Electronic device

Abstract

The utility model discloses electronic equipment, and belongs to the technical field of antennae, the electronic equipment comprises an antenna structure, the antenna structure comprises a feed source, a first radiator, a second radiator and a third radiator, and the feed source is electrically connected with the first radiator; the frame body structure comprises a metal frame and a plastic frame, the plastic frame wraps the metal frame, the first radiating body and the second radiating body are both arranged on the metal frame, a first breaking joint is further arranged on the metal frame, and a second breaking joint is further arranged on the second radiating body. The first radiating body and the second radiating body are coupled and connected through the first breaking joint; a containing groove is formed in the position, corresponding to the first breaking joint, of the plastic frame, the third radiator is arranged in the containing groove, and the third radiator is in coupling connection with the first radiator and the second radiator.

Description

Technical Field

[0001] The present application belongs to the field of antenna technology, and specifically relates to an electronic device. Background Art

[0002] With the development of technology, mobile phones and other electronic devices have become comprehensive tools for information exchange, entertainment and leisure, life assistance and many other aspects, providing great convenience for users' work, life and study. As one of the core performance of electronic devices, communication performance is mainly determined by the antennas installed on the electronic devices. However, as the functions of electronic devices such as mobile phones become more and more abundant, the number of antennas on electronic devices is also increasing, resulting in the limited design size of some antennas, which makes it difficult for these antennas to meet the growing communication performance requirements.

[0003] It can be seen that the antenna solution in the related art has the problem of poor communication performance. Utility Model Content

[0004] The purpose of the embodiments of the present application is to provide an electronic device that can solve the problem of poor communication performance of the antenna solution in the related art.

[0005] In order to solve the above technical problems, this application is implemented as follows:

[0006] The present application provides an electronic device, including:

[0007] An antenna structure, the antenna structure comprising a feed source, a first radiator, a second radiator and a third radiator, the feed source being electrically connected to the first radiator;

[0008] A frame structure, wherein the frame structure comprises a metal frame and a plastic frame, wherein the plastic frame is wrapped around the metal frame, wherein the first radiator and the second radiator are both arranged on the metal frame, and a first slit is further arranged on the metal frame, and the first radiator and the second radiator are coupled and connected via the first slit;

[0009] A receiving groove is arranged on the plastic frame at a position corresponding to the first slit, the third radiator is arranged in the receiving groove, and the third radiator is coupled and connected with the first radiator and the second radiator respectively.

[0010] In an embodiment of the present application, a receiving groove is provided at a position of the plastic frame corresponding to the first break, and a third radiator is provided in the receiving groove so that the third radiator is coupled and connected to the first radiator and the second radiator respectively; since the third radiator is coupled and connected to the first radiator and the second radiator respectively, the electric field on the first radiator can not only be directly coupled to the second radiator based on the first break, but also can be coupled to the second radiator through the third radiator, that is, the provision of the third radiator can effectively enhance the electric field strength of the second radiator, thereby improving the radiation effect of the second radiator, improving the passive efficiency of the antenna structure, and improving the antenna performance of the electronic device.

[0011] Additional aspects and advantages of the present application will be given in part in the description below, and in part will become apparent from the description below, or will be learned through the practice of the present application. BRIEF DESCRIPTION OF THE DRAWINGS

[0012] The above and / or additional aspects and advantages of the present application will become apparent and easily understood from the description of the embodiments in conjunction with the following drawings, in which:

[0013] Figure 1 is a structural schematic diagram of an antenna structure provided in an embodiment of the present application;

[0014] Figure 2 It is one of the structural schematic diagrams of the electronic device provided in the embodiment of the present application;

[0015] Figure 3 This is the second structural diagram of the electronic device provided in the embodiment of the present application;

[0016] Figure 4 This is the third structural diagram of the electronic device provided in the embodiment of the present application;

[0017] Figure 5 This is the fourth structural diagram of the electronic device provided in the embodiment of the present application;

[0018] Figure 6 is a schematic structural diagram of a third radiator provided in an embodiment of the present application;

[0019] Figure 7 is a schematic diagram of electric field distribution of an antenna structure provided in an embodiment of the present application without a third radiator;

[0020] Figure 8 yes Figure 1 Schematic diagram of the electric field distribution of the antenna structure shown. DETAILED DESCRIPTION

[0021] The embodiments of the present application will be described in detail below, and examples of the embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals throughout represent the same or similar elements or elements having the same or similar functions. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain the present application, and should not be construed as limitations on the present application. Based on the embodiments in the present application, all other embodiments obtained by ordinary technicians in the field without making creative work are within the scope of protection of the present application.

[0022] The term "first" or "second" in the specification and claims of this application may include one or more of the features explicitly or implicitly. In the description of this application, unless otherwise specified, "plurality" means two or more. In addition, "and / or" in the specification and claims means at least one of the connected objects, and the character " / " generally means that the objects connected before and after are in an "or" relationship.

[0023] In the description of the present application, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", "clockwise", "counterclockwise", "axial", "radial", "circumferential" and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present application and simplifying the description, and do not indicate or imply that the referred device or element must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as a limitation on the present application.

[0024] In the description of this application, it should be noted that, unless otherwise clearly specified and limited, the terms "installed", "connected", and "connected" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection, or it can be indirectly connected through an intermediate medium, or it can be the internal communication of two components. For ordinary technicians in this field, the specific meanings of the above terms in this application can be understood according to specific circumstances.

[0025] like Figures 1 to 5 As shown, an embodiment of the present application provides an electronic device, including: an antenna structure 10 and a frame structure 20. The radiator of the antenna structure 10 can be arranged on the frame structure 20, and the frame structure 20 can be understood as the frame structure of the electronic device, that is, the radiator of the antenna structure 10 can be arranged on the frame structure of the electronic device to realize the antenna function of the antenna structure 10.

[0026] The above-mentioned antenna structure 10 includes a feed source 11, a first radiator 12, a second radiator 13 and a third radiator 14, and the feed source 11 is electrically connected to the first radiator 12, that is, the first radiator 12 can be understood as the main radiation branch of the antenna structure 10, and the second radiator 13 and the third radiator 14 can be understood as parasitic radiation branches or coupled radiation branches of the antenna structure 10.

[0027] In some embodiments, the antenna structure 10 further includes a matching circuit 15, and the feed source 11 can be electrically connected to the first radiator 12 through the matching circuit 15, so as to improve the antenna performance of the antenna structure 10 through the matching circuit 15. The matching circuit 15 can be composed of at least one of a capacitor, an inductor, and a switch, and can be used to adjust the resonance, impedance and other parameters of the antenna structure 10.

[0028] The above-mentioned frame structure 20 includes a metal frame 21 and a plastic frame 22, and the plastic frame 22 is wrapped around the metal frame 21, and the first radiator 12 and the second radiator 13 of the antenna structure 10 can be arranged on the metal frame 21, that is, the first radiator 12 and the second radiator 13 can be metal branches arranged on the metal frame 21, and a first break 211 is also arranged on the metal frame 21, and the first radiator 12 and the second radiator 13 can be coupled and connected through the first break 211.

[0029] In some embodiments, the metal frame 21 is further provided with a second break 212, and the first break 211 is arranged between the first radiator 12 and the second radiator 13 to achieve coupling between the first radiator 12 and the second radiator 13; the second break 212 is arranged at an end of the first radiator 12 away from the second radiator 13, that is, the second break 212 is used to separate the first radiator 12 from the main body structure of the metal frame 21, so that the first radiator 12 forms a metal branch suspended relative to the main body structure of the metal frame 21.

[0030] Furthermore, to reduce the interference of the main structure of the metal frame 21 on the first radiator 12 , one end of the main structure of the metal frame 21 close to the second slit 212 may be grounded, and one end of the second radiator 13 away from the first slit 211 may be grounded.

[0031] Since both ends of the first radiator 12 are provided with gaps, that is, the first radiator 12 is a metal branch suspended relative to the main structure of the metal frame 21; therefore, the plastic frame 22 can also play the role of a fixed bracket, that is, by wrapping the plastic frame 22 around the main structure of the metal frame 21, the first radiator 12 and the second radiator 13, the structural stability of the metal frame 21 can be maintained.

[0032] The plastic frame 22 is provided with a receiving groove 221 at a position corresponding to the first slit 211 . The third radiator 14 is disposed in the receiving groove 221 , and the third radiator 14 is coupled to the first radiator 12 and the second radiator 13 , respectively.

[0033] In this embodiment, a receiving groove 221 is provided at a position of the plastic frame 22 corresponding to the first slit 211, and the third radiator 14 is provided in the receiving groove 221, so that the third radiator 14 is coupled and connected to the first radiator 12 and the second radiator 13 respectively; since the third radiator 14 is coupled and connected to the first radiator 12 and the second radiator 13 respectively, the electric field on the first radiator 12 can not only be directly coupled to the second radiator 13 based on the first slit 211, but also can be coupled to the second radiator 13 through the third radiator 14, that is, the provision of the third radiator 14 can effectively enhance the electric field strength of the second radiator 13, improve the radiation effect of the second radiator 13, improve the passive efficiency of the antenna structure 10, and improve the antenna performance of the electronic device.

[0034] In the process of coupling the electric field on the first radiator 12 to the second radiator 13 through the third radiator 14, the electric field on the first radiator 12 can first be coupled to the third radiator 14 based on the coupling connection between the third radiator 14 and the first radiator 12, and the electric field coupled to the third radiator 14 can also be coupled to the second radiator 13 based on the coupling connection between the third radiator 14 and the second radiator 13, so as to enhance the electric field strength of the second radiator 13.

[0035] like Figure 7 and Figure 8 As shown, relative to Figure 7 The electric field distribution of the antenna structure shown in the figure is not provided with a third radiator. In the present application, the electric field strength of the second radiator 13 of the antenna structure 10 is effectively enhanced, that is, by providing the third radiator 14, the electric field strength of the second radiator 13 can be effectively enhanced.

[0036] Moreover, the setting can also make the radiation current of the antenna structure 10 more uniform, which is beneficial to disperse the hot spots of the specific absorption ratio (SAR) of the antenna structure 10, thereby achieving the effect of reducing the SAR value and meeting the design requirements of the low SAR effect of the antenna structure 10.

[0037] In some embodiments, the third radiator 14 can be understood as a tuning device of the antenna structure 10, which is used to enhance the electric field strength of the second radiator 13, improve the passive efficiency of the antenna structure 10, and enhance the antenna performance of the electronic device.

[0038] In some embodiments, the third radiator 14 disposed in the receiving groove 221 is suspended relative to the first radiator 12 and the second radiator 13 , that is, the third radiator 14 is not electrically connected to the first radiator 12 and the second radiator 13 .

[0039] Among them, the receiving groove 221 can be understood as an embedded groove, that is, the third radiator 14 can be set on the plastic frame 22 by embedding, so as to realize the setting of the third radiator 14 corresponding to the first break 211 on the metal frame 21, and meet the design requirements that the third radiator 14 can be coupled and connected with the first radiator 12 and the second radiator 13 at the same time.

[0040] In some embodiments, Figure 6 As shown, the receiving groove 221 is connected to the first slit 211, and the first radiator 12 and the second radiator 13 are partially exposed in the receiving groove 221;

[0041] The third radiator 14 includes a conductive layer 141 and a first adhesive layer 142 . The conductive layer 141 can be connected to the first radiator 12 and the second radiator 13 respectively through the first adhesive layer 142 . The distance from the conductive layer 141 to the first radiator 12 or the second radiator 13 is the thickness of the first adhesive layer 142 .

[0042] The conductive layer 141 is also coupled to the first radiator 12 and the second radiator 13 respectively.

[0043] In this embodiment, the receiving groove 221 is connected to the first slit 211, that is, the receiving groove 221 is set as a receiving structure on the plastic frame 22 that penetrates the metal frame 21, and the distance from the conductive layer 141 to the first radiator 12 or the second radiator 13 is the thickness dimension of the first adhesive layer 142; therefore, the distance from the conductive layer 141 to the first radiator 12 or the second radiator 13 can be adjusted by adjusting the thickness dimension of the first adhesive layer 142, that is, the coupling amount of the third radiator 14 relative to the first radiator 12 or the second radiator 13 can be adjusted by adjusting the thickness dimension of the first adhesive layer 142. Compared with machining the receiving groove 221 with a suitable depth by machining, the processing and manufacturing process of the antenna structure 10 can be effectively simplified.

[0044] In some embodiments, since the receiving groove 221 is connected to the first slit 211 , the receiving groove 221 can be directly molded during the process of forming the plastic frame 22 , that is, the receiving groove 221 can be directly formed by injection molding without machining, thereby simplifying the processing technology of the receiving groove 221 .

[0045] Moreover, since the distance from the conductive layer 141 to the first radiator 12 or the second radiator 13 is the thickness dimension of the first adhesive layer 142, the distance from the conductive layer 141 to the first radiator 12 or the second radiator 13 can be adjusted by adjusting the thickness dimension of the first adhesive layer 142, thereby improving the precision control of the distance from the conductive layer 141 to the first radiator 12 or the second radiator 13 and improving the consistency of the antenna coupling test production line in the whole machine production process.

[0046] Among them, since the conductive layer 141 is connected to the first radiator 12 and the second radiator 13 respectively through the first adhesive layer 142, there is no electrical connection between the conductive layer 141 of the third radiator 14 and the first radiator 12 and the second radiator 13, which meets the design requirement that the third radiator 14 can be coupled and connected to the first radiator 12 and the second radiator 13 at the same time.

[0047] In some embodiments, the electronic device further includes a battery compartment side wall 30, a first metal surface of the first radiator 12 facing away from the battery compartment side wall 30 is exposed in the receiving groove 221, a second metal surface of the second radiator 13 facing away from the battery compartment side wall 30 is exposed in the receiving groove 221, and both the first metal surface and the second metal surface are inclined surfaces;

[0048] The conductive layer 141 is bonded and connected to the first metal surface and the second metal surface respectively through the first adhesive layer 142 .

[0049] The first metal surface and the second metal surface are both inclined surfaces, which can be understood as a certain angle between the first metal surface and the second metal surface and the display surface of the electronic device, such as a 30° angle between the first metal surface and the second metal surface and the display surface of the electronic device.

[0050] In this embodiment, by setting the first metal surface of the first radiator 12 and the second metal surface of the second radiator 13 as inclined surfaces, the receiving groove 221 can be designed as an inclined receiving groove adapted to the metal inclined surface. Compared with setting the receiving groove 221 in a direction perpendicular to the display surface of the electronic device, the wall thickness of the plastic frame 22 can be effectively increased, thereby increasing the supporting strength of the plastic frame 22 to the battery compartment side wall 30, thereby reducing the battery safety risk of the electronic device.

[0051] In some embodiments, the bottom surface of the receiving groove 221 is parallel to the first metal surface or the second metal surface, which can further increase the wall thickness of the plastic frame 22 .

[0052] like Figure 2As shown in FIG4 , if the receiving groove 221 is set in a direction perpendicular to the display surface of the electronic device, the wall thickness of the plastic frame 22 at the receiving groove 221 is H1; if the receiving groove 221 is designed as an inclined receiving groove adapted to the metal inclined surface, the wall thickness of the plastic frame 22 at the receiving groove 221 is H2. Figure 2 and Figure 4 It can be seen that H2 is greater than H1, that is, relative to setting the receiving groove 221 in a direction perpendicular to the display surface of the electronic device, the wall thickness of the plastic frame 22 can be increased by designing the receiving groove 221 as an oblique receiving groove adapted to the metal slope, thereby increasing the supporting strength of the plastic frame 22 to the battery compartment side wall 30.

[0053] In some embodiments, the length of the conductive layer 141 in the first direction is negatively correlated with the thickness of the first adhesive layer 142 , and the first direction is parallel to the length direction of the first radiator 12 .

[0054] Since the coupling amount between the third radiator 14 and the first radiator 12 or the second radiator 13 is mainly determined based on the distance from the conductive layer 141 to the first radiator 12 or the second radiator 13, and the overlapping area between the conductive layer 141 and the first radiator 12 or the second radiator 13, that is, the length dimension of the conductive layer 141 in the first direction is positively correlated with the thickness dimension of the first adhesive layer 142, that is, reducing the thickness dimension of the first adhesive layer 142 can increase the coupling amount between the third radiator 14 and the first radiator 12 or the second radiator 13; therefore, by reducing the thickness dimension of the first adhesive layer 142, the length dimension of the conductive layer 141 in the first direction can be shortened, so that the size of the third radiator 14 can be controlled within an appropriate range, so as to reduce the installation space required for the arrangement of the third radiator 14.

[0055] In some embodiments, adjacent first sink grooves and second sink grooves are provided on the plastic frame 22, and a connecting structure is provided on the battery compartment side wall 30. The first sink groove and the second sink groove are connecting grooves adapted to the connecting structure, so that the battery compartment side wall 30 can be assembled and connected to the plastic frame 22 through the adaption connection between the connecting structure and the first sink groove and the sink groove.

[0056] In some embodiments, the length dimension of the conductive layer 141 in the first direction can be shortened by reducing the thickness dimension of the first adhesive layer 142, so that the size of the third radiator 14 is controlled to be about 10mm*1mm, and the design requirement that the receiving groove 221 is located between the first groove and the second groove is met.

[0057] Furthermore, by arranging the receiving groove 221 between the first sink groove and the second sink groove, compared with arranging the receiving groove 221 across the first sink groove or the second sink groove, the waterproof performance of the entire electronic device can be improved.

[0058] For example, waterproof glue can be directly used to achieve the waterproof requirements of the first sink and the second sink, thereby avoiding the risk of liquid seeping into the sink to the waterproof reliability of the whole machine.

[0059] In some embodiments, the length of the conductive layer 141 in the first direction may be set to be 6 mm to 9 mm.

[0060] In some embodiments, the third radiator 14 is an FPC antenna radiator, that is, the third radiator 14 is a sheet-like radiating structure, and the third radiator 14 also includes a covering film layer 143, and the first adhesive layer 142, the conductive layer 141 and the covering film layer 143 are stacked in sequence.

[0061] In this embodiment, the cover film layer 143 is provided to improve the structural strength of the third radiator 14 , thereby preventing the third radiator 14 from warping or falling off, and improving the reliability of the third radiator 14 .

[0062] The size of the third radiator 14 is 10 mm*1 mm, which can be understood as the size of the radiation surface of the third radiator 14 with a sheet structure, that is, 10 mm and 1 mm do not include the thickness of the third radiator 14 .

[0063] When the size of the third radiator 14 is about 10 mm*1 mm, that is, the width of the third radiator 14 is relatively narrow, it is not conducive to the third radiator 14 being pasted into the receiving groove 221 .

[0064] In this embodiment, the thickness of the covering film layer 143 can be increased. For example, the thickness of the covering film layer 143 can be set to 45 microns to 55 microns. Compared with the conventional FPC antenna radiator whose covering film layer thickness is only about 25 microns, the thickness of the covering film layer 143 is nearly doubled, thereby effectively improving the structural strength of the third radiator 14 and reducing the risk of warping.

[0065] In some embodiments, after increasing the thickness of the covering film layer 143, it is necessary to reduce the thickness of the first adhesive layer 142. To meet the bonding requirements between the conductive layer 141 and the first radiator 12 or the second radiator 13, the first adhesive layer 142 can be set to a more adhesive layer structure such as 3M6653 to prevent the third radiator 14 from warping or falling off in the receiving groove 221.

[0066] In some embodiments, the covering film layer 143 includes a first polyimide (PI) layer and a second adhesive layer, the conductive layer 141 includes a copper layer, a third adhesive layer and a second PI layer, and the first PI layer, the second adhesive layer, the copper layer, the third adhesive layer, the second PI layer and the first adhesive layer 142 are stacked in sequence.

[0067] In some embodiments, the thickness of the first PI layer is 25 microns, the thickness of the second bonding layer is 25 microns, the thickness of the copper layer is 18 microns, the thickness of the third bonding layer is 13 microns, the thickness of the second PI layer is 12.5 microns, and the thickness of the first bonding layer is 30 microns.

[0068] In this embodiment, the covering film layer 143 with a thickness of 50 microns is composed of a first PI layer of 25 microns and a second adhesive layer of 25 microns. Compared with the covering film layer composed of a first PI layer of 12.5 microns and a second adhesive layer of 15 microns, the thickness of the first PI layer of the covering film layer 143 is doubled, and the thickness of the covering film layer 143 is also increased to 50 microns, which effectively improves the structural strength of the third radiator 14.

[0069] Among them, when the covering film layer is composed of a first PI layer of 12.5 microns and a second adhesive layer of 15 microns, the thickness of the first adhesive layer 142 is 50 microns; in this way, by setting the covering film layer 143 to be composed of a first PI layer of 25 microns and a second adhesive layer of 25 microns and setting the thickness of the first adhesive layer 142 to 30 microns, not only the structural strength of the third radiator 14 can be improved, but also the thickness of the first adhesive layer 142 can be reduced, thereby better meeting the miniaturization design requirements of the third radiator 14.

[0070] In some embodiments, the antenna structure 10 may be an inverted-F antenna or an antenna solution of a monopole plus a parasitic branch.

[0071] In some embodiments, the third radiator 14 can be understood as an FPC antenna radiator, or can be a copper layer structure formed by laser direct forming technology or direct printing technology.

[0072] It should be noted that the electronic device in the present application may be a mobile phone, a tablet computer, a laptop computer, a PDA, a vehicle-mounted electronic device, a wearable device, an ultra-mobile personal computer (UMPC), a netbook or a personal digital assistant (PDA), etc.

[0073] In the description of this specification, the description with reference to the terms "one embodiment", "some embodiments", "illustrative embodiments", "examples", "specific examples", or "some examples" means that the specific features, structures, materials, or characteristics described in conjunction with the embodiment or example are included in at least one embodiment or example of the present application. In this specification, the schematic representation of the above terms does not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials, or characteristics described may be combined in any one or more embodiments or examples in a suitable manner.

[0074] Although the embodiments of the present application have been shown and described, those skilled in the art will appreciate that various changes, modifications, substitutions and variations may be made to the embodiments without departing from the principles and spirit of the present application, and that the scope of the present application is defined by the claims and their equivalents.

Claims

1. An electronic device, characterized in that: include: An antenna structure, the antenna structure comprising a feed source, a first radiator, a second radiator and a third radiator, the feed source being electrically connected to the first radiator; A frame structure, wherein the frame structure comprises a metal frame and a plastic frame, wherein the plastic frame is arranged to wrap the metal frame, wherein the first radiator and the second radiator are both arranged on the metal frame, and a first slit is further arranged on the metal frame, and the first radiator and the second radiator are coupled and connected via the first slit; A receiving groove is arranged on the plastic frame at a position corresponding to the first slit, the third radiator is arranged in the receiving groove, and the third radiator is coupled and connected with the first radiator and the second radiator respectively.

2. The electronic device according to claim 1, characterized in that: The third radiator is suspended relative to the first radiator and the second radiator.

3. The electronic device according to claim 1, characterized in that: The receiving groove is connected to the first slit, and the first radiator and the second radiator are partially exposed in the receiving groove; The third radiator includes a conductive layer and a first adhesive layer, the conductive layer is respectively connected to the first radiator and the second radiator through the first adhesive layer, and the distance from the conductive layer to the first radiator or the second radiator is the thickness of the first adhesive layer.

4. The electronic device according to claim 3, characterized in that: The electronic device further comprises a battery compartment side wall, a first metal surface of the first radiator facing away from the battery compartment side wall is exposed in the receiving groove, a second metal surface of the second radiator facing away from the battery compartment side wall is exposed in the receiving groove, and both the first metal surface and the second metal surface are inclined surfaces; The conductive layer is respectively bonded and connected to the first metal surface and the second metal surface through the first adhesive layer.

5. The electronic device according to claim 4, characterized in that: The bottom surface of the receiving groove is parallel to the first metal surface or the second metal surface.

6. The electronic device according to claim 3, characterized in that: The length dimension of the conductive layer in a first direction is positively correlated with the thickness dimension of the first adhesive layer, and the first direction is parallel to the length direction of the first radiator.

7. The electronic device according to claim 6, characterized in that: The length of the conductive layer in the first direction is 6 mm to 9 mm.

8. The electronic device according to claim 3, characterized in that: The third radiator is an FPC antenna radiator, and the third radiator further includes a covering film layer, and the first adhesive layer, the conductive layer and the covering film layer are stacked in sequence; Wherein, the thickness of the covering film layer is 45 microns to 55 microns.

9. The electronic device according to any one of claims 1 to 8, characterized in that: The plastic frame is provided with a first sink groove and a second sink groove adjacent to each other; A material connection structure is provided on the side wall of the battery compartment of the electronic device, and the first sink groove and the second sink groove are material connection grooves adapted to the material connection structure.

10. The electronic device according to claim 9, characterized in that: The receiving groove is located between the first sink groove and the second sink groove.

Images