, and usually corresponds to the first pin 1021 one by one, and is symmetrically arranged based on the main structure 100. It should be noted that the positioning structure 103 can be made of a conductive material and is integrally formed with the main structure 100.

[0039] In order to further improve the accuracy and efficiency of the packaging process and ensure product quality and stability, refer to Figure 1In some embodiments, the second pin 1022 further includes a positioning through hole 106, and the positioning through hole 106 passes through the second pin 1022. The positioning through hole 106 is usually arranged in a position close to the plastic package body 40. Figure 3 The pin structure 102 is further provided with an auxiliary positioning hole 107, which is at least provided on a portion of the second pin 1022 away from the main structure 100, or on any first pin 1021. It should be noted that, in some embodiments, a plurality of auxiliary positioning holes 107 may be provided on one first pin 1021, and the auxiliary positioning hole 107 may be a square hole or a round hole.

[0040] Reference Figure 4 In some embodiments, the semiconductor device further includes a support structure 104, and the support structure 104 includes a support plate 1041 and a positioning assembly. The positioning assembly and the lead frame 10 are located on the same side of the support plate 1041, and the positioning assembly is fixedly connected to the support plate 1041 for fixing the lead frame 10. In some embodiments, the positioning assembly includes at least one or a combination of a first positioning member 1042, a second positioning member 1043, and a third positioning member 1044. The first positioning member 1042 is a columnar structure protruding from the support plate 1041, and is used to be inserted into the positioning gap 105 and abut against the lead frame 10. The second positioning member 1043 is also a columnar structure protruding from the support plate 1041, and is used to be inserted into the positioning through hole 106 and abut against the lead frame 10. The number of the first positioning members 1042 is generally set according to the number of the positioning gaps 105. In addition, with respect to the first positioning member, in some embodiments, refer to Figure 5 The first positioning member 1042 is a plate-like structure protruding from the support plate 1041. A plurality of protrusions are protruding from the side of the first positioning member 1042 away from the support plate 1041. The plurality of protrusions are used to be inserted into the positioning gap 105. The number of protrusions is usually based on the number of positioning gaps 105. Two third positioning members 1044 are usually provided, and the two third positioning members 1044 are respectively abutted against two opposite side surfaces of the plastic sealing body 40. It should be noted that the third positioning member 1044 is also a columnar structure protruding from the support plate 1041, and the end of the third positioning member 1044 used to abut against the main structure 100 can be set to a stepped shape, which is used to fit the side and bottom surfaces of the plastic sealing body 40. Specifically, referring to Figure 4 The positioning assembly is a combination of a first positioning member 1042 , a second positioning member 1043 and a third positioning member 1044 .

[0041] And, in some embodiments, reference Figure 6The support structure 104 further includes a fourth positioning member 1045, which is a columnar structure protruding from the support plate 1041 and inserted into the auxiliary positioning hole 107. The number of the fourth positioning members 1045 is set according to the number of the auxiliary positioning holes 107 (this application only takes the second pin 1022 as an example to open the auxiliary positioning hole 107, but in some embodiments, the first pin 1021 also opens an auxiliary positioning hole 107).

[0042] Finally, it should be noted that in some semiconductor devices, the semiconductor chip 20 may be a magnetic induction chip, and the electronic component 30 may be a capacitor component.

[0043] The technical features of the above embodiments may be combined arbitrarily. To make the description concise, not all possible combinations of the technical features in the above embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0044] The above embodiments only express several implementation methods of the present application, and the descriptions thereof are relatively specific and detailed, but they cannot be understood as limiting the scope of the patent application. It should be pointed out that, for a person of ordinary skill in the art, several variations and improvements can be made without departing from the concept of the present application, and these all belong to the protection scope of the present application. Therefore, the protection scope of the patent application shall be subject to the attached claims.

Claims

1. A semiconductor device, characterized in that: include: A lead frame (10), a semiconductor chip (20), an electronic component (30) and a plastic package (40), wherein the lead frame (10) comprises a main structure (100), a pin structure (102) and a balance structure (101), wherein the main structure (100) is used to carry the semiconductor chip (20) and the electronic component (30), the pin structure (102) and the balance structure (101) are respectively located on two opposite sides of the main structure (100) and are both fixedly connected to the main structure (100), the pin structure (102) is used to be electrically connected to the semiconductor chip (20) and the electronic component (30), and the plastic package (40) is used to seal the main structure (100), the semiconductor chip (20) and the electronic component (30).

2. The semiconductor device according to claim 1, wherein: The invention also comprises a positioning structure (103), wherein the positioning structure (103) and the balancing structure (101) are located on the same side of the main structure (100) and are fixedly connected to the main structure (100), and the positioning structure (103) and the balancing structure (101) are arranged at a distance, and a positioning gap (105) is formed between the positioning structure (103) and the balancing structure (101).

3. The semiconductor device according to claim 2, characterized in that At least two positioning structures (103) are provided, and the two positioning structures (103) are respectively located on two sides of the balancing structure (101), and both of them form the positioning gap (105) with the positioning structure (103).

4. The semiconductor device according to claim 3, characterized in that The pin structure (102) comprises at least two first pins (1021), the first pins (1021) correspond to the positioning structures (103) one by one, and the first pins (1021) and the positioning structures (103) are symmetrically arranged based on the main structure (100).

5. The semiconductor device according to claim 4, characterized in that The pin structure (102) comprises a second pin (1022), the second pin (1022) comprises a positioning through hole (106), and the positioning through hole (106) is arranged to fit the plastic package body (40).

6. The semiconductor device according to claim 5, characterized in that The second pin (1022) and the balancing structure (101) are symmetrically arranged based on the main structure (100), and the width of the portion of the second pin (1022) close to the plastic package (40) is equal to the width of the balancing structure (101).

7. The semiconductor device according to claim 5, characterized in that The pin structure (102) further comprises an auxiliary positioning hole (107), wherein the auxiliary positioning hole (107) is at least formed on a portion of the second pin (1022) away from the main structure (100) or on any one of the first pins (1021).

8. The semiconductor device according to claim 5, characterized in that The invention also includes a support structure (104), wherein the support structure (104) includes a support plate (1041) and a first positioning member (1042), wherein the first positioning member (1042) and the lead frame (10) are located on the same side of the support plate (1041), and the first positioning member (1042) is fixedly connected to the support plate (1041) and inserted into the corresponding positioning gap (105).

9. The semiconductor device according to claim 8, characterized in that The support structure (104) further comprises a second positioning member (1043), wherein the second positioning member (1043) and the lead frame (10) are located on the same side of the support plate (1041), and the second positioning member (1043) is fixedly connected to the support plate (1041) and inserted into the positioning through hole (106).

10. The semiconductor device according to claim 9, characterized in that The support structure (104) further comprises two third positioning members (1044), wherein the two third positioning members (1044) and the lead frame (10) are located on the same side of the support plate (1041), and the two third positioning members (1044) are both fixedly connected to the support plate (1041) and respectively abut against two opposite side surfaces of the plastic package body (40).

11. The semiconductor device according to claim 1, wherein: The semiconductor chip (20) includes a magnetic induction chip, and the electronic component (30) includes a capacitor component.

Images